Mobile Electrostatic Carrier

1. Beam Services, Inc.
September 27, 2010

2. Beam Services, Inc.
Mobile electrostatic carrier
technology
Rigid carrier that utilizes electrostatic
force for the bonding to an ultra thin
substrate
Thin opaque electrostatic carrier for the
processing of transparent substrates
Clean and “Green”
Reduced damage during de‐bond
>2000 charge cycle capability
Simple carrier re‐charge for extended
processes
Single tool set for bond and de‐bond
process
Multiple automated integration
solutions

3. Beam Services, Inc.
Objective: Beam Services is focused on the
commercialization of mobile and non‐
mobile electrostatic handling systems for
automated high volume manufacturing.
1.) Fully and semi automated ES
temporary bond and de-bond
systems for the handling of
ultra thin substrates
2.) Tools and applications
engineering for customer
specific handling requirements

4. Beam Services, Inc.
1. Thin substrate and ESC Thin substrate
are separated
ESC layers
Electrostatic Carrier
2. Thin substrate and ESC
are placed in close Thin substrate
contact
ESC layers
Electrostatic Carrier
3. Thin substarte is
chucked by the Thin substrate
electrostatic field ++-
-
generated by ESC ESC field
Electrostatic Carrier

5. Beam Services, Inc.
C+ Bipolar C
- Wafer
U0/2
+ - + - + - +-
ESC
A plane A/2 Cover foil
Multi-Cell Electrostatic field
U0
- +- - +- - +- - +- - +-- +-
ESC
Power electrodes can hold the wafer without
the presence of a grounding electrode

6. Beam Services, Inc.
Applications
•Materials
•Semiconductor wafer
•Semiconductor solar cells
•Metal masks
•Glass substrates
•Non conductive substrates with
conductive layer
•MEMS
•Substrate pieces
•Substrates typical dimensions
•Thickness (any kind): typical 10µm – 750µm
•Size (any kind): typical 1” to 12”
•Shape (any kind): circle, square, rectangular

7. Beam Services, Inc.
Easily integrated charging
units, all communication
protocols supported (USB, 232,
etc.)
Operating with “IntelliCharge® ”
fully heuristic intelligent charging
technology. Patent Pending
In house design, hardware,
software capability
Volume manufacturing at low
cost in the US
Highly experienced team with
multi‐market background

8. Beam Services, Inc.
APACHE APACHE
BOLTS Charging Automated Charging
Station Station
APACHE 2100
ESC Charging
Controller
APACHE
Integrated Charging APACHE
Station Bi-polar ESCs Table Top Charging
Station

9. Beam Services, Inc.
150 mm, 200 mm, and 300 mm mobile
ES carrier capability
Integrated real time voltage
monitoring for process testing
Vacuum ESC hold down and contact
pin actuation
Contact pin assembly design allows
for increased rotational tolerance
Integrated touch screen user interface
In house customization options