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Six-Core AMD Opteron™ Processor with AMD Chipset Platform
Six-Core AMD Opteron™ Processor with AMD Chipset Platform  Unified server platforms with AMD on AMD – benefits of processor + chipset Enhanced platforms with chipset choices and key technologies Ultra power efficient platform designed for cloud and dense deployments (using AMD Opteron™ EE processor and S5650 chipset) First 4P x86 Platform with PCI Express® 2.0 for HPC applications Three chipset solutions to optimize workloads Extends AMD Virtualization™ (AMD-V™) technology and AMD-P suite of features Wide availability from ODMs; OEMs are expected to introduce new chipsets as part of AMD’s 2010 processor lineup
Key Benefits Choice ofChipsets KeyTechnologies Consistent Feature Set ,[object Object]
AMD-V™
PCI Express® 2.0
HyperTransport™ 3.0 TechnologySR5690 SR5650 SR5670 Benefits Range and flexibilityof chipsets(from high bandwidth to power efficient)to meet the demandsof your workloads Power efficiency beyond the processor Exceptional Virtualization capabilities Only 4P x86 solution with Tagged TLB, RVI and I/O Virtualization Increased  performance and throughput (up to 2x for PCI Express® 2.0 vs. PCI Express® 1.0)
TYAN S8208: Energy Efficient Server Platform TYAN S8208 Overview AMD and TYAN Collaboration TYAN S8208 = Six-Core AMD Opteron™ EE + new AMD SR5650 & SP5100 server chipset  Energy Efficient ,[object Object]
Optimized for HE& EE
Energy Efficient AMD Chipset
AMD-P Technology
Platform-level power management support

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Six Core AMD Opteron Processor With AMD Chipset Platform

  • 1. Six-Core AMD Opteron™ Processor with AMD Chipset Platform
  • 2. Six-Core AMD Opteron™ Processor with AMD Chipset Platform Unified server platforms with AMD on AMD – benefits of processor + chipset Enhanced platforms with chipset choices and key technologies Ultra power efficient platform designed for cloud and dense deployments (using AMD Opteron™ EE processor and S5650 chipset) First 4P x86 Platform with PCI Express® 2.0 for HPC applications Three chipset solutions to optimize workloads Extends AMD Virtualization™ (AMD-V™) technology and AMD-P suite of features Wide availability from ODMs; OEMs are expected to introduce new chipsets as part of AMD’s 2010 processor lineup
  • 3.
  • 6. HyperTransport™ 3.0 TechnologySR5690 SR5650 SR5670 Benefits Range and flexibilityof chipsets(from high bandwidth to power efficient)to meet the demandsof your workloads Power efficiency beyond the processor Exceptional Virtualization capabilities Only 4P x86 solution with Tagged TLB, RVI and I/O Virtualization Increased performance and throughput (up to 2x for PCI Express® 2.0 vs. PCI Express® 1.0)
  • 7.
  • 12. Expected Nov. 09Ultra power efficient twin form-factor platform designed for cloud and density deployments
  • 13.
  • 14. QDR Switch incorporated inside the blade enclosure
  • 15. Management per node including KVM/IP
  • 16. Redundant PSU’s capable of operating at ultra high power efficiency Quantity: 720 processors; 4320 cores     
  • 17.
  • 18. PCI Express® 2.0 chipset to drive high end graphics
  • 19. Maximum number of GPU's in a single server
  • 20. Highly dense solution of servers and GPU's                                                AMD product: Six-Core AMD Opteron™ processor with Dual AMD 5690 chipsets and 4 AMD FireStream™ cards per node Infrastructure: : Supermicro 2P with dual 5690’s and 2 HyperTransport™ technology links per socket Quantity: 5 Racks; 120 nodes; 240 CPU’s and 480 GPU’s                                                
  • 23. AMD Server Platforms: A Look Ahead Six-Core AMD Opteron™ Processor Virtualizationdrives the need for more cores and greater scalability AMD Opteron™ 6000 series platform Performance/ Expandability Quad-Core AMD Opteron™ Processor Cloud computing and dense deployments drivethe need for greater energy efficiency AMD Opteron™ 4000 series platform Power/ Cost Efficiency Driving performance, consistency and value to the market
  • 24. Unified server platforms with AMD on AMD – benefits of processor and chipset AMD continues to execute the strategy to provide enhanced platforms to the market Range and flexibility of chipsets to meet varied demands of key workloads Six-Core AMD Opteron™ processor with AMD chipset furthers AMD’s goal to drive performance, consistency and value in the market Platform Benefits
  • 25. Disclaimer & Attribution DISCLAIMER The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. ATTRIBUTION © 2009 Advanced Micro Devices, Inc.  All rights reserved.  AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Opteron, AMD Virtualization, AMD-V, FireStream, and combinations thereof are trademarks of Advanced Micro Devices, Inc.  HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. Other names are for informational purposes only and may be trademarks of their respective owners.