This document describes a 1GB DDR2 memory module from Kingston with the following specifications: - It has 128M x 64-bit components running at DDR2-1066 speeds with a latency of 5-5-5-15. - The module uses 240 pins and requires a power supply of 1.8V. - It has features like double data rate architecture, burst lengths of 4 or 8, and refresh intervals of 7.8us.

1. T E C H N O L O G Y
Memory Module Specification
KHX8500D2/1G
1GB 128M x 64-Bit PC2-8500
CL5 240-Pin DIMM
DESCRIPTION:
This document describes Kingston's 128M x 64-bit 1GB (1024MB) DDR2-1066 CL5 SDRAM (Synchronous DRAM)
memory module, based on sixteen 64M x 8-bit DDR2 FBGA components. This module has been tested to run at DDR2
1066MHz at a latency timing of 5-5-5-15 at 2.2V. The SPD is programmed to JEDEC standard latency 800Mhz timing
of 5-5-5-18 at 1.8V. This 240-pin DIMM uses gold contact fingers and requires +1.8V. The electrical and mechanical
specifications are as follows:
FEATURES:
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 5 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 5-5-5-18 at +1.8V / 5-5-5-15 at +2.2V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.180” (30.00mm), double sided component
PERFORMANCE:
Clock Cycle Time (tCK) CL=5 2.5ns (min.) / 8ns (max.)
Row Cycle Time (tRC) 51.5ns (min.)
Refresh to Active/Refresh Command Time (tRFC) 105ns
Row Active Time (tRAS) 39ns (min.) / 70,000ns (max.)
Single Power Supply of +1.8V (+/- .1V)
Power 2.025 W (operating)
UL Rating 94 V - 0
Operating Temperature 0o C to 55o C
Storage Temperature -55o C to +125o C
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Document No. 4804465-001.C00 09/23/08 Page 1

2. Kingston Technology
MODULE DIMENSIONS:
Units: millimeters
2.7
1.270 ± 0.10
3.00
2.50±0.20
5.00
4.00 0.80±0.05
4.00
3.80 0.20
2.50 4.00
1.50±0.10 1.00
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w/ heatsink assembly
For more information, go to www.kingston.com
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not
operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to
run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to
computer components.
Document No. 4804465-001.C00 Page 2