New Innovation in x86 Computing from IBM System x

© 2013 IBM Corporation
New Innovation in x86 Computing
from IBM System x
September 10, 2013

© 2013 IBM Corporation2
Today’s Speakers
Brian Connors
Vice President
System x Development &
Lab Services
Roland Hagan
Vice President of Marketing
IBM System x
Scott Tease
Director & Product Line Manager
System x Technical Computing
Dr Adrian Wander
Director
Scientific Computing
Department of SFTC
Cliff Brereton
Director
Hartree Centre
Shannon Poulin
Vice President, Datacenter
Marketing Group
Intel Corporation

© 2013 IBM Corporation3 1) Facebook Second quarter 2013 results 2) Economist: stats from Morgan Stanley 3) IBM research
Shifts in IT are happening fast, bringing a new era of IT
1.15 Billion
Facebook
users today1
Social
Media
90% of data in the
world today created in
last two years alone.3
Big Data
10 billion
devices by
20202
Mobile
Need to analyze
and extract value from
massive amounts of data
… provide insight and drive
business outcomes

High-end systems
Broad portfolio to meet a
wide range of client
needs from infrastructure
to technical computing
4 socket+ enterprise-class
x86 performance,
resiliency and security
Integration across IBM assets in
systems and SW for maximum
client optimization and value
Optimize space-constrained
data centers with extreme
performance and energy
efficiency
IBM PureSystemsIBM eX5 Systems
IBM System x iDataPlex
IBM NeXtScale
IBM System x Rack & Tower
IBM Flex System
IBM BladeCenter
IBM Strategy delivers a leadership systems portfolio
Blades/Integrated systems
Volume systems Dense systems

AnalyticsCloud
Application ready
solutions to improve
insight, reduce risk,
speed deployment
Solutions based on key
ISVs such as SAP
HANA & integrated IBM
offerings
Powerful and innovative
Improve outcomes through a
better understanding of
business environments
Designed for flexibility
Cost effective cloud
deployment with leadership
x86 scalability
Workload optimized
IBM innovation in x86 for
maximum performance and
scalability
Technical Computing
Meet public, private and
hybrid cloud for clients &
service providers
Client focus delivers solutions clients require to win
 Performance & resiliency in x86 mission critical, memory
intensive workloads
 Scalability of compute, network and I/O to efficiently meet
growing needs
 Consolidation & virtualization of infrastructure to reduce cost,
increase agility
 Over $1 billion planned investment in x86 over three years

New & optimized architectures are needed for new workloads
Cloud
Web 2.0
Technical
Computing

Brian Connors
Vice President
System x Development and Lab Services

Mainframe,
Mini Computer
Terminals
LAN/Internet Client/Server
PC
Mobile Cloud Big Data Social
Mobile Devices
Source: IDC, 2012
The Shifts are occurring rapidly, according to IDC we are at the
3rd platform

Industry
Partnering
NeXt generation systems
High performance storage
– IBM GPFS Storage Server
Flash/Networking
– eXFlash, Virtual Fabric
Energy efficiency
– Water cooling
– Energy aware scheduling
Open industry standards
– Chair, actively participate
Deep relationships
– Lead validation partner
– Strong architecture
influence
– Over 100 industry suppliers
Optimization
– Algorithms
– OS’s, hypervisors, systems
– Solutions - e.g. SAP HANA
Solution Provider
– Technical Computing
– Big Data, Cloud & Analytics
– Virtual Desktop
– MSP, CSP’s
Involved with client
– Trusted advisor
– Data center efficiency
– Proof of concepts
– Learn and apply to
new products
IBM System x – Systems engineered for a changing landscape
$1B
Innovation
Investment
Client
Engaged

Performance Optimized Systems
World Records:
 4 socket TPC-C and TPC-E benchmarks
 2 and 4 socket TPC-E price/performance
 2 socket blade SPECvirt performance
 4 and 8 socket servers for two-tier SAP
#1 in installed aggregate supercomputer performance
IBM Technology Leadership
Enterprise X-Architecture Leadership
 36 #1 eX5 benchmarks since 2010 launch
IBM #1 in patents for 20 consecutive years
 >6400 patents in 2012
X-Architecture
5
Generations
World Records
#1TPC, SAP, Spec
Benchmarks
IBM System x – Great Today, Engineered for Tomorrow
Client Benefits and Trust
 As little as three months ROI for technology refreshes
 Leading x86 energy-efficient systems
 Simplified workload and resource management
Client Satisfaction
TBR
#1

 IBM SmartCloud Entry
 IBM Application Ready Solutions
 IBM Intelligent Cluster™
 IBM GPFS™ Storage Server
 IBM Platform Computing™
IBM System x 3650 M4 HD
Big data and
dense storage server
High Density, 2 socket
x3500 M4
Business Critical
2 socket
iDataPlex®
dx360 M4
HPC, 2 socket
x3550 M4
Business Critical
2 socket
x3650 M4
Business Critical
2 socket
Platform
HPC
Platform
LSF
Platform
Symphony
Hyperscale, density,
flexibility, 2 socket
GPFS
Storage Server
17%3
Greater
Memory Speed
50%1
More Cores
& Cache
50%2
Greater
Performance
1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB
2 Intel E5-2690 vs E5-2697 v2
3 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz
IBM System x – New innovation
Enhanced
Systems
Software and Solutions IBM NeXtScale System™
9/10
New system for
scale-out computing
9/10

Scott Tease
Director & Product Line Manager
System x Technical Computing

IBM NeXtScale SystemTM
– Guiding principles
IT Your Way
Powerful
Yet Simple
FLEXIBILITY
SIMPLICITY
SCALE
Scale Enabled
for everyone

Compute
Chassis
Storage
Acceleration
More Coming
Standard Rack
Primary Target Workloads
 Architected for now and the future
 Better density and flexibility
 Compatible with standard racks
 Optimized for top of rack switching
 Software Defined Networking
(SDN) ready
 Intel® Xeon® Processor E5-2600 v2
product family
 Powerful roadmap
2013 – Introducing IBM NeXtScale
A superior architecture for scale-out computing
Public
Cloud
High
Performance
Computing
Private
Cloud

IBM NeXtScale – Simplicity
Native eXpansion – Adding Value, not Complexity
 Base node delivers robust and dense raw compute capabilities
 NeXtScale’s Native Expansion capability allows seamless upgrades
of the base to add common functionalities
– Storage
– Graphics Acceleration or Co-Processing
 What is Native Expansion?
No Exotic Components. No Mid-plane Dependencies.
+
nx360 M4
IBM NeXtScale nx360 M4
with Storage NeX
Storage NeX
+
RAID Card +
SAS Cable + HDDs
+
nx360 M4
PCI NeX
+
GPU Riser Card +
GPU/Phi
IBM NeXtScale nx360 M4
with Accelerator NeX

 6U Chassis, 12 bays
 Half width component support
 Up to 6 900W power supplies
N+N or N+1 configurations
 Up to 10 hot swap fans
 Fan and power controller
 Mix and match compute,
storage, or GPU nodes
 No built in networking
 No chassis management required
IBM NeXtScale n1200
Fan and power
controller
Front view
6 x 900W
power supplies
10 x 80mm
fans
Rear view
NeXtScale – Dense Chassis
Optimizedsharedinfrastructure

Simplearchitecture
Power button and
information LED
Dual-port mezzanine
card (IB/Ethernet)
KVM
connector
Labeling
tag
1 GbE
ports
IMM v2
port
PCIe 3.0
Slot
x24 PCIe
3.0 slot
x8 mezz.
connector
2 x CPU 8 x DIMMs
Power
Interposer
Flexible
Drive bay(s)
x16 PCIe
3.0 slot
NeXtScale – The Compute Node
 New ½ Wide 1U 2 socket server
 Intel®
Xeon®
Processor E5-2600 V2
 Flexible slot-less I/O design
 Generous PCIe capability
 Open design, works with existing
x86 tools
 Versatile design with flexible Native
Expansion options
 32TB local storage (November)
 GPUs/Phi adapters (2014)
IBM NeXtScale n360 M4
Hyperscale Server

Number of part numbers
needed for the entire
solution – no matter the
brand of component
SAVE
Faster Time from arrival
to production readiness
75% 1
£
¥
€
$
IBM NeXtScale – Flexibility
How Do You Want Your IT to Arrive?
 NeXtScale can be shipped fully configured
and ready to power on
– Fully racked and cabled
– Labeling with user supplied naming
– Pre programmed IMMs and addresses
– Burn in testing before shipment at no added cost
 Prefer to receive systems in boxes –
no problem
IBM Intelligent Cluster
1
Per Rack
105 lbs of cardboard1
54.6 ft3
of styrofoam
288 linear feet of wood
21,730 less paper inserts
Customer Benefits

IBM NeXtScale System
Workload Optimized Stack for Cloud and Technical Computing
19
Cloud
Technical Computing

IBM NeXtScale – Flexible
Designed on Open Standards = Seamless Adoption
IBM ToolsCenter OpenStack Ready
• Consolidated, integrated suite of mgmt tools
• Powerful bootable media creator, FW updating
• Deploy OpenStack with Chef or Puppet
• Mirantis Fuel, SuSE Cloud, IBM SmartCloud
UEFi and iMM IPMI 2.0 Compliant
• Standards-based hardware that combines
diagnostic and remote control; No embedded SW
• Richer management experience and
future-ready
• Use any IPMI compliant mgt. software – Puppet,
Avocent, IBM Director, iAMT, xCAT, etc.
• OpenIPMI, ipmitool, ipmiutils, FreeIPMI compatible
xCAT System Monitoring
• Provides remote & unattended methods to
assist with Deploying, Updating, Configuring,
and Diagnosing
• Friendly with open source tools like Ganglia,
Nagios, Zenoss, etc.
• Use with any RHEL/SuSE (and clones) or
Windows based tools
Platform Computing SDN Friendly
• Workloads managed seamlessly with
Platform LSF
• Deploy clusters easily with Platform HPC
• Networking direct to system; no integrated
proprietary switching
• Support for 1/10/40Gb, Infiniband, FCoE, and VFAs

IBM NeXtScale – Simplicity
NeXtScale will keep you in front (of the rack that is)
 Cold aisle accessibility to most components
 Tool-less access to servers
 Remove a server without touching it’s power
 Approved for 40O
C operation to lower
operating costs
 Front-access to networking cables & switches
 Simple cable routing
(front or traditional rear rack cabling)
 Power and LEDs all front facing
Which aisle would you rather
be working in?
Know what cable you are pulling!
Service NeXtScale from the front of the rack
65-80ºF
>100 ºF!

IBM NeXtScale – Scale
Start at any size. Grow in any increment you want.
Growing node by node?
 Available direct from IBM
 Optimized for availability through our partners
 Install the chassis today, grow into it tomorrow
Single nodes
and chassis
Configured
racks or chassis
Complete
clusters and
containers
Want to speed how quickly you can grow?
 Shipped fully assembled
 Client driven, choice optimized
 “Starter Pack” solutions are appliance easy, yet flexible
Growing by leaps and bounds?
 NeXtScale can arrive ready to power on – ‘personality’ applied
 Racks at a time or complete infrastructure ready containers
Single Nodes
Rack (s)
Chassis or Departmental
Solutions
Containers –
‘NeXtPods’

MORE
servers/rack6
2X16%
Amount of power
saved with
Platform LSF
Energy Aware4
15%
One nx360 with
SSDs delivers
same IO perf as
355Hard Disks
3X
35%
Maximize the capability of
your data center floor with
dense and essential IT
 More servers per floor tile
 Easy front access serviceability
 Choice of rack infrastructure
 Light weight + high performance can
reduce floor loading
Race Car Design – performance
and cost point ahead of features/
functions
 Fastest Xeon E5 2600 v2 processors
 Fast memory running at 1866Mhz
 Choice of SATA, SAS, or SSD on
board
 Open ecosystem of high speed
IO interconnects
40%
Less weight per
system5
More High
Frequency Cores1
50%
Processing
More cores per U
than a Xeon E-5
2600 1Us7
Lower power per
TFLOP of
performance8
Maximum impact per $. Per ft 2
. Per rack.
Customer
Benefits
Memory Runs
FASTER2

Announce:
Sep 10 2013
Shipping:
Oct 28 2013
6U Dense Chassis
1U tall 1/2 Wide
Compute
Departmental HPC
and Cloud
Computing Solution
PCI Native
Expansion
(PCI NEX)
1U (2U tall 1/2 Wide)
GPU or Xeon Phi
Support
Storage Native
Expansion (Storage
NEX)
1U (2U tall 1/2 Wide)
Up to 32TB total
capacity
6U Chassis will support mix-match nodes
IBM NeXtScale Product Roadmap
Announce:
Sep 10 2013
Shipping:
Nov 29 2013
Shipping:
2014
More Storage
More IO Options
Next Gen
Processors
MicroServers
A Lot More
Coming!

Primary Target Workloads
 >60% more drive bay capacity vs x3650 M4 for higher throughput & ample storage
 Flexible offering of SSDs & HDDs - up to 41.6 TB storage
 *50% more cores & cache, 50% greater performance, 17% greater memory speed
 12 Gb RAID on board for optimized RAID performance & data protection
*Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB. *Intel Test SPECjbb*2013 benchmark, 07/13. *Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz
Introducing System x3650 M4 HD
Ultimate high density storage server, optimized for analytics and business
critical workloads
 High Performance & Availability
 Flexible IO & storage options
 Easy Setup & Serviceability
 Energy Star compliance
 Advanced security
Data
Management
Big
Data
SAP /
Analytics

50%1
More Cores & Cache
50%2
More Performance
17%3
Faster Memory
40%4
Lower Power
Better Price Performance
System x3500 M4
1 Intel Xeon E5-2600 8C & 20MB cache vs E5-2600 v2 12C & 30MB 2 Intel E5-2690 vs E5-2697 v2 3 Intel Xeon E5-2600 1600MHz vs E5-2600 v2 1866MHz
4 Intel Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP, 8/13.
Improved systems with Intel Xeon processors
Unlock New Performance from a Family of Trusted Systems
Analytics, database,
cloud, VDI
iDataPlex dx360 M4
High performance & cloud computing
System x3550 M4
Cloud, VDI, analytics, big data, HPC
System x3650 M4
Cloud, VDI, Analytics, Database, HPC
Virtualization, Cloud,
Big Data
Flex System x240
BladeCenter HS23
Cloud, VDI, Analytics,
Database, HPC

Re-Architecting the Data Center
For a Services Oriented World
Shannon Poulin
Vice President, Datacenter and Connected Systems Group
General Manager, Datacenter Marketing Group
Intel Corporation

Intel + IBM: Rich History of Innovation
28
System Solutions
Software Solutions
Networking
Storage
New Business +
Opportunities
Technology Development
Bluetooth, Infiniband,
PCIeG3, Xen, KVM, Java,
Linux Kernel, Hadoop
Industry
Enablement
Blade.org
PCI.org
Open Source
Joint
Collaboration
eX5, BladeCenter, IBM
Flex Systems &
NeXtScale

IT: Period of Transformation
Focused on
Productivity
through
automation
Focused on
Rapid Service
Delivery
through cloud & devices
Focused on
Cost Reduction
through
connectivity
Computer-Centric Network-Centric Human-Centric
‘90s ‘00s Today

INTEL CONFIDENTIAL
Re-architecture of the Datacenter Needed
1: Source: Intel IT internal estimate
Datacenter Today Software-defined
Infrastructure
Time to Provision New
Service: Minutes1
Time to Provision New
Service: Months1
Idea for
service
IT scopes
Needs
Balance user
demands
Idea for
service
Internet
of things
Private
Public
Self service
orchestration
Infrastructure
resources composed
Service
running
Manually configureManually configure
devicesdevices
Set up serviceSet up service
componentscomponents
Service
running
SW components
assembled

INTEL CONFIDENTIAL
Software Defined Infrastructure on Intel
OPEN: Standards based
EFFICIENT: Intelligent and scalable
AGILE: Software on high volume servers
Storage ServerNetwork

Launched Today:
Intel®
Xeon®
Processor E5-2600 v2 Product Family
At the Heart of a Modern Data Center
Energy Efficient
Up to 45% greater energy efficiency1
High Performance
Up to 50% more performance2
50% more cores and cache (up to 12C, 30MB)
Faster DDR3 memory (up to 1866 MTS)
Datacenter Class
Up to 1.5 TB memory support (in 2S system)
Improved PCI Express* 3.0 to unleash
10GbE
Virtualization and Security innovation
Workload Optimized
Advanced Vector Extensions
IO optimized for Intel ® Xeon Phi ™
Processors
Balanced for Big Data & Intel®
Distribution for Apache Hadoop* software
IA Software Compatibility
Leverages Existing SW Ecosystem
IN PRODUCTION NOW!
Intel Xeon Processor E5-2600 v2
1
Software and workloads used in performance tests may have been optimized for performance only on Intel
microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific
computer systems, components, software, operations and functions. Any change to any of those factors may
cause the results to vary. You should consult other information and performance tests to assist you in fully
evaluating your contemplated purchases, including the performance of that product when combined with
other products. For more information go to http://www.intel.com/performance
Intel does not control or audit the design or implementation of third party benchmark data or Web sites
referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others
where similar performance benchmark data are reported and confirm whether the referenced benchmark
data are accurate and reflect performance of systems available for purchase. *Other names and brands may
be claimed as the property of others. Configuration - Server-Side Java* Energy Efficiency: E5-2690 (32GB),
E5-2697 v2 (32GB)
Versatile
Datacenter
Processor
powering
IBM’s
NeXtScale
System
32

Adrian Wander
Director
Scientific Computing Department
of STFC
Cliff Brereton
Director
Hartree Centre

Maximum impact per $. Per ft 2
. Per rack.
1. Intel Xeon E-5 26xx v2 versus current Intel Xeon3-5 26xx
2. Memory DIMMs running at 1866Mhz versus 1600Mhz in current platforms
3. 4 nx360 M4 includes 4 x 1.8” SSDs run which run faster than traditional 2.5” SAS HDDs. SSDs deliver peak performance of 40,000 IOPS versus HDDs at peak of
450 IOPS. 4 x 50,000 = 200,000 IOPS which is equivalent to 355 2.5” HDDs
4. Based on A 1000 node cluster with 2 x86 sockets, 8 core 2.7 GHz, consumes about 340 KW. No hardware changes – optimization of power useage at rest and at
peak utilization.
5. Europe (0.15€ per KWh) = 441K€ per year
6. US (0.10$ per KWh) = US$ 295K per year
7. Asia (0.20$ per KWh) = US$ 590K per year
8. As compared to a traditional 1U server like HP DL360 Gen 8 – needs weights for each
9. As compared to a traditional 1U server like HP DL 360 Gen 8 in a 42U rack – DL 360 = 42 system max, NeXtScale = 84 systems max
10.As compared to a traditional 1U server like HP DL360 Gen 8 with Intel E-5 2600 processors. NeXtScale nx360 M4 with E-5 26xx v2 = 24 cores/system and 48
cores/U, HP 360 Gen8 with top bin E-5 2690 at 16 cores per system and per U.
11. Need to get from Intel – v1 compare to v2
12.As compared to a a traditional 1U server like HP DL360 Gen 8 Weight (maximum config) 17.69kg (39lbs) versus NeXtScale nx360 M4 (6.05kg) + apportioned
chassis (39kg/12 or 3.25kg) = 9.30kg. 9.30 v 17.69 = 47% less weight.
13.Calculation based on typical Intel E5 2600 2.6Ghz 8C top bin processor system compared to typical Intel E5 2600 v2 2.7Ghz 12C top bin processor system. 2
sockets. TFLOPs/2S 2600 v1 = 332.8GFLOPs . TFLOPs/2S 2600 V2 = 518GFLOPs. To achieve 1TFLOP we need 3 v1 systems at 450W each versus 2 v2
systems at 440W each
MORE servers/rack6
2X
3X
35%
40%
Less weight per system5
More cores per U than a
Xeon E-5 2600 1Us7
Lower power per TFLOP
of performance8
16%
Amount of power saved with
Platform LSF Energy Aware4
15%
One nx360 with SSDs
delivers same IO perf as
355Hard DisksMore High Frequency Cores1
50%
Processing
Memory Runs
FASTER2

36
Legal DisclaimersLegal Disclaimers
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark andSoftware and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary.MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary.
You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product whenYou should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products.combined with other products.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visitIntel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit
the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflectthe referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect
performance of systems available for purchase.performance of systems available for purchase.
Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. RelativeRelative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative
performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results ofperformance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of
each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.
SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. SeeSPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.orghttp://www.spec.org for morefor more
information.information.
Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PCIntel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC
manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology,manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology,
visitvisit http://www.intel.com/info/hyperthreadinghttp://www.intel.com/info/hyperthreading..
Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available onIntel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on
select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visitselect Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit
http://www.intel.com/go/turbohttp://www.intel.com/go/turbo
Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder atIntel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/http://ark.intel.com/ or contact your Intel representative for more information.or contact your Intel representative for more information.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
http://www.intel.com/products/processor_numberhttp://www.intel.com/products/processor_number
Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and productsIntel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products
specified are for planning purposes only and are subject to change without notice.specified are for planning purposes only and are subject to change without notice.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of recordIntel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record
product roadmaps.product roadmaps.
Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or itsCopyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries.subsidiaries in the United States and other countries.
All dates and products specified are for planning purposes only and are subject to change without noticeAll dates and products specified are for planning purposes only and are subject to change without notice
*Other names and brands may be claimed as the property of others.*Other names and brands may be claimed as the property of others.
* Other names and brands may be claimed as the property of others.

37
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCHTO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OFPRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF
INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANYINTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE ORA "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR
USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORSUSE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS
AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES ANDAND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND
REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANYREASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY
WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, ORWAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR
WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features orIntel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising frominstructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. CurrentThe products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htmhttp://www.intel.com/design/literature.htm
* Other names and brands may be claimed as the property of others.

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change withoutAll products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without
notice.notice.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not acrossIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families. Go to: http://www.intel.com/products/processor_numberdifferent processor families. Go to: http://www.intel.com/products/processor_number
Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviateIntel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate
from published specifications. Current characterized errata are available on request.from published specifications. Current characterized errata are available on request.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM).Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM).
Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not beFunctionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be
compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualizationcompatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization
No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computerNo computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer
system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-
compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visitcompatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit
http://www.intel.com/technology/securityhttp://www.intel.com/technology/security
Intel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logoIntel, Intel Xeon, Intel Atom, Intel Xeon Phi, Intel Itanium, the Intel Itanium logo, the Intel Xeon Phi logo, the Intel Xeon logo and the Intel logo
are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Other names and brands may be claimed as the property of others.Other names and brands may be claimed as the property of others.
Copyright © 2013, Intel Corporation. All rights reserved.Copyright © 2013, Intel Corporation. All rights reserved.

Baseline Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2690 (2.9GHz, 8-core , 20MB L3 cache,
8.0GT/s, 135W), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Balanced Perf Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG),
Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score: 4,033. Source: Intel TR#1299 as of 12 Aug 2013.
New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache,
8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf
Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013.
Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2Baseline Configuration and Score on SPECpower*_ssj2008 benchmark: IBM System x3650 M2 withwith two Intel® Xeon® Processortwo Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache,X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s,6.4 GT/s, 95W)95W),, 8GB memory (48GB memory (4
x 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 Windows Server 2008 amd64-64 jvmx 2048MB DDR3-10600R CL9 ECC), 32 GB SATA SSD, Microsoft* Windows Server 2008 Enterprise Edition x64 SP1, IBM J9 VM (build 2.4, J2RE 1.6.0 IBM J9 2.4 Windows Server 2008 amd64-64 jvm
pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source:pwa6460sr5-20090406_01(SR5) (JIT enabled, AOT enabled). Source: http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090519-00165.html as of June 2009http://www.spec.org/power_ssj2008/results/res2009q2/power_ssj2008-20090519-00165.html as of June 2009. Score:1,977. Score:1,977
New Configuration and Score on Server-Side Java* Energy Efficiency benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache,
8.0GT/s, 130W, C0-stepping), Hardware Prefetcher: Disabled; MLC Spatial Prefetcher: Disabled, DCU Streamer: Disabled; DCU IP: Enabled; Hyper-threading: Enabled; Turbo: Enabled; Balanced Perf
Mode, 32GB memory (8 x 4GB DDR3L-1600 ECC REG), Microsoft* Windows Server 2008 R2 SP1, IBM J9 VM 1.7.0. Score : 5,670. Source: Intel TR#1299 as of 12 Aug 2013.
Baseline Configuration and Score on SPECint*rate_base2006 Benchmark: BL265 using two Intel® Xeon® Processor X5570 (2.93 GHz, 4-core, 8MB L3 cache, 6.4 GT/s, 95W), 48GB memory (12x 4GB
2Rx4 PC3-10600R-9, ECC), 73 GB SAS 10 K RPM, SUSE Linux Enterprise Server 11 (x86_64) SP1, Kernel 2.6.32.12-0.7-default. Compiler version: Intel C++ Compiler XE for applications running on IA-32
Version 12.0.1.116 Build 20101116. Source: http://www.spec.org/cpu2006/results/res2011q1/cpu2006-20110215-14599.html as of Feb 2011. Score: 264.
New Configuration and Score on SPECint*rate_base2006 Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s,
130W, C0-stepping) , EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 128GB memory (8x16GB DDR3-1866), Red Hat* Enterprise Linux Server 6.3. CPU2006-1.2 with Intel compiler IC13.1
Source Intel TR#1270 as of 11 June 2013. Estimated Score: 906.
Baseline Configuration and Score on Benchmark: Intel® Server Board S2600GL platform with two Intel® Xeon® Processor E5-2690 (2.9GHz, 8-core, 20MB L3 cache, 8.0GT/s, 135W, C2-stepping),
Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1333 DR REG
ECC), 128GB SATA SSD, ESXi4.1u1 (build 348481). Source: Intel TR#1359 as of 24 July 2013. Score: 1723 @ 108VMs.
New Configuration and Score on Benchmark: Intel® Server Board S2600CP platform with two Intel® Xeon® Processor E5-2697 v2 (2.7GHz, 12-core, 30MB L3 cache, 8.0GT/s, 130W, C0-stepping),
Virtualization Technology Enabled, Turbo Enabled, HT Enabled, NUMA Enabled, MLC Spatial Prefetcher Enabled, DCU Data Line Prefetcher Enabled, 256GB memory (16x 16GB DDR3-1866 DR REG
ECC), 128GB SATA SSD, ESXi 5.1(build 799733). Source: Intel TR#1359 as of 24 July 2013. Score: 2246 @ 144VMs

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