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SUPER SPEED USB3.0


                     1
INTRODUCTION
• The USB 3.0 Promoter Group announced on
  November 17, 2008, version 3.0 and
  submitted to USB-IF
• The first certified USB 3.0 consumer products
  were announced January 5, 2010




                                           2
UNIVERSAL SERIAL BUS

• Designed to allow many peripherals to be
  connected using a single standardized
  interface socket.
• Consists of a host, USB ports, and peripheral
  devices connected in a tiered-star topology
• Also called as Superspeed
• Provides power to low power consuming
  devices

                                           3
Pre-releases
1      USB-IF formed

1      USB 1.0 specification   12 Mbit/s

1      USB 2.0 specification        480 Mbit/s

1      USB 3.0 specification         5 Gbit/s

2010    USB 3.0 devices in market

                                                4
Architectural components
Hub
  Provides electrical interface between
devices and host.
  Functionalities
  Types
Host
  Types
  Functionalities
                                          5
DUAL BUS ARCHITECTURE
• USB 3.0 is a
  physical
  SuperSpeed
  bus combined
  in parallel with
  a physical USB
  2.0 bus



                          6
SUPER SPEED CONNECTION

Device notifies it is connected

Host makes request

Device ready notifies this with ERDY

Else tells host unavailable to process by sending
NRDY

                                               7
Physical structure

Cable structure
Connector pins




                           8
CABLE STRUCTURE




• One power pair
• One twisted signal pair for USB 2.0 data path
• Two twisted signal pairs for the SuperSpeed
  data path.
• Supports full duplex mode
                                          9
CONNECTOR PINS




                 10
FEATURES
•   Transfer Rate
•   Backward compatibility
•   Power specifications
•   Cable length
•   Transfer mode




                             11
USB 3.0 vs USB2.0
   USB 3.0          USB 2.0
•Super speed      High speed

•900 mA power     500 mA
•Full duplex      Half duplex




                                12
ADVANTAGES
•   Super speed
•   Power efficiency
•   Efficient when compared to its competitors
•   Backward compatibility
           DRAWBACKS
• Cable length is limited to 3m.
• Intel at present not supporting

                                           13
CONCLUSION
• USB 3.0 wil also be popular like earlier
  versions.
• As it is backward compatible it will be used in
  the new computers and devices
• High speed communication protocol.




                                            14
REFERENCES
[1] en.wikipedia.org/wiki/Universal_Serial_Bus
[2]USB 3.0 specification released by USB
consortium www.usb.org/developers/docs
[3] www.inno-logic.com/resourcesUSB3.html
[4] deviceguru.com/superspeed-usb-promises5gbps




                                          15
23/01/12
THANK YOU

            17

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Super speed usb3.0

  • 2. INTRODUCTION • The USB 3.0 Promoter Group announced on November 17, 2008, version 3.0 and submitted to USB-IF • The first certified USB 3.0 consumer products were announced January 5, 2010 2
  • 3. UNIVERSAL SERIAL BUS • Designed to allow many peripherals to be connected using a single standardized interface socket. • Consists of a host, USB ports, and peripheral devices connected in a tiered-star topology • Also called as Superspeed • Provides power to low power consuming devices 3
  • 4. Pre-releases 1 USB-IF formed 1 USB 1.0 specification 12 Mbit/s 1 USB 2.0 specification 480 Mbit/s 1 USB 3.0 specification 5 Gbit/s 2010 USB 3.0 devices in market 4
  • 5. Architectural components Hub Provides electrical interface between devices and host. Functionalities Types Host Types Functionalities 5
  • 6. DUAL BUS ARCHITECTURE • USB 3.0 is a physical SuperSpeed bus combined in parallel with a physical USB 2.0 bus 6
  • 7. SUPER SPEED CONNECTION Device notifies it is connected Host makes request Device ready notifies this with ERDY Else tells host unavailable to process by sending NRDY 7
  • 9. CABLE STRUCTURE • One power pair • One twisted signal pair for USB 2.0 data path • Two twisted signal pairs for the SuperSpeed data path. • Supports full duplex mode 9
  • 11. FEATURES • Transfer Rate • Backward compatibility • Power specifications • Cable length • Transfer mode 11
  • 12. USB 3.0 vs USB2.0 USB 3.0 USB 2.0 •Super speed High speed •900 mA power 500 mA •Full duplex Half duplex 12
  • 13. ADVANTAGES • Super speed • Power efficiency • Efficient when compared to its competitors • Backward compatibility DRAWBACKS • Cable length is limited to 3m. • Intel at present not supporting 13
  • 14. CONCLUSION • USB 3.0 wil also be popular like earlier versions. • As it is backward compatible it will be used in the new computers and devices • High speed communication protocol. 14
  • 15. REFERENCES [1] en.wikipedia.org/wiki/Universal_Serial_Bus [2]USB 3.0 specification released by USB consortium www.usb.org/developers/docs [3] www.inno-logic.com/resourcesUSB3.html [4] deviceguru.com/superspeed-usb-promises5gbps 15
  • 17. THANK YOU 17

Notas del editor

  1. USB-IF,managing body of usb specification The USB 3.0 Promoter Group announced on November 17, 2008, that version 3.0 of the specification had been completed and was transitioned to the USB Implementers Forum (USB-IF), the managing body of USB specifications. [57] This move effectively opened the specification to hardware developers for implementation in future products. The first certified USB 3.0 consumer products w at the Las Vegas Consumer Electronics Show (CES), including two motherboards by ASUS and Gigabyte Technology. [
  2. Additional USB hubs may be included in the tiers
  3. USB MILESTONES 2009 NEC ships world's first USB 3.0 host silicon SuperSpeed USB logo debuted Linux begins native USB 3.0 support 2008 USB 3.0 specs released 2005 Wireless USB 1.0 specs released 2002 Windows XP SP1 supports USB 2.0 natively 2001 USB OTG specification released. 2000 USB 2.0 specs released USB started to gain reputation as a mainstream bus technology 1998 Apple shipped iMac with USB ports only USB 1.1 specification released 1997 USB-IF membership increased to over 400 companies Over 500 USB products were in development worldwide 1996 USB 1.0 specs released First USB product introduced. First USB Plugfest compliance workshop held. 1995 USB Implementers Forum (USB-IF) formed with an initial membership of 340 companies 2001 usb otg, 2005 wireless usb1.0, 480 Mbit/s (now called "Hi-Speed" ). achieve 3.2 Gbit/s (0.4 GByte/s or 400 MByte/s)superspeed 2009 Linux began USB 3 support
  4. Simultaneously 2 cannot be connected….,provides backward compatibility
  5. 6 billion deivices sold,25gb in 70 seconds
  6. Increase battery power of lap