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White Paper:
Evaluating MLC vs TLC vs V-NAND
Choosing the Right SSD for Enterprise Applications
Enterprise applications have
become much more versatile
within the past decade, due to
the rise of Internet-connected
devices such as smartphones
and tablets. As the amount of
data that are generated every
day is growing and devices are
shifting away from high-capacity
local storage to cloud storage,
the requirements for enterprise
storage are changing and cost
considerations are becoming
more critical.
Today, there are numerous
classes of enterprise solid
state drives (SSDs) for different
applications, each with unique
performance and endurance
characteristics. One of the most
critical differentiators is the
underlying NAND technology,
which has been developing
rapidly in the past decade with
new innovations such as Multi-
Level Cell (MLC) and Vertical
NAND (V-NAND) technologies.
Choosing the right SSD for the
application is not necessarily an
easy task given the complexity
of the differences between
various NAND technologies.
This whitepaper explains the
fundamental characteristics of
two-bit-per-cell (MLC) and three-
bit-per-cell (3-bit MLC or TLC)
NAND technologies, as well as
the inherent scaling limitations of
planar NAND and how vertical
NAND (V-NAND) technology
solves these issues with our
innovative vertical structure.
Understanding the basics
of NAND is the key to
understanding performance,
endurance and cost differences
between SSDs, which is
essential for making an educated
purchase for your specific
enterprise application.
When NAND was invented in the
late 1980s, it was only capable
of storing one bit per cell. It
took nearly two decades of
engineering work before the first
SSD based on MLC NAND with
two bits per cell was introduced
by Samsung in 2007. Ever since
then, the industry has been
moving more and more towards
MLC technology and today,
SLC only accounts for a few
per cents of total NAND flash
output. Recently, triple-level-cell
(3-bit MLC) NAND has also been
gaining popularity, with Samsung
being the first manufacturer to
introduce it to its client SSDs in
2012 and to enterprise SSDs
two years later.
The SSD and NAND industries
have been adopting multi-
level cell technology due to the
increased cost efficiency. NAND
cost is dictated primarily by
the number of gigabytes each
wafer yields and historically there
have been two ways to achieve
increases. The first is to shrink
individual cells through traditional
lithography and multi-patterning
technologies. By making each
cell smaller, it’s possible to fit
more cells in a wafer, which
yields more gigabytes and thus
reduces the manufacturing
cost of each gigabyte. The
whole semiconductor industry
relies on lithography shrinks
to either provide lower cost
by reducing the die size, or by
adding more transistors per
die to deliver more functionality
or higher performance. While
lithography is the cornerstone
of semiconductor scaling, it has
become less cost effective in
recent years.
The second way is to add more
bits per cell. NAND flash works
by trapping electrons in an
insulated floating gate, which
creates a charge inside the cell.
SLC NAND cells only have two
states: charged (0) and non-
charged (1), whereas 2-bit MLC
NAND has four and 3-bit MLC
NAND eight to differentiate all the
possible bit outputs that two or
three bits can have.
Evaluating MLC vs TLC vs V-NAND
History of Multi-Level Cell NAND Flash
EMC Digital Universe Study, IDC
The Digital Universe by 2020
Zettabytes
of Data
44
Both cost scaling methods
have a negative impact on the
endurance and performance
of NAND. Making cells smaller
reduces the number of available
electrons that can be used to
differentiate between voltage
states and additionally, by
bringing cells closer to each
other and thinning the insulators
around the floating gate, the
cells become more vulnerable
to interference from neighboring
cells.
As NAND goes through program
and erase (P/E) cycles, the
tunnel oxide wears out due to
the stress caused by the strong
electric field, which is required
to tunnel electrons through the
insulating oxide to the floating
gate. This generates holes
inside the oxide structure, which
act as escape paths for the
electrons in the floating gate.
Electrons may also get trapped
in the holes during the tunneling
process. Because NAND flash
differentiates bit values based
on the voltage state of the
floating gate, electron leakage
and trapping may alter the state
from the correct one, making
the cell unreliable.
Increasing the number of bits
per cell makes matters worse
because 3-bit MLC NAND
needs to differentiate between
eight voltage states, while MLC
NAND has only four. That makes
3-bit MLC NAND less tolerant
against cell-to-cell interference
and electron leakage/
trapping, because it takes less
interference and fewer electrons
to change the state of a cell.
Similarly, 3-bit MLC NAND
requires more program-verify
iterations than MLC NAND,
as every bit is programmed
separately and the voltage
distribution of each state is
much finer, requiring a very
specific number of electrons in
the floating gate.
This all leads to 3-bit MLC
NAND having lower write
endurance and performance
compared to MLC NAND,
but read endurance and
performance are barely affected.
Because reading from NAND
works by simply sensing
the charge in the cell, the
read performance difference
between MLC and 3-bit MLC
is practically negligible in real-
world applications. Similarly,
as reading doesn’t involve a
stressful electron tunneling
process, reads induce
substantially less strain on
cells. Whereas write cycles are
measured in thousands or tens
of thousands, read cycles run
in hundreds of millions even for
3-bit MLC NAND.
The Downsides of NAND Flash Cost Scaling
1 0
11 10 01 00
Single Level Cell (SLC) NAND
NAND Flash Types
Multi Level Cell (MLC) NAND
Tri Level Cell (TLC) NAND
000 001 010 011 100 101 110 111
As explained above, NAND has
traditionally been scaled by
shrinking the lithography, and in
the past decade, multiple bits
per cell have been introduced
to further scale the cost
down, but both methods are
now starting to become less
effective. These methods are
actually counteractive because
as cell size and the number of
electrons scale down, storing
multiple bits per cell becomes
even more difficult and creates
serious endurance and reliability
concerns.
To continue cost scaling in
the future, semiconductor
manufacturer have introduced
3D or Vertical NAND, stacking
multiple cells in layers. Samsung
was the first manufacturer to
begin production of its V-NAND
in 2013, with the first V-NAND-
based SSDs released a year
later.
V-NAND works by stacking
multiple layers in order to create
“cell towers.” Scaling to the
third dimension takes away
the lithography stress because
instead of making cells smaller,
cost reduction can be achieved
by increasing the number of
layers. Samsung is currently
shipping its second generation
32-layer V-NAND, and third
generation 48-layer V-NAND is
going into production in October
2015.
Because the high number of
layers brings considerable
density improvement, the cells
don’t have to be packed as
closely. Samsung has actually
moved to much larger 30nm-
class lithography, whereas
modern planar NAND is
manufactured using 15-20nm
lithography. As cells are larger
with more available electrons
and distance between cells
is greater, V-NAND is able to
provide tremendous endurance
and performance gains over
planar NAND.
V-NAND: Enter the Third Dimension of Scaling
Cell to cell interference
occurs under 20nm
2D Planar NAND Flash
30nm
Vertical NAND Flash
2.5 billion holes in
an area the size
of a fingertip
32ormorelayers
10nm
Transforming NAND in an Upward Direction
For more details about
V-NAND and how it differs
from planar NAND, please
refer to this Samsung
V-NAND technology
whitepaper.
LEARN MORE
For the majority of client
applications, 3-bit MLC NAND
provides the necessary write
endurance and performance
because consumers do not
usually write more than 20
gigabytes of data per day and
disk activity is based on bursts
of IOs. However, enterprise IO
workloads are more complicated
because there are many different
applications, each with unique
characteristics. Enterprise
workloads can, however, be
roughly divided into categories
by their write-intensity.
Read-centric workloads
include applications such
as cloud storage, media
streaming and web servers.
In these applications, data is
written once but is rarely, if
ever, modified, yet it may be
accessed by millions of people.
3-bit MLC NAND is perfect for
such applications because it
offers read performance very
similar to MLC NAND, but at a
substantially lower cost. Many
read-intensive applications
require very large amounts of
storage (consider Netflix and
Facebook as examples), but
as the data is mostly read-only,
the applications do not usually
need more than one drive write
per day (DWPD) in endurance,
making 3-bit MLC an ideal
choice because of its lower
cost.
For mixed workloads, the
choice of NAND depends on
the amount of write activity.
Because V-NAND technology
offers much higher endurance
over planar NAND, 3-bit MLC
V-NAND can be used for
mixed workloads with low
write endurance needs –
1 DWPD or less. For example,
desktop virtualization (VDI) is
typically not very write-intensive
in office environments, and
3-bit MLC V-NAND can meet
the endurance needs for such
workloads.
On the other hand, applications
such as online analytical
processing (OLAP) tend to
require higher endurance
than 1 DWPD and are hence
best served by MLC V-NAND,
which can scale to up to 10
DWPD with configurable over-
provisioning offered in the
Samsung SM863 Series.
Use cases such as real-time
financial trading and online
transaction processing are
great examples of very write-
intensive and performance-
sensitive applications. Because
these applications generate
a lot of write IOs and even a
millisecond of additional latency
may result in a lost trade or sale,
the higher endurance and write
performance of MLC V-NAND
is required for such critical
applications.
In most enterprise workloads,
the path to the lowest total cost
of ownership (TCO) is to utilize
the benefits of both 3-bit MLC
and MLC technologies through
tiering. Files that have a lot of
write activity can be kept in the
more durable MLC-based SSDs,
while files that are read-only or
accessed more infrequently can
be moved to a lower tier that is
based on 3-bit MLC SSDs.
Choosing the Right NAND for Enterprise Applications
Content Delivery
Network
Drive writes
per day
Application
Workload
Suitable
NAND Type
Web
Server
Application
Server
Database
Server
0.35 DWPD 10 DWPD
3 bit 2 bit
Read-intensive Write-intensive
Mixed Pattern
The choice between 2-bit and
3-bit MLC depends on the
application and its performance
and endurance requirements.
For read-intensive applications,
3-bit MLC is an obvious choice
because it delivers the same level
of performance at a substantially
lower cost per gigabyte. The use
of 3-bit MLC V-NAND technology
in the Samsung PM863, rated
for 1 DWPD, also extends the
usability from strictly read-centric
applications to some mixed
workloads with low write activity.
While V-NAND technology
increases write endurance, 3-bit
MLC is still inherently slower and
less durable than 2-bit MLC, so
it is not ideal for write-intensive
applications. For mixed and write-
intensive workloads, Samsung
offers the SM863, which comes
standard with 3 DWPD but can
be over provisioned to reach
endurance of up to 10 DWPD.
The lower cost per gigabyte
that 3-bit MLC offers may
seem alluring, but MLC actually
provides a better TCO for write-
intensive applications because
drives need to be replaced less
frequently due to the higher
endurance.
Learn more: samsung.com/enterprisessd | 1-800-SAMSUNG | 1-866-SAM4BIZ
Follow us: youtube.com/samsungbizusa | @SamsungBizUSA
© 2015 Samsung Electronics America, Inc. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd.
All products, logos and brand names are trademarks or registered trademarks of their respective companies. This white paper is for
informational purposes only. Samsung makes no warranties, express or implied, in this white paper.

WHP-SSD-MLCvsTLC-OCT15J
Conclusion
About the Author
Kristian Vättö is a technical marketing specialist and
started his career as a news editor at AnandTech.com
in 2011. He later became the site’s SSD editor and
was responsible for producing highly-detailed and
professional SSD reviews. In addition to his work with
Samsung, Kristian is currently studying economics at
the University of Tampere in Finland.
	 *Pricing is as of October, 2015 and subject to change
	**TBW = TeraBytes Written
***1 GigaByte = 1 000 000 000 bytes
SM863 PM863
MSRP (960GB) $639.99 $549.99
Endurance (960GB) 6,160 TBW* 1,400 TBW
Price per Gigabyte $0.67/GB** $0.57/GB
Price per TBW $0.10/TBW $0.39/TBW

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Evaluating MLC vs TLC vs V-NAND for Enterprise SSDs – Whitepaper

  • 1. White Paper: Evaluating MLC vs TLC vs V-NAND Choosing the Right SSD for Enterprise Applications
  • 2. Enterprise applications have become much more versatile within the past decade, due to the rise of Internet-connected devices such as smartphones and tablets. As the amount of data that are generated every day is growing and devices are shifting away from high-capacity local storage to cloud storage, the requirements for enterprise storage are changing and cost considerations are becoming more critical. Today, there are numerous classes of enterprise solid state drives (SSDs) for different applications, each with unique performance and endurance characteristics. One of the most critical differentiators is the underlying NAND technology, which has been developing rapidly in the past decade with new innovations such as Multi- Level Cell (MLC) and Vertical NAND (V-NAND) technologies. Choosing the right SSD for the application is not necessarily an easy task given the complexity of the differences between various NAND technologies. This whitepaper explains the fundamental characteristics of two-bit-per-cell (MLC) and three- bit-per-cell (3-bit MLC or TLC) NAND technologies, as well as the inherent scaling limitations of planar NAND and how vertical NAND (V-NAND) technology solves these issues with our innovative vertical structure. Understanding the basics of NAND is the key to understanding performance, endurance and cost differences between SSDs, which is essential for making an educated purchase for your specific enterprise application. When NAND was invented in the late 1980s, it was only capable of storing one bit per cell. It took nearly two decades of engineering work before the first SSD based on MLC NAND with two bits per cell was introduced by Samsung in 2007. Ever since then, the industry has been moving more and more towards MLC technology and today, SLC only accounts for a few per cents of total NAND flash output. Recently, triple-level-cell (3-bit MLC) NAND has also been gaining popularity, with Samsung being the first manufacturer to introduce it to its client SSDs in 2012 and to enterprise SSDs two years later. The SSD and NAND industries have been adopting multi- level cell technology due to the increased cost efficiency. NAND cost is dictated primarily by the number of gigabytes each wafer yields and historically there have been two ways to achieve increases. The first is to shrink individual cells through traditional lithography and multi-patterning technologies. By making each cell smaller, it’s possible to fit more cells in a wafer, which yields more gigabytes and thus reduces the manufacturing cost of each gigabyte. The whole semiconductor industry relies on lithography shrinks to either provide lower cost by reducing the die size, or by adding more transistors per die to deliver more functionality or higher performance. While lithography is the cornerstone of semiconductor scaling, it has become less cost effective in recent years. The second way is to add more bits per cell. NAND flash works by trapping electrons in an insulated floating gate, which creates a charge inside the cell. SLC NAND cells only have two states: charged (0) and non- charged (1), whereas 2-bit MLC NAND has four and 3-bit MLC NAND eight to differentiate all the possible bit outputs that two or three bits can have. Evaluating MLC vs TLC vs V-NAND History of Multi-Level Cell NAND Flash EMC Digital Universe Study, IDC The Digital Universe by 2020 Zettabytes of Data 44
  • 3. Both cost scaling methods have a negative impact on the endurance and performance of NAND. Making cells smaller reduces the number of available electrons that can be used to differentiate between voltage states and additionally, by bringing cells closer to each other and thinning the insulators around the floating gate, the cells become more vulnerable to interference from neighboring cells. As NAND goes through program and erase (P/E) cycles, the tunnel oxide wears out due to the stress caused by the strong electric field, which is required to tunnel electrons through the insulating oxide to the floating gate. This generates holes inside the oxide structure, which act as escape paths for the electrons in the floating gate. Electrons may also get trapped in the holes during the tunneling process. Because NAND flash differentiates bit values based on the voltage state of the floating gate, electron leakage and trapping may alter the state from the correct one, making the cell unreliable. Increasing the number of bits per cell makes matters worse because 3-bit MLC NAND needs to differentiate between eight voltage states, while MLC NAND has only four. That makes 3-bit MLC NAND less tolerant against cell-to-cell interference and electron leakage/ trapping, because it takes less interference and fewer electrons to change the state of a cell. Similarly, 3-bit MLC NAND requires more program-verify iterations than MLC NAND, as every bit is programmed separately and the voltage distribution of each state is much finer, requiring a very specific number of electrons in the floating gate. This all leads to 3-bit MLC NAND having lower write endurance and performance compared to MLC NAND, but read endurance and performance are barely affected. Because reading from NAND works by simply sensing the charge in the cell, the read performance difference between MLC and 3-bit MLC is practically negligible in real- world applications. Similarly, as reading doesn’t involve a stressful electron tunneling process, reads induce substantially less strain on cells. Whereas write cycles are measured in thousands or tens of thousands, read cycles run in hundreds of millions even for 3-bit MLC NAND. The Downsides of NAND Flash Cost Scaling 1 0 11 10 01 00 Single Level Cell (SLC) NAND NAND Flash Types Multi Level Cell (MLC) NAND Tri Level Cell (TLC) NAND 000 001 010 011 100 101 110 111
  • 4. As explained above, NAND has traditionally been scaled by shrinking the lithography, and in the past decade, multiple bits per cell have been introduced to further scale the cost down, but both methods are now starting to become less effective. These methods are actually counteractive because as cell size and the number of electrons scale down, storing multiple bits per cell becomes even more difficult and creates serious endurance and reliability concerns. To continue cost scaling in the future, semiconductor manufacturer have introduced 3D or Vertical NAND, stacking multiple cells in layers. Samsung was the first manufacturer to begin production of its V-NAND in 2013, with the first V-NAND- based SSDs released a year later. V-NAND works by stacking multiple layers in order to create “cell towers.” Scaling to the third dimension takes away the lithography stress because instead of making cells smaller, cost reduction can be achieved by increasing the number of layers. Samsung is currently shipping its second generation 32-layer V-NAND, and third generation 48-layer V-NAND is going into production in October 2015. Because the high number of layers brings considerable density improvement, the cells don’t have to be packed as closely. Samsung has actually moved to much larger 30nm- class lithography, whereas modern planar NAND is manufactured using 15-20nm lithography. As cells are larger with more available electrons and distance between cells is greater, V-NAND is able to provide tremendous endurance and performance gains over planar NAND. V-NAND: Enter the Third Dimension of Scaling Cell to cell interference occurs under 20nm 2D Planar NAND Flash 30nm Vertical NAND Flash 2.5 billion holes in an area the size of a fingertip 32ormorelayers 10nm Transforming NAND in an Upward Direction For more details about V-NAND and how it differs from planar NAND, please refer to this Samsung V-NAND technology whitepaper. LEARN MORE
  • 5. For the majority of client applications, 3-bit MLC NAND provides the necessary write endurance and performance because consumers do not usually write more than 20 gigabytes of data per day and disk activity is based on bursts of IOs. However, enterprise IO workloads are more complicated because there are many different applications, each with unique characteristics. Enterprise workloads can, however, be roughly divided into categories by their write-intensity. Read-centric workloads include applications such as cloud storage, media streaming and web servers. In these applications, data is written once but is rarely, if ever, modified, yet it may be accessed by millions of people. 3-bit MLC NAND is perfect for such applications because it offers read performance very similar to MLC NAND, but at a substantially lower cost. Many read-intensive applications require very large amounts of storage (consider Netflix and Facebook as examples), but as the data is mostly read-only, the applications do not usually need more than one drive write per day (DWPD) in endurance, making 3-bit MLC an ideal choice because of its lower cost. For mixed workloads, the choice of NAND depends on the amount of write activity. Because V-NAND technology offers much higher endurance over planar NAND, 3-bit MLC V-NAND can be used for mixed workloads with low write endurance needs – 1 DWPD or less. For example, desktop virtualization (VDI) is typically not very write-intensive in office environments, and 3-bit MLC V-NAND can meet the endurance needs for such workloads. On the other hand, applications such as online analytical processing (OLAP) tend to require higher endurance than 1 DWPD and are hence best served by MLC V-NAND, which can scale to up to 10 DWPD with configurable over- provisioning offered in the Samsung SM863 Series. Use cases such as real-time financial trading and online transaction processing are great examples of very write- intensive and performance- sensitive applications. Because these applications generate a lot of write IOs and even a millisecond of additional latency may result in a lost trade or sale, the higher endurance and write performance of MLC V-NAND is required for such critical applications. In most enterprise workloads, the path to the lowest total cost of ownership (TCO) is to utilize the benefits of both 3-bit MLC and MLC technologies through tiering. Files that have a lot of write activity can be kept in the more durable MLC-based SSDs, while files that are read-only or accessed more infrequently can be moved to a lower tier that is based on 3-bit MLC SSDs. Choosing the Right NAND for Enterprise Applications Content Delivery Network Drive writes per day Application Workload Suitable NAND Type Web Server Application Server Database Server 0.35 DWPD 10 DWPD 3 bit 2 bit Read-intensive Write-intensive Mixed Pattern
  • 6. The choice between 2-bit and 3-bit MLC depends on the application and its performance and endurance requirements. For read-intensive applications, 3-bit MLC is an obvious choice because it delivers the same level of performance at a substantially lower cost per gigabyte. The use of 3-bit MLC V-NAND technology in the Samsung PM863, rated for 1 DWPD, also extends the usability from strictly read-centric applications to some mixed workloads with low write activity. While V-NAND technology increases write endurance, 3-bit MLC is still inherently slower and less durable than 2-bit MLC, so it is not ideal for write-intensive applications. For mixed and write- intensive workloads, Samsung offers the SM863, which comes standard with 3 DWPD but can be over provisioned to reach endurance of up to 10 DWPD. The lower cost per gigabyte that 3-bit MLC offers may seem alluring, but MLC actually provides a better TCO for write- intensive applications because drives need to be replaced less frequently due to the higher endurance. Learn more: samsung.com/enterprisessd | 1-800-SAMSUNG | 1-866-SAM4BIZ Follow us: youtube.com/samsungbizusa | @SamsungBizUSA © 2015 Samsung Electronics America, Inc. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. All products, logos and brand names are trademarks or registered trademarks of their respective companies. This white paper is for informational purposes only. Samsung makes no warranties, express or implied, in this white paper. WHP-SSD-MLCvsTLC-OCT15J Conclusion About the Author Kristian Vättö is a technical marketing specialist and started his career as a news editor at AnandTech.com in 2011. He later became the site’s SSD editor and was responsible for producing highly-detailed and professional SSD reviews. In addition to his work with Samsung, Kristian is currently studying economics at the University of Tampere in Finland. *Pricing is as of October, 2015 and subject to change **TBW = TeraBytes Written ***1 GigaByte = 1 000 000 000 bytes SM863 PM863 MSRP (960GB) $639.99 $549.99 Endurance (960GB) 6,160 TBW* 1,400 TBW Price per Gigabyte $0.67/GB** $0.57/GB Price per TBW $0.10/TBW $0.39/TBW