The 65 nm Spansion® FL-S NOR Flash memory family has over 20% faster double data rate (DDR) read speeds and three times the programming speed over competing serial Flash solutions. The Spansion FL-S delivers leading performance, automotive grade temperature ranges and in some applications, eliminates the need for DRAM. Engineers are increasingly demanding these attributes for improving the user experience and designing innovative, graphic-rich, stylish designs in next generation electronics. The product family is available from 128 Mb (megabit) to 1 Gb (gigabit).

1. Spansion® FL-S Serial Flash Memory September 2011

2. 2 © 2011 Spansion, Inc. CONFIDENTIAL The Changing Landscape of Serial Flash Memory

3. Applications Demand Performance and High Density

4. Spansion® Flash Memory for Every Design Need Performance(Parallel NOR) System Cost(Serial NOR) Density(NAND) Spansion®GL-S SpansionFL-S SpansionNAND

6. High reliability and 10+ yearproduct commitments

7. Up to 128 Mb densities required

8. 3D graphic data storage for real-time driver information

9. Simpler memory system without need for DRAM

11. Small form factor enables stylish designs

12. Up to 256 Mb density

13. Instant-on performance for improved user experience

14. High reliability

16. Simpler memory system without need for DRAM

17. Up to 1 Gb densities required

18. Secure customer data storage

19. High reliability and 10+ yearproduct commitments

21. Small form factor enables stylish designs

22. Up to 256 Mb density

23. Small form factor/BGA packages

24. High reliability

26. High reliability

27. Up to 512 Mb density

28. Instant-on performance and advanced security to prevent network access

29. Small form factor enables stylish designs

31. High reliability and 10+ yearproduct commitments

34. Reduces chip re-programming time during manufacturing

35. Reduces programming costs

36. Increases manufacturing throughput

37. Faster systemboot times

38. Improved user experienceDDR Read – MB/s Seconds Seconds Note: Comparisons based on 256 Mb devices

40. Industry-standard packaging with Universal Footprint

41. Enhanced security with 1kB one-time programmable (OTP) region, 128-bit ID

42. 3V Vcc, 1.65V – 3.6VVio support

43. -40°C to +85°C / 105°C temperature support

44. Spansion® FFS flash file system support

45. 5X Faster Erase

46. 3X Faster Programming

49. Spansion Universal Footprint: SPI Flash Package Overview Consistent pin outs across densities and product families Spansion FL-S * 32 Mb 128 Mb 256 Mb 512 Mb 1 Gb 64 Mb 16 Mb 4 Mb 8 Mb 8-pin SO (150 & 208 mil) Serial Peripheral Interface (SPI) 16-pin SO (300 mil) 24-ball BGA (6x8mm) USON/WSON (5x6mm/6x8mm) * planned

50. 2 © 2011 Spansion, Inc. CONFIDENTIAL Summary: Spansion® FL-S Changing the Serial Landscape Industry-Leading Performance Enables Innovation Move to high-density, high performance Small form factor for stylish designs in next generation electronics Improved user experience for embedded applications Lower system costs and eliminate DRAM in some applications

53. 1 Primary Fab (Austin) Partners: SMIC (65nm, 45nm), Elpida (43nm, 24nm), TI (110nm)

56. Niche electronic systems providers

57. Global distributor network