1. MRS Fall Meeting: Symposium
Multilayer Ceramic Microsystems:
applications in wireless, energy and
life sciences
Micro-Technologies Research Lab
Solid State Research Center
Motorola Labs
Tempe, Arizona
2. OUTLINE
• MST definitions and technologies
• Ceramic “MEMS” technology
• Ceramic “MEMS” applications
– Integration of RF-Wireless Functions
– Miniaturization of Fuel Cell Systems
• Direct Methanol
• Reformed Hydrogen
– Life Science Devices/Appliances
• MHD pumping
• DNA Amplification
• DNA Hybridization & Detection
• UV Light Source
• Conceptual Life Science Integrated Appliance
3. MicroSystem Technology (MST)*
Lab-on- System in/on a
Chip Package (SIP) MOEMS Packaging Modular MEMS
MicroSystem Technologies
System Miniaturization and Integration of
Device Functions Based on:
Mechatronics Electronics Photonics MicroFluidics Thermonics
Microgrippers Microsensors/detectors
Micropumps Microreactors
Microactuators Microplasma Microvalves Microheaters
Micromirrors
Microswitches Micropneumatics Micromixers
Enabled By 3D Multilayer
Integration/Fabrication Technologies:
Ceramic, Glass, Plastic, Si
*Source: M. Riester and D.L. Wilcox
4. Definition of MST
Any device or unit made up of a number of micro-
engineered components/devices.
An intelligent miniaturized monolithic and/or hybrid
integrated system comprising sensing, processing
and/or actuating devices utilizing two or more of the
following technologies: electronic, mechatronic,
microfluidic, thermonic, and photonic.
5. Microsystems Technology Driving
Forces
• Integration and Miniaturization of
Multifunctional Appliances
• Enabled by Integration of fluidics,
electronics, photonics, and “thermonics”
• Market Opportunities:
– Wireless – multiband and multimode phones
requiring more components
– Micro-scale energy sources for portable
appliances
– Emerging life science fluidic based devices
– “Lab on a chip”; Micro-reactor; etc.
6. Important Microsystem Integration
Technologies
• Ceramic - MEMS
• Si – MEMS
• Other Glass and Plastic (PCB) Technologies
• Electronic Packaging and Interconnect
Technologies
• Materials, Process and Device Modeling and
System Architecture/Partitioning and
Technology Selection Protocols
• Tools for managing cross-discipline, cross-
function teams!
7. Ceramic MEMS: Technologies & Applications
Methanol Reformer
Cell Phone
Receiver
15 mm
fuel integrated
ENERGY reformers modules
5 mm
MICROSYSTEM
WIRELESS
Direct FUNCTIONS on-chip
Methanol power COMMUNICATIONS
Fuel Cell ICs amplifiers
sensors
fuel NEW
Micro Hollow Cathode cells MATERIALS & filters 8 mm
Discharge (MHCD) PROCESSES
light pumps
UV light source
sources 8.5 mm
Power Amplifier
temperature chemical
reactors PCR
E-chip control Pumping/
Mixing
V cell sorting
Integrated
BioChip LIFE DNA
Technology
SCIENCES amplification
9. MLC Feature Forming Technologies
green sheet thickness
50-250 mm
VIA mechanical punching laser drilling
FORMATION 100 mm 50 mm
stencil
VIA 100 mm
FILL
LATERAL screen printing photo-defined
FEATURES 50 mm 50 mm
(interconnects, print thickness
passives) 5-20 mm
11. AdvancedCMEMS Tape Texturing Technologies
Microchannel Forming Technologies
Embossing Cast-on-Photoresist Fugitive
Paste
Ceramic
Sheet Ceramic
Sheet
8 mm x 8 mm 10 mm channels heights
channels for rapid diffusive mixing
12. Applications of the Ceramic MEMS
• Integration of RF-Wireless Functions (SIP)
• Miniaturization of Fuel Cell Systems
– Direct Methanol
– Reformed Hydrogen
• Life Science Devices/Appliances
– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– UV light source
– Conceptual integrated life science appliance
13. Conceptual Diagram for Wireless Communication
Device
RF Frontend IF &
Baseband Auxiliary
Mainly Analog Functions
Circuit Mainly Digital
Circuit
• Low RF Signal Loss Critical • High Interconnect Density:
• Need High Frequency Stability Fine Line, Pitch and Pad
• High Functional Integration: • High Speed and Low Cross
Medium K (7-200) Dielectric Talk: Low K ( < 4) Dielectric
• Low L,C,R Values • High L,C,R Values
14. RF Device Elemental Structures
ANT
C7
C8
Z1
Multilayer Capacitor
Z4
C1 Z2 D1 Z3 C4
TX RX
Vertically Coiled C2 C3 D2
C5
Transmission Line BIAS
C6
Metal
Dielectric Metal
Horizontally Coiled
Substrate Transmission Line
Capacitor
16. MCIC Integration Efforts
IRIDIUM:
LNA AND SWITCH
ANT
ACC Rx / Tx - ANT / ACC
RF SWITCH
PCS / DCS
MCIC FILTER
GSM LEAP:
TRI-BAND Rx VCO
TUNABLE DUPLEXER
GSM LEAP:
TRI-BAND Tx VCO
GSM KRAMER:
DUAL BAND PA MATCH,
HARMONIC FILTER,
Power Amp
COUPLER
17. Example of RF Front-End Functional Integration
•
~
~
•
LNA Bypass
Impedance Power and Bias Capacitors Bandpass Filter
Matching
Line
To
Bias Amplifier
Circuit
Trap From
Filter Amplifier
1 cm X 1 cm
Switch w/
Harmonic 41 components per sq. cm.
Filter To Mixer
Switch Image Reject Filter
Transmit Antenna Bias
19. Formation of High Q Dielectric
10.0 1200
1100
K
9.0 1000
900
K Q
Q
8.0 800
700
7.0 600
800 825 850 875 900 925 950 975
Temperature (°C)
• Sintering T > 850 °C is necessary for high Q
• Self Limiting Crystallization - Wide Sintering Window
20. Compensation of Tf in T2000 Dielectric
1.006
Tf Measurement Compensation of Tf:
1.004 TiO2: TK =-750 ppm/°C
CaTiO3: TK =-1850 ppm/°C
SrTiO3: TK =-3000 ppm/°C
Normalized Frequency
1.002
1.000 Tf Measurement
1.248
1.246 TiO2 added
Hz)
0.998 T2000: 0.6 ppm/C No TiO
9
2
FerroA6: -48 ppm/C 1.244
DuPont 943: -58 ppm/C
0.996 DuPont 951: -69 ppm/C 1.242
Resonant frequency (10
Hereaus: -76 ppm/C
1.24
0.994
-50 -30 -10 10 30 50 70 90 1.238
Temperature (C) Tf =4.2 ppm/°C
1.236
• Tf of T2000 is ~ 80 ppm/°C 1.234
Tf =-78.5 ppm/°C
without compensation 1.232
• Can be continuously tuned -40 -20 0 20 40 60 80
Temperature (°C)
to ~ 0 ppm/°C
21. Tf Impact on Embedded Filter Performance
Example of Tf Influence on Filter
Performance
0
10 Stop
Band Pass
Band
20
Attn.
Filter
30 response at
room Tf = - 60, Q=1000
40 temperature
Tf = 0 , Q=1000
50
850 900 MHz 950
Tf = -(1/2)Tk -
Tk: T coefficient of dielectric constant
: linear CTE, 3~15 ppm/°C
22. Applications of the Ceramic MEMS
• Integration of RF-Wireless Functions
• Miniaturization of Fuel Cell Systems
– Direct Methanol
– Reformed Hydrogen
• Life Science Appliances
– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– Photonic light source
– Conceptual integrated life science appliance
23. MicroSystem Fuel Cell & Applications
A Fuel Cell is a System
Fuel Delivery System
Fuel Processing/Reforming
Stack
Fuel Supply
Small Portable Large Applications
Applications LOCAL
Central Mobile
FIXED Utilities Power MOBILE
Distributed Luggable
Utilities Power
DISTRIBUTED
24. Methanol Fuel Cells
Direct Methanol Fuel cell
Two Approaches
Proton Conducting
_
Pt-Ru Catalyst
Direct Methanol Fuel Cells (DMFC)
+ Membrane
CH3OH Air (O2)
- Low Power Density
6H+ Electrode
- Room Temperature Operation Pt Catalyst
CO2
- Liquid handling
e-
Load
- Initial Product Target: CH3OH + H2O CO2 + 3H2O
100 mw system for Portables
Hydrogen Fuel cell
Proton Conducting
Reformed Hydrogen (Methanol H2) Fuel Cells (RHFC) Pt Catalyst _
+ Membrane
- High Power Density H2 Air (O2)
2H+ Electrode
- Reformer Operating Temp ~200ºC Pt Catalyst
- Gas handling e-
Load
- Initial Focus on miniature reformer 2H2 + O2 2H2O
Higher wattage systems
25. Direct Methanol Fuel Cell System
CO2 Separation
& Venting
Water Recovery
Water & Recirculation
Cartridge DC-DC
Control Converter
Mixing
Fuel
circuitry Cell
Chamber
Stack
Fuel (Methanol) MEMS Pumps Sensors Rechargeable Cell
Cartridge Battery Phone
Methanol Concentration
Temperature
Flow
26. DMFC Fuel Cell Assembly
Gold Concept for Fuel Cell with integrated
Current pumping and control
Flow Field Collector Air Holes
(anode side) (cathode side)
MEA
Gaskets Working Fuel Cell
Assembled Fuel Cell
27. Reformed Hydrogen Fuel Cell System
Temperature & Control
Po2 Sensors Circuitry
Fuel Vaporizer (chemical heat)
or Electric Heat Preferential
Fuel (Methanol) Oxidation
Cartridge DC-DC
Reactor
Converter
Steam Reformer (CO cleanup) Fuel
- Catalyst Cell
Stack
Water - Temperature 250C
Rechargeable Cell
Cartridge Battery Phone
Heat Exchanger
Capture waste heat from FC feed
28. Reformed Hydrogen Fuel Cell System
Fuel Reformer
Miniature Fuel Reformer with Integrated
Chemical Combustor Using Ceramics MEMS
CH3OH H2O Technology (Conceptual Design)
Reformer
Output to Fuel
Cell and Gas
Insulation analysis
250 °C Insulator
Steam
Reformer (Endothermic Reaction)
Fuel Reformer H2 in
CuO-ZnO
Catalyst Chemical Combustor Air in
CH3OH + H2O
CO2 + H2 + CO (about 1%) Fuel Vaporizer/Heat Exchanger MeOH in
Insulator
Exhaust
out
CO Insulation
Clean up
CO + 1/2O2 CO2
Preferential Methanol/Water (1:1 mole ratio)
Oxidation
Liquid Feed Pump: 10- 25 uL/min
Catalyst
H2 gas to fuel cell
29. RHFC Fuel Processor
Miniature Steam Reformer To Produce Reformer Test Data
Hydrogen Gas from Liquid Methanol Fuel (MeOH/ Water :1/1.05, 5 ul/min inlet fuel)
100%
MeOH
CO2 CO2
Steam reformer
80%
Gas Outlet CO
catalyst
Volume %
(H2 , CO and CO2) CO2
60%
40%
Fuel Inlet
Fuel Vaporizer (Methanol + Water) H2 H2 H2
20%
0%
180 200 230
~ 1 micro-liter/min total liquid in Temperature (C)
produces
~ 1 milli-liter/min total gas out. >90% MeOH Conversion @ 200C
• 50 ul/min fuel can produce sufficient H2 for a Fuel Cell to produce 3W power
operating at 30% efficiency
30. Applications of Ceramic MEMS
• Integration of RF-Wireless Functions
• Miniaturization of Fuel Cell Systems
– Direct Methanol
– Reformed Hydrogen
• Life Science Appliances
– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– Photonic light source
– Conceptual integrated life science appliance
32. Magnetohydrodynamic (MHD) Pumping
Initial Pump Design
Basic MHD Theory
First Generation MHD
B
View Channel 1 mm
I
v
IBw 2 h
v
8mL( w h) 2 OUTLET Outlet
Inlet
Electrodes for E-field
“channel for pumping”
External mini-electromagnet
INLET for B-field
MHD Pumping Video
MHD Experimental Data (100 mM NaCl solution)
3.5 2.0
3.0 1.5
Model Prediction Model Prediction
1.0 Measured Data
Flow Rate (uL/min)
2.5 Measured Data
Flow Rate (uL/min)
0.5
2.0
0.0
1.5 0 30 60 90 120 150 180
-0.5
1.0
-1.0
0.5
-1.5
0.0 -2.0
0.0 2.0 4.0 6.0 8.0 10.0 12.0
Phase Angle (Degrees)
Current (mA)
Impact: No moving parts, bi-directional, non-pulsating flow
33. DNA amplification
CONTINUOUS FLOW POLYMERASE CHAIN REACTION (PCR)
DESIGN LTCC DEVICE THERMAL PROFILE
Outlet
95 C 55 C 72 C
AIR GAP
CHANNEL 1
CHANNEL 2
CHANNEL 3
AIR GAP
Generation 1 Model Predictions Experimental Validation
Inlet
AIR AIR
GAP GAP
DNA
AMPLFICATION
Generation 2
Second generation design completed
with reduction in dead volume from
75% to 25% of the reactor
34. DNA hybridization & detection
FABRICATED DEVICES
MODELING OBJECTIVE:
less than 1C temperature variation
across the array Sensing
Electrodes
Heater: Ag-Pd strip of 80 squares
Resistance: 30 mW/square x 80 squares = 2.4W
Energy Input: 160 mW
Heat loss: Natural Convection at device boundary
Temperature Profile PCB-based array
Schematic of E-chip across Sensor Pads
Ag-Pd Heater
Microwell
Gold Pad & Via Sensor pads Temperature Heater
Plane
sensor
Ceramic arrays
35. Model Validation of Thermal Profile
Experimental Details
Heater Resistance: 2.6 W
Current: 250 mA
Energy Input (expt.): 0.1625 W
Energy Input (model): 0.16 W
Temperature Profile along X-axis Temperature Profile along Y-axis
Measured
DT < 0.5 C DT ~ 0.5 C
Predicted
Column 3
Column 2
Column 1
Row 4
Row 2
Row 3
Row 1
36. Ceramic Micro Hollow Cathode Discharge
Integrated UV
Light Source
1000
800 XeI*B-X
Intensity (a.u.)
253 nm
600
400 XeI*B-A
320 nm
200 Iodine I*2
206 nm 342 nm
0
200 250 300 350 400
Wavelength (nm)
Dia. =250 mm
Separation = 190 mm
Gas: XeI
V = 300 V
I = 150 mA
Collaboration with G. Eden, B. Vojak,
Pressure = 20-60 Torr
V Univ. of Illinois, Urbana, Illinois
37. CMEMS Enabled Devices and Functions
Capacitive sensing of fluids Capacitor Capacitive sensing of fluids:
Channel flow sensor plate -Channel flow sensor
-Fluidic-well fill sensor
Conductor -Precise metering of fluids
trace -’Macro-to-micro’ fluid metering
Fluidic well fill sensor 160
140
Fluid heating
Temperature (deg C)
Integrated coil heater 120
100
80
60
Temperature region
40
of interest for “PCR”
20
Electromagnetic-Coil Integration 0 0.5 1 1.5 2 2.5 3 3.5
Heater-Coil Power (Watts)
Electromagnetic
coil
50
Magnetic Flux (Gauss)
0
-50
-100
Coil High-mu material -150
Integrated EM coils Enable: -200 Polymer “Mag-Spheres”
-Magnetic microsphere manipulation attracted to embedded
-250
-Magnetic-based stirring -0.5 0 0.5 1 1.5 2 2.5 electromagnetic coil
-Magnetic pumping concepts Power (Watts)
38. MST Integrated Bio-Analysis Appliance
ELECTRONIC
MST-ENABLED 2-way Wireless Signaling
& Networks (ANTENNA)
FEATURES
- uP & Memory
- Thermal Cycles
Ceramic-MEMS
- Photon Sources
- Photo Imager/Det
- uFluidic Channels
- uBio Chemistry
- uPumping
- Dense Packing MST-INTEGRATION
- Low Cost TECHNOLOGIES
examples:
RFIC
- Si-MEMS uPump
uPump uC
- Ceramic-MEMS
- PCB/HDI/Plastics
- Si ICs uC
3D LTCC Smart Substrate
- RFIC neuRFon™
- LTCC 3D Interconnect
Miniature Blood Analyser - Micro Displays
- Wafer Scale Ass’y
Input Blood Sample -- cell sort -- lysing -- DNA amplify --
DNA signal detection -- DNA analysis -- Transmission -- - Known Good Parts
Medical Network Database -- Medical Network Response
P. Roberts-SSRC
39. Summary
• A Microsystems Technology is Emerging
– Enabling integration/miniaturization of bench top appliances
– Enabling devices that are multifunction integrating electronic,
microfluidic, mechatronic, thermonic and photonic devices
• These appliances will impact the electronic, energy, life
science and micro-reactor related markets
• A Ceramic – “MEMS” or MST technology is emerging as
an important multifunction micro-systems 3D integration
technology:
• Building on the multilayer “packaging/interconnect”
and capacitor technologies and infrastructure
• A true 3D integration technology with a rich menu of
integrateable materials for Device opportunities
• Provides dimension gap system tradeoff: SOC vs SIP
40. Summary
CMEMS Applications will accelerate with:
•Advances in simulation and modeling tools
•Advances in materials integration, and feature forming
technologies
•Expanded Research at Universities and National Labs
• Establishment of CMEMS User Facilities
• Establishing Standards for Materials and Processes
• Emulating PCB and Silicon Foundry Infrastructure ..
Cost, Cycle Times, Multiple Sources
41. Material and Process Challenges
Material challenges:
• Dielectrics
• Ceramics (e.g., high K dielectrics)
• Glass-ceramics (LTCC)
• Glasses (encapsulation, sealing etc)
• Conductors
Au, Ag, Ag/Pd, Pt, Cu, base metals,…
• Resistors (internal cofired, post fired, etc)
• Magnetic Materials (ferrites, permanent magnets, etc)
• Ferroelectric and Piezoelectric Materials
Process Challenges
• Tape and Thick film processes
• Thin film process
• Interconnect technologies
Looking for collaborations in the above fields!
