SlideShare una empresa de Scribd logo
1 de 8
Descargar para leer sin conexión
Device Modeling Report



COMPONENTS: Silicon Carbide Schottky Diode
PART NUMBER: SCS110AG_-25c
MANUFACTURER: ROHM
REMARK: Standard Model
REPORT:(LTspice IV)




                Bee Technologies Inc.



  All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Spice model
                                     Model description
 parameter
     IS        Saturation Current
     N         Emission Coefficient
     RS        Series Resistance
    IKF        High-injection Knee Current
    CJO        Zero-bias Junction Capacitance
     M         Junction Grading Coefficient
     VJ        Junction Potential
    ISR        Recombination Current Saturation Value
     BV        Reverse Breakdown Voltage(a positive value)
    IBV        Reverse Breakdown Current(a positive value)
     TT        Transit Time
    EG         Energy-band Gap




              All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Forward Current Characteristic

Circuit Simulation Result




Evaluation Circuit




                     All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Comparison Graph

Circuit Simulation Result


                               100.000
                                                   Measurement
                                                   Simulation

                                10.000
      FORWARD CURRENT: IF(A)




                                 1.000



                                 0.100



                                 0.010



                                 0.001
                                         0.0           0.5            1.0         1.5           2.0            2.5
                                                                FORWARD VOLTAGE: VF(V)


Simulation Result

                                                                       VF(V)
                                    IF(A)                                                          Error (%)
                                                     Measurement               Simulation
                                          0.001             0.9500                    0.9471              -0.30
                                           0.01             1.0100                    1.0070              -0.30
                                             0.1            1.0700                    1.0695              -0.05
                                             0.2            1.0900                    1.0908               0.07
                                             0.5            1.1250                    1.1244              -0.05
                                               1            1.1600                    1.1589              -0.09
                                               2            1.2050                    1.2100               0.41
                                               5            1.3300                    1.3332               0.24
                                             10             1.5100                    1.5170               0.46
                                             15             1.7000                    1.6933              -0.39




                                           All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Junction Capacitance Characteristic

Circuit Simulation Result




Evaluation Circuit




                     All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Comparison Graph

Circuit Simulation Result


                                              1000
                                                                                                            Measurement
       CAPACITANCE BETWEEN TERMINAL: Ct(pF)




                                                                                                            Simulation




                                              100




                                                10




                                                1
                                                     0.1                   1                 10                           100
                                                                          REVERSE VOLTAGE:VR(V)


Simulation Result

                                                                                C (pF)
                                                VR(V)                                                          Error (%)
                                                                  Measurement             Simulation
                                                            0.1         495.522                 500.945                1.09
                                                            0.2         478.484                 484.972                1.36
                                                            0.5         432.707                 437.279                1.06
                                                              1         381.755                 382.943                0.31
                                                              2         315.733                 317.098                0.43
                                                              5         227.287                 228.635                0.59
                                                            10          170.646                 171.457                0.48
                                                            20          125.176                 125.891                0.57
                                                            50           82.750                  82.216               -0.65
                                                           100           60.545                  59.210               -2.20




                                                       All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Reverse Recovery Characteristic

Circuit Simulation Result




                                                Time (s)

Evaluation Circuit




Compare Measurement vs. Simulation

                               Measurement                 Simulation          Error (%)
            trj        ns                   7.500                  7.468             -0.42




                     All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
Reverse Recovery Characteristic                                                 Reference




                                                      Measurement




Trj =7.5(ns)
Trb=16.0(ns)
Conditions: Ifwd=0.2A, Irev=0.2A, Rl=50Ω




                                                          Example




                               Relation between trj and trb




                 All Rights Reserved Copyright (C) Bee Technologies Inc. 2010

Más contenido relacionado

Más de Tsuyoshi Horigome

Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspiceTsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is ErrorTsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintTsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsTsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hiresTsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)Tsuyoshi Horigome
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモTsuyoshi Horigome
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?Tsuyoshi Horigome
 
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)Tsuyoshi Horigome
 
SPICE PARK JAN2024 (6,665 SPICE Models)
SPICE PARK JAN2024 (6,665 SPICE Models)SPICE PARK JAN2024 (6,665 SPICE Models)
SPICE PARK JAN2024 (6,665 SPICE Models)Tsuyoshi Horigome
 
社会現象及び社会記号と関連付けたマーケティング
社会現象及び社会記号と関連付けたマーケティング社会現象及び社会記号と関連付けたマーケティング
社会現象及び社会記号と関連付けたマーケティングTsuyoshi Horigome
 
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)Update 42 models(Diode/General ) in SPICE PARK(DEC2023)
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)Tsuyoshi Horigome
 
SPICE PARK DEC2023 (6,625 SPICE Models)
SPICE PARK DEC2023 (6,625 SPICE Models) SPICE PARK DEC2023 (6,625 SPICE Models)
SPICE PARK DEC2023 (6,625 SPICE Models) Tsuyoshi Horigome
 
電子部品調達者の動向
電子部品調達者の動向電子部品調達者の動向
電子部品調達者の動向Tsuyoshi Horigome
 
マーケティングのPoDとPoP
マーケティングのPoDとPoPマーケティングのPoDとPoP
マーケティングのPoDとPoPTsuyoshi Horigome
 
アクティブ電流駆動IGBTゲートドライバ回路の利点
アクティブ電流駆動IGBTゲートドライバ回路の利点アクティブ電流駆動IGBTゲートドライバ回路の利点
アクティブ電流駆動IGBTゲートドライバ回路の利点Tsuyoshi Horigome
 

Más de Tsuyoshi Horigome (20)

Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?
 
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)
Update 40 models(Schottky Rectifier ) in SPICE PARK(JAN2024)
 
SPICE PARK JAN2024 (6,665 SPICE Models)
SPICE PARK JAN2024 (6,665 SPICE Models)SPICE PARK JAN2024 (6,665 SPICE Models)
SPICE PARK JAN2024 (6,665 SPICE Models)
 
社会現象及び社会記号と関連付けたマーケティング
社会現象及び社会記号と関連付けたマーケティング社会現象及び社会記号と関連付けたマーケティング
社会現象及び社会記号と関連付けたマーケティング
 
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)Update 42 models(Diode/General ) in SPICE PARK(DEC2023)
Update 42 models(Diode/General ) in SPICE PARK(DEC2023)
 
SPICE PARK DEC2023 (6,625 SPICE Models)
SPICE PARK DEC2023 (6,625 SPICE Models) SPICE PARK DEC2023 (6,625 SPICE Models)
SPICE PARK DEC2023 (6,625 SPICE Models)
 
電子部品調達者の動向
電子部品調達者の動向電子部品調達者の動向
電子部品調達者の動向
 
電流制御資料
電流制御資料電流制御資料
電流制御資料
 
マーケティングのPoDとPoP
マーケティングのPoDとPoPマーケティングのPoDとPoP
マーケティングのPoDとPoP
 
アクティブ電流駆動IGBTゲートドライバ回路の利点
アクティブ電流駆動IGBTゲートドライバ回路の利点アクティブ電流駆動IGBTゲートドライバ回路の利点
アクティブ電流駆動IGBTゲートドライバ回路の利点
 

Último

How AI, OpenAI, and ChatGPT impact business and software.
How AI, OpenAI, and ChatGPT impact business and software.How AI, OpenAI, and ChatGPT impact business and software.
How AI, OpenAI, and ChatGPT impact business and software.Curtis Poe
 
Gen AI in Business - Global Trends Report 2024.pdf
Gen AI in Business - Global Trends Report 2024.pdfGen AI in Business - Global Trends Report 2024.pdf
Gen AI in Business - Global Trends Report 2024.pdfAddepto
 
SALESFORCE EDUCATION CLOUD | FEXLE SERVICES
SALESFORCE EDUCATION CLOUD | FEXLE SERVICESSALESFORCE EDUCATION CLOUD | FEXLE SERVICES
SALESFORCE EDUCATION CLOUD | FEXLE SERVICESmohitsingh558521
 
DevoxxFR 2024 Reproducible Builds with Apache Maven
DevoxxFR 2024 Reproducible Builds with Apache MavenDevoxxFR 2024 Reproducible Builds with Apache Maven
DevoxxFR 2024 Reproducible Builds with Apache MavenHervé Boutemy
 
How to write a Business Continuity Plan
How to write a Business Continuity PlanHow to write a Business Continuity Plan
How to write a Business Continuity PlanDatabarracks
 
Dev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebDev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebUiPathCommunity
 
Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationSlibray Presentation
 
The Ultimate Guide to Choosing WordPress Pros and Cons
The Ultimate Guide to Choosing WordPress Pros and ConsThe Ultimate Guide to Choosing WordPress Pros and Cons
The Ultimate Guide to Choosing WordPress Pros and ConsPixlogix Infotech
 
WordPress Websites for Engineers: Elevate Your Brand
WordPress Websites for Engineers: Elevate Your BrandWordPress Websites for Engineers: Elevate Your Brand
WordPress Websites for Engineers: Elevate Your Brandgvaughan
 
What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024Stephanie Beckett
 
DevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsDevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsSergiu Bodiu
 
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024BookNet Canada
 
From Family Reminiscence to Scholarly Archive .
From Family Reminiscence to Scholarly Archive .From Family Reminiscence to Scholarly Archive .
From Family Reminiscence to Scholarly Archive .Alan Dix
 
Unraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfUnraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfAlex Barbosa Coqueiro
 
DSPy a system for AI to Write Prompts and Do Fine Tuning
DSPy a system for AI to Write Prompts and Do Fine TuningDSPy a system for AI to Write Prompts and Do Fine Tuning
DSPy a system for AI to Write Prompts and Do Fine TuningLars Bell
 
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptx
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptxThe Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptx
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptxLoriGlavin3
 
Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Mattias Andersson
 
Scanning the Internet for External Cloud Exposures via SSL Certs
Scanning the Internet for External Cloud Exposures via SSL CertsScanning the Internet for External Cloud Exposures via SSL Certs
Scanning the Internet for External Cloud Exposures via SSL CertsRizwan Syed
 
TeamStation AI System Report LATAM IT Salaries 2024
TeamStation AI System Report LATAM IT Salaries 2024TeamStation AI System Report LATAM IT Salaries 2024
TeamStation AI System Report LATAM IT Salaries 2024Lonnie McRorey
 
Digital Identity is Under Attack: FIDO Paris Seminar.pptx
Digital Identity is Under Attack: FIDO Paris Seminar.pptxDigital Identity is Under Attack: FIDO Paris Seminar.pptx
Digital Identity is Under Attack: FIDO Paris Seminar.pptxLoriGlavin3
 

Último (20)

How AI, OpenAI, and ChatGPT impact business and software.
How AI, OpenAI, and ChatGPT impact business and software.How AI, OpenAI, and ChatGPT impact business and software.
How AI, OpenAI, and ChatGPT impact business and software.
 
Gen AI in Business - Global Trends Report 2024.pdf
Gen AI in Business - Global Trends Report 2024.pdfGen AI in Business - Global Trends Report 2024.pdf
Gen AI in Business - Global Trends Report 2024.pdf
 
SALESFORCE EDUCATION CLOUD | FEXLE SERVICES
SALESFORCE EDUCATION CLOUD | FEXLE SERVICESSALESFORCE EDUCATION CLOUD | FEXLE SERVICES
SALESFORCE EDUCATION CLOUD | FEXLE SERVICES
 
DevoxxFR 2024 Reproducible Builds with Apache Maven
DevoxxFR 2024 Reproducible Builds with Apache MavenDevoxxFR 2024 Reproducible Builds with Apache Maven
DevoxxFR 2024 Reproducible Builds with Apache Maven
 
How to write a Business Continuity Plan
How to write a Business Continuity PlanHow to write a Business Continuity Plan
How to write a Business Continuity Plan
 
Dev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebDev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio Web
 
Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck Presentation
 
The Ultimate Guide to Choosing WordPress Pros and Cons
The Ultimate Guide to Choosing WordPress Pros and ConsThe Ultimate Guide to Choosing WordPress Pros and Cons
The Ultimate Guide to Choosing WordPress Pros and Cons
 
WordPress Websites for Engineers: Elevate Your Brand
WordPress Websites for Engineers: Elevate Your BrandWordPress Websites for Engineers: Elevate Your Brand
WordPress Websites for Engineers: Elevate Your Brand
 
What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024
 
DevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsDevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platforms
 
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024
Transcript: New from BookNet Canada for 2024: BNC CataList - Tech Forum 2024
 
From Family Reminiscence to Scholarly Archive .
From Family Reminiscence to Scholarly Archive .From Family Reminiscence to Scholarly Archive .
From Family Reminiscence to Scholarly Archive .
 
Unraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfUnraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdf
 
DSPy a system for AI to Write Prompts and Do Fine Tuning
DSPy a system for AI to Write Prompts and Do Fine TuningDSPy a system for AI to Write Prompts and Do Fine Tuning
DSPy a system for AI to Write Prompts and Do Fine Tuning
 
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptx
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptxThe Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptx
The Fit for Passkeys for Employee and Consumer Sign-ins: FIDO Paris Seminar.pptx
 
Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?
 
Scanning the Internet for External Cloud Exposures via SSL Certs
Scanning the Internet for External Cloud Exposures via SSL CertsScanning the Internet for External Cloud Exposures via SSL Certs
Scanning the Internet for External Cloud Exposures via SSL Certs
 
TeamStation AI System Report LATAM IT Salaries 2024
TeamStation AI System Report LATAM IT Salaries 2024TeamStation AI System Report LATAM IT Salaries 2024
TeamStation AI System Report LATAM IT Salaries 2024
 
Digital Identity is Under Attack: FIDO Paris Seminar.pptx
Digital Identity is Under Attack: FIDO Paris Seminar.pptxDigital Identity is Under Attack: FIDO Paris Seminar.pptx
Digital Identity is Under Attack: FIDO Paris Seminar.pptx
 

SPICE MODEL of SCS110AG , TC=-25degree , LTspice (Standard Model) in SPICE PARK

  • 1. Device Modeling Report COMPONENTS: Silicon Carbide Schottky Diode PART NUMBER: SCS110AG_-25c MANUFACTURER: ROHM REMARK: Standard Model REPORT:(LTspice IV) Bee Technologies Inc. All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 2. Spice model Model description parameter IS Saturation Current N Emission Coefficient RS Series Resistance IKF High-injection Knee Current CJO Zero-bias Junction Capacitance M Junction Grading Coefficient VJ Junction Potential ISR Recombination Current Saturation Value BV Reverse Breakdown Voltage(a positive value) IBV Reverse Breakdown Current(a positive value) TT Transit Time EG Energy-band Gap All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 3. Forward Current Characteristic Circuit Simulation Result Evaluation Circuit All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 4. Comparison Graph Circuit Simulation Result 100.000 Measurement Simulation 10.000 FORWARD CURRENT: IF(A) 1.000 0.100 0.010 0.001 0.0 0.5 1.0 1.5 2.0 2.5 FORWARD VOLTAGE: VF(V) Simulation Result VF(V) IF(A) Error (%) Measurement Simulation 0.001 0.9500 0.9471 -0.30 0.01 1.0100 1.0070 -0.30 0.1 1.0700 1.0695 -0.05 0.2 1.0900 1.0908 0.07 0.5 1.1250 1.1244 -0.05 1 1.1600 1.1589 -0.09 2 1.2050 1.2100 0.41 5 1.3300 1.3332 0.24 10 1.5100 1.5170 0.46 15 1.7000 1.6933 -0.39 All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 5. Junction Capacitance Characteristic Circuit Simulation Result Evaluation Circuit All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 6. Comparison Graph Circuit Simulation Result 1000 Measurement CAPACITANCE BETWEEN TERMINAL: Ct(pF) Simulation 100 10 1 0.1 1 10 100 REVERSE VOLTAGE:VR(V) Simulation Result C (pF) VR(V) Error (%) Measurement Simulation 0.1 495.522 500.945 1.09 0.2 478.484 484.972 1.36 0.5 432.707 437.279 1.06 1 381.755 382.943 0.31 2 315.733 317.098 0.43 5 227.287 228.635 0.59 10 170.646 171.457 0.48 20 125.176 125.891 0.57 50 82.750 82.216 -0.65 100 60.545 59.210 -2.20 All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 7. Reverse Recovery Characteristic Circuit Simulation Result Time (s) Evaluation Circuit Compare Measurement vs. Simulation Measurement Simulation Error (%) trj ns 7.500 7.468 -0.42 All Rights Reserved Copyright (C) Bee Technologies Inc. 2010
  • 8. Reverse Recovery Characteristic Reference Measurement Trj =7.5(ns) Trb=16.0(ns) Conditions: Ifwd=0.2A, Irev=0.2A, Rl=50Ω Example Relation between trj and trb All Rights Reserved Copyright (C) Bee Technologies Inc. 2010