The document is an illustrated guide to the process of manufacturing computer chips. It describes 12 key steps: (1) Silicon is extracted from sand and purified into crystal ingots; (2) The ingots are sliced into wafers and polished; (3) Photolithography is used to etch circuit patterns on the wafers; (4) The wafers undergo doping through ion implantation; (5) Copper is electroplated to form connections; (6) Multiple metal layers are added through deposition and polishing; (7) The wafers are tested and sorted before being sliced into dies; (8) The dies are packaged with a substrate and heatspreader; (9)