igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment. The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report. Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency. This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM. More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
June 2014 – Version 1 – Written by Sylvain Hallereau

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Comparison of LEDS
– Reverse Costing Methodology
2. Companies Profile 9
– Osram Opto Profile
3. LE UV U1A4 LED headlamp Characteristics 11
– LE UV U1A4 01 7Q6REB Characteristics
4. Physical Analysis 15
– Physical Analysis Methodology
– Package Views & Dimensions
– Package Opening
– X-Ray
– Package Cross-Section
– IMS Substrate
– AlN Substrate
– Phosphor
– LED Assembly
– Package Characteristics
– LED Views & Dimensions
– LED Cross-Section
– Cathode
– Anode
– Dielectric Layers
– Epitaxy
– LED Thickness
– LED Characteristics
– OSTAR Headlamp Pro Comparison
5. Manufacturing Process Flow 55
– Global Overview
– LED Fabrication Unit
– LED Process Flow
– Package Fabrication Unit
– Package Process Flow
6. Cost Analysis 67
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– Epitaxy Step
– LED Front-End Cost
– LED Wafer Cost
– LED Cost per process steps
– LED Equipment Cost per Family
– LED Material Cost per Family
– Back-End : Probe and dicing Cost
– Packaging Cost
– Final Assembly Cost
– Component Cost & Price
7.Estimated Manufacturer Price Analysis 93
Contact 99

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3
• Package is analyzed and measured.
• Package is opened in order to identify the elements constituting it.
• Cross-section are realized to get overall package data : dimensions, main characteristics.
• The LED is analyzed and measured.
• SEM photographs to measure the LED dimensions.
• Cross-section are realized to get overall LED data : dimensions, main characteristics.
• An analysis of the technologies and of the materials used is performed.

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4
Cathode contacts
Anode contactsFour LEDs in series +
protection diode
Aluminium heat-spreader with
the PCB form an IMS (Insulated
Metal Substrate)
Cathode bond wire (covered)
Anode bond wire (covered)
Ceramic
substrate
Si dam
Optical tilted view : package Optical top
view : package

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Remote phosphor plate
AlN ceramic
substrate
Ge LED cathode
Dam
black silicone
thinned Al heat
spreader
white silicone AlN ceramic
substrate
Dam
Optical view : cross section of the
package.
SEM view : cross section of the
package.
Optical view : detail

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7
• The front-end cost ranges from $xx to $xx
according to yield variations.
• The high cost of the wafer explain the portion
of the manufacturing cost is due to yield
losses in the cost.
• The new equipment explain the portion of
the manufacturing cost is due to the
equipment at xx%.
• The manufacturing yield is between xx% and
xx% in 2013

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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8

9. Osram Opto LE UV U1A4 01 7Q6REB - LED Array
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Reverse costing analysis represents the best cost/price evaluation given the
publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of
correction would lead to a +/- 10% correction on the manufacturing cost (if all
parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your
information. Please contact us:
European & USA Office
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01
90, Email: jourdan@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr