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© 2014
Copyrights © Yole Développement SA. All rights reserved.
Status of the MEMS Industry 2014
Challenged by newcomers proposing innovative low-cost solutions for consumer
applications, established MEMS players must develop new strategies to ensure
continued growth.
SAMPLE
© 2014• 2
• This 2014 edition of “Status of the MEMS Industry” presents the MEMS device
market and key industry changes and trends.
• Yole is actively following the market evolution of more than 220+ MEMS
applications and is tracking 350+ MEMS companies  this report combines all
these applications into 15+ major MEMS devices: IJ heads, pressure sensors,
microphones, accelerometers, gyroscopes, magnetometers, IMUs, micromirrors,
MOEMS, microbolometers, IR sensors, microdisplays, microfluidics, RF MEMS,
Oscillators, micro tips, and emerging MEMS devices.
• Based on the thousands of direct interviews Yole Développement analysts are
conducting annually in the MEMS field with MEMS manufacturers, system
manufacturers integrating MEMS and MEMS designers, MEMS equipment and
material manufacturers, and MEMS technology developers, this 11th version of
the “Status of the MEMS Industry” provides up-to-date analyses and data on MEMS
markets.
© 2014• 3
2012-2019 MEMS Markets (US$M)
© 2014• 4
2012-2019 MEMS Markets by Application (US$M)
© 2014• 5
Evolution 2009-2013: Maintaining growth is a challenge for
consumer applications
© 2014• 6
Example of supply chain & infrastructure
15+ detailed supply chains
© 2014• 7
Consumer MEMS challenges
PRICE PRESSURE
SIZE REDUCTION
NEW
APPLICATIONS
Internet of Things
Mobility
LBSE-Health
Social networking
Connectivity everywhere
MORE
INTELLIGENCE
Sensor fusionSoftware
Data discrimination
Stronger RF specifications
Closer integration with processing
Better performance
High volume production
3D integration
New wafer bonding
Fabless model
Shared fab infrastructure
MEMS across multiple markets
New MEMS design
Above IC
© 2014• 8
Accelerometer MEMS size evolution
2008 2010 2011
MEMS Size (mm²)
4
2
3
$0.03-0.075
$0.075-0.1
>$0.1
ST
LIS331DLH
ST LIS3DH
BOSCH
BMA180
BOSCH
BMA250 /
BMC050
Kionix KXTE9
5
ADI
ADXL346
VTI
CMA3000
n.a.
2007
ST
LIS3L02AE12
2012 2013
ADI
ADXL362
ST LIS302DL
MCube BI3L
BOSCH
SMI540
ST
LSM330 ST
LSM303D
AUTO
CONSUMER
2014
BOSCH
BMA355
1
2009
All are 3-axis accelerometers
US$ values are Production Cost
© 2014• 9
New approaches to overcome MEMS challenges
Maximum optimization Breakthrough
• Single 3A gyro design (STM,
Invensense)
• Single 3A accelero + 3A gyro
structure (STM, Invensense)
• TSV via last (STM)
• TSV via first (STM)
• TSV in ASIC (Bosch)
• 3D MEMS with TSV (mCube)
• Eutectic Au-Si bonding (Maxim)
• Eutectic Al-Ge bonding (Bosch,
Invensense)
• CMOS-MEMS (Invensense)
• TSV platform (Teledyne Dalsa)
Design Process
• Single 3A gyro
design (STM,
Invensense)
• Single 3A accelero +
3A gyro structure
(STM, Invensense)
New detection principles
• BAW resonant sensor (Qualté)
• M&NEMS (Tronic’s)
• NEMS gas chromatography (APIX)
• Suspended Microchannel Resonator (Affinity Biosensors)
• Quartz Crystal Microbalance (Q-Sense)
© 2014• 10
2020+2010200019901960
Cost(US$)
Size(mm²)
FIRST INTEGRATED
SENSOR
Ex: SA20 Sensonor for
Airbag systems.
CAPACITIVE COMB
DRIVE BECOMES
DOMINANT
Ex: ST, Bosch …
PACKAGING /
INTEGRATION AS
ENABLING
TECHNOLOGY
Ex: SiTime, ST, Bosch …
From micro machines to MEMS
MEMS to
NEMS
NEMS
MIX MEMS (thick layer)
& NEMS (gauge) FOR
MIN AREA &
IMPROVED PERF.
Ex: Tronics
DISRUPTIVE
APPROACHES
Ex: EPFL, CNRS, CEA
Leti, Caltech, Berkeley …
3
10
1
15
0.5
1
0.1
5
From micro machines to MEMS to NEMS …
© 2014• 11
Available MEMS reports
Technology Trends
for Inertials MEMS
Trends in MEMS
Manufacturing &
Packaging
Ferro-Electric
Thin Films
IMU & Gyro for
Defense, Aerospace
& Industrial
Status of the
CMOS Image
Sensors Industry
Thin Wafer
Handling
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
Motion Sensors for
Consumer & Mobile
applications
Sensor fusion of
acceleros, gyros &
magnetometers
Infrared Detectors
Technology &
Market Trends
Inertial MEMS
Manufacturing
Trends 2014
RF Filters, PAs, Antenna
Switches & Tunability for
Cellular Handsets
MEMS Front-End
Manufacturing
Trends
MEMS Pressure
Sensor
Technologies &
Sensors for the
Internet of Things
New!
MEMS Microphones
MEMS for Cell
Phones and Tablets
Status of the
MEMS Industry
Emerging MEMS
New! New!New! New!
New!
New!
© 2014• 12
Yole activities in MEMS
www.yolefinance.com
YOLE FINANCE
M&A/ Due Diligence/ Fundraising/
Technology brokerage
PARTNERS
CONSULTING
Market research/Technology
& Strategy/Patent Investigation/
Reverse costing
www.yole.fr
MEDIA
News portal/Technology magazines/
Webcasts/Communication services
REPORTS
Market & technology/Patent
Investigation/Reverse costing
Status of the
MEMS Industry
© 2014• 13
Our offices and contact information
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
European and North America Office
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer
Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr
© 2014• 14
For more information…
Take a look at our websites:
www.yole.fr
Yole Développement corporate website
www.i-micronews.com
News Portal - online free registration to our publications
www.systemplus.fr
Sister company expert in teardown & reverse costing analysis
www.yolefinance.com
Separate business unit of Yole dedicated to financial services
Follow us on
ORDER FORM
Status of the MEMS Industry in 2014
SHIPPING CONTACT
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SALES CONTACTS
• North America: David Jourdan - jourdan@yole.fr
• Asia: Takashi Onozawa - onozawa@yole.fr
• Europe  RoW: Jean-Christophe Eloy - eloy@yole.fr
• Korea: Hailey Yang - yang@yole.fr
• General: info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
July 28th, 2014
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
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be aware that our publication will be watermarked on each page with the name of the
recipient and of the organization (the name mentioned on the PO). This watermark
will also mention that the report sharing is not allowed.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media
in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or
process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED,
Image Sensors, Optoelectronics, Microfluidics  Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics.
The group supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends
to develop their business.
MEDIA  EVENTS
• i-Micronews.com, online disruptive technologies website
• @Micronews, weekly e-newsletter
• Technology Magazines dedicated to MEMS, Advanced Packaging,
	 LED and Power Electronics
• Communication  webcasts services
• Events: Yole Seminars, Market Briefings…
More information on www.i-micronews.com
CONTACTS
For more information about :
• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)
• Financial Services: Géraldine Andrieux-Gustin (andrieux@yole.fr)
• Report Business: David Jourdan (jourdan@yole.fr)
• Corporate Communication: Sandrine Leroy (leroy@yole.fr)
CONSULTING
• Market data  research, marketing analysis
• Technology analysis
• Reverse engineering  costing services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
REPORTS
• Collection of technology  market reports
• Manufacturing cost simulation tools
• Component reverse engineering  costing
	analysis
• Patent investigation
More information on www.i-micronews.com/reports
FINANCIAL SERVICES
• Mergers  Acquisitions
• Due diligence
• Fundraising
• Coaching of emerging companies
• IP portfolio management  optimization
More information on www.yolefinance.com

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Status of the MEMS Industry 2014 Report by Yole Developpement

  • 1. © 2014 Copyrights © Yole Développement SA. All rights reserved. Status of the MEMS Industry 2014 Challenged by newcomers proposing innovative low-cost solutions for consumer applications, established MEMS players must develop new strategies to ensure continued growth. SAMPLE
  • 2. © 2014• 2 • This 2014 edition of “Status of the MEMS Industry” presents the MEMS device market and key industry changes and trends. • Yole is actively following the market evolution of more than 220+ MEMS applications and is tracking 350+ MEMS companies  this report combines all these applications into 15+ major MEMS devices: IJ heads, pressure sensors, microphones, accelerometers, gyroscopes, magnetometers, IMUs, micromirrors, MOEMS, microbolometers, IR sensors, microdisplays, microfluidics, RF MEMS, Oscillators, micro tips, and emerging MEMS devices. • Based on the thousands of direct interviews Yole Développement analysts are conducting annually in the MEMS field with MEMS manufacturers, system manufacturers integrating MEMS and MEMS designers, MEMS equipment and material manufacturers, and MEMS technology developers, this 11th version of the “Status of the MEMS Industry” provides up-to-date analyses and data on MEMS markets.
  • 3. © 2014• 3 2012-2019 MEMS Markets (US$M)
  • 4. © 2014• 4 2012-2019 MEMS Markets by Application (US$M)
  • 5. © 2014• 5 Evolution 2009-2013: Maintaining growth is a challenge for consumer applications
  • 6. © 2014• 6 Example of supply chain & infrastructure 15+ detailed supply chains
  • 7. © 2014• 7 Consumer MEMS challenges PRICE PRESSURE SIZE REDUCTION NEW APPLICATIONS Internet of Things Mobility LBSE-Health Social networking Connectivity everywhere MORE INTELLIGENCE Sensor fusionSoftware Data discrimination Stronger RF specifications Closer integration with processing Better performance High volume production 3D integration New wafer bonding Fabless model Shared fab infrastructure MEMS across multiple markets New MEMS design Above IC
  • 8. © 2014• 8 Accelerometer MEMS size evolution 2008 2010 2011 MEMS Size (mm²) 4 2 3 $0.03-0.075 $0.075-0.1 >$0.1 ST LIS331DLH ST LIS3DH BOSCH BMA180 BOSCH BMA250 / BMC050 Kionix KXTE9 5 ADI ADXL346 VTI CMA3000 n.a. 2007 ST LIS3L02AE12 2012 2013 ADI ADXL362 ST LIS302DL MCube BI3L BOSCH SMI540 ST LSM330 ST LSM303D AUTO CONSUMER 2014 BOSCH BMA355 1 2009 All are 3-axis accelerometers US$ values are Production Cost
  • 9. © 2014• 9 New approaches to overcome MEMS challenges Maximum optimization Breakthrough • Single 3A gyro design (STM, Invensense) • Single 3A accelero + 3A gyro structure (STM, Invensense) • TSV via last (STM) • TSV via first (STM) • TSV in ASIC (Bosch) • 3D MEMS with TSV (mCube) • Eutectic Au-Si bonding (Maxim) • Eutectic Al-Ge bonding (Bosch, Invensense) • CMOS-MEMS (Invensense) • TSV platform (Teledyne Dalsa) Design Process • Single 3A gyro design (STM, Invensense) • Single 3A accelero + 3A gyro structure (STM, Invensense) New detection principles • BAW resonant sensor (Qualté) • M&NEMS (Tronic’s) • NEMS gas chromatography (APIX) • Suspended Microchannel Resonator (Affinity Biosensors) • Quartz Crystal Microbalance (Q-Sense)
  • 10. © 2014• 10 2020+2010200019901960 Cost(US$) Size(mm²) FIRST INTEGRATED SENSOR Ex: SA20 Sensonor for Airbag systems. CAPACITIVE COMB DRIVE BECOMES DOMINANT Ex: ST, Bosch … PACKAGING / INTEGRATION AS ENABLING TECHNOLOGY Ex: SiTime, ST, Bosch … From micro machines to MEMS MEMS to NEMS NEMS MIX MEMS (thick layer) & NEMS (gauge) FOR MIN AREA & IMPROVED PERF. Ex: Tronics DISRUPTIVE APPROACHES Ex: EPFL, CNRS, CEA Leti, Caltech, Berkeley … 3 10 1 15 0.5 1 0.1 5 From micro machines to MEMS to NEMS …
  • 11. © 2014• 11 Available MEMS reports Technology Trends for Inertials MEMS Trends in MEMS Manufacturing & Packaging Ferro-Electric Thin Films IMU & Gyro for Defense, Aerospace & Industrial Status of the CMOS Image Sensors Industry Thin Wafer Handling MEMS Cosim+ MEMS Manufacturing Cost Simulation Tool Motion Sensors for Consumer & Mobile applications Sensor fusion of acceleros, gyros & magnetometers Infrared Detectors Technology & Market Trends Inertial MEMS Manufacturing Trends 2014 RF Filters, PAs, Antenna Switches & Tunability for Cellular Handsets MEMS Front-End Manufacturing Trends MEMS Pressure Sensor Technologies & Sensors for the Internet of Things New! MEMS Microphones MEMS for Cell Phones and Tablets Status of the MEMS Industry Emerging MEMS New! New!New! New! New! New!
  • 12. © 2014• 12 Yole activities in MEMS www.yolefinance.com YOLE FINANCE M&A/ Due Diligence/ Fundraising/ Technology brokerage PARTNERS CONSULTING Market research/Technology & Strategy/Patent Investigation/ Reverse costing www.yole.fr MEDIA News portal/Technology magazines/ Webcasts/Communication services REPORTS Market & technology/Patent Investigation/Reverse costing Status of the MEMS Industry
  • 13. © 2014• 13 Our offices and contact information Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr European and North America Office • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: yang@yole.fr
  • 14. © 2014• 14 For more information… Take a look at our websites: www.yole.fr Yole Développement corporate website www.i-micronews.com News Portal - online free registration to our publications www.systemplus.fr Sister company expert in teardown & reverse costing analysis www.yolefinance.com Separate business unit of Yole dedicated to financial services Follow us on
  • 15. ORDER FORM Status of the MEMS Industry in 2014 SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code : 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America: David Jourdan - jourdan@yole.fr • Asia: Takashi Onozawa - onozawa@yole.fr • Europe RoW: Jean-Christophe Eloy - eloy@yole.fr • Korea: Hailey Yang - yang@yole.fr • General: info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: July 28th, 2014 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER Please enter my order for above named report : One user license*: Euro 3,990 Multi user license: Euro 5,990 For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Please be aware that our publication will be watermarked on each page with the name of the recipient and of the organization (the name mentioned on the PO). This watermark will also mention that the report sharing is not allowed. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to develop their business. MEDIA EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics • Communication webcasts services • Events: Yole Seminars, Market Briefings… More information on www.i-micronews.com CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) • Financial Services: Géraldine Andrieux-Gustin (andrieux@yole.fr) • Report Business: David Jourdan (jourdan@yole.fr) • Corporate Communication: Sandrine Leroy (leroy@yole.fr) CONSULTING • Market data research, marketing analysis • Technology analysis • Reverse engineering costing services • Strategy consulting • Patent analysis More information on www.yole.fr REPORTS • Collection of technology market reports • Manufacturing cost simulation tools • Component reverse engineering costing analysis • Patent investigation More information on www.i-micronews.com/reports FINANCIAL SERVICES • Mergers Acquisitions • Due diligence • Fundraising • Coaching of emerging companies • IP portfolio management optimization More information on www.yolefinance.com