More information on that report at http://www.i-micronews.com/reports/Permanent-Wafer-Bonding-Semiconductor-Trends-Technology/14/430/

1. © 2014
Permanent Wafer
Bonding
Application trends & Technology
Brewer Science

2. © 2014• 2
Table of content
• Table of contents……………………………...2
• Objectives of the Study………………………4
• Definition, limitations & Methodology……..6
• 2011 vs. 2014 Analysis Comparison……….7
• Companies Cited in the Report…………..…9
• Glossary…………………………………….…..10
• Executive summary…………………………..12
– Methodology and Key Trends
– Bonding technologies vs Applications
2013-2019 Number of wafers bonded (wspy
– Permanent Bonding Market Forecasts
(in wafer eq., $M)
• by Technology
• by Application
– Permanent Bonder Market Forecasts
(in Unit of Production)
– Breakdown by End Applications
– in 8 eq wspy
• in 8 eq wspy
• in $M
– Permanent Bonding Equipment suppliers’ Market
Share ………….………………………………..36
• Introduction, Definitions & Scope of the Report ..59
– Overview of the permanent bonding
technologies……………………………….64
•
• Main Players involved Permanent Bonding
Equipment ………………………………………..……67
• 2013-2019 Detailed Permanent Bonding
Market Forecast by Wafer bonding process……..71
– Permanent Bonding Market Forecasts by
technology (in $M)
– Permanent Bonding Market Forecasts by
technology (in wafer eq.)
– Fusion bonding…………..............................84
– Anodic bonding……………………………….109
– Glass frit bonding……………………………129
– Adhesive bonding……………………………139
– Eutectic Bonding……………………………..153
– Transit Liquid Phase bonding………………164
– Cu-Cu @ Room Temp bonding……………..175
– Thermo-compression bonding………………185
• 2013-2019 Detailed Permanent Bonding Forecast by
Applications…………………….……195
– MEMS devices…………………….208
– Advanced Packaging……..……..227
• CMOS Image Sensors
• 3D Stack TSV
– LED devices……………………….264
– SOI substrate………………………285
• Conclusions & Perspectives……………….300
• Company Presentation………………….…..305

3. © 2014• 3
Objectives of the study
• This is the second research update on this market after our first report published in 2011 on
Permanent bonding technologies
• We described the main applications that require permanent bonding processes and as well as the
types of permanent bonding technologies
• Market Research Scope: the objectives of the report are:
– Give the detailed information regarding permanent bonding processes
– Describe the main applications using permanent bonding processes
– To provide an overview of the technological trends and applications that use permanent bonding processes
– To provide a forecast for the next five years, and predict future trends for permanent bonding
• Overview of the permanent bonding used in MEMS, Advanced Packaging, LED and SOI substrate applications
• Evaluate market developments in terms of market size
• in wafers, number of chambers, value in $M by application, by permanent bonding technology and wafer size
• We have focused on the following permanent bonding applications
– MEMS
– Advanced Packaging
– LED
– SOI substrate
• We have not included:
– PV applications
– C2W approach
– Advanced Substrate such as SSOI, SGOI, GOI

4. © 2014• 4
Wafer bonding
technologies
Without intermediate
layer
Fusion bonding/ direct
or molecular bonding
200°C<T<1100°C
Anodic bonding
350°C<T<450°C
With intermediate layer/
indirect
Insulating interlayer
Glass frit bonding
350°C<T<450°C
Adhesive bonding
T<150°C
Metal bonding
Cu-Cu/oxide hybrid
bonding at RT
Solder bonding
Eutectic bonding
300°C<T<450°C
Transit Liquid Phase
180°C<T<300°C
Thermo-compression
• Permanent Bonding technologies
– Throughout this report, we will address and cover the following permanent bonding
technologies
– Depending on the permanent bonding technology, the bonding step can be performed at
various temperatures
Wafer bonding technology
Overview

5. © 2014• 5
Scope of the Report
• Market scope:
– Permanent wafer bonding is used in a wide range of devices in the semiconductor industry.
– Advanced Substrate will not be covered in this report
Applications of permanent bonding technologies covered
MEMS
LED
packaging
(for HB-LED)
WLCapping
Advanced Packaging LED
CMOS Image
Sensor
LED carrier:
Bonding to
the carrier
Back-Side
Illumination
Capping Wafer
Level Packaging
3D Stack
TSV
SOI Substrate

6. © 2014• 6
MEMS
Advanced Packaging LED
SOICIS
TSV
stacks
Carrier HB-LED
BSI
Capping
WLP
Permane
nt
Bonding
Direct
bonding
Fusion
bonding
Anodic
Bonding
Indirect
bonding
Glass Frit
Bonding
Adhesive
bonding
Cu-Cu/ oxide
hybrid
bonding @RT
Solder
bonding:
Eutectic
Bonding
Solder
Bonding: TLP
Thermo-
compression
Bonding technologies vs Applications
Production
On development

7. © 2014• 7
WPSY MEMS
Advanced Packaging LED
SOICIS
TSV
stacks
Carrier HB-LED
BSI
Capping
WLP
Permane
nt
Bonding
Direct
bonding
Fusion
bonding
1.1M
8’’ eq
Anodic
Bonding
Indirect
bonding
Glass Frit
Bonding
Adhesive
bonding
199 k
8’’ eq
Cu-Cu/ oxide
hybrid
bonding @RT
0 k
8’’ eq
Solder
bonding:
Eutectic
Bonding
Solder
Bonding: TLP
Thermo-
compression
Bonding technologies vs Applications
2013 Number of wafers bonded (wspy) 8 inch eq

8. © 2014• 8
0
2 000
4 000
6 000
8 000
10 000
12 000
14 000
16 000
18 000
2013 2014 2015 2016 2017 2018 2019
Numberofwafers(8incheq)
Wafer Forecast by Application (in 8 inch eq)
(Report includes detailed breakdown for the following applications: 3D TSV stack, CIS BSI, CIS capping WLP, LED
carrier, LED packaging, MEMS, SOI)
Yole Developpement © April 2014
Wafer Forecast by Permanent Bonding
Technology (in 8 inch eq)

9. © 2014• 9
2013 Overall Market Share for Permanent Bonding
• The Permanent Bonding business is fragmented into EVG, SUSS MicroTec and TEL
• EVG, SUSS, TEL today concentrate almost 80% of the permanent bonding equipment
market by focusing on MEMS devices, Advanced Packaging (CIS BSI, WLP, 3D
Stacks), applications
Market share extracted from the preivous
report Permanent bonding in 2011
Market share assessed in 2013
2013 market share breakdown by permanent bonding
equipment supplier (in M$)
(Report includes detailed breakdown for each supplier)

10. © 2014• 10
More slides extracts

11. © 2014• 11
Who Should Be Interested in This Report?
• Equipment & Materials suppliers
– Identify new business opportunities and prospects
– Understand the differentiated value of your products and technologies in this market
– Identify technology trends, challenges and precise requirements related to permanent
bonding
– Evaluate market potential of your permanent bonding technologies
– Position your company in the market
– Monitor and benchmark your competitors
• IDMs, CMOS foundries & OSAT players
– Understand technology trends related to permanent bonding applied in the MEMS, LED, CIS
and Advanced Packaging applications
– Spot new opportunities and define diversification strategies
• R&D organizations & Investors
– Monitor the global activity and consolidation currently happening in the semiconductor
equipment & material business in order to identify new partners, targets and make the right
decisions before committing to one particular supplier

12. © 2014• 12
About the author of this report
Amandine Pizzagalli
– Amandine is in charge of equipment & material fields for the Advanced
Packaging & Manufacturing team at Yole Développement after graduating as an
engineer in Electronics, with a specialization in Semiconductors and Nano
Electronics Technologies. She worked in the past for Air Liquide with an
emphasis on CVD and ALD processes for semiconductor applications.
Contact: pizzagalli@yole.fr

13. © 2014• 13
Companies Cited in this Report
AMD, AML, Applied Materials, Avago, Bosch, Discera, EVG, Infineon,
Invensense, Lemoptix, Luxtera, Mitsubishi Heavy Industries, Murata /
VTI, Nemotek, OSRAM, PlanOptik, Samsung, Sensonor, SOITEC, ST
Micro, SUSS MicroTec, Sony, Teledyne/Dalsa, Tokyo Electron, Ziptronix,
IMEC, Leti, Texas Instruments, Tezzaron, WiSpry, Ziptronix, and more…

14. © 2014• 14
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