As major technology changes continue to reshape the industrial landscape, a 10% CAGR is forecast for the CMOS image sensor market from 2013 – 2018. The market will reach a total value of ~US$13B by 2018, driven by consumer and automotive applications. The CMOS Image Sensor market will reach US$13B by 2018! Driven by handset and tablet applications, a 10% CAGR is forecast for the CMOS image sensor market from 2013 – 2018, reaching a value of almost US$13B by 2018. Many different applications are driving CMOS image sensor integration. It’s likely that the consumer market will benefit from new mobile technologies. As such, we foresee consumer applications (tablets, DSC etc.) to be the growth driver over the next five years (which is the opposite of the previous five years, which were driven exclusively by mobile applications). Moreover, after being dominated by CCD, DSC applications are now shifting towards CMOS. And while DSLR will be a substitution market, the next wave is likely to be automotive applications, which could become CIS’ third big market. Indeed, the CIS sensor market in automotive is showing steady growth, which is expected to continue in the coming years; possibly become CIS’ third-largest CIS market. Automotive also demands new technologies such as high dynamicrange sensors and near infra-red response, and will benefit (with appropriate optimization) from technology developments in the handset market. A shift from driving assistance applications to security-based applications may imply significant quality and reliability design improvements in the near future, possibly leading to traditional automotive product providers entering the market with more exuberance. Many other emerging applications are also set to drive CIS’ future growth, such as wearable electronics (i.e. smart watches), machine vision, security & surveillance, and medical applications. These applications are likely to be in position for strong growth in the mid and long-term. The “Big 3” are likely to maintain their leadership, thanks to advanced technologies and strong production capacity For each application, different market dynamics exist between competitors. In the handset market, we believe the Big 3, Omnivision, Samsung and Sony, will continue to dominate thanks to advanced technologies, a large installed capacity and a costoptimized manufacturing machine, while secondtier players must overcome economic and technical challenges to stay competitive. In the consumer market, major Japanese companies will still lead in DSLR, and it’s likely to stay that way since they’re vertically-integrated (although some CIS companies have announced dedicated products). Automotive is a highly concentrated market, with 95% served by the top five suppliers. More information on that report at http://www.i-micronews.com/reports/Status-CMOS-Image-Sensor-Industry/1/414/

1. Status of the CMOS Image
Sensors Industry
2014 Report
Driven by consumer and automotive applications, the CMOS image sensor market is
forecasted to have a 10% CAGR over 2013-2018 to value ~US$13M in 2018.
© 2013

2. Table of Contents (1/2)
•
•
•
What we saw, what we missed …………….5
Changes for 2013 report …………………….6
Objectives & Scope of the report…..………7
•
Executive Summary ………………..........… 13
1)
Introduction & Background ……….........… 49
–
2)
Application Focus ………..………..........…116
–
Market shares by application ………………………..117
–
Mobile phones ………………………..…………….128
o Applications, specifications, markets & supply chain
–
–
–
–
Shipment forecast (in Munits)
Revenue forecast (in $M)
FSI vs. BSI forecast
Wafer production forecast (in wafer size eq.)
•
200mm vs. 300mm production forecast
–
•
Manufacturing infrastructure
Supply chain & Value chain
2012 market shares
•
In shipments (in Munits)
•
In revenue (in $M)
Estimated 2013-2018 market share projection 98
2
Automotive sensors …………………………………..155
o Applications, specifications, markets, players & supply chain
o Night-vision: Near Infrared vs. Far Infrared cameras
–
Security & Surveillance Sensors ………………..175
o
Global CMOS Image Sensor ……………………. 91
o
o
o
Professional video ………..………………….148
o Applications, specifications, markets & supply chain
2011 - 2018 CMOS Image Sensors Forecasts …. 57
o
o
o
o
High-End photography ………..………………….139
o Applications, specifications, markets & supply chain
CCD versus CMOS Sensors ……………………… 50
Market Forecasts & Supply Chain …..…. 56
© 2013 •
3)
–
Applications, specifications, markets & supply chain
Medical Imaging …………………………………….183
o
o
o
Applications, specifications, markets, players & supply chain
Endoscopy:
•
Cameras pills
•
disposable endoscopes
X-ray imaging:
•
Dental imaging: intraoral and 3D extra oral detectors
•
Medical detectors: CMOS x-ray Flat panel detectors &
Single photon counting detectors

3. Table of Contents (2/2)
3)
–
Application Focus (continued)
–
–
o
o
Industrial Machine Vision ……………………………. 217
o
Applications, specifications, markets & supply chain
–
Barcode scanning …………………………….. 237
o
Improved light confinement & selection ……. 337
BSI imagers ………………………………………. 359
o
o
Applications, specifications, markets & supply chain
BEOL improvements
Color filters improvements
Introduction to BSI architecture
BSI manufacturing challenges
•
4)
Final conclusions ………………………. 404
•
Appendix ………..…………………....….. 408
New & Future Technologies …….………... 243
–
–
Summary of main technical innovations for CMOS
image sensors ………………………………….. 244
New functionalities ………………………………. 263
o
o
o
–
Future generation of image sensors …………….. 303
o
o
–
3
New absorptive layer
Quantum detection
Advanced pixel architecture ………………………. 317
o
o
o
o
© 2013 •
3D imaging & gesture recognition
Computational imaging
Phase detection
Transistor-shared pixels
Pixel isolation
FLAT pixel
3D stacked image sensors
–
Yole Développement presentation

4. Companies Cited in This Report
Acti Corp, ADIMEC, Advantest, Advasense, AIE, Alexima, Allied Vision Technology, AML, Anafocus,
Anteryon, Aphesa, Aptina Imaging, Austria Microsystems, Axis Communication, Awaiba, Basler, Bosch
Security Systems, Brainvision, Brigates, Brookman Technology, BYD, Caeleste, Canon, Carestream Dental,
Carestream Health, Clairpixel, CMOSIS, CMOS Vision, CMT Medical, Cognex, Continental, Crysview, CSEM,
Dahua Technologies, Denso, Dexela, DEXIS, D-Link, Delphi, Dongbu HiTek, DXG, e2v, e-con systems,
ELMOS, EPFL, Excico, Fairchild Imaging, FLIR, Fondazione Bruno Kessler, Forza Silicon, Fotonic, Foveon,
Fraunhofer, Fujifilm, Fujitsu, GalaxyCore, Gendex, Given Imaging, Grace Tech, Hamamatsu Photonics,
Hella, Hightec, Hejian, Hikvision, Himax imaging, HHNEC-Grace, HTC, SK Hynix, Instrumentarium,
Intromedic, Invisage, Invision biometrics, Invendo Medical, Invensense, ImageWorks, IMEC, IMS-Chips, IO
Industries, ISDI, ISORG, JAI, Jinshan Group, JSR, JVC/Altasens, Konica Minolta, Kostal, KunShan RuiXin
Micro, KYEC, Leica, Lfoundry, LG, Lytro, Mantis Vision, Magna, Magneti Marelli, Medigus, Melexis, MESA
Imaging, Micron, Microsoft, Mobotix, Morita, New Imaging Technologies, Nikon, Novatek, Odos Imaging,
Omnivision, Omron, ON Semi, Optex, Owandy, Oy Ajat, Panavision Imaging, Panasonic, Pelican Imaging,
PerkinElmer, Philips, Pixart, PixelPlus, Pixim, Pelco, Photobit, Plastic Logic, PMD Technologies, Point Grey
Research, Powerchip, Pyxalis, Rad-icon, Raytrix, Renesas, Rutherford Appleton Laboratory, Samsung,
Sarnoff, SETi, Sharp, Shick/Sirona, SiliconFile, Soft Kinetic, SK Hynix, SMIC, SOITEC, Sony, SRI
International, STMicroelectronics, SuperPix, TEL, Teledyne DALSA, Tessera, Thayer school of engineering
Dartmouth, The Imaging source, Tong Hsing, TOK, Toray, Toshiba, Toyota Central Labs, Trixell/Thales,
TrueSense, TSMC, Toshiba Teli, TowerJazz, Tridicam, TRW, TU Delph, TYZX, UMC, University of Edinburg,
Valeo, Vanguard, Vatech Humanray, VisEra, Vista Point, Viti, Viimagic, Vision research, Vivitar, Vivotek,
WLCSP, X-counter, X-Fab, XinTec, Ziptronix and more …
© 2013 •
4

5. What We Saw, What We Missed
What We Saw
o
The continuous growth for CIS.
o
What We Missed
The growth of the automotive applications.
The different technological evolutions,
especially the 3D imaging.
o
BSI penetration.
o
The shift CMOS vs. CCD for DSC
applications.
© 2013 •
5
The new application of wearable
electronics (Google glasses).
o
o
o
The computational imaging
technology.

6. Changes for the 2013 Report
New Content Compared to 2012 Version
What’s New?
o Updated 2012-2018 market forecasts with refined model for cell
phones application
o New entrants: SMIC (likely to work with Chinese design houses),
Lfoundry (Micron fab), UMC, Hynix
o Updated applications analysis with focus on machine vision
o Updated technological section describing new production trends
at different levels:
o New functionalities
o Future CIS generation
o Advanced pixel architecture
o Improved light confinement & selection
© 2013 •
6

7. Scope of the Study
• There are various kinds of image sensors:
– CMOS versus CCD image sensors. Array versus Linear image sensors
CCD
CMOS
image sensors
image sensors
Linear
image
sensors
Array
image
sensors
 This report will focus primarily on Array CMOS
image sensors
© 2013 •
7

8. CMOS vs CCD, Past and Future (1/2)
•
CMOS image sensors (CIS) were initially introduced in low-end applications
like mobile phones because they were more easily adapted than CCDs to
high volume portable application markets requiring cost-effective and lowpower sensors.
•
The first push for CIS to be introduced in low-end applications came mainly
from start-up companies such as Omnivision, Photobit, and VLSI Vision
Limited, among others. The exception is Sony, which entered into CIS from
the DSLR application before entering the mobile application market.
•
CIS market is driven by Consumer and Mobile applications which
contribute massively to the evolution of the technologies.
•
The other markets will largely benefit from the evolution of the Consumer /
Mobile applications. It could be difficult to enter the other markets if a
company is not a key player in CIS technology because of the costs of
technology development and access.
© 2013 •
8

9. CMOS vs CCD, Past and Future (2/2)
•
CIS sales have rapidly gained market share over CCD sensors in the last
ten years driven by camera integration inside mobile phone. But CCD
sensors were still the preferred option for the high-end applications
requiring the highest image quality and sensitivity such as machine vision,
surveillance, microscopy, etc….
•
However since 2010, the introduction of new designs and front-end
technologies have compensated for the weaknesses of CMOS image
sensors.
•
Global shutter and BSI technology have enabled CIS to perform as well as
CCD on image quality, while keeping its traditional advantages: namely fast
speed, low-power consumption, high resolution, and high integration. We
now see the shift from CCD to CMOS dramatically accelerating in all the
footholds of CCD sensors: surveillance, life sciences, machine vision, and
DSC. Consequently we expect CIS revenue, representing 89% of total
imager market in 2013, will go up to 97% of total revenue by 2018.
© 2013 •
9

10. CMOS Image Sensor Revenue
Forecast by Market (in $M)
• Mobile handset sales accounted for ~ 55% of TOTAL CMOS image sensor sales in 2013. Overall revenue growth
is anticipated to experience a CAGR of ~ 8% within the next 5 years.
• Mobile handset market share is expected to decrease to 50% of total CIS market revenue in 2017, because of
the strong growth in the consumer market driven by massive sales of tablets . Key growth driver for the next 5
years will be consumer (tablets) application.
© 2013 •
10

11. Forecasted Growth of CIS Sales Volume
by Application
•
Three categories of applications can be identified:
–
–
–
© 2013 •
11
Fast emerging applications driving overall growth of the market with a CAGR over 20%.
Maturing applications that are either widely equipped with CIS cameras, or maturing (CAGR between 10% & 20%).
The middle category consists of applications driving the growth of CIS for two reasons: either an intrinsic growth of
the market, or an ongoing shift from CCD to CMOS (Security).
Maturing markets (below 10%).

12. Future Technologies Roadmap for CIS for Mobile
And more* …
Multi sensing (VIS & IR)
New absorptive layer
0.9 µm pixel size & below
BEOL improvements (<65 nm, new CFA …)
3D Stack
Backside Illumination
300 mm infrastructure
2013
2016+
* In particular, we see an increasing use of global shuttering (for machine vision).
© 2013 •
12

13. Future Technologies for CIS
BEOL improvements: form factor reduction /
increased QE / reduced X-talk / higher CRA /
reduced power consumption
• Design rules < 65 nm
• Inter pixels shielding, reflecting walls, CFA
• Inner µlenses
• µcolor splitters
• Lightpipes
New absorptive layer /
quantum detection: form
factor reduction / flexibility /
robustness / maximize QE /
higher dynamic range /
multispectral imaging :
faster processing / photon
discrimination / gesture
recognition:
• Quantum / organic films
• Organic printed PDs
• Quanta image sensor
• SPD
© 2013 •
13
MODULE LEVEL: Computational imaging: form factor reduction /
robustness / better QE / higher dynamic range / multispectral imaging
/ past & faster focus / 3D imaging / gesture recognition / micro lens &
software:
• Microlenses & software
Novel CFA: maximize QE / increased
resolution / minimize X-talk:
• RGBW / RGBC / Clarity+
• Lensed color filters
• 3x2 color filter array
• Rectangular color filter array…
Advanced pixel architecture:
maximize QE / increased
resolution / minimize X-talk /
higher dynamic range / reduced
power consumption:
• Transistor-shared pixel design
• Pixel isolation
• FLAT pixel
New functionalities at pixel level:
dual phase pixels / phase pixels:
• Faster focus

14. CMOS Image Sensor
2012 Revenue & Market Share ($M)
Relative Market Shares by Player (for sales > US$10M)
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
Cell-Phones
DSLR / ILCs
Notebooks
Tablets
Security & Surveillance Cameras
DSC
Automotive
Portable Game Stations
Game Stations
X-Ray medical imaging
Machine vision
Professional & Broadcast cameras
Others
© 2013 •
14

15. About the Authors of This Report
•
Dr. Eric Mounier
–
Dr. Eric Mounier co-founded Yole Développement in 1998. He oversees technology analysis
for MEMS-related manufacturing technologies and Optical MEMS (including micromirrors,
micro-displays, autofocus and IR micro-bolometers) applications within the company. Eric
has also developed a unique cost modeling tool, called “MEMSCoSim”, which is able to
evaluate the cost of MEMS module manufacturing.
–
Contact: mounier@yole.fr
•
Paul Danini
–
Paul is in charge of the imaging technology studies at Yole Développement. After a short
experience at e2v, he previously worked in IP strategy and management at Avenium
Consulting. He holds a Master of Engineering in instrumental physics & medical imaging,
complemented by a master’s degree in Technology and Innovation Management from
Grenoble EM Business School.
•
Jean-Luc Jaffard
–
From 1996 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at
the forefront of the emergence and growth of this business. At STMicroelectronics Imaging
Division he was successively appointed Research Development and Innovation Director
managing a large multidisciplinary and multicultural team and later on promoted Deputy
General Manager and Advanced Technology Director in charge of identifying and developing
breakthrough Imaging Technologies and to transform them into innovative and profitable
products. In 2010 he was appointed STMicroelectronics Intellectual Property Business Unit
Director. In January 2014 he created the Technology and Innovation branch of Red Belt
Conseil
© 2013 •
15

16. Available MEMS Reports
Uncooled Infrared
Imaging Techology &
Market Trends
New!
MEMS Pressure
Sensor
New!
Status of the
CMOS Image
Sensors
Infrared Detectors
Technology &
Market Trends
New!
MEMS Front-End
Manufacturing
Trends
16
MEMS for Cell
Phones and Tablets
Emerging MEMS
New!
New!
New!
RF Filters, PAs,
Antenna Switches &
Tunability for Cellular
Handsets
Technology Trends
for Inertials MEMS
IMU & Gyro for
Defense, Aerospace
& Industrial
New!
MEMS
Microphone
Sensor fusion of
acceleros, gyros &
magnetometers
© 2013 •
Status of the
MEMS Industry
Ferro-Electric
Ferro-Electric
Thin Films
Thin Films
Thin Wafer
Handling
Trends in MEMS
Manufacturing &
Packaging
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
Motion Sensors for
Consumer & Mobile
applications

17. Yole activities in MEMS
MEDIA
REPORTS
CONSULTING
News portal/Technology magazines/
Webcasts/Communication services
Market & technology/Patent
Investigation/Reverse costing
Market research/Technology
& Strategy/Patent Investigation/
Reverse costing
www.yole.fr
Status of the
MEMS Industry
YOLE FINANCE
M&A/ Due Diligence/ Fundraising/
Technology brokerage
www.yolefinance.com
PARTNERS
© 2013 •
17

18. Our Offices & Contact Information
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• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 Email: mclaughlin@yole.fr
• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986- Email: edwards@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
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Email: onozawa@yole,fr
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•
Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer
Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr
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• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810
- Fax: (82) 2 2010 8899 – Email: yang@yole.fr
© 2013 •
18

19. For More Information…
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19