1. Shaping One’s Career by Leading Paradigm Shifts (for Information Age) Presented by: Al Kwok ( 郭灿辉 ) President, CASPA Pearl River Delta Chapter Individual Member, VSI Alliance Career Forum (Sep/10/2005)
12. CASPA: A Community Service Platform Shanghai Taipei Silicon Valley, HQ Singapore Austin Phoenix HQ, local chapters Corporate Sponsors Alliances Oregon HongKong Beijing Dallas CASPA Global Business Network
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15. Career Development Path (2) Main (IP trading) Main (IP trading) Main (MOU) Some (connection) CASPA PRD (ecosystem) Some (CAM Std.) Main (IP mgmt.) Some (M&A) Some (res. Mgmt.) Some NMI (bus. dev.) Some (P-flash) Main (IP B.M.) Main (licensees) Some (tech. dev.) Some PMC (bus. dev.) Some (QSOP) Some (fabless) Main (vendors) Main (res. mgmt.) Some (tech. tranf.) QSI (operations) Some (strat. partr.) Main (proj. mgmt.) Some VTI (88-89) Some (CMOS) Some (CMOS) Main (proj. mgmt.) Main (yield guru) IDT (83-88) Some (team leadr.) Main AMD (79-83) Rainmaker (ecosystem) Path-finder Deal-maker Facilitator Contributor
19. The CMOS Low Power Advantage Picture was taken on September 7, 1983 by A. Kwok (IDT) for a Fortune Magazine article about IDT (Integrated Device Technology) and CMOS technology published on the Oct. 17, 1983 issue (P.85) written by Gene Bylinsky. IDT went IPO in mid 1984 on CMOS. Source: “(Silicon Valley) High Tech – Window to The Future” (Gene Bylinsky)
23. Anatomy of a Generic Problem-solving (Intelligent) Process Pattern recognition parallel-search engine is fundamentally superior to algorithmic one Presented in Jan. 2000
24. CMOS Technology – the ONLY Scalable One, the Best of Human Inventions
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26. Source: Intel Presentation Could not happen w/o CMOS! Could have ended at “80286”
27. Source: Intel Presentation This future of semiconductor industry could not happen w/o CMOS!
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29. Source: Intel Presentation CMOS power scaling => Feature size scaling Feature size scaling => Price scaling The secret behind scaling: Price can drop because power can be reduced!
41. The Value/Demand Chain IC H/W Platform IC S/W Platform (API, drivers, etc.) System Application Platform(s) Generic Reference Design (w/ other chips) Differentiated Application Designs Various Applications/Services Consumer Markets (End Users) IC Design houses System Integrators Service Providers For Consumer Electronics Market System Manuf.