It is infact a paradigm shift.. We are use to thinking 2D but the need for performance, power, and smaller footprints Are pushing us to utilize the 3rd dimension as well. Reasons….CMOS Scaling has reached its limit Physics will DEMAND that memory and analog functions DO NOT migrate to 22 nm together or even 16 and force our industry to combine heterogeneous die. Keep in mind that 3D will reduce the need to invest huge R&D efforts into developing "can do all" processes for SoCs with high-speed logic, precision analog, cost-effective large eDRAMs, and other features.Mobility Is Key From chipset to systems : As an example, let’s take a look at the mobile device industry. Clearly the convergence of mobility, communications and computing is the key trend driving the industry.This is what our consumer ask for…Right !! Thin gadgets, Lots of features, Their toy to run fast and at the same time be affordable “to them” : Small, Simple, Blazing Fast & Cheap all at the same time.Time to market is key : it is costly to build “can do all processes” and more and more IP reuse trends are becoming obvious. Trend is reusing what can be used with minimal add ons to tailor it to a different application, different marker – 80-20 rule applies…3D SoC integration of heterogeneous technologies is what is driving 3D ICs