1. A Bridge Over Troubled Wafer… Use of design layout for systematic defect identification for New Product Introduction cycle time reduction Ehud Tzuri Chief Marketing Officer Applied Materials 4 May 2011
4. It’s all about Yield Defectivity and process control are directly linked to yield productivity Maintain and improve yield at volume production Shorten ramp time Modeled Yield Curve time 4
5. Variation-Aware Design – Why? 5 Design variation: the variation in parametric and die yield results caused by process, random variation, and layout dependent effects (proximity) Source: VARIATION-AWARE CUSTOM IC DESIGN REPORT 2011, Amit Gupta President and CEO, Solido Design Automation
6. % Systematic Defects in Ramp, Growing Schematic depiction 6 Random Systematic Particle Pattern
7. Local area with narrow process window What is a “Hot Spot”? 7 Process window Die Yield Line CD
9. Complex Die Layout – A Sensitivity Issue 9 Different densities and patterns have different optical characteristics in the eyes of the inspection tool Inspection Tool Scan Image
10. Challenges Summary Difficulty to reach yield entitlements fast with minimal re-spins Increasing number of “hot spots” Inefficient separation of random / systematic defects Products complexity growing different sensitivity areas required for inspection 10
14. DBI: Design Based Inspection Using CAD data to set up complex die layouts for inspection 50% faster time to recipe due to increased automation Improved sensitivity by assigning different thresholds to different areas 13
15. Defect die stack Manual layout DBI layout Sensitivity improved by DBI recipe DBI Case Study: Sensitivity 14
16. DBB: Design Based Binning - Concept 15 Binning of all defects per layout /structure
17. DBB Case Study DBB Pareto and clips of largest bins SEM Images of Critical Structures Faster identification of Process-Window-Limiting-Structures Complementing Hot Spot simulation data 16
18. DBB Case Study 17 Clear visual identification of process window
19. Benefits of Approach: Voice of Customer “The introduction of CAD-based inspection technology for defect analysis and monitoring at GLOBALFOUNDRIES Fab 1 has helped improve defect management efficiency and reduce cycle time for process optimization. Both our production and development lines now rely on this technology to help guarantee process quality and yield stability." Remo Kirsch, Manager of Contamination Free Manufacturing at GLOBALFOUNDRIES Fab 1 in Dresden, Germany Press announcement, 28 February 2011 18
Notas del editor
http://www.solidodesign.com/files/variation-aware-custom-design-survey-2011.pdfThe survey was executed in late 2010, with 486 IC design professionals participating.A blind, anonymous survey was emailed to several thousand participants worldwide by an independentconsultancy over the time period from Sept 22, 2010 to November 7, 2010. 486 IC design professionalscompleted the survey online. Survey respondents were comprised of a broad spectrum of designers andengineering management, with a majority (53%) in an engineering management role.