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LTCC Sensitivity Analysis Presentation 2004

TecnologíaEmpresariales
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[object Object],[object Object],[object Object],[object Object],Variational Analysis in LTCC Packages
Outline ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
LTCC Process 1 2 3 ,[object Object],PUNCH -- VIA FILL -- PRINTING --
LTCC Process ,[object Object],Collate Sheets -- 4 Lamination -- 5 Fired Ceramic Multilayer -- 6
LTCC Package cross-section Vias Stacked Vias Internal Conductors Thermal Vias Thick Film Dielectric or Post Fire Resistor Back side or External Conductor Top side or External Conductor Dielectric Layers Buried Resistors
Process Variance ,[object Object],[object Object], 2 1 +  2 2 +  2 3 +  2 4 + … =  2 TOTAL ,[object Object],[object Object]
Single Layer Test Panel
Test Panel Features LOWER LEFT CENTER
Measurement Multi-layer Test
Results: 64 panels measured PROCESS 3  FEATURE PUNCH 0.3 mil PATTERN PRINT 0.5 mil LAMINATION, VIA & PRINT 1.3 mil LAMINATION, CAVITY 2.7 mil FIRING (SHRINKAGE) 0.9 % THICKNESS (SHRINKAGE) 3.4 % SAW CUT 2.2 mil COMPONENT MACHINE 1.6 mil COMPONENT ATTACH 4.0 mil
RF Measurements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
RF Stripline Design Calculations (S 21 in dB) ,[object Object],[object Object],Subtract 2) from 1) cancels 2*S 21  terms and gets… S 21L1 - S 21L2 = (S 21 /inch)*(L1-L2) Solve for S 21 /inch (S 21L1 - S 21L2 )/(L1-L2) = S 21 /inch Measured results  L1 L2
RF Stripline Insertion Loss
Example: Dielectric Thickness 1 2 3 4 5 6 GROUND TAPE DIELECTRIC GROUND PRINTED DIELECTRIC FILTER ELEMENT SONOSCAN IMAGE THROUGH FIRED PART Stripline BandPass Filter for 2.45 GHz
X-section ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Dielectric Thickness  Frequency Response
Comparison with model At 2.45 GHz -2.1 Measured -2.2 HFSS IL (dB) Data
Variation greatest within lot Insertion Loss at 2.45 GHz Avg(6): -2.42 dB Max: -2.04 dB; Filter: A2 Min: -2.81 dB; Filter: A6
Example: RF Via Transition RF VIA RF INPUT (LEAD) SOURCES OF VARIATION ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Parameter Measurement ,[object Object],[object Object]
Braze Fillet DIELECTRIC THICKNESS VIA ALIGNMENT BRAZE THICKNESS BRAZE FILLET SHAPE
Modeling: Braze Fillet Model rka_123 was modified to include a braze structure observed in cross-sections. Braze Board ceramic Lead Changes: added 2 mils to braze height for total 3 mils, Added 3 mil wide (each side) tapered braze fillets to full height of lead
Variation Added to Model
Modeled Variation in Spec
Summary ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

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Imaps Nw Ness 4 23 03 Compressed

  • 1.
  • 2.
  • 3.
  • 4.
  • 5. LTCC Package cross-section Vias Stacked Vias Internal Conductors Thermal Vias Thick Film Dielectric or Post Fire Resistor Back side or External Conductor Top side or External Conductor Dielectric Layers Buried Resistors
  • 6.
  • 8. Test Panel Features LOWER LEFT CENTER
  • 10. Results: 64 panels measured PROCESS 3  FEATURE PUNCH 0.3 mil PATTERN PRINT 0.5 mil LAMINATION, VIA & PRINT 1.3 mil LAMINATION, CAVITY 2.7 mil FIRING (SHRINKAGE) 0.9 % THICKNESS (SHRINKAGE) 3.4 % SAW CUT 2.2 mil COMPONENT MACHINE 1.6 mil COMPONENT ATTACH 4.0 mil
  • 11.
  • 12.
  • 14. Example: Dielectric Thickness 1 2 3 4 5 6 GROUND TAPE DIELECTRIC GROUND PRINTED DIELECTRIC FILTER ELEMENT SONOSCAN IMAGE THROUGH FIRED PART Stripline BandPass Filter for 2.45 GHz
  • 15.
  • 16. Comparison with model At 2.45 GHz -2.1 Measured -2.2 HFSS IL (dB) Data
  • 17. Variation greatest within lot Insertion Loss at 2.45 GHz Avg(6): -2.42 dB Max: -2.04 dB; Filter: A2 Min: -2.81 dB; Filter: A6
  • 18.
  • 19.
  • 20. Braze Fillet DIELECTRIC THICKNESS VIA ALIGNMENT BRAZE THICKNESS BRAZE FILLET SHAPE
  • 21. Modeling: Braze Fillet Model rka_123 was modified to include a braze structure observed in cross-sections. Braze Board ceramic Lead Changes: added 2 mils to braze height for total 3 mils, Added 3 mil wide (each side) tapered braze fillets to full height of lead
  • 24.