The document provides guidelines for PCB design including board size, thickness, trace width and spacing, pad sizes, hole sizes, hole density, and standard drill sizes. Key recommendations include checking the maximum board size with your fabricator, using standard board thicknesses like 0.062" FR4, following trace width and spacing rules like 8/8 mil, using a 5 mil annulus for pad sizes, and being aware of the fabricator's maximum hole density which may involve extra charges above 24 holes/square inch.

1. PCB Design Guidelines
Below are a number of Guideline Rules to follow and keep in mind when designing PCBs. These are
general rules that apply for the most PCB fabricators, but it is advisable to check with your fabricator.
Board Size
PCB manufacturers have a maximum size board they can handle. Typically this is also their panel size. The
PCB fabrication house's panel size is also important when mass producing boards. In this situation one
would want to fit as many boards as possible on a panel with as little wasted board space as possible (in
order to reduce costs). Normal board spacing for routing (how boards are separated on a panel) is 0.3",
plus there is typically a 1.0" to 2.0" border on the board for handling it during processing.
Board thickness may also be specified. A standard thickness and type of board is .062" FR4. Other typical
board thickness are .010", .020", .031", and .092".
Trace Width and Spacing
The chemical and photographic processes used to produce a PCB put requirements on the minimum width
of trace and the minimum spacing between traces. If a trace is made smaller than this minimum width there
is some chance it will open (no connection) when manufactured. If two traces are closer together than the
minimum spacing there is some chance they will short when manufactured. These parameters are usually
specified as "x/y rules", where x is the minimum trace width and y is the minimum trace spacing. For
example, "8/10 rules" would indicate 8 mil minimum trace width and 10 mil minimum trace spacing. These
rules (especially spacing) apply to any metal on the PCB, including pad to track spacing and line widths for
strings on the PCB.
Typical modern process rules are 8/8 rules with values as small as 2/2 rules being available. For Press-n-
Peel people have had success using 12/12 rules, but values a little larger are easier to make work
consistently. However, keep in mind that the board must be soldered and a trace within 8 mils (8/8 rules) of
a pad is easier to short than one with greater spacing when hand soldered. For hand soldering 10/10 rules
are much easier to solder (if the design density can allow spacing this large).
Pad Sizes
The biggest issues with pad size are solder ability and manufacturability. Solder ability is really just a matter
of skill and will not be discussed here. Manufacturability is concerned with whether or not the pad will be
broken when the hold is drilled in it. This is mainly a function of the accuracy of the PCB manufacturer's
drilling. If a drill hole is slightly off center the pad may be broken at one edge possibly leading to an open in
the circuit. A standard requirement for pad sizes is a 5 mil annulus. This means there must be .005" all
around the hole (i.e. a 28 mil hole would require a 38 mil pad). Something a little larger than this (maybe 10
mils) is recommended for solder ability. AP Circuits states they have had relatively consistent success with
a 2.5 mil annulus (i.e. a 20 mil hole with only a 25 mil pad), but they don't recommend it.
Hole Sizes
Most PCB manufacturers have a wide selection of drill (hole) sizes available. Some charge per drill size
used, others offer a standard set of drill sizes for no charge and then charge for any non-standard drill sizes.
AP Circuits uses the latter approach. When choosing a hole size remember that the plate-through will cause
the hole to effectively be more narrow. The plate-through thickness varies from .001" to .003". AP Circuits'

2. plate-through thickness is approximately .015" (meaning the "finished hole" diameter is 3 mils smaller).
Standard Drill Sizes
Finished Hole
Drill Number Hole Size
Size
70 .028" .025"
65 .035" .032"
58 .042" .039"
55 .052" .049"
53 .0595" .056"
44 .086" .083"
1/8" .125" .122"
24 .152" .149"
Hole Density
Hole density is purely a cost issue. The more holes there are on a board the more wear and tear
manufacturing will put on the equipment (and thus the more the board will cost). Most PCB manufacturers
have a maximum hole density and boards with greater density are charged more. For AP Circuits, there is a
per hole charge for densities above 24 holes per square inch.
Drill Chart
Drill Drill Drill
Inches Inches Inches
No. No. No.
80 .0135 53 .0595 27 .1440
79 .0145 52 .0635 26 .1470
78 .0160 51 .0670 25 .1495
77 .0180 50 .0700 24 .1520
76 0200 49 .0730 23 .1540
75 .0210 48 .0760 22 .1570
74 .0225 47 .0785 21 .1590

3. 73 .0240 46 .0810 20 .1610
72 .0250 45 .0820 19 .1660
71 .0260 44 .0860 18 .1695
70 .0280 43 .0890 17 .1730
69 .0292 42 .0935 16 .1770
68 .0310 41 .0960 15 .1800
67 .0320 40 .0980 14 .1820
66 .0330 39 .0995 13 .1850
65 .0350 38 .1015 12 .1890
64 .0360 37 .1040 11 .1910
63 .0370 36 .1065 10 .1935
62 .0380 35 .1100 09 .1960
61 .0390 34 .1110 08 .1990
60 .0400 33 .1130 07 .2010
59 .0410 32 .1160 06 .2040
58 .0420 31 .1200 05 .2055
57 .0430 1/8" .1250 04 .2090
56 .0465 30 .1285 03 .2130
55 .0520 29 .1360 02 .2210
54 .0550 28 .1405 01 .2280
dBm - Volts - Watts Conversion
dBm V Po dBm V Po dBm uV Po
+53 100.0 200W +7 0.50 5mW -37 3.2
+50 70.0 100W +6 0.445 4mW -38 2.85

4. +49 64.0 80W +5 0.40 3.2mW -39 2.5
+48 58.0 64W +4 0.355 2.5mW -40 2.25 0.1uW
+47 50.0 50W +3 0.320 2.0mW -41 2.0
+46 44.5 40W +2 0.280 1.6mW -42 1.8
+45 40.0 32W +1 0.252 1.25mW -43 1.6
+44 32.5 25W 0 0.225 1.00mW -44 1.4
+43 32.0 20W -1 0.200 0.80mW -45 1.25
+42 28.0 16W -2 0.180 0.64mW -46 1.18
+41 26.2 12.5W -3 0.160 0.50mW -47 1.00
+40 22.5 10W -4 0.141 0.40mW -48 0.90
+39 20.0 8W -5 0.125 0.32mW -49 800
+38 18.0 6.4W -6 0.115 0.25mW -50 710 0.01uW
+37 16.0 5W -7 0.100 0.20mW -51 640
+36 14.1 4W -8 0.090 0.16mW -52 570
+35 12.5 3.2W -9 0.080 0.125mW -53 500
+34 11.5 2.5W -10 0.071 0.10mW -54 450
+33 10.0 2W -11 64 -55 0.40
+32 9.0 1.6W -12 58 -56 351
+31 8.0 1.25W -13 50 -57 320
+30 7.10 1.0W -14 45 -58 286
+29 6.40 800mW -15 40 -59 251
+28 5.80 640mW -16 35.5 -60 225 0.001uW
+27 5.00 500mW -17 31.5 -61 200
+26 4.45 400mW -18 28.5 -62 180
+25 4.00 320mW -19 25.1 -63 160
+24 3.55 250mW -20 22.5 0.01mW -64 141
+23 3.20 200mW -21 20.0 -65 128
+22 2.80 160mW -22 17.9 -66 115

5. +21 2.52 125mW -23 15.9 -67 100
+20 2.25 100mW -24 14.1 -68 90
+19 2.00 80mW -25 12.8 -69 80
+18 1.80 64mW -26 11.5 -70 71 0.1nW
+17 1.60 50mW -27 10.0 -71 65
+16 1.41 40mW -28 8.9 -72 58
+15 1.25 32mW -29 8.0 -73 50
+14 1.15 25mW -30 7.1 0.001mW -74 45
+13 1.00 20mW -31 6.25 -75 40
+12 0.90 16mW -32 5.8 -76 35
+11 0.80 12.5mW -33 5.0 -77 32
+10 0.71 10mW -34 4.5 -78 29
+9 0.64 8mW -35 4.0 -79 25
+8 0.58 6.4mW -36 3.5 -80 22.5 0.01nW
Getek® Laminates - Epoxy / Polyphenylene Oxide Resin
(Type: NEMA FR-4, IPC-L-108B/04)
Nominal Thickness GE E-Glass
Dk@1MHz.
thickness tolerance grade construction
0.0027" �0.0005" ML200D 1080 3.8
0.004" �0.0005" ML200D 2313 3.9
0.005" �0.0007" ML200M 2313/106 3.8
0.006" �0.0007" ML200D 2313/1080 3.9
0.007" �0.0010" ML200M (2)2313 3.8
0.008" �0.0010" ML200D 2313/2116 3.9
0.010" �0.0010" ML200D (2)2116 3.9

6. 0.012" �0.0010" ML200D 1080/7628/1080 3.9
0.014" �0.0015" ML200D (2)7628 4.2
0.018" �0.0015" ML200D 7628/2313/7628 4.1
0.021" �0.0020" ML200D (3)7628 4.2
0.024" �0.0020" ML200C 2116/(2)7628/2116 4.1
0.028" �0.0020" ML200D (4)7628 4.2
0.028"(Alt.) �0.0020" ML200C 1080/2313/(3)2116/2313/1080 3.8
0.031" �0.0030" ML200C 2116/(3)7628/2116 4.1
0.031"1 �0.0040" ML200D (4)7628 4.2
0.044"1 �0.0050" ML200D (6)7628 4.2
0.059"1 �0.0050" ML200D (8)7628 4.2
VSWR Vs. Return Loss
Ret. Ret. Ret. Ret. Ret.
VSWR Loss VSWR Loss VSWR Loss VSWR Loss VSWR Loss
- - - - -
1.01 1.51 1.79 2.18 2.57
46.064 13.842 10.960 8.611 7.135
- - - - -
1.02 1.52 1.80 2.19 2.58
40.086 13.708 10.881 8.565 7.105
- - - - -
1.03 1.53 1.81 2.20 2.59
36.608 13.577 10.804 8.519 7.074
- - - - -
1.04 1.54 1.82 2.21 2.60
34.151 13.449 10.729 8.474 7.044
- - - - -
1.05 1.55 1.83 2.22 2.61
32.256 13.324 10.654 8.430 7.014
- - - - -
1.06 1.56 1.84 2.23 2.62
30.714 13.201 10.581 8.386 6.984
- - - - -
1.07 1.57 1.85 2.24 2.63
29.417 13.081 10.509 8.342 6.954
- - - - -
1.08 1.58 1.86 2.25 2.64
28.299 12.964 10.437 8.299 6.925
- - - - -
1.09 1.59 1.87 2.26 2.65
27.318 12.849 10.367 8.257 6.896

7. - - - - -
1.10 1.60 1.88 2.27 2.66
26.444 12.736 10.298 8.215 6.867
- - - - -
1.11 1.61 1.89 2.28 2.67
25.658 12.626 10.230 8.173 6.839
- - - - -
1.12 1.62 1.90 2.29 2.68
24.943 12.518 10.163 8.132 6.811
- - - - -
1.13 1.63 1.91 2.30 2.69
24.289 12.412 10.097 8.091 6.783
- - - - -
1.14 1.64 1.92 2.31 2.70
23.686 12.308 10.032 8.051 6.755
- - - -
1.15 1.65 1.93 -9.968 2.32 2.71
23.127 12.207 8.011 6.728
- - - -
1.16 1.66 1.94 -9.904 2.33 2.72
22.607 12.107 7.972 6.700
- - - -
1.17 1.67 1.95 -9.842 2.34 2.73
22.120 12.009 7.933 6.673
- - - -
1.18 1.68 1.96 -9.780 2.35 2.74
21.664 11.913 7.894 6.646
- - - -
1.19 1.69 1.97 -9.720 2.36 2.75
21.234 11.818 7.856 6.620
- - - -
1.20 1.70 1.98 -9.660 2.37 2.76
20.828 11.725 7.818 6.594
- - - -
1.21 1.71 1.99 -9.601 2.38 2.77
20.443 11.634 7.781 6.567
- - - -
1.22 1.72 2.00 -9.542 2.39 2.78
20.079 11.545 7.744 6.541
- - - -
1.23 1.73 2.01 -9.485 2.40 2.79
19.732 11.457 7.707 6.516
- - - -
1.24 1.74 2.02 -9.428 2.41 2.80
19.401 11.370 7.671 6.490
- - - -
1.25 1.75 2.03 -9.372 2.42 2.81
19.085 11.285 7.635 6.465
- - - -
1.26 1.76 2.04 -9.317 2.43 2.82
18.783 11.202 7.599 6.440
- - - -
1.27 1.77 2.05 -9.262 2.44 2.83
18.493 11.120 7.564 6.415
- - - -
1.28 1.78 2.06 -9.208 2.45 2.84
18.216 11.039 7.529 6.390
- - - -
1.29 1.40 2.07 -9.155 2.46 2.85
17.949 15.563 7.494 6.366
- - - -
1.30 1.41 2.08 -9.103 2.47 2.86
17.692 15.385 7.460 6.341
- - - -
1.31 1.42 2.09 -9.051 2.48 2.87
17.445 15.211 7.426 6.317

8. - - - -
1.32 1.43 2.10 -8.999 2.49 2.88
17.207 15.043 7.393 6.293
- - - -
1.33 1.44 2.11 -8.949 2.50 2.89
16.977 14.879 7.360 6.270
- - - -
1.34 1.45 2.12 -8.899 2.51 2.90
16.755 14.719 7.327 6.246
- - - -
1.35 1.46 2.13 -8.849 2.52 2.91
16.540 14.564 7.294 6.223
- - - -
1.36 1.47 2.14 -8.800 2.53 2.92
16.332 14.412 7.262 6.200
- - - -
1.37 1.48 2.15 -8.752 2.54 2.93
16.131 14.264 7.230 6.177
- - - -
1.38 1.49 2.16 -8.705 2.55 2.94
15.936 14.120 7.198 6.154
- - - -
1.39 1.50 2.17 -8.657 2.56 2.95
15.747 13.979 7.167 6.131
VSWR Vs. Return Loss (Continued)
Ret. Ret. Ret. Ret. Ret.
VSWR Loss VSWR Loss VSWR Loss VSWR Loss VSWR Loss
- - - - -
2.96 3.07 3.18 3.29 3.40
6.109 5.872 5.654 5.452 5.265
- - - - -
2.97 3.08 3.19 3.30 3.41
6.086 5.852 5.635 5.435 5.248
- - - - -
2.98 3.09 3.20 3.31 3.42
6.064 5.832 5.617 5.417 5.232
- - - - -
2.99 3.10 3.21 3.32 3.43
6.042 5.811 5.598 5.400 5.216
- - - - -
3.00 3.11 3.22 3.33 3.44
6.021 5.791 5.579 5.383 5.200
- - - - -
3.01 3.12 3.23 3.34 3.45
5.999 5.771 5.561 5.365 5.184
- - - - -
3.02 3.13 3.24 3.35 3.46
5.977 5.751 5.542 5.348 5.168
- - - - -
3.03 3.14 3.25 3.36 3.47
5.956 5.732 5.524 5.331 5.152
- - - - -
3.04 3.15 3.26 3.37 3.48
5.935 5.712 5.506 5.315 5.137

9. - - - - -
3.05 3.16 3.27 3.38 3.49
5.914 5.693 5.488 5.298 5.121
- - - - -
3.06 3.17 3.28 3.39 3.50
5.893 5.674 5.470 5.281 5.105
WIRE DATA CHART
Diam Diam Diam Diam
AWG AWG AWG AWG
(In.) (In.) (In.) (In.)
4/0 0.4600 9 0.1144 21 0.0285 33 0.0071
3/0 0.4096 10 0.1019 22 0.0253 34 0.0063
2/0 0.3648 11 0.0907 23 0.0226 35 0.0056
1/0 0.3249 12 0.0808 24 0.0201 36 0.0050
1 0.2893 13 0.0720 25 0.0179 37 0.0045
2 0.2576 14 0.0641 26 0.0159 38 0.0040
3 0.2294 15 0.0571 27 0.0142 39 0.0035
4 0.2043 16 0.0508 28 0.0126 40 0.0031
5 0.1819 17 0.0453 29 0.0113 41 0.0028
6 0.1620 18 0.0403 30 0.0100 42 0.0025
7 0.1443 19 0.0359 31 0.0089 43 0.0022
8 0.1285 20 0.0320 32 0.0080 44 0.0020
PCMCIA CONNECTOR PIN OUT
16-
32-bit 16-Bit 32-bit
Bit Pin Memory I/O+Mem CardBus
Memory I/O+Mem CardBus
Pin
1 GND GND GND 35 GND GND GND
2 D3 D3 CAD0 36 CD1# CD1# CCD1#

10. 3 D4 D4 CAD1 37 D11 D11 CAD2
4 D5 D5 CAD3 38 D12 D12 CAD4
5 D6 D6 CAD5 39 D13 D13 CAD6
6 D7 D7 CAD7 40 D14 D14 RSRVD
7 CE1# CE1# CCBE0# 41 D15 D15 CAD8
8 A10 A10 CAD9 42 CE2# CE2# CAD10
9 OE# OE# CAD11 43 VS1# VS1# CVS1
10 A11 A11 CAD12 44 RSRVD IORD# CAD13
11 A9 A9 CAD14 45 RSRVD IOWR# CAD15
12 A8 A8 CCBE1# 46 A17 A17 CAD16
13 A13 A13 CPAR 47 A18 A18 RSRVD
14 A14 A14 CPERR# 48 A19 A19 CBLOCK#
15 WE# WE# CGNT# 49 A20 A20 CSTOP#
16 READY IREQ# CINT# 50 A21 A21 CDEVSEL#
17 Vcc Vcc Vcc 51 Vcc Vcc Vcc
18 Vpp1 Vpp1 Vpp1 52 Vpp2 Vpp2 Vpp2
19 A16 A16 CCLK 53 A22 A22 CTRDY#
20 A15 A15 CIRDY# 54 A23 A23 CFRAME#
21 A12 A12 CCBE2# 55 A24 A24 CAD17
22 A7 A7 CAD18 56 A25 A25 CAD19
23 A6 A6 CAD20 57 VS2# VS2# CVS2
24 A5 A5 CAD21 58 RESET RESET CRST#
25 A4 A4 CAD22 59 WAIT# WAIT# CSERR#
26 A3 A3 CAD23 60 RSRVD INPACK# CREQ#
27 A2 A2 CAD24 61 REG# REG# CCBE3#
28 A1 A1 CAD25 62 BVD2 SPKR# CAUDIO
29 A0 A0 CAD26 63 BVD1 STSCHG# CSTSCHG

11. 30 D0 D0 CAD27 64 D8 D8 CAD28
31 D1 D1 CAD29 65 D9 D9 CAD30
32 D2 D2 RSRVD 66 D10 D10 CAD31
33 WP IOIS16# CCLKRUN# 67 CD2# CD2# CCD2#
34 GND GND GND 68 GND GND GND
TRACE SPACING GUIDELINE
Voltage Between Conductors
VDC or
A1 A2 A3 A4 A5 A6 A7
Peak
0 thru
.004 0.025 0.025 0.005 0.005 0.005 0.005
15 0
16 thru
.004 0 .025 0.025 0.005 0.005 0.010 0.005
30 0
31 thru
.004 0.025 0.025 0.005 0.005 0.015 0.005
50 0
51 thru
0.004 0.025 0.060 0.005 0.005 0.020 0.005
100
101
thru 0.008 0.025 0.125 0.015 0.015 0.030 0.015
150
151
thru 0.008 0.050 0.125 0.015 0.015 0.030 0.015
170
171
thru 0.008 0.050 0.250 0.015 0.015 0.030 0.015
250
251
thru 0.008 0.050 0.500 0.015 0.015 0.030 0.015
300
301
thru 0.010 0.100 0.500 0.030 0.030 0.060 0.030
500

12. More
0.0002/V
than 0.0001/V
0.001/V
0.00012/V 0.00012/V 0.00012/V 0.00012/V
500
A1 - Internal Conductors
A2 - External Conductors, uncoated, sea level to 10,000 ft.
A3 - External Conductors, uncoated, over 10,000 ft.
A4 - External Conductors, with permanent polymer coating (Solder Mask).
A5 - External Conductors, with conformal coating over assembly.
A6 - External Component lead/termination, uncoated.
A7 - External Component lead/termination, with conformal coating.
Electrical Design Factors
Conductor Capacitance
C = 0.31 a/b + 0.23(1 + k) log10 (1 + 2b/d +2b + b2/d2)
Where
k = Substrate dielectric constant
a = Conductor thickness
b = Width of conductor in inches
d = Distance between conductors in inches
Conductor Resistance
R = 0.000227W
Where
W = Width of conductor
Characteristic Impedance
Zo = R + jwL / G + kwC
Where
Zo = Apparent Z of an infinitely long line in ohms
R = Resistance in ohms
L = Inductance in Henries
G = Conductor per unit length of line in mhos
C = Capacitance in farads
Characteristic Impedance for a Micro Strip
Zo = (h/W) (377 / (Sqrt. er) {1 + (2h/PI W)[1 + ln(PI W/h)]}
Where
h = Dielectric thickness

13. W = Micro Strip width
er = Effective dielectric constant of substrate
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