This training module introduces the packing improvement for high speed amplifiers and summary the performance & design considerations of high speed amplifiers
Welcome to the training module on Analog Devices High Speed Amplifiers Part 3 . This training module introduces the packing improvement for high speed amplifiers and summary the performance & design considerations of high speed amplifiers.
Packaging plays a large role in high-speed applications. Smaller packages enable better performance at higher speeds, and compact layout. The low distortion pinout also provides compact layout, streamline signal flow, and lower distortion.
04/14/11 The new high performance pin out or (low distortion pinout) from ADI is being used on many of their new high performance op amps. This pin out was introduced in 2003 with the release of the AD8099. These op amps are offered in two different packages: SOIC / LFCSP. The SOIC package is the standard 8 pin package that has been around for decades, but features a little twist, you can see they’ve added a dedicated feedback pin on pin 1 of the SOIC. This greatly simplifies PCB layouts. The pinout helps isolate the output from the load which improves the capacitor load stability. The LFCSP also has the feedback pin- here we have rotated the pins counter-clockwise by 1. This isolates the non-inverting input from the –Vs which is a source of 2 nd order harmonic distortion. Intersil has already released a product in the LFCSP package and pin out. These packages also feature an exposed thermal pad which helps get the heat out of the package, and keep the junction temperature down.
04/14/11 This graph shows the same part (die) in both the SOIC and LFCSP package. As you can see, the part in the LFCSP package with the new pinout has ~14dB and better 2 nd HD at 10 MHz than the SOIC.
Here’s an example of a traditional SOIC package and layout. The Feedback path is routed around amplifier, which as we discussed earlier can introduce parasitic inductance and cause trouble for the circuit if we are not careful.
Notice what a difference the low distortion pinout makes in the layout of the board. The long feedback path is gone along its parasitic effects. Low distortion pinout enables compact and streamline layout
This board encompasses many if not all of the points made in this layout section. This board clearly illustrates the desired layout of keeping the bypass caps and the load resistors close and minimizes the interaction of other currents flowing in the ground plane. Multiple capacitors are used on the power supply pins to maintain a good low impedance across a wide frequency range. the small pads are used to minimize the effects of parasitics. This is a very desirable layout for high speed applications.
In the first module, we introduce the basic knowledge of high speed amplifiers. high speed amplifiers have bandwidth greater than 50MHz. They have two different topologies, voltage feedback and current feedback. Noise gain must be distinguished from signal gain. There are three amplifier architecture with different performance. using a resistor to isolate capacitive loading effects at an amplifier output is a good method to maintain performance and stability.
In the second module, the issues in PCB layout design have been discussed. Here highlight the key points in PCB layout design.
Here is more information for PCB design.
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