1. TOPIC : Effects of Wire Type & Mold
Compound on Wearout Reliability of
Semiconductor flash Fineline BGA
MAIN AUTHOR : C.L. Gan
CO-AUTHORS : F.C. Classe, B.L. Chan, E.K. Ng,
U. Hashim
AFFILIATION : Spansion (Penang) Sdn Bhd
Email : chong-leong.gan@spansion.com
Paper Code: AS008-1
Date: Thurs, Oct 24, 2013
2. OUTLINE
1 INTRODUCTION, BACKGROUND OF THE
STUDY, IMPORTANCE
2 EXPERIMENTAL MATRIX
3 WEAROUT MECHANISMS (HAST, TC)
4 WEAROUT RELIABILITY PLOTTING & SEM
ANALYSIS (HAST, TC)
5 EFFECTS OF WIRE TYPE, EMC TYPE
6 CONCLUSION & FUTURE WORKS
7 QUESTION & ANSWER
2
3. Future Works
• Wear out reliability knowledge based reliability
testing, derivation of HAST Eaa, HTSL Eaa
– To proliferate to Pd-doped Cu wire
• IMC diffusion kinetics study for various wire types
included Pd-doped Cu wire
