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Merix Def Aero Oct08 A
- 1. MERIX CORPORATION YOUR COMPLETE CIRCUIT BOARD SOLUTION October 2008 Defense & Aerospace Overview
- 6. Our goal is to grow DEF/AERO business rapidly Target >25% of Merix-US Sales for FY09 FY2008 (end May ’08), % of Merix-US Sales DEFENSE/AEROSPACE 15% COMMERCIAL 85%
- 7. Defense/Aerospace Capabilities Merix Oregon Complete facilities capability available at: http://www.merix.com/files/merix_capabilities.pdf * Other Lead free, Halogen free, ZBC and RF materials available in production or leading edge quantities Yes Yes Yes Types I, II, III 2-30 0.125”max 2-30 0.125”max Isola P-95 Polyimide In Development 2008 Yes Yes Types I, II, III 32-40 2-30 FR408, N4000-13EP Low Loss Lead Free Yes Yes Yes Types I, II, III 32-40 2-30 PCL370HR Lead Free 170 Tg In Development 2008 Yes Yes Types I, II, III 32-40 2-30 N4000-13 Advanced Low Loss In Development 2008 Yes Yes Types I, II, III 32-40 2-30 FR408 Low Loss Yes Yes Yes Types I, II, III 32-40 2-30 FR406 170 Tg Epoxy 3 point Etchback 2 point Etchback Non-Conductive Via Fill HDI Controlled Production Volume Production Material Material Type Number of Conductive Layers Number of Conductive Layers
- 8. Defense/Aerospace Capabilities Merix Oregon Complete facilities capability available at: http://www.merix.com/files/merix_capabilities.pdf Controlled Production Class B Volume Production Class A November 2008 Mil-PRF-31032 .002 .002 Soldermask Min Clearance .002 .002 Soldermask Min Dam Yes Yes Cavity Designs Yes Yes Copper Filled Micro Via Yes Yes UV Via Cap Yes Yes Robotic TDR .0035”/.0035” .0035”/.004” Outerlayer Line/Space .003”/.003” .003”/.0035” Innerlayer Line/Space 16:1 14:1 Aspect Ratio (.010 drill) .015” .017” Minimum Thickness .270” .270” Maximum Thickness 16X18 18X24 21X24 Panel Sizes
- 9. Defense/Aerospace Capabilities Merix San Jose Complete facilities capability available at: http://www.merix.com/files/merix_capabilities.pdf * Other Lead free, Halogen free, ZBC and RF materials available in production or leading edge quantities Yes Yes Yes Types I, II 2-30 NA Isola P-95 Polyimide Yes Yes Yes Types I, II 2-30 NA FR408, N4000-13EP Low Loss Lead Free Yes Yes Yes Types I, II 2-30 NA IS410, PCL370HR Lead Free 170 Tg Yes Yes Yes Types I, II 2-30 NA N4000-13 Advanced Low Loss Yes Yes Yes Types I, II 2-30 NA FR408 Low Loss Yes Yes Yes Types I, II 2-30 NA FR406 170 Tg Epoxy 3 point Etchback 2 point Etchback Non-Conductive Via Fill HDI Controlled Production Volume Production Material Material Type Number of Conductive Layers Number of Conductive Layers
- 10. Defense/Aerospace Capabilities Merix San Jose Complete facilities capability available at: http://www.merix.com/files/merix_capabilities.pdf .002 .002 Soldermask Min Clearance Controlled Production Class B Volume Production Class A Mil-PRF-55110 and Mil-PRF-31032 Certified .003 .003 Soldermask Min Dam No No Cavity Designs No No Copper Filled Micro Via Yes Yes UV Via Cap Yes Yes Robotic TDR .0035”/.0035” .0035”/.004” Outerlayer Line/Space .003”/.003” .003/.0035 Innerlayer Line/Space 12:1 10:1 Aspect Ratio (.010 drill) .025 .025 Minimum Thickness .250” .240 Maximum Thickness 16X18 18X24 21X24 Panel Sizes