The BGA reballing process is explained in this slide set. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of BGA package being reballed.A brief description of the reballing process as well as some of the inspection tools is also discussed.If BGA reballing services are required then contact information for BGA reballing is on the last slide.

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What is BGA Reballing and
Why it needs to be done
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BGA Reballing
• Handling of Parts
• Data Sheets
• Tools
• Process
• Inspection
• “Gotchas”
• Marking
• Bakeout and Drypack
• Profiling

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Why Devices Get Reballed

Availability

Alloy conversion

Rework
Why BGA Reballing is
important

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Handling of Parts
 Work areas must be kept clean and neat in
order to prevent contamination of the work
area
 Stacking of devices should be avoided to
prevent physical damage
 Trays for handling

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 Components should be handled by the edges or
with proper ESD-safe tooling (JSTD-001)
 When not being worked on, sensitive components
must be enclosed in shielded bags or boxes.
 Whenever handling an area array device the
operator must be properly grounded
Handling of Parts-ESD

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 Devices should be handled at properly
designated work areas only
 Designated ESD safe work areas must
be checked periodically to ensure their
continued safety from ESD
 Static dissipation of work surfaces
 Static dissipation of floor surfaces
 Designated work areas must be kept
free of static generating materials such
as styrofoam, vinyl, plastic, fabrics or
any other static generating materials
Handling of Parts-ESD

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Handling of Parts-MSD
 Awareness of the MSD level
 Risk of “popcorning” or part delamination
 Logging system for control
 Dry box for control of moisture levels of
parts for reballing/rework
 (Do not open the doors too frequently and
/ or for extended periods of time)
 Familiarity and knowledge of
IPC/JEDEC J-STD-033 (handling) J-STD-
020 (parts classification)

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Data Sheets
Drive the design of the fixture, stencils and preforms

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Tools for Reballing-
Inspection

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Tools for Reballing-
Inspection

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Tools for Reballing-
Inspection
 Excessive graininess
 Incomplete reflow
 Poor wetting
 Balls with pits, voids, indentations,
gouges and other depressions
exceeding 20% of ball diameter
 Burrs exceeding 10% of ball diameter
 Balls with peeling, flaking or blistering
See IPC 7095

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Tools for Reballing-
XRAY Inspection

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High volume-several thousand pieces
Reball Process

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Fixtures and/or stainless stencils
Reball Process
Moderate volume <2K pieces

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Non contact deballing
Photo Courtesy of VJ Electronix

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Photo Courtesy of VJ Electronix
Reball Process
Semi-automated process

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Pick and Place solder ball pre-form
Pre-form
Photo Courtesy of VJ Electronix
Reball Process
Semi-automated process

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Reflow spheres onto substrate
Photo Courtesy of VJ Electronix
Reball Process
Semi-automated process

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Reball Process
Low Volume 1-several hundred
Cut in-house for fastest
delivery

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Reball Process
“Peel Away Preform”

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Ability to
reball down
to 0.15mm
pitch, 4 mil
ball size
Reball Process
“Peel Away Preform”

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Marking
Identify parts which have been
reballed
Color
dots
used
by
some

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Bake Out + Dry Pack
Used when shipping reballed
devices

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Bake Out + Dry Pack
Used when shipping reballed
devices

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 Thermal gradient 2-3°C
 Soak temperature (board) 150°C
 Short preheat (as needed)
 Reflow temp 210-220°C (liquidus 183°)
 Reflow time 45-90 seconds (for lead free), 30-60 seconds (for
Sn63Pb37)
Proper Thermal Profiling

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Lead-Free BGA Reballing
Concerns
 Die exposure to multiple heat cycles
(can be overcome with process)
 Cross-contamination of materials
(controlled by process)

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For reballing projects:
Call 847-797-9250
or send mail to
info@solder.net
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