IMI provides flexible electronics manufacturing solutions including design, engineering, and manufacturing services. It delivers innovative, customized, and integrated solutions to diverse markets such as automotive, industrial, medical, communications, computing, and renewable energy. IMI has a global manufacturing presence in Asia, North America, and Europe.

1. BUILD YOUR
BUSINESS
WITH OUR FLEXIBLE
SOLUTIONS
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2. IMI - Integrated Micro-Electronics Inc.
A leading provider of electronics
manufacturing services (EMS) and power
semiconductor assembly and test services
Delivers innovative, customized, and
integrated solutions of highest quality
Serves diverse markets
Automotive, industrial, and medical electronics
Communications, computing and renewable
energy
With manufacturing presence in Asia, North
America, and Europe
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3. IMI, an Ayala Company
‘CORE’ ‘EMERGING’
Ayala
53.2%
Largest and only full line property 67.7% New Sectors
developer in the country 24th
of the top 50 EMS
companies in the world
— Power &
33.6% Most profitable bank among peers; 100.0% — Infrastructure
leader in remittances, trust & asset • Top 5 in CRM
management • Top 3 in KPO
• Top 3 in Graphics Design
• Outsourcing
30.5%
Second largest telco company in the country Ayala Automotive100.0%
Largest dealership network of
Manila Water Honda and Isuzu cars
43.2% nationwide
Pioneer in water infrastructure development
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4. IMI Ownership Structure
For Common Shares % of Ownership
AYC Holdings, Ltd. 58.03%
Resins, Inc. 14.51%
EPIQ NV 12.12%
ESOWN Subscription 5.86%
POMS Investment PTE, LTD. 3.48%
Mitsubishi Corp. 0.73%
SiiX Corporation 0.40%
Others/Public 4.87%
Total 100%
As of May 2012
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5. IMI Milestones
1980 IMI was established by Ayala Corporation and Resins Inc
1982 Expanded IC assembly business into contract manufacturing
1998 Started offering design and product development services
2001 Obtained the Philippine Quality Award level III for mastery in quality
management
2005 Established global footprint through acquisition of the EMS assets of Saturn
Electronics and Engineering Inc. and then Speedy-Tech Electronics Ltd.
2006 Made it to list of the top 50 EMS providers of Manufacturing Market Insider
2007 Received Circuits Assembly’s Service Excellence Award for Highest Overall
Customer Ranking
2010 Listed by way of introduction on the Philippine Stock Exchange, opened 6th
manufacturing facility in China, established IMI Energy Solutions, and acquired power
semiconductor company PSi Technologies, Inc.
2011 Acquired EPIQ subsidiaries in Bulgaria, the Czech Republic, and Mexico
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6. IMI Complete Solutions
OEMs:
Brand
Marketing
Design and Support and
Engineering Manufacturing
Fulfillment
OEMs:
Technology
R&D
• From PCB and FPCB Assembly • Materials Sourcing
• Design and Engineering Services to Complete Box Build and Logistics
• Low-Volume, High-Mix Solutions
• Advanced Manufacturing Manufacturing
Engineering • Product Reliability
• High-Volume Manufacturing and Failure Analysis
• Test and Systems • Power Semiconductor Assembly
Development and Test Solutions • Product Repair Services
• Flexible Business Set-ups
• New Product Introduction
• Plastic Injection
Services
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Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011

7. Power Semiconductor Assembly and
Test Services
OEMs:
Brand
Marketing
Design and
Engineering Manufacturing Support and
OEMs:
Technology Fulfillment
R&D
• Design Services • Die Inspect Services • Materials Sourcing and
• Virtual Prototyping – • From Wafer Saw to Front- Logistics Solutions
Thermo-mechanical and of -Line to End-of -Line • Product Reliability and
Electrical Simulation Assembly Services Failure Analysis
• Prototype Builds • Testing Services
• Material Development • Caters to Power
and Qualification Semiconductor Packages
• Test Development (Metal Can/Hermetics,
• New Product TO Packages, PQFN and
Introduction Services Power Modules)
• High Volume Manufacturing
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8. Reputation
24th in Manufacturing Market
Insider’s list of Top 50 EMS
companies in 2011
Preferred supplier of a
number of global OEMs,
including Assa Abloy and
Bosch
Gold Awardee for Corporate
Governance from the
Institute of Corporate
Directors in the Philippines in
2011
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9. Quality Systems
Total Quality Management
Continuous Improvement and
innovation
International Standard Certifications include
Quality of Supply Chain and
ISO 9001:2008 Quality Management System
Supplier Partnerships
Environmental Management
ISO 14001:2004
System
Six Sigma and LEAN
ISO/TS Quality Management System for
Manufacturing Systems 16949:2009 Automotive Applications
ISO 13485:2003 Quality Management System for
Medical Devices
QC080000 Hazardous Substance Free
Process Management System
ISO/IEC Quality Management System for
17025:2005 Testing and Calibration Laboratories
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10. IMI Revenues
In Million US$
600.0
500.0
400.0
300.0
200.0
100.0
0.0
2005 2006 2007 2008 2009 2010 2011
IMI Group 182.1 395.0 422.1 441.1 395.5 412.3 575.5
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11. Revenues by Customer Nationality
2011 Sales: US$575.5 Million
Rest of
Asia, 13%
Japan, 13%
EMEA*, 50%
North
America, 24%
* EMEA – Europe, Middle East and Africa
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12. Revenues by Market Segment
2011 Sales: US$575.5 Million
Medical, 4%
Computing, 6%
Consumer, 20%
Multiple Markets,
15%
Telecom, 19%
Automotive, 18%
Industrial, 18%
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13. Global Footprint
Shenzhen Shenzhen Shenzhen
(Liantang) (Kuichong) (Fu Yong) Jiaxing Chongqing Chengdu
Třemošná
Czech Republic Shenzhen 3x
Jiaxing
Chongqing
Chengdu
Botevgrad . Fremont, California
Bulgaria Japan
. . USA
China .
. Laguna 3x
. .
. Taguig .
Cavite
.
Tustin, California Guadalajara, Mexico
Philippines
Singapore
.
Laguna Site 3x
Singapore
Taguig
Cavite
Manufacturing
Total manufacturing space of about 245,000 sq.m. in 17 sites
Over 14,000 employees worldwide (as of March 2012) Engineering
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14. Sales Offices
Europe
USA
Japan
.
China
. Philippines
.
Sales Contacts
Philippines
Singapore .
China: Shenzhen,
Jiaxing, Chengdu,
Singapore
Nagoya, Japan
Germany
France
Bulgaria
Czech Republic
Tustin, CA USA
Fremont, CA USA
Toronto, Canada
Guadalajara, Mexico
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Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011

15. FLEXIBLE SOLUTIONS
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16. APQP Process*
Product Development Cycle
NPI
Program Management: CFT
Ph. 1 – Ph. 2 – Ph. 3 – Ph. 4 – Ph. 5 –
Requirements Product Design Process Design Product & Mass
Ph. 0 – RFQ Definition & & Development & Development Process Production
Process Planning Validation
Process Owner: Process Owner: Process Owner:
Process Owner: Process Owner: Process Owner:
CFT Program CFT Program Design & Advance Manufacturing Production
Manager Manager Development/ Manufacturing
Engineer, Manager
Test & System Engineering
Project
Development Project Manager
/Value Manager
Engineering
Project Manager
* Advance Product Quality Planning
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17. Supplier Quality Engineering
23 SQE teams in three continents
SQE specialization in PCB, Passives, E-
Mechanical
ZDAP (Zero Defect Action Plan) for strategic
suppliers
Global audit plan with process audits in
different sites
Supplier development plan implementation
and monitoring
Standardization and centralization of supplier
evaluation
Supplier management controlled by AVL
Quality contracts and targets with suppliers
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18. EMS Design & Engineering Solutions
Contract Design and Joint
Development Solutions in
Power Electronics
Embedded Systems
Camera and Imaging Systems
Lighting Systems
Power Semiconductors
Short-Range Wireless
Design Services
Hardware & Software Development
Mechanical Design
Printed Circuit Board Layout
Design for Manufacturability, Reliability,
and Testability
Simultaneous Engineering
Value Engineering
Prototyping and Pre-Certification Testing
Design of Plastic Enclosures
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19. Power Design & Engineering Solutions
Contract Design and Joint
Development Solutions in
Power Modules
Power QFN
Power Components
Power Design Services
Mechanical Design
Design for Manufacturability,
Reliability, and Testability
Simultaneous Engineering
Value Engineering
Virtual Protoyping
High Power Prototyping and Pre-Certification
Module Testing
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20. EMS Advanced Manufacturing Engineering
Advanced Manufacturing Technology
Direct Chip Attach (COB, Flip Chip, and
Chip on Silicon)
Multi-Chip Module (MCM) and
Microsystem
Thermally Enhanced Direct Chip Attach
Advance Surface Metallurgies
Pre-flow Underfill Process (IMI Patent)
Traceless Flip Chip Technology ( IMI
Patent)
Substrate and Interconnect Technology
Small Precision Assembly
Traceability
Conformal Coating & Casting
equipment (selective & potting)
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21. Power Advanced Manufacturing
Advanced Manufacturing Technology
LED package
Low Rdson Cu-Clip solutions
Multi-Chip Module (MCM) and (SiP)
Thermally Enhanced Dual Cool
Technology
P-QFN package Advanced Die attach (Sintering)
LED packaging (IMI Patent)
Ceramic Isolated TO packages
Cu and Al-Ribbon bonding
High Temperature Packages
SiC/GaN technology
P-Comp
Hermetic package
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22. EMS Manufacturing Solutions
PCB & FPCB Assembly Smallest Component Size
With 144 SMT Lines as of Mar 2012
0402
Chip
Flexible PCBA 01005 ready
Aluminum PCBA QFP Lead Pitch
0.40
0.30 mm ready
Ceramic PCBA
Connector Lead Pitch 0.40 mm
Flip Chip On Flex
Chip-On-Board BGA/CSP Bump Pitch 0.50 mm
Chip-On-flex
BGA/CSP Bump Diameter 0.30 mm
Chip-On-Glass
Chip-Scale Packaging Flip Chip Bump Pitch 0.16 mm
Hybrid Module PCBA
Flip Chip Bump Diameter 0.07 mm
PCBA with Multiple BGA SMT
Selective and Robotic Soldering Largest Component
QFP/SOP 45 x 45 mm
Complete Box Build
Connectors 90 x 100 mm
Cleanroom Operations
BGA Package Size 54 x 54 mm
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23. Power Manufacturing Solutions
Lead-frame and DBC Assembly
High Volume Core Processes
30mio device/week capacity
4mil min
TO220 2/3/5/7 leads Wafer Sawing
01005 ready
TO247 2/3 leads Lead and lead
Solder Die attach
free
T0252 2/3 leads
TO264 2/3leads Reflow (standard & Vacuum) void free soldering
TO257/58 Hermetics Cu-Clip power connection Low Rdson
SOT227
Au and Al bonding wire and ribbon
P-QFN 3x3, 3.3x3.3, 5x6
P-QFN system in package (SiP) Transfer molding Green
SSPM IGBT Modules
Saw singulation , Trim & Form flexible POD
Hybrid TO packages
Full-pack TO packages Advanced Processes
Cu Bonding up to 3mil wire
Complete Box Build high rel die
Sintering
attach
Customized packages on
Rapid Prototyping RnD line
request
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24. Injection Molding Capabilities
State-of-the-art injection
Molding and drying machines
Horizontal injection press
Vertical bi-injection press
Injects most of the
engineering resins : PA, PBT,
POM, PET, PC, PP
High precision thin wall focus
mineral and glass fiber filled
material injection capability
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25. Plastic Injection Capabilities
From 50 to 850 tons
Injection, Over-molded, and
Optical Plastics Parts
Decorating, Painting, and Laser
Graving
Functional and Cosmetic
Tool Shop Services
Design and Manufacturing of
Molds
Partnerships for Inserts
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26. Test and Systems Development
Co-development of test specifications
concurrent to new product development
Design for testability and flexibility for
product revisions
Turnkey hardware design and
assembly
Parallel test solutions for high volume
manufacturing
Software development and upgrades
Test documentation
Training and 24x7 manufacturing
support
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Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011

27. Reliability, Failure Analysis, and Calibration
Reliability Engineering
Accelerated testing to determine
product:
• Life Expectancy
• Warranty
• Reliability
Failure Analysis
Data analysis and identification of
failure cause as well as preventive
measures
Calibration Service
Offer services on the following:
• Thermometry
• Electrical equipment
• Metrology
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28. MARKET SEGMENT
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29. Automotive Electronics
Key Capabilities
Electronics Manufacturing Services
(EMS) including
Experience • Automotive Camera Platform
• Sensors & Imaging Contract Design
• Automotive Camera
• Power Electronics
• PCBA for Electronic Stability Program (ESP) • COB Manufacturing
• Tire Pressure Sensor PCBA • Product Miniaturization
• Car Windshield Temperature and Humidity Sensor • DFM and DFT
• Electronic Power Steering (EPS) Rotor Position Sensor (RPS) • Test Equipment Development
• PCBA for Headlight • Rigid Printed Circuit Board Assembly
• Switch Controller for Main Light • Flex Printed Circuit Assembly
• Communication Power PCBA • Flip Chip Process
• Body Control Module (BCM) • Automatic Pin Insertion
• Antenna Receiver / DAB Tuner • Simultaneous Engineering
• Powertrain Control Solutions
• ISO/TS 16949:2002 Certified Lines
• Semiconductors used in Electric Drive/ Hybrid Electric Vehicles
• Fuel Management
• Critical Part Monitoring (CPM)
• Pump Driver • Reject Profile Analysis (RPA)
• Steering Wheel Control Device • Parts Average Test (PAT)
• Cockpit Control Device • Statistical Bin Analysis
• Audio Processor • RoHS Compliant Lines
• Plastic Injection
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30. Industrial Electronics
Experience
• Automated Meter Reading (AMR)
• Security Device Key Capabilities
• Electronic Door Access System
• Smart Card Electronics Manufacturing Services
• Point Of Sales System
• Printer Control Board (EMS) including
• Power Amplifier • Low-Volume / High-Mix Manufacturing
• DC-DC Power Converter • Power Supply Design
• Engine Controllers • Sensor & Imaging Contract Design
• Welding Machine Inverter • Mechanical Enclosure Design
• Motor Drivers for Conveyor • DFM and DFT
• Fan Motor Control Board • Test Equipment Development
• Computer Numerical Control (CNC) Control Board • Rigid Printed Circuit Board Assembly
• Main Power Supplies for LED Street Lighting • Automatic Pin Insertion
• Modules for Renewable Energy Generation, • COB (Au & Al Wires)
Transmission and Conversion • Complete Box Build
• Medium to High Power Discrete Packages
and Process
• Power Modules
• RoHS Compliant Lines
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31. Medical Electronics
Key Capabilities
Electronics Manufacturing Services
(EMS) including
• Low-Volume / High-Mix Manufacturing
• Product Design Co-development
• DFM and DFT
Experience • Product Miniaturization
• Rigid Printed Circuit Board Assembly
• Flex Printed Circuit Assembly
• Flat Panel Imaging Equipment • Flip Chip On Flex Assembly
• Auto Body Contouring Imaging Equipment • COB including Die Attach of Imager Die
• Dental Imaging System • ISO 13485:2003 Certified Lines
• Defibrillator Component
• Concealed Hearing Aid
• Biomedical and Laboratory Equipment
• Centrifuge Control Board
• Fitness Equipment Control Board
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32. Communications Electronics
Key Capabilities
Flexible Electronics Manufacturing
Services (EMS) including
• Design for Manufacturability
• Product Miniaturization
• Pre-certification Testing
• Test Equipment Development
Experience • Rigid Printed Circuit Board Assembly
• COB with Die Attach of Imager Die & Al Wires
• Complete Box Build
• Back Panel for Telecommunication Board • Repair Services
• Fiber to the “X” (FFTx) systems • RoHS Compliant Lines
• Booster Amplifier • Power QFN
TM
• GPON (Gigabit Passive Optical Network) Systems • Powermite
• Wireless Security System • Power Management (IC) Discrete Packaging,
• Base Station Power Supply e.g., 5-7L TO-220, TO-263, TO-252, and
TM
• Digital Station Control Board Powerflex
• Power Transistors for amplifiers in cellular base stations
• Power Conversion ICs in adapters and chargers for cell
phones and cordless phones
• DC Port and USB Port Protection for cell phones and satellite
radio peripherals
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33. Computing and Storage Devices
Experience
• CD/Combo Drive
• DVD Drive
• Blu-Ray Disc Drive
• Hard Disk Drive
• Solid State Drives
• Printer Sensor
Key Capabilities
• Printer Control Board Flexible Electronics Manufacturing
• Multi-Function Copier Machine Services (EMS) including
• DVD Recorder Power Supply
• Power Supplies for Servers, PCs, • Product Miniaturization
• Test Equipment Development
Notebooks, and Netbooks
• Rigid Printed Circuit Board Assembly
• Over-voltage Protection for HDD and DC • Flex Printed Circuit Assembly
Port Protection for Keyboard Mouse • Flip Chip Process
• Mechanical and Optical Precision Assembly
• Complete Box Build
• RoHS Compliant Lines
• Power QFN
• PowermiteTM
• Power Management (IC) discrete packaging, e.g.,
5-7L TO-220, TO-263, TO-252, and PowerflexTM
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34. Consumer Electronics
Experience
• Ultrasonic Toothbrush
• Hybrid IC
• Gas Ignitor and Re-Ignitor Key Capabilities
• Air-Conditioning (HVAC) Controller
• Projector Lamp Drivers Flexible Electronics Manufacturing
• Refrigerator and Cooker Hood Control Board
• Power Management & Home Appliance for Lighting Control
Services (EMS) including
• Household Metering Device • Cost-Effective High-Volume Manufacturing
• Bluetooth Headset • Firmware Development
• Electric Drive Control for Home Appliances • Mechanical Enclosure Design
• Main Power Supply for Flat-panel TV • Low Profile Switch Mode Power Supplies
• Power Supply for Game Consoles and Entertainment Electronics • Pre-certification Testing
• High Voltage Power Conversion ICs in Adapters and Chargers for • Test Equipment Development
Personal Electronics • Flip Chip Process
• Garage Door Control • Automatic Pin Insertion
• Programmable Timer • Complete Box Build Assembly
• Pressure Cooker Modules • Low to High Power Outline Packages
• Steamer Controller Modules • Small to Large Outline Packages
• Washing Machine controllers • Specialized Interconnect Process for Product
• Coffee Machine Power Requirements
• Plastic Injection
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35. Renewable Energy
Key Capabilities
Electronics Manufacturing Services (EMS)
including
• PV Module or Panel Design/Co-Development
• Materials Qualification
• Process Development
• Prototyping
• Panel Testing and Certification (with RETC) Low-
Volume Manufacturing of Engineering or
Experience Marketing Samples
• 2.3 MW Low Volume Capacity (in Fremont,
• PV Panel Assembly
CA , USA)
• PV Co-Design & Development
• PV Panel High Volume Mfg. • 30-60MW High Volume Capacity (in Jiaxing,
• PV Panel Platform China)
• PV Inverter Platform • Development of Solar Inverters (in Singapore)
• Inverter Electronics
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36. IMI SITES OVERVIEWS
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37. IMI Bulgaria – Botevgrad Overview
Site Details | Botevgrad
Date Founded 1998
Footprint 23,778 sq.m. (about 255, 944 sq.ft.)
Headcount 1,183 employees
Markets Served Automotive, Industrial, Consumer Electronics
Site Capabilities PCBA: SMT, COB/COF/ IC Encapsulation, Pin
Through Hole, Automatic Pin Insertion, Wave
Map: Soldering, Selective Soldering System, BGA, X-ray,
Nitrogen Equipment, Protective Coating, ICT/ FCT
Test, Thermopaste Dispensing, AOI,
Plastic Injection, Embedded Toolshop, Overmoulding,
Botevgrad
Box build: Mechanical Design and Assembly,
Experience Wiper Systems, Steering Wheel Controls, Cockpit
Control Devices, Dashboard Elements; Truck Opening
Site: Botevgrad, Bulgaria Systems, Security Devices, ECU Modules, Sensors
for Cars, Steering Sensors, Control Unit Panels, Audio
Location: 60km from Sofia International Airport
Processors; Power Management, Remote Control,
45 min by car
Fuel Management, RF Modules, Lighting Control
Address: Integrated Micro-Electronics Bulgaria Devices, Programmable Timers, Pressure Cooker
Industrial Zone "Microelektronika" P.O. 66 Modules, Steamer Controller Modules, Washing
2140 Botevgrad, Municipality of Botevgrad Machine Controllers, Coffee Machines
Sofia District, Bulgaria
Contact
Numbers: Tel: +359.72.36.83.00 Certifications ISO/ TS 16949, ISO 9001, ISO 14001
Fax: +359.72.36.82.46
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38. IMI China - Shenzhen (Liantang) Overview
Site Details | Shenzhen (Liantang)
Date Founded 1988
Footprint 18,600 sq. m. (about 200,208 sq. ft)
Headcount 1,637 employees
Map: Markets Communication, Backplane
Served Wireless Metering & Wireless Security
System
Site Turnkey & Consignment, HMLV &
Fuyong
Kuichong Capabilities LMHV, SMT & PTH lines, BGA &
Liantang
COB, X-ray, AOI, ICT, Functional
Testing, Test Development: H/W &
S/W PCBA Assembly & Full System
Box Build, New Product Introduction
Site: China, Shenzhen (Liantang) (NPI) Center; Central Warehouse,
Logistics Services, D&D Center
Location: 55km from Hong Kong International Airport;
around 75min by car Experience Back Panel for Telecommunication
Board, Fiber Optic Product, POA
Address: Shenzhen Speedy-Tech Electronics Co., Ltd. Product, Wireless Security System,
Speedy-Tech Industrial Building, RF Metering
Area 7 of Liantang Industrial Zone,
Luo Hu, Shenzhen P.R.C. 518004 Certifications ISO9001:2000, ISO14001:1996,
TL9000
Contact
Numbers: Tel: +86.25708382
Fax: +86.25708019
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Strictly Confidential. All rights reserved by Integrated Micro-Electronics, Inc. (IMI) -- including any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications for industrial property rights. July 2011