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PillarHall by VTT in ALD2018, Incheon, South Korea, 29.7.-1.8.2018

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Learn how PIllarHall® lateral high aspect ratio test structures are utilized by scientific professionals in Atomic Layer Deposition (ALD) fundamental research, thin film characterization and control and monitoring in manufacturing.

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PillarHall by VTT in ALD2018, Incheon, South Korea, 29.7.-1.8.2018

  1. 1. Mikko Utriainen, Dr. Tel. +358 40 753 7415 mikko.utriainen@vtt.fi or pillarhall@vtt.fi The AVS 18th International Conference on Atomic Layer Deposition (ALD 2018), 29th July – 1st August 2018, Incheon, South Korea, https://ald2018.avs.org/ VISIT OUR DISPLAY BOOTH PillarHall® by VTT WELCOME! Presentations in ALD 2018 with PillarHall® PillarHall® Lateral High Aspect Ratio (LHAR) MEMS-based test structure technology is developed for accelerating thin film R&D. Technology is made available by VTT Technical Research Centre of Finlánd. Learn how PIllarHall® is utilized by scientific professionals in ALD fundamentals, characterization and manufacturing. 31st July 4:15pm Thin Film Conformality Analysis‚ Reliability and Modeling using All-silicon Lateral High Aspect Ratio Structures Oili Ylivaara, VTT 31st July 5:00pm Mechanisms limiting conformality in thermal and plasma-assisted ALD investigated by Lateral High Aspect Ratio structures Karsten Arts, TU-Eindhoven 31st July 5:00pm Monitoring Conformality in ALD Manufacturing: Comparing Lateral and Vertical High Aspect Ratio Test Structures Mikko Utriainen, VTT (in collaboration with Fraunhofer IPMS) 31st July 5:30pm Conformality Measurement Needs and Challenges: Survey among ALD professionals Mikko Utriainen, VTT (POSTER) See you in ALD 2018 J PillarHall® Test Chips SPECIAL OFFER only in ALD2018 http://www.pillarhall.com/ https://www.vttresearch.com/cleanroom- facility-for-microelectronics-–-micronova Let’s meet in ALD 2018

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