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PillarHall® Test Chip is a special substrate for thin film deposition and related processes. The PillarHall® Test Chip consists of microscopic Lateral High-Aspect-Ratio (LHAR) test structures that offer an easy, fast and accurate way to characterize thin film processes in three dimensional substrate. PillarHall® approach is especially suitable for thin film conformality characterization by deposition methods such as ALD (Atomic Layer Deposition) and Chemical Vapor Deposition (CVD). PillarHall® Test Chips are useful for thin film R&D as well as their manufacturing process control and monitoring.
The core of the PillarHall® LHAR structures is the existence of a wide area lateral air gap under the thin silicon membrane with controlled 500 nm gap height. The name PillarHall comes from the microscopic silicon pillars that stabilize the thin silicon membrane roof. This lateral 3D approach is the core invention and benefit of the PillarHall® technology. The controlled lateral high aspect ratio structures enable fast analysis of thin film conformality without cross-sectioning and tedious sample preparation.
PillarHall® LHAR Test Chips are designed, developed and fabricated in VTT Technical Research Centre of Finland. The PillarHall® MEMS processes and manufacturing is carried out in Micronova Micro- and Nanomanufacturing Centre of VTT in Espoo, Finland.