Second Generation Electronic Compass, very low power consumption and tiny footprint (2.2x2.2mm²) thanks to an optimized integration The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch. Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation. The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found in BMC050. The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications. More information on that report at http://www.i-micronews.com/reports/Bosch-Sensortec-BMC150-6-Axis-MEMS-eCompass/1/425/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
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21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
December 2013 – Version 2 – Written by Romain Fraux

2. Bosch BMC150 6-Axis eCompass
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Bosch Sensortec
– BMC150 Characteristics
3. Physical Analysis 19
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package
– Package Views, Dimensions & Pin Out
– Package Opening
– Wire Bonding Process
– Package Cross-Section
– ASIC Accelero Die
– View, Dimensions & Marking
– Delayering
– Main Blocks Identification
– Cross-Section
– Process Characteristics
– MEMS Accelero Die
– View, Dimensions & Marking
– Bond Pad Opening & Bond Pad
– Cap Removed & Cap Details
– Sensing Area Details
– Cross-Section (Sensor, Cap & Bonding)
– Process Characteristics
– Magnetometer Die
– View, Dimensions & Marking
– Hall sensor and fluxgate sensors
– Delayering
– Main Blocks Identification
– Cross-Section (CMOS & Sensor)
– Process Characteristics
4. Manufacturing Process Flow 90
– Global Overview
– ASIC Accelero Front-End Process
– MEMS Accelero Process Flow
– Magnetometer Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
5. Cost Analysis 111
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– ASIC Accelero Front-End Cost
– ASIC Accelero Back-End 0 : Probe Test & Dicing
– ASIC Accelero Wafer & Die Cost
– MEMS Accelero Front-End Cost
– MEMS Accelero Front-End Cost per process steps
– MEMS Accelero Back-End 0 : Probe Test & Dicing
– MEMS Accelero Wafer & Die Cost
– Magnetometer CMOS Front-End Cost
– Magnetometer Sensor Cost
– Magnetometer Sensor Cost per process steps
– Magnetometer Back-End 0 : Probe Test & Dicing
– Magnetometer Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– BMC150 Component Cost
6. Estimated Price Analysis 144
– Manufacturer Financial Ratios
– Estimated Selling Price
Contact 149

3. Bosch BMC150 6-Axis eCompass
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

4. Bosch BMC150 6-Axis eCompass
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• Package is analyzed and measured.
• The package is opened to get overall dies data: dimensions, main characteristics, device markings.
– Pictures of selected area are made in order to understand the connections between the MEMS and the
ASIC.
• The ASICs are separated to get overall dies data: dimensions, main blocks, pad number and pin out,
die marking.
– Removal of metal layers (step by step) to measure the minimum dimensions.
– Pictures of selected areas to identify the nature of the transistors.
– SEM photographs to measure the transistors dimensions.
• The MEMS are separated to get overall dies data: dimensions, main blocks, pad number and pin
out, die marking.
– SEM pictures of mechanical structures.
– Cross section of MEMS to measure thicknesses.

5. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Package Side View
• Package: LGA 14-pin
• Dimensions: 2.2 x 2.2 x 0.95mm
• Pin Pitch: 0.4mm
• Marking:
00A
2A
Package top view
Package back view
Orientation of Axes
(from datasheet)

6. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6
• The die marking includes the logo of Bosch and:
BAA255CA
BOSCH
2012
ASIC Accelero Die Marking

7. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7
• The die marking includes the logo of Bosch and:
BAM150AB
BOSCH
2012
Magnetometer Die Marking

8. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8
Si wafer
•Thinning 300µm
•Pad oxide (Oxide1)
deposit
Si wafer
•Buried Poly (Poly1)
deposition
•Ion implantation
•Pattern & etch
Si wafer
•Sacrificial Oxide 1 (Oxide
2) deposit
•Pattern & etch
Si wafer
•Seed Layer (Poly 2)
Deposition
•Ion implantation
•Pattern & Etch

9. Bosch BMC150 6-Axis eCompass
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10. Bosch BMC150 6-Axis eCompass
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11. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 11

12. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 12

13. Bosch BMC150 6-Axis eCompass
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 13
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on
the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
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