1. Faculty of Mechanical Engineering
Universiti Teknologi Malaysia
INFINEON TECHNOLOGIES (M) SDN BHD
INDUSTRY TRAINNING REPORT
Name : Mohamad Asrul Affendi B Mohd Kasem
Matric No : A11KM0077
Staff No : 30082275
University : Universiti Teknologi Malaysia
Company : Infineon Technologies (M) SDN BHD
Period : 16 June 2014-5 September 2014
Department : IFMY OP BE POM SO M1 UPS MLD
Company’s supervisor : Gerry Escribano Tortillas/S.Gopalakrishnan

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I declare that this report entitled “INDUSTRIAL TRAINING REPORT” is the result
of my own research except as cited in the references. The thesis has not been
accepted for any degree and is not concurrently submitted in candidature of any other
degree.
Signature : ……………………………………
Name : ……………………………………
Date : …………………………………...

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ABSTRACT
The Industrial Training in Infineon Technologies is a pre working step before
entered working stage and to learn knowledge and skills outside campus. The
knowledge and skills that had learned during this training will help students a lot,
make easier and have the great advantages to enter student’s future company
especially in semiconductor field. Besides, students can gain some sociality and
communication techniques which benefit in future when enter the society.
This report explains and describes details about this training. Generally, this
industrial report contains all the activities and projects that I had carried out during
my 12 weeks industrial training from at Infineon Technologies (Malaysia) Sdn Bhd.
This report will briefly describe introduction of the Infineon Technologies
(Malaysia) Sdn. Bhd. and the brief explanations on the process that involved in the
Power Semiconductor Department in producing its product from its raw material till
its finishing product. This industrial report covers the general information of Infineon
Technologies, the assembly flow in the line which include Front of Line (FOL) and
End of Line (EOF). Apart from that, this report also including the information that I
have learnt throughout the 12 weeks training and the assignments that had been
assigned to me.

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ACKNOWLEDGEMENT
Taking this opportunity, I would like to express my gratitude to workers for
given me all the helps and supports needed in completing my industrial training here
at Infineon Technologies (M) Sdn. Bhd. Without them, my training here will not be
so meaningful and memorable.
First of all, I would like to thank Infineon Technologies (M) Sdn. Bhd. for
giving me this opportunity to have my training here. It is such a great experience
having my training here as Infineon Technologies is one of the leading companies
over the world. Although it is a big company to me, I enjoyed my training here since
workers here are helpful and friendly. It is honestly being accepted for having
training at here.
Hereby, I would like to thank my supervisor Mr. Gerry Escribano Tortillas
and Mr. S.Gopalkrishnan for assisting me and sharing the working experience with
me. Furthermore, they taught me a lot of soft skill and technical hands on. I learnt to
organize things well and have a good time management under their supervision. . I
am deeply thankful for his kindness and willingness in teaching me to handle variety
of machines and explained theories and operations of processes involved in the
semiconductor industry.
Next, I would like to thanks to Mr. Norzairiashar B Abd Malek who the
person that have been guide me for my training period and also to the other who help
me a lot things during my training time Not forget to extend my appreciation to the
engineers, Miss Syukriah Ismail and Mr. Nicholas Santiavu, technicians and
operators who had kindly share their experience, knowledge and expertise with me
and assisted me throughout my training life. Their assistance and encouragement are
much appreciated.
Last but not least, a big thank you to my dearest family and my friends
especially my mother Hasnah Jantan for having being there for me through thick
and thin. Without them, my training will not turn out to be so great. And I strongly
believe that all the precious experience that I gained during the 12 weeks of training
here will make me become a more competent engineer in the near future.

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TABLE OF CONTENTS
CHAPTER TITLE PAGE
ABSTRACT 3
ACKNOWLEDGEMENT 4
TABLE OF CONTENTS 5
LIST OF FIGURES AND TABLES 7
CHAPTER 1 INTRODUCTION 10
1.1 Introduction to Industrial Training 10
1.2 Objective of Industrial Training 11
1.3 Scope of Industrial Training 11
1.4 Summary of Industrial Training 12
CHAPTER 2 BACKGROUND OF ORGANIZATION 13
2.1 Company profile 13
2.2 Company Logo and Name 16
2.3 Mission 16
2.4 Vision 17
2.5 Infineon World Wide 18
2.6 Organizational structure 19
2.7 Introduction of Power Semiconductor Department (PO) 20
2.7.1 Department’s Mission 21
2.7.2 Department’s Vision 21

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2.7.3 Department Organization 22
CHAPTER 3 POWER SEMICONDUCTOR PROCESS FLOW 24
3.1 Introduction 24
3.2 Overall Process Flow 24
3.2.1 Pre-Assembly 25
3.2.2 Wafer Mounting 26
3.2.3 Wafer Sawing 27
3.2.4 Die Bond 28
3.2.5 Wire bond 29
3.2.6 Molding 30
3.2.7 Post Mold Cure (PMC) 31
3.2.8 Plating 31
3.2.9 Trim & Form 32
3.2.10 Testing 33
3.2.11 Mark, Scan and Pack 34
CHAPTER 4 PROJECT, TASK AND TRAINING 36
4.1 Overall Industrial Training Activities 36
4.2 Task, Training and Project. 37
4.2.1 Training 1 37
4.2.2 Training 2 41
4.2.3 Task 1 46
4.2.4 Task 2 49
4.2.5 Task 3 51
4.2.6 Task 4 52
4.2.7 Project 1 55
CONCLUSION 61
REFERENCES 62

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LIST OF FIGURES AND TABLES
FIGURE PAGE
Figure 1: Sky View of Infineon (M) Sdn. Bhd. ......................................................... 13
Figure 2: Logo of Infineon Technologies .................................................................. 16
Figure 3: Four Pillars for Company’s Mission .......................................................... 17
Figure 4: Infineon World Wide.................................................................................. 18
Figure 5: Company Organization Chart..................................................................... 19
Figure 6: Main door of PO......................................................................................... 20
Figure 7: Organization chart ...................................................................................... 22
Figure 8: Molding Organization Chart ...................................................................... 23
Figure 9: Process Flow of PO .................................................................................... 24
Figure 10: Wafer Case ............................................................................................... 25
Figure 11: Wafer........................................................................................................ 25
Figure 12: Wafer after mounting ............................................................................... 26
Figure 13: Wafer before mounting............................................................................. 26
Figure 14: Mounting Machine ................................................................................... 26
Figure 15: Wafer Sawing Process.............................................................................. 27
Figure 16: LPL HD frames ........................................................................................ 28
Figure 17: LPL Standard frame ................................................................................. 28
Figure 18: Fullpack frame.......................................................................................... 29
Figure 19: Conventional frame .................................................................................. 29
Figure 20: Wire Bonding Process.............................................................................. 29
Figure 21: Molding Machine ..................................................................................... 30
Figure 22: PMC Oven................................................................................................ 31
Figure 23: Plating Machine........................................................................................ 32
Figure 24: Trim and Form Process Chart .................................................................. 32
Figure 25: Trim and Form Machine........................................................................... 33

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Figure 26: Testing Machine....................................................................................... 34
Figure 27: Marking Machine ..................................................................................... 35
Figure 28: ASM IDEAL MOLD Machine................................................................. 37
Figure 29: FICO AMS-i............................................................................................. 38
Figure 30: FICO-AMS-36-M2................................................................................... 38
Figure 31: LPL HD Leadframe.................................................................................. 38
Figure 32: LPL Standard Leadframe ......................................................................... 38
Figure 33: On Loading............................................................................................... 39
Figure 34: PRESS ...................................................................................................... 40
Figure 35: OFF Loading ............................................................................................ 40
Figure 36: Position of rubber sheet............................................................................ 41
Figure 37: Brush plungger ......................................................................................... 42
Figure 38: Remove and dig cavity............................................................................. 42
Figure 39: Blow air to the plunger hole..................................................................... 43
Figure 40: Blow air to the plunger hole (from top dieset) ......................................... 43
Figure 41: Levelness of plunger ................................................................................ 43
Figure 42: Conditioning process................................................................................ 44
Figure 43: Check any remnant................................................................................... 44
Figure 44: Vacuum process........................................................................................ 45
Figure 45: BuyOff process......................................................................................... 45
Figure 46: Air gap...................................................................................................... 49
Figure 47: Dented Leg ............................................................................................... 49
Figure 48: SAT picture (Leg) .................................................................................... 50
Figure 49: SAT Picture (Top).................................................................................... 50
Figure 50: Calibration tool......................................................................................... 51
Figure 51: Position of Pellet and Plunger .................................................................. 53
Figure 52: Complain unit vs simulation unit ............................................................. 56
Figure 53: Scratches LF VS No Scratches LF........................................................... 56
Figure 54: Lead frame before mold ........................................................................... 57
Figure 55: Lead frame after mold .............................................................................. 57
Figure 56: Remnant block at air vent and gate .......................................................... 58
Figure 57: Air vent and mold gate ............................................................................. 58
Figure 58: Result after remove remnant .................................................................... 59
Figure 59: Air vents drawing ..................................................................................... 59

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Figure 60: One Point Lesson (OPL) .......................................................................... 60

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CHAPTER 1
INTRODUCTION
1.1 Introduction to Industrial Training
For Faculty of Mechanical Engineering undergraduate students, there are
compulsory to attend 12 weeks Industrial Training during the period of their studies.
This training is part of teaching course that provides exposure to the world of careers
for students to all theories which learnt in the lecture room with reality and are
willing to be involved in the work environment.
Bachelor programs that required Industrial Training are as follows:
Bachelor of Engineering (Mechanical) (SKMM)
Bachelor of Engineering (Naval Architecture and Offshore Engineering) (SKMO)
i. Bachelor of Engineering (Mechanical - Aeronautics) (SKMT)
ii. Bachelor of Engineering (Mechanical - Automotive) (SKMV)
iii. Bachelor of Engineering (Mechanical - Materials) (SKMB)
iv. Bachelor of Engineering (Mechanical - Manufacturing) (SKMP)
v. Bachelor of Engineering (Mechanical - Industrial) (SKMI)
All Students will undergo training in Year Three in short semester of their
studies. To undertake the Industrial Training, students must pass the core courses and
obtained at least a total 80 credits and minimum grade D- (30%).

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1.2 Objective of Industrial Training
The purposes of Industrial Training are to enhance students’ knowledge and
skills to a career in their respective professions, as well as to produce graduate with
professional, ethical, skilled, creative and competent. Therefore, Industrial Training
objectives are:
i. To expose students to the environment and working conditions in
their respective fields
ii. To obtain working experiences in industry related their professions.
iii. To use the knowledge of the Industrial Training, this was followed at
university.
iv. To train students to interact and communicate effectively at all levels
in the workplace
v. To train students to prepare technical reports related to the Industrial
Training which conducted.
vi. To inspire a spirit or working as a team.
vii. To appreciate the ethical values of their profession.
1.3 Scope of Industrial Training
The Industrial Training scope to be passed by students in company includes
various aspects such as to observe organization’s operations/factories/companies.
Besides that, it also include perform operations by making use of machinery,
equipment and to work on the installation and fabrication. The inspection and quality
control, to work on process control and instrumentation, and to work on project
design also include in Industrial training scope. Lastly, the scopes of Industrial
Training also include maintenance and repair of machinery and equipment,
installation of new equipment and testing, management and administration and also
consultation.
However, the scope and the actual training program depend on the type of
companies involved. The program which only requires students to carry out

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production work alone is not sufficient and will not be ratified by the faculty. The
companies are requested to provide appropriate training to students who will work as
engineer or industrial designer after completing their studies.
1.4 Summary of Industrial Training
As Conclusion, Industrial training refers to students’ work experience in an
engineering-practice environment to familiarize themselves with professional
engineering practices prior to graduation. It provides students an opportunity expose
to professional engineering practices in the industries due to their major discipline.
Moreover, it helps to develop awareness about general workplace behaviors and
build interpersonal skills as an engineer.

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CHAPTER 2
BACKGROUND OF ORGANIZATION
2.1 Company profile
Infineon Technologies is a German semiconductor manufacturer founded on
1 April 1999, when the semiconductor operations of the parent company Siemens
Figure 1: Sky View of Infineon (M) Sdn. Bhd.

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AG were spun off to form a separate legal entity. As of 30 September 2013, Infineon
has 26,725 employees worldwide.
Infineon Technologies is a leading innovator in the international
semiconductor industry. The company designs, develops, manufactures and markets
a broad range of semiconductors and complete system solutions targeted at selected
industries. Infineon products serve applications in the wireless and wire line
communication, automotive, industrial, computer, security, and chip card markets.
The company’s product portfolio consists of both memory and logic products and
includes digital, mixed signal and analog integrated circuits (ICs) as well as discrete
semiconductor products and system solutions. With a global presence, Infineon
operates through its subsidiaries in the USA, from Milpitas, California, and in the
Asia-Pacific region, from Singapore and from Tokyo, Japan.
Today, Infineon Technologies (Malaysia) Sdn. Bhd. has become one of the
largest manufacturing sites of Infineon with the cumulative investment of
approximately EUR 1.0 billion. The company has established itself as a leading
manufacturing site for Discrete Semiconductors, Power Semiconductors, Sensor and
Logic Products. With a committed workforce of 7000, this manufacturing site
assembles and tests more than 12 billion highly sophisticated semiconductor devices
annually. The company’s products are exported globally through Infineon’s
distribution centers in Asia, Europe and United States, The millions of
semiconductor devices produced hourly lead to an annual export volume of over RM
3 billion and thus contributing to Malaysia’s trade balance as well as the economic
growth in the state of Melaka.
Infineon’s corporate presence in Malaysia started with the setup of
InfineonTechnologies (Malaysia) Sdn. Bhd. formerly known as Siemens
Components Sdn. Bhd. in 1973, which is one of the pioneer companies in the Free
Trade Zone (FTZ) Batu Berendam, Melaka. It started operation in UMNO building,
Jalan Hang Tuah, Malacca with only 50 employees. The first production activity was
assembly of transistors mainly used in amplifiers and receivers. In 1974, the
company moved to Batu Berendam FTZ. A new administration block and a second
block were developed following the expansion of the company. In 1992, the third
block which was used for high storage of equipment of DRAM production was

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completed. On 3rd of May 1999, Siemens Malacca changed its name to Infineon
Technologies. The company successfully enters the NYSE on 13th
March 2000.
Besides the investment in manufacturing facilities in Melaka, Infineon
Technologies also invests in engineering competence centers and training facilities
on site to meet the ever growing demand for innovative and competitive solutions.
The manufacturing environment in Melaka has evolved from labor intensive to
automated production by constantly investing in the latest technologies which has
contributed additional value to our stakeholders. In order to complement the
introduction of state-of-the-art technologies, Melaka site also provide training
academy to continuously upgrade the skills of the workforce and prepare the
employees for the present and future technological challenges.
The company’s commitment towards quality goes back to its very founding
days with the launch of Quality Drive to ensure business excellence. The focus on
quality and productivity laid the foundation for the company’s success through the
perpetuation for TQM culture. The company has promoted this culture based on the
three principles of involvement, continuous improvement and stakeholders’
satisfaction using EFQM Excellence Models systematic. The success of Infineon
Technologies (Malaysia) Sdn. Bhd. is evidenced by eleven National Awards received
from the Prime Minister’s Office as well as 15 corporate awards, affirming its TQM
efforts. The continued excellent performance of the Melaka operation ensures
success in today’s competitive business environment.
.

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2.2 Company Logo and Name
Figure 2: Logo of Infineon Technologies
The name Infineon combines the English word “infinity” with “eon,” the
ancient Greek word for eternity, in an attempt to call to mind positive associations
with the idea of infinity. The name bears with it all the associations one would from a
high-tech microelectronic company, which are endurance, reliability, visionary,
dynamic and improvement-driven.
The Infineon logo is vital in communicating the company identity. The
“swoop” around the logo embodies a dynamic, future-oriented company with an
innovative spirit. The curve is not a closed circle, which shows the company’s
openness and desire to always move forward. The blue colour is used in the name to
reinforce the deep engineering and technological base. The red colour, which is used
for the “swoop” highlights the warmer, more human elements of their technological
expertise.
2.3 Mission
Manufacturing and marketing the industry’s most advanced microelectronics
products has always been the main mission of Infineon Technologies. The built out
technological strength to offer our customer a wide range of leading edge solution
emphasizing communication, computer, chip card and the automotive applications.

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They attract the best talent worldwide and translate advanced technologies into value
for their customer and shareholder.
Figure 3: Four Pillars for Company’s Mission
Figure 3 show that the four pillars for Company’s Mission. There are as the
following below:
i. Customer Focus: to think of customers first; delivering innovative
semiconductor solutions to meet their needs today and in the future.
ii. Operational Excellence: to be committed to being best-in-class on cost,
quality and time-to-market.
iii. Profitable Growth: to focus on profitable growth in the interest of our
shareholders and employees.
iv. Collaborative Leadership: to foster a cooperative culture and work as a
global team for success of our customers.
2.4 Vision
The vision of Infineon Technologies is to create Semiconductor Solutions
enabling the Technology Lifestyle of the Individual in 21st
Century. In addition, it is
to shape microelectronics by creating innovative products, leading-edge solutions
and services for the benefit of customer and shareholders.

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2.5 Infineon World Wide
Figure 4: Infineon World Wide
Infineon is a giant multinational company with manufacturing plants located
worldwide where the head quarter is located in Germany. With the most advance
technologies in R&D and manufacturing techniques, Infineon had become the
number one leader in semiconductor sector.

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2.6 Organizational structure
Figure 4 is the organization chart of Infineon Technologies (Malaysia) Sdn.
Bhd. The company can be divided into three main part, finance and business
Safety Health &
Environment
Purchasing
Logistics
Plant Security
Plant Facillities TQM &
Communications
Sensor Segment
Discrete Segment
Information
Technologies
Human Resource Quality Management
Product Planning
Advance Logic
Power segmentFinance and Business
Administration
INFINEON TECHNOLOGIES
(MALAYSIA) SDN BHD
Figure 5: Company Organization Chart

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administration, production team and support function team. Each part has its own
section with different functionality and responsibility. Power Segment, Advance
Logic, Discrete Segment and Sensor Segment are four business segments. The rest
such as Product planning, quality management, TQM & Communications, plant
facilities, plant security, human resource, information technologies, logistics,
purchasing, and safety health & environment make the support function team.
2.7 Introduction of Power Semiconductor Department (PO)
Power (PO) Segment is a backend operation focusing on assembles and
testing of power semiconductors as well as package development for Automotive and
Industrial market. In order to achieve manufacturing operational excellence, PO
manage it engineering competencies by delivering the four Key Success Factors,
namely Speed, Quality, Cost and Flexibility.
There have two sub-segments, namely PO TO and PO DSO where the former
is located in Malacca and later in Batam islands, Indonesia. PO TO in Malacca
manufactures a wide range of packages and product for both “through hole” and
Figure 6: Main door of PO

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“SMD” application such as I/Dpak, TO220/263, Fullpack, Powerpack, TO218,
SS08/S308, CiPOS, etc.
PO TO start its operation in 1981, manufacturing TO220/3 SIPMOS
production. Since then, PO TO has grown its manufacturing site with a production
volume of more than 1.3 billion semiconductor devices and offers more than 2,100
job opportunities.
2.7.1 Department’s Mission
This Department aim to achieve these missions:
i. We shape microelectronics by creating assembly and interconnect
technologies, leading edge solutions and services for the benefit of our
customers.
ii. We lead the packaging future.
iii. To be committed to produce excellent quality products at competitive cost
through continuous improvement in Technologies and Logistics by
striving to understand and exceed customers’ expectation and perception.
2.7.2 Department’s Vision
The vision of department is to fulfill customer needs and perceptions by
creating, providing and marketing total assembly & interconnect solutions.
i. Development of new packages, sub-components, materials and
processes needed for the success of the product divisions.
ii. Provision of necessary backend production support for improvement
in essential processes and materials.
iii. Generation of inventions and optimization of the IP portfolio to
protect our core competencies.

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iv. To be center of Excellence in Backend Power Semiconductor
Manufacturing.
2.7.3 Department Organization
Power Malacca Segment
Segment Operation Segment Support
Module M1 (Assy)
Module M1 (Test)
ProjectPIPTE
Module M4
Module M2
M1 T UPSTech Support
M1 LPNM1 T P
MOLD
Figure 7: Organization chart

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Although I am assign at PO department, I have through my training life at
Molding Section. There is the organization chart for molding section.
MOLDING Segment
Head of Engineer
Engineer
Engineer
EngineerEngineer
Process technician Maintenance
Technician
Figure 8: Molding Organization Chart

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CHAPTER 3
Power Semiconductor Process Flow
3.1 Introduction
This chapter will deal with the process flow of Power Semiconductor
Department in detail. Reader may get more thorough information on the process flow
which starts from wafer mounting and eventually the product testing before sending
for the customers.
3.2 Overall Process Flow
Figure 9: Process Flow of PO

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The processes are divided into four parts, mainly comprises of Pre-assembly,
Front of Line (FOL), End of Line (EOL) and Testing.
3.2.1 Pre-Assembly
The wafer initially was stored in a wafer case. Once the wafer had been
received from other division, several processes required before using it in FOL. They
receive the wafers which brought in from Infineon Kulim or Germany and start the
production. The wafers are come in the shipper and normally there are maximum 25
pieces wafers in a shipper. There are 2 kinds of shipper; one is where wafers are
arranged in vertical form and the other one where wafers are arranged in horizontal
form. The wafers have 3 different sizes which are 5 inch, 6 inch and 8 inch wafer.
These wafers come together with the wafer cases and are transported in special boxes
called “entigris” boxes. The quantity, type, specifications and size of the wafer are
shown by the codes stated on the wafer cases and the wafers are received by the
officer at the Material room. The 2 main processes are wafer mounting and wafer
sawing. It will undergo 100% visual inspection before sending for die bonding
process.
Figure 10: Wafer CaseFigure 11: Wafer

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3.2.2 Wafer Mounting
Wafer mounting is a process which the wafer and the wafer frame are
attached on a dicing tape by die attach. The purpose of the process is to provide
support to the wafer during wafer sawing process. The wafer frame is made of
plastic, with the resistance to warping, bending, corrosion and heat; whereas the
dicing tape is PVC sheet which adhesive on one side for holding the frame and
the wafer.
Figure 13: Wafer before mounting Figure 12: Wafer after mounting
Figure 14: Mounting Machine

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3.2.3 Wafer Sawing
Wafer sawing is the step that actually cuts the wafer into individual dice
for assembly in IC packages. The wafer sawing process is explained by the
following steps:
i. The frame-mounted wafer is automatically aligned into position for cutting.
ii. The wafer is then cut through its thickness according to the programmed die
dimensions using a resin- bonded diamond wheel rotating at a very high rpm.
iii. The wafer then goes through a cleaning process using high pressure di-
ionised water (DI) that is sprayed on the rotating work piece and then dried
by air-blowing to prevent any silicon dust or any liquid droplets to dry on the
wafer surface. Contamination left on the wafer surface may be a source of
wire bonding problems.
Figure 15: Wafer Sawing Process

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3.2.4 Die Bond
The assembly process start with die bonding. Die bonding/attach is
defined as the process whereby silicon chips are taken or sucked up from the
sawn wafer and attach it on the die to a lead frame and on a printed circuit board
by a die bonding machine to provide mechanical and electrical connection
between chip and lead frame. In Infineon, the package is produced in large
production volume, so the die bonding process is perform in an automated
assembly machine. However, there is operator that needs to run the machine and
fix some error made by the machine.
The die bonding comprises of 4 types, which are:
i. Eutectic soldering
ii. Adhesive soldering
iii. Glue soldering
iv. Diffusion soldering
The resulting product consists of single chip, chip-on-chip, chip-by-chip and
chip on chip-by-chip. There are 4 types of packages implemented in Front of
Line big package in M1
Figure 17: LPL Standard frame
Figure 16: LPL HD frames

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3.2.5 Wire bond
Wire bonding is the process whereby wire is attached to the die and lead
frame for the purpose of linking a die to the lead frame. The wire used in wire
bonding process is usually made of either aluminum (Al), gold (Au) or copper
(Cu) wire. Two common bonding processes are wedge bonding and ball bonding.
Figure 19: Conventional frame
Figure 18: Fullpack frame
Figure 20: Wire Bonding Process

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3.2.6 Molding
Molding is the process of encapsulating a device with plastic material to
protect the chip and wire from any external physical damage. A common
molding process in the semiconductor industry is the transfer molding process.
First, mold compound is pre heated to a specific temperature. After pre-heating,
the molding compound is forced by a hydraulic plunger into the pot where it
reaches melting temperature and becomes fluid. The plunger then continues to
force the fluid-molding compound into the runners of the mold chase. These
runners serve as canals where the fluid-molding compound travels until it reaches
the cavities which contain the lead frames for encapsulation. Cavity nearer to the
runner will fill up the first follow by the cavity further away from the cull. The
highest filling velocity is experienced by the first cavity. However, the filling
velocity decreases as the first cavity is filled. The mold compound then turn into
solid but still brittle that will fully encapsulate the device.
Figure 21: Molding Machine

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3.2.7 Post Mold Cure (PMC)
Post mold cure is a minor process that is done to enhance the physical and
performance properties of the molded plastic material. Post mold sure has to be
conducted at temperature above the ultimate glass transition temperature of the
epoxy molding compound, typically 140-160˚C. Post mold cure at higher
temperature reduces the required time to reach full conversion. Usual post mold
cure treatment is for 4-5 hours.
3.2.8 Plating
Plating is the process of applying a coat of metal over the leads and heat
sink. The reason for doing this is to protect the lead against of corrosion and
abrasion. It also can improve the solder ability of the leads and appearance of
leads.
There are two widely used lead finish techniques in the semiconductor
industry, namely, plating and coating. Further, there are two types of plating,
pure metal plating such as tin plating and alloy plating such as tin/lead plating.
Coating is the process of depositing filler metal (usually solder) over a surface,
achieving metallurgical bonding through surface wetting. The filler metal should
Figure 22: PMC Oven

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have a melting temperature below 315°C for the process to be classified as
coating. The driving force for a solder coating process is surface tension, wetting
of the surface to be coated by the solder must be achieved. A solder diffusion
layer grows at the surface-solder interface as solder spreads through the surface
during the coating process.
3.2.9 Trim & Form
Trim and form is the last process of End of Line. Trim process means
cutting process. It comprises of dejunk cut process, dam bar cutting process,
center lead cutting process and detect uncut dam bar. Forming process means
deform the lead into its final form. It also contains cutting process. The following
chart show that the process of Trim and Form.
Figure 23: Plating Machine
Dejunk
Dambar
Cut
Lead
Length Cut
Singulation
Pre form Final form
Figure 24: Trim and Form Process Chart

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3.2.10 Testing
Package test is to confirm the package functionality before shipping to
customer. “Burning” is an electrical stress test that employs voltage and
temperature to accelerate the electrical failure of a device. Burn-in may be used
as a reliability monitor. Burn-in is essential to simulate the operating life of the
device, since the electrical excitation applied during burn-in may mirror the
worst-case bias that the device will be subjected to in the course of its useable
life. Depending on the burn-in duration used, the reliability information obtained
may pertain to the device's early life or its wear-out.
Usually there have two type of testing, Electrical Testing and temperature
Testing. Electrical testing is the identification and segregation of electrical
failures from a population of devices. An electrical failure is any unit that does
not meet the electrical specifications defined for the device. Temperature testing
is the identification and segregation of temperature failures from a population of
devices. The temperature test is to see whether the units can be last long at high
temperature and low temperature, because of the Power Semiconductor‟s
Figure 25: Trim and Form Machine

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product have application in automotive industrial, so the test is determine the
products can be last long in both temperature.
3.2.11 Mark, Scan and Pack
Marking is the process of putting identification, traceability, and
distinguishing marks on the package of an IC. The device name, company logo, date
code, and lot id are examples of information commonly marked on the IC’s package.
Some marks are put on the package during Assembly and some marks are put on the
package during Test. There are two common marking processes, namely, ink
marking and laser marking. The most common ink marking process for
semiconductor products is pad printing.
Pad printing consists of transferring an ink pattern from the plate, which is a
flat block with pattern depressions that are filled with ink, to the package, using a
silicone rubber stamp pad. Silicone rubber repels ink, making the transfer of the ink
Figure 26: Testing Machine

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pattern clean and efficient. It is also resilient and elastic, making it possible to print
even on uneven surfaces. After the ink is situated on the package, it must be sent for
curing to let the ink to be dry.
Laser marking is the process of engraving marks on the surface of the
package. The needed pattern is first key into the machine computer. An automated
loader feed the package into position and the engraving process start. This technique
is considerably faster than the ink marking technique. After all these processes, the
products are pack and will ship to the customers.
Figure 27: Marking Machine

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CHAPTER 4
PROJECT, TASK AND TRAINING
(Molding Section)
4.1 Overall Industrial Training Activities
During Industrial Training, I have been learns many types of training like
handling of equipment and operational observation. Besides that, I also learn about
familiarization on the defect types (100% visual inspection, failure catalog and
mapping process). From that, I learn that we must identify the problem and also their
pattern. Those also build my observation skills.
Other than that, I have learn about dieset management (assemble dieset and
cleaning dieset). That will help me familiar to tools and how to use it in real
situations. Then I also learn about product identification and project report
compilation. It will help me to improve my skill to using software like excel, power
point and Microsoft word that I will use during my final year for completing my final
year project.
Besides that, I have been train to collect data and process (DDM, Yield and
Machine parameters). That will help me to know how to obtain valid data for my
final year project in the future. Finally, types of training that I learn in this company
is follow up with technician system issues and also follow up on engineer task.
Therefore, I have learn many thing that help me to gain skills that I can use in my
final year student and also prepare myself as engineer in the future.

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4.2 Task, Training and Project.
4.2.1 Training 1
i. Type of Training
 Familiarization on the Molding Machine.
ii. Objectives of Training.
 Identify the types of machine
 Identify the machine’s operation (basic operation)
In M1 Molding Section (M1 Block 4 only), there have 3 types of the molding
type. It is an ASM IDEAL MOLD machine, Fico-AMS-36-M2 machine and Fico
AMS-i machine. Each machine has their operation. For machine Fico-AMS-36-M2
and Fico AMS-i, the type of leadframe that have been use to mold is LPL Standard
leadframe. While, In ASM IDEAL MOLD machine, the type of leadframes that have
been mold is LPL HD leadframe. However, There one machine for ASM IDEAL
MOLD molded LPL Standard leadframe. There are the picture of the machine and
types of leadframes.
Figure 28: ASM IDEAL MOLD Machine

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Figure 30: FICO-AMS-36-M2
Figure 29: FICO AMS-i
Figure 32: LPL Standard
Leadframe
Figure 31: LPL HD
Leadframe

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Every machine has their operation. The following below is the explanation of
machine’s operation for basic operation only.
Machine’s operation (basic operation)
Machine usually divided into three main parts. Each part has their own
operation. The first part is called ON Loading, second part is Press and the last one is
Off Loading.
On loading is the part where the magazines that contain frames have been
inserted in the machine. This part will operate manually with help the operators.
Operators will insert the magazines one by one into On Loading part.
The second part is called PRESS. PRESS is the main part of the machine.
Most of molding activities happen inside the PRESS. Firstly, after magazine has
been inserted into ON Loading the frame from magazine will insert into turntable or
pre heater table inside PRESS. After that, frames will insert into dieset and mold
Figure 33: On Loading

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process will occur with specific temperature. It also will be compress with certain
pressure and time.
After mold process has done, the frame will be taken out from dieset and the
remove runner from the frame. This process will be done by degator. Then frame
will send into part that called OFF Loading.
The third part is OFF Loading, OFF Loading is the part where the frames
after mold has been put together into magazine before that out by operator to another
process.
Turn table or
Pre heater
Dieset Degator
Figure 34: PRESS
Figure 35: OFF Loading

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4.2.2 Training 2
i. Type of training.
 Dieset cleaning
ii. Objectives of training.
 To learn about procedure of cleaning dieset.
There have two types of cleaning dieset. First is Online Cleaning and Offline
Cleaning. The following below is the procedure of both types of cleaning.
Online cleaning
Step 1: Open the dieset.
Step 2: Place the rubber sheet at the middle of cavity. The condition of
rubber sheet must be at middle of cavity (7-10 shot).
Step 3: Close the dieset and do the cleaning process.
Figure 36: Position of rubber sheet

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Offline cleaning
Step 1: Take out the dieset from the machine. Open dieset and remove
access compound, dig cavity & brush dieset surface and brush
plunger.
Step 2: Blow air to the plunger hole (from bottom dieset) to remove the dirty
compound at plunger hole.
Figure 38: Remove and dig cavity
Figure 37: Brush plungger

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Step 3: Blow air to the plunger hole (from top dieset) to remove the dirty compound
at plunger hole.
Step 4: Levelness of plunger must be used jig or tools.
Figure 39: Blow air to the plunger hole
Figure 40: Blow air to the plunger hole (from
top dieset)
Figure 41: Levelness of plunger

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Step 5: Take in back the bottom dieset, wait until the temperature in spec and then do
the conditioning (2-4 shot).
Step 6: After done do conditioning, make sure double gate, single gate, cavity hole &
air vents must be clear form dirty, if not do digging again.Do it at top and
bottom mold dieset.
Figure 42: Conditioning process
Figure 43: Check any remnant

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Step7: Vacuum mold dieset.
Step 8: Buy off by PPC (person who incharge for quality control).
This is how to cleaning mold dieset (FICO machine). This procedure are
make because of they want to prevent the defect like rough surface, piping hole or
short mold, because after 900-1100 shot, the mold condition is not in good, so to
prevent and for long lasting until 900-1100 shot when running material, this
procedure must be followed exactly.
Figure 44: Vacuum process
Figure 45: BuyOff process

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4.2.3 Task 1
i. Types of task.
 Pinching’s measurement.
ii. Objective of training.
 Collecting data (Measure pinching).
 Prepare slide presentation.
iii. Pinching measurement process.
Step 1: Collecting Sample.
Step 2: Doing the mapping process (find pinching location)
Step 3: Take photo of the pinching.
Step 4: Measure pinching using “SmartScope”
“SmartScope” procedure.
a) Open measuring software.
b) Click on “System, Reset”
c) Click on “Target, Crosshair”
d) Find the pinching location and take the measurement at x-axis and y-axis.
e) Record the data collection.
f) Repeat step d and e to another pinching location that have been determine
from mapping process.
Step 5: Prepare Slide presentation.

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48. 48
From the result, the worst case for pinching problem for dieset C and dieset Q
is at the frame that on the left of the dieset. This is because the measurement of
pinching on the frame of the left side of dieset C has average around `0.6 mm (x-
axis) compare to the right side of the dieset C. While for dieset Q, the pinching
problem doesn’t no occur on frame that at right side of dieset and mostly pinching
occur on frame at left side of the dieset. However for dieset O, the pinching problems
occur on frames at both side of the dieset.
The factors that usually cause the pinching problem is the temperature
doesn’t not follow the parameters or position of the dieset of frame a bit offset. When
the temperature doesn’t follow the parameters, the frames will over expand if
temperature higher than parameters and frames will under expand if temperatures
lower that than parameters. Then when the dieset compress to do mold process the
pinching problem will be occur. For the dieset or frames have a bit offset from their
original position also will be cause pinching problem.
Therefore for this problem, dieset C and Q has worse pinching promble on
left side of the dieset. That show the frames a bit offset. That mean either dieset or
frame have their problem on position. Usually dieset in fixed position, therefore
transferring process a frame to dieset must be reset to original position. We must
make sure frame will go a bit to right to stop this problem. Then for dieset O, the
pinching problems occur on both sides. Therefore, we must set temperature follow
the parameters that already fixed by engineer.

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4.2.4 Task 2
i. Type of task.
 Air gap Unit.
ii. Objectives of task.
 Find the unit that have air gap.
When has a report or DDM issues about air gap, we need to find the affected
lot. Firstly, we must search the lot number of affected lot in DDM and also find it
location. Then, get the affected lot and do a mapping process and take the photo of
affected unit.
Mapping process is the process to known whether the location of unit that
affected with air gap have same location or not. From mapping process, we know
that e21 and e61 only have air gap. That means the air gap only occurs on the end of
frames and also only on dieset e. Therefore, inform to technician to do some check
on dieset e.
Figure 47: Dented Leg
Figure 46: Air gap

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Figure 46 and 47 shows that air gap occur because the unit has dented leg.
Dented leg usually occurs during the process remove runner. That means during
degate, the extra runner has been clamping along a frames. When have dented leg,
we need to SAT (Scanning Acoustic Thermograph) process to check whether the unit
have bent or broken wire or not. From SAT result, we know that all units do not have
any broken or bent wire. As conclusion, we know that the root cause of this air gap
problem from the dented leg. It happens during the process removing runner process.
Figure 49: SAT Picture (Top)
Figure 48: SAT picture (Leg)

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4.2.5 Task 3
i. Type of task.
 Calibration of dieset temperature.
ii. Objectives of task.
 Measure top and bottom dieset using measuring tool
 To make sure the temperatures of the dieset follow parameters
according their compound types.
Calibration Procedure
1. Take the temperature measurement by using calibration tool.
2. Take temperature for top and bottom dieset.
3. Record the temperature reading and compare with the parameters according
compound types that machine use.
4. If the temperature out of range, ask the technician to adjust the temperature
according the parameters.
5. Repeat the steps to take temperature in every half hour.
Figure 50: Calibration tool

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The temperature of the dieset is very import to make sure molding process
run smoothly and can reduce the failure defect. This is because some of the failure
defects happen because the temperatures of the dieset are not follow the parameters
according to their types of compound. If the temperature is lower than parameters, it
will make compound doesn’t fully liquid. Then the compound will not fully cover
the unit or exposed the internal element (shot mold or exposed copper). If the
temperature is higher than parameters, it will affect the lead frames. It will cause
pinching problem when lead frames over expansion and will make it offset from
dieset.
Besides that, when we take the temperature in few point in dieset, we can
know if there have bigger different between the part of dieset in temperature or not.
If it have large different, then we must check the heater. This is because top and
bottom dieset must not have large different in temperature.
4.2.6 Task 4
i. Type of Task.
 Short shot simulation.
ii. Objectives of Task.
 To see the meeting point of compound during molding process.
Short Shot is the molding simulation that we create to see meeting point of
compound. This simulation can help us to investigate piping holes defects and also
short molding defects. It can help us to see flow of the compound during molding
process because during molding process, compound will be press into dieset follow
the position that already be set up. There have 7 positions. Every position have their
own quantity of compound that be insert into dieset. Therefore we must set the last
position according compound’s height.

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Short Shot procedure
1. Change machine’s setting from production into short shot simulation.
2. Set last position (position 7) to 20 mm. That mean, when pellet become 20
mm height, plunger will stop push into cavity.
3. Insert dummy frames and pellet into dieset manually.
4. Start molding process.
5. Repeat step 2, step 3 and 4 for 16 mm, 15mm, 14 mm and 12 mm.
Result
From this short simulation, we can know that the meeting point of compound
during molding process at 14 mm. This is because for 20 mm and 16mm and 15mm,
the compound does not have meeting point. The compounds not fully cover the
frames. However for 12 mm, also does not have meeting point because compound
has already covered the frames.
Pellet
compound
Plunger
Bottom
Cavity
Figure 51: Position of Pellet and Plunger

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Result
Meeting
point occur

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4.2.7 Project 1
i. Type of Project.
 Customer complain (Mold bleed simulation)
ii. Objectives of training.
 Create a situation that will produce same problem with complain unit.
 To find the root cause.
 Provide the action for this problem from happen again.
The customer complains unit have mold bleed problem on the first lead of the
unit. Then, we must do the simulations that will get same problem like customer
complains unit. From that simulation will be know the root cause of the defect and
can create some solution that will avoid this problem occur next time. For this
problem, there have two simulations.
The first simulation, the abnormalities found of the unit having mold bleed at
first lead after second dambar having deep scratches below dambar. Reject pattern is
intermittent and sporadic. If the lead frame having vertical deep scratches the
tendency to have mold bleed is high and severity of the deep scratches will reflecting
mold bleed at first dambar or second dambar (near to the 1st lead). Then, for lead
frame without the vertical deep scratches didn’t shows mold bleed at second dambar
(near to the 1st lead).Only mold air vent visible at 1st dambar area.
Furthermore, in the 7 lead counts type lead frame drawing is not mentioning
regarding the vertical deep scratches mark. Usually, the mold bleed also will happen
because it will come out from air vent. When the pressure applies on dieset, the air
inside dieset will be force out through air vent. Then, mold will go out with air
through air vent. However, mold bleed does not enough or will not touch the lead of
unit. If it doesn’t touch, then it will pass because during trim and form process the
mold bleed will cut off.

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Figure 52: Complain unit vs simulation unit
Figure 53: Scratches LF VS No Scratches LF

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Figure 54: Lead frame before mold
Figure 55: Lead frame after mold

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Figure 54 show that the vertical scratches already exist before molding
process. Therefore, this problem does not occur during the molding process.
Second simulation; show that there have probability excess compound block
air vent and gate. When air vent and gate choked, it will cause similar mold bleed as
complain unit. The reject pattern if happen is always localized. Mold parameter study
show high transfer pressure and low mold clamping tonnage will not cause similar
mold bleed.
Figure 57: Air vent and mold gate
Figure 56: Remnant block at air vent and gate

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Red dot is example if any remnant choked partially will cause similar mold
bleed at venting area. Then after removing the remnant, there is no more excess
compound or mold bleed on the frames.
Figure 59: Air vents drawing
Figure 58: Result after remove remnant

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The action that be taken for this problem is provide the one point lesson
(OPL) regarding any air vent or gate choked occurred and brief to production people
shop floor. Besides that, provide 2 lead frames from incoming that has mold bleed at
air vent near first lead after mold process to material engineer to liaise lead frame
supplier to check lead frames thickness, clamping mark depth, clamping mark
position, and overall dimension. There is the following One Point Lesson (OPL).
So as conclusion, we must do some investigation about the problem occur to
know their root cause and create an action to prevent same problem occur again.
Figure 60: One Point Lesson (OPL)

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Conclusion
Throughout the 12 weeks of industrial training in Infineon Technologies (M)
Sdn Bhd, I really learned a lot of working experience. I’d experienced the working
environment in a competitive and well-known company like Infineon Technologies.
This experience definitely has strengthened my studies in the university and widened
my knowledge of working. I had observed the implementation of the engineering
theories in the manufacturing of a product.
Besides exposing to the working environment in Infineon Technologies, I
managed to gain much practical and technical knowledge on semiconductor fields
earlier before I am graduated. Moreover, I learnt to be more thorough in managing
the evaluation data in excel form and preparing the presentation slide.
Besides that, in industry life we have to work to much kind of people at many
stages. For example, we need to communicate with operators, technician, and other
engineers and as well the management people. Everyone has their own way to
communication. Therefore from that situation, I get improve my communication
skills that also apply on university. It also can gain my confident level when talk or
handled any kind of conversation. This is important because it can help I to handle
any kind of situation in industry sectors and also in University level.
Other than that, as an employee, punctuality is a must to me. Present to work
and submit duties given punctually will be able to give my employers, my clients,
my supervisor, and my colleagues as well a good image. In additional, I have learned
to hold awareness the safety, health, and welfare of the public. Honest, punctual,
helpful, be awareness, responsible, lawfully are the interpersonal built throughout my
training. And also, throughout my training, I am able to record my work and prepare
a fully report professionally.
As an employee, punctuality is a must to me. Present to work and submit
duties given punctually will be able to give my employers, my clients, my
supervisor, and my colleagues as well a good image. In additional, I have learned to
hold awareness the safety, health, and welfare of the public. Honest, punctual,
helpful, be awareness, responsible, lawfully are the interpersonal built throughout my

62. 62
training. And also, throughout my training, I am able to record my work and prepare
a fully report professionally.
Lastly, I enjoyed the working environment in Infineon Technologies (M)
Sdn. Bhd and hope all experience that knowledge that I get from this industrial
training will help me to complete my studies and become an engineer in the future. I
also would not forget the great help given to me by all the helpful colleagues during
my training period. Without their guidance, encouragement and advice, I won’t be
able to cope with the working environment easily.
References
1. Infineon Company, 2014. “Company”. 1999 – 2014 Infineon Technologies.
http://www.infineon.com/cms/en/corporate/company/index.html
2. Infineon Technologies background, on AHK Malaysia (Malaysian-German
Chamber of Commerce and Industry), from
http://malaysia.ahk.de/en/members/malaysia-members-directory/g-
k/infineontechnologies-malaysia-sdn-bhd-56645-d/
3. Infineon Technologies histories, on Funding Universe, from
http://www.fundinguniverse.com/company-histories/Infineon-Technologies
AGCompany-History.html