20140211 critical-electronics-for-aircraft

CISEC 2014 Conferences / Critical Embedded Systems / Electronics for Aircraft - Avioncs

Fbruary 2014

Presented by: Philippe PONS
Airbus Avionics & Simulation Products
Electronics Senior Expert

CISEC 2014 Conferences –
Critical Embedded Systems
Electronics for Aircraft –
Avionics
Feb. 11, 2014


Electronics for Aircraft – Avionics
Summary
• Introduction
• Context
• Some significant aeronautical constraints / requirements – Impacts on
electronics and avionics equipments development

• Design and development processes
• Conclusion

Page 2
© AIRBUS Operations S.A.S. All rights reserved. Confidential and proprietary document.

Fbruary 2014


Introduction

Page 3

Fbruary 2014


Fbruary 2014

Introduction – Overview of Avionics & Simulation Products
• Avionics & Simulation Products (EYY): AIRBUS Centre of Competences

simul
ation
Avionics

for on-board Electronics and Software in real time applications
 Cover the whole life cycle: development, production, sales & customer support
Design of 10 to 15% of Aircraft Electronics to acquire
expertise and support Programmes, Procurement, Engineering regarding the
other 85 to 90%
Focus on domains which are difficult, and/or sensitive & critical, innovative
A300/310

A319/20/21

•
•
•
•

Flight Control
Warnings
Maintenance
Communication

A380
A330/340

6000
equipments /
year
Page 4


Fbruary 2014

Context (1/5)
Embedded electronics: high growth since 20 years
Electronics overruns the Aircraft and brings intelligence, control precision,
performance, flexibility, reliability…

Examples: Fly-by-Wire, Cockpit

Cockpit
commands

Aircraft
sensors
Flight
computers

Page 5

Actuators


Fbruary 2014

Context (2/5)

• Nevertheless, low percentage of the worldwide electronics industry
o Dominated and ruled by high volume and low cost oriented applications

(ex.

consumers, telecom)
Note:

- Aerospace: below 1% of global component market, almost stable
- Automotive: ~8%, growing
o Characterized by rapide changes (ex. electronic components technologies, component
manufacturers buyout…)

A300

A340

A380

• But high level of contraints & requirements for on-board applications
Page 6


Context (3/5)
• Markets have drastically different characteristics

Page 7

Fbruary 2014


Fbruary 2014

Context (4/5)
How to proceed to remain competive in development / production of onboard electronics & equipments?
Adapt to the technologies, components, … market trends & use
appropriate processes
 Grasp opportunities offered by advanced & emerging technologies and
propose innovative solutions to keep a competitive advantage


-

•

Enabling new functions, allowing higher performance and
integration with reduced cost

But
- Often implemented on commercial applications, high volume,
low constraints, and not initially adapted to needs & requirements
of on-board systems
- Sometimes, limited access for European Actors (growth in US,
Asia, access / export limitation)
- Adding higher complexity (IS; EMC; hot spot,...), PCB,
assembly vs.comp. packages, certification, maintenance /
investigations), obsolescence, potential counterfeiting issues,
reliability risks,...

© Freescale Semiconductor, Inc. 2008

Satisfy specific constraints / requirements of Avionics
Page 8


Fbruary 2014

Context (5/5)
Major drivers:
•
•

Use of COTS components and widely ‘shared’ technologies (avoid “niches”)
High performances (electrical; functional  ex. processing, power efficiency with
increase of the frequency, …; less energy; …)

•
•
•
•

High integration for smaller
size & volume and smaller weight
High reliability and safety in compliance with the requirements for embedded
electronics
Performance & compliance with environmental constraints (thermal, EMC,
cosmic radiation,…)

•
•

Regulations: certifications, environmental directives (ex. RoHS, Reach)
Complexity and development cycles mastering – design maturity
(model based techniques, modeling & simulation , verification,…)

•
•
•
•

High industrial maturity (Entry in Service)
Long term availability  High life time (~15 years to > 30 years)
Lowest costs
Low and medium manufacturing volume / mass-production

Page 9


Summary
• Introduction
• Context

• Conclusion

Page 10

Fbruary 2014


Fbruary 2014

Some significant aeronautical constraints / requirements – Impacts
on electronics and avionics equipments development
 Service life
o

Electronic components (as example)

 Environmental conditions (thermal, mechanical… EMC, atmospheric
radiation, …)
 Safety
 Reliability
 Maintainability and Testability
 Certification

Page 11


Fbruary 2014

Service life
Service life of equipment is the time at which it is no longer physically feasible
or economically considered as rentable to repair or overhaul the equipment
to acceptable standards
Example: 150 000 flight hours, 30 000 cycles or 25 years

200X

201x + 5
EIS
Equipment

200X + 30
Equipment End of Service Life

design
Kick-off

 High impacts on:

Page 12

Electronic components and technologies (ex. manufacturing technologies) selection
Electronic providers selection and follow-up
Manufacturing & test means (industrialization)
Documentation set volume to preserve product knowledge
EIS: Entrance In Service



Fbruary 2014

Service life – Electronic components management

• Context:
Electronic components is the “raw material” for an electronic equipment: “to make
a good dish, good ingredients are needed”

Raw
materials

Design

Ensure >25 years life cycle (service life)

Page 13

Final product


Fbruary 2014

• Need

to manage electronic components to ensure:

 Right component for the right function: market trends, durability,
reliability (e.g. failure mechanisms vs. new technologies), sensitivity to
atmospheric radiation…
Continuously supply A/C for 25 years: expertise and audit of components
suppliers and manufacturers, obsolescence management and durability
control of components (if stocks), counterfeiting avoidance (supply through
approved network highly recommended)

International Specification IEC/TS 62239-1 “Process management for avionics
– Management plan – Part 1: Preparation and maintenance of an electronic
management plan” defines requirements for selecting and managing
electronic components (COTS and specific) in compliance with the end
application

Page 14

COTS: Commercial Off-The-Shelf



Fbruary 2014

Obsolescence management
PREVENT

DETECT

 PREVENT Obsolescence
- Select Electronic Components among “golden rules”
- Manage selection for design with a Preferred Parts List

- Define design margin in order to allow easier parts replacements
- Perform BOM analysis in order to validate components choices
- ...

 DETECT Obsolescence
- Perform technical components suppliers survey : meetings, visits, audits, ...

- Identify availability information within the components database,
- Conduct yearly obsolescence analysis and plan for each product

 SOLVE Obsolescence
- Identify replacement solutions & impacts on design (qualification level)
- Decide the mitigation solutions : short / mid / long – term redesign, stock,
- Update obsolescence plan
- ...
Page 15

SOLVE


Fbruary 2014

Environmental conditions: Mechanical & climatic requirements
Typical examples
•Temperature (ex. E-bay)
o
o
o

Storage: -55°C / +85°C
Operation: -40°C / +70°C
ambiant, air forced
Loss of cooling: 30mn @
+55°C ambiant; 8h @ +40
or +45°C

• Temperature Variation
• Altitude/Pressure (if required)
• Humidity

•Shocks (ex. E-bay)
o

6g

• Vibration
o

Random vibr. 1,68gRms /
10 – 400Hz

• Constant Acceleration
•10g

•Fluids
•Sand and Dust
•Fungus Resistance
•Salt Spray
•Icing
•Flammability/Smoke/Toxicity

Requirement’s magnitude and applicability depend on equipment category
 Temperature & Vibration are main constraints for on-board electronic equipments
requiring:
• Cooling analysis & solution (vs. for ex. acceptable components Tj)
• Mechanical analysis & assembly solution
• Performance margin definition
• Component selection & sort

!! Impact on weight
Page 16


Fbruary 2014

Environmental conditions: Transients and Electromagnetic (EMC)
requirements
• Transients
• Lightning strike attachments to the aircraft surface
• On aircraft switching of electrical loads and electrostatic discharges
• Radio Frequency Energy
• Those generated externally (example: high intensity radiated fields and
aircraft on-board transmitters)

• Those generated internally (example: emissions from neighbouring
systems and electronic equipments)

High impact on equipment design:
- Input/Output protections
- Specific filters design
- Strict packaging and electronic design rules/guidelines (vs. EMC
emission, immunity)
Page 17

EMC: Electro-Magnetic Compatibility



Environmental conditions: EMC Emission and Immunity
(Susceptibility)

•
•

Electronic boards are the central issue of the avionic EMC
Components may be both perturbing (guilty) and perturbed elements
(victim)

Page 18

Fbruary 2014


Fbruary 2014

Environmental conditions: EMC activities within equipment
development
System level
Equipment level
Environmental
& Functional
HW assembly
Specification

Preliminary
Design

Integration /
Verification

Phase 1

Qualification

Changes
Management

Packaging level
packaging
Specifications

Preliminary
Design

Packaging
Design

implementation

Verification

Implementation
(board prototyping)

Verification

Board level
Environmental &
Functional Board
Specifications

Preliminary Design

Electrical Diagram
Design, physical
design, place and
route

FPGA ASIC level
Functional
FPGA
Specifications

Preliminary
Design

- Architecture
- Electrical
and
grounding
network
technological
drawing
choices
-Lightning processes (applicable
Integral
- EMC Mockprotection and
ups
BCI filtering Planning and
HW
architecture
development - Signal
- Mechanical
intergrity
design
Simulations
requirements

Detailed
Design, coding,
synthesis,
place and route

Implementation
(programming)

Verification

- Schematic

diagram checks
(Analysis
at each level)
report)
Modification /
- Signal
Configuration
intergrity
management
Simulations

Page 19

- PCB Design
checks
- CAD
Certification liaison
Contraints
Notes
(airborne HW)

- Board checks
(signal integrtiy,
...)
- Equipment
checks
(robustness
tests)

V&V

HW process and quality
assurance


Environmental conditions: EMC compliance (example)
EMC compliance in a functional objective
Comply with the EMC standards

Functional improvement at design level

Page 20

Fbruary 2014


Fbruary 2014

Environmental conditions: Atmospheric radiation
Atmospheric Radiation Requirements
ALTITUDE
106

1.
Ft (330 Kms)
Orbit of the space shuttle

PRIMARY PARTICLES ISSSUE FROM
COSMIC RAY
(protons : 87% - helium atoms : 12% - Heavy
Ions : 1%)

Filter (Terrestrial Magnetic Field + Solar Wind)
INTERACTION WITH
ATMOSPHERIC ATOMS
(Oxygen + Nitrogen)

~ 39

000 Ft (12 000 m)
Aircraft Altitude

RADIATIVE ENVIRONMENT
AT THE FLIGHT ALTITUDE

For highly integrated electronic, consequences of the radiation impacts may be modifications to
logic states SEU/MBU in memory cells or registers : Safety-Reliability-Availability impacts
Order of Magnitude to consider: with 200MBytes embedded memory, 1 Upset by flight hour

 Impact on equipment design:
• Architecture
• Component selection
• Mitigation techniques
Page 21

SEU: Single Event Upset
MBU: Multiple Bit Upsets



Fbruary 2014

Environmental conditions: Atmospheric radiation effects
High energy particles

Collisions in
atmosphere

SEU sensitivity depends on many
parameters:
Technology(CMOS, Particle energy,
particule flux (function of altitude,
latitude), type of cell (RAM, flip-flop),
cell design, ...

SEU (Single Event Upset) are
concerning sequential logic
(RAM cells and Flip-Flops)
Where bit flip can occur and
remain “stored”

Neutron

Sensitive volume: nuclear reaction  parasitic currents

SEU cross section:
• Intrinsic parameter of a chip/circuit that specifies its response to a particle species
(e.g. neutron, proton, pion, heavy ion, etc.)
• Measured using a beam of particles produced at an accelerator. The SEU crosssection depends on the particle type and particle energy
Page 22


Fbruary 2014

Environmental conditions: Atmospheric radiation management and
mitigations
• Atmospheric Radiation effects Risk analysis (part of safety risk analysis)
International Standard IEC 62396-1 “Process management for avionics – Atmospheric
radiation effects – Part 1: Accommodation of atmospheric radiation effects via single event
effects within avionics electronic equipment” provides a general view of the subject to help
designers to assess the impact of cosmic radiation on electronic: SEU/MBU Risk Analysis

• Mitigations Techniques : Examples at component / equipment level
• Hardware protections
• Insensible components (ROM) or with a very low sensitivity
• Parity checks on Memory allow detection of SEU. The computer can generate an auto-reset or can
fail itself => impact on the availability

• Error Correction Code (Hamming Code, Reed Solomon…) : allows the detection and the correction
of the SEU => no impact on the availability (to be analyzed for MBU)

• Scrambling : arrangement of bits of memory to limit MBU,
• FPGA RAM Based : Internal triplication; Scrubbing : periodic refresh
• Software protections
• Many protections  Up to 30% of processor load

Page 23


Safety
Safety requirement for safe operation in compliance with Authorities
regulations and Customers / Airlines requirements

• Safety activity shall be done in order to keep the hazards associated with the aircraft or
with the environment to a minimum level

Analyze all potential safety hazards and associated hazardous conditions:
o Functional hazards (hazards associated with function/equipment/components)
o Intrinsic hazards (hazards intrinsic to equipment)
o Human activity hazards (maintenance, operational activities)
Example: Flight Control Computer safety requirements

• No single hardware failure shall be able to cause undetected oscillation of inputs / outputs
Failure Modes and Effects Analysis (FMEA) is a systematic method of safety analysis
o Identify potential failure modes of a
system, function, or piece part (i.e.
component)
o Determine the effects on the
respective level as well as on the next
higher levels of the design
Page 24

Fbruary 2014


Fbruary 2014

Safety: Impacts and mitigations
Impact on equipment design:
Functional architecture solution
Hardware and Software design solutions / techniques

Example of common safety mechanisms implemented in hardware and electronics
design
• COM/MON architecture
• Monitoring and test of each function shall be possible
• Watchdog
• Clock monitoring, Power monitoring
• ECC (error-correcting code) protection of RAM
• CRC (cyclic redundancy check) on ROM content
• Etc…
Additional features required by aeronautical
requirements
- Over current protection with filter
- High level disabling capability
- Function status feedback for monitoring
purpose
- Lock mechanism on failure (prevent from
oscillatory behaviour)
- Current inversion protection

Page 25


Fbruary 2014

Reliability
Probability that an item will perform a required function,
under specified conditions, without failure, for a
specified period of time
Main Quantitative specifications through:

• MTBUR (Mean Time Between Unscheduled Removals): obtained by dividing the total number of flight
hours logged by population of an equipment over a certain period of time by the number of unscheduled
removals during that same period

• MTBF (Mean Time Between Failures): obtained by dividing the total number of flight hours logged by a
population of an equipment over a certain period of time by the total number of confirmed failures occurring in
flight or on ground within the population during the same time period

• FR (Failure Rate): failures count per flight hour
• FIT (Failure in Time): failures for billion flight hours
Example: Flight Control Computer shall comply with MTBF 15 000FH & MTBUR 12 000FH

 Impact on equipment design:
• All domains from architecture, components selection, design rules, thermal – vibration –
EMC … environmental solutions implementation
Page 26


Fbruary 2014

Reliability: Design for reliability and reliability prediction approach
Design for reliability based on FIDES Guide: new
predictive reliability methodology based on Physic of
Failure, as previous methodology and guides were based
only on experience feedback analysis, did not follow the
components evolutions, were very pessimistic compared
with the current field return (e.g. MIL-HDBK217,… )

• Many COTS families
Parts

Electronic
boards

Sub-assemblies

• Fides methodology for MTBF evaluation
Technology

Reliability

Good correlation between FIDES
predictions and field return data

Use
Process

http://www.fides-reliability.org/
Page 27


Fbruary 2014

Reliability: Mission profile impact
Medium Range A/C

Computer in avionic bay

Computer in wing

Impact of the Mission Profile on MTBF
using FIDES:
Avionic Bay

Wing

A/C Long Range

x

>>x

A/C Medium Range

y

>>y

A/C Short Range

z

>>z

Page 28

Very important
to know the real
environment


Fbruary 2014

Reliability: Example of reliability assessments and qualification
applied to manufacturing technologies (e.g. PCB, assembly)
• How to do?

Potential failure modes &
mechanisms  Reliability

Pass criteria
Key characteristics  Monitoring

Technologies & processes
maturity

• Example: How many manufacturing process qualified for series production of this
board?
• PCB : 11
• Comp Assembly: 33
• Mech Assembly: 13

Page 29

PCB: Printed Circuit Board



Fbruary 2014

Reliability: Example of reliability assessments and qualification
applied to manufacturing technologies (e.g. PCB, assembly)
• Qualification procedure according to
• Normative standards (ex. IPC)
• Experience

• Procedures and sanction criterias defined to meet Aircraft Worst Case mission
profile

• Typical qualification stress
o 1000 thermal cycles from -40°C to +100°C with ramp +5°C or 10°C/mn
o Or 2000 thermal cycles if Lead-Free technology
o Vibration
And analysis

o Board visual inspection, resistivity measurements between isolated area., continuity
measurements on daisy chained assembly, PCB micro-sections inspection with microscope
Objective: Identify potential failure modes & mechanisms (ex. at solder joints level)
influancing reliability parameters / models (cf. FIDES)
Page 30


Fbruary 2014

Maintenability and Testability
• Maintainability
Under dedicated use conditions, capacity of an equipment to be
maintained or restored in a state in which it is able to accomplish its
required function, when the maintenance has been accomplished
under the required conditions, using the required procedures and tools
Obtained thanks to a set of principles and directives, which have to be followed throughout the
design of the equipment

• Testability:
Property of a system or Line Replaceable Unit (LRU) allowing rapid confirmation of its own
functional integrity at the most cost effective level

o Testability at system level: prompt integrity check of an operationally critical LRU
o Testability at LRU level: prompt integrity check of an internal board, component or module

Impact on equipment design: design for test
• Electronic and functions observability
• Test coverage techniques …
Page 31


Fbruary 2014

Time Critical

Equipment shall meet strict Time Critical performances for a number of applications
(example: Flight Control).
 Huge impact on equipment design:

• Equipment architecture to ensure determinism
• Electronic component selection to reach committed performances (ideally: cycle
accurate model)

• Specific custom component’s behavior determinism
• Software partitionning and determinism (including OS)

Page 32


Fbruary 2014

Certification
Equipment shall meet Airworthiness Certification standards to be integrated in
Aircraft System (Safety driven)
Need to follow strict Design Assurance Guidelines defined according to equipment
criticity level  Design Assurance Levels (DAL)
DAL

Description

Failure Rate (Hours)

A

Catastrophic

< 10-9

B

Hazardous

< 10-7

C

Major

< 10-5

D

Minor

> 10-5

E

No Effects

Don't Care

Impact on equipment design process according to criticity level mainly for
complex COTS components, specific components (e.g. FPGA, ASIC)
•For example for DAL-A: requirements traceability, FPGA separated
design and verification teams…
Page 33

DAL: Design Assurance Level
FPGA: Field Programmable Gate Array


ASIC: Application-Specific Integrated Circuit


Fbruary 2014

Typical requirements for Flight Control Computer located in
Avionics Bay
•
•
•
•

Service Life: 25 years
MTBF : 15 000 Flight Hours
DAL A : Catastrophic  Failure rate < 10-9
Environmental constraints compliance (vs. directives and/or normative standards)

o Operating temperature range thermal cycles) from -40°C to +70°C and loss of cooling conditions
o Vibration: (engine fan blade loss
o EMC compliance (radiated and conducted emission and immunity )
o Lightning protections
o Atmospheric radiation
o ….

• Power Supply Line (28VDC): from 18.5V to 32.5V with 46 V exceptionally
• Strict Time Critical Application
 Equipment’s function looks quite simple BUT due to Avionics
constraints & requirements, Design and Verification become COMPLEX

 Complex balance to meet specifications with regard to weight… and
cost targets
Page 34


Summary
• Introduction
• Context

• Conclusion

Page 35

Fbruary 2014


Fbruary 2014

Design and development processes: Product life – End to End
process
Requirements
(Customers)

Specifications

Design

Hardware

Development

Product
lifecycle

Software

Software

Hardware

Manufacturing

Test &
Integration

Delivery

Support

Page 36

Avionics
Products


Design and development processes

• Development process: How to Master the complexity
 Certification standards driven

 Design and development process / cycle

Page 37

Fbruary 2014


Fbruary 2014

Design and development processes: Civil certification standards
Part 21 : Certification of Aircraft and related Products, Parts and Appliances
CS25 : Certification Specifications for large Aeroplanes
CS25.1309 : Equipment, Systems and installations
AMC 25.1309 : system Design and analysis

ARP4754/ED79
System Development Process

ARP4761/ED135
Safety Assessment

Airworthiness
Standards
Set of requirements to
ensure passengers safety
Regulatory request
Acceptable Means of
compliance
Industrial answer, agreed by
consensus
System / Equipment

DO297/ED124
Integrated Modular Avionics
(IMA)

DO160E/ED14E
Environmental conditions
and test procedures

DO254/ED80
Hardware Development Process

Hardware / electronics

DO178B/ED12B
Software Development Process

Software

Updated : DO178C
Page 38


Fbruary 2014

Design and development processes: Civil certification - ARP4761,
safety approach overview

• Aircraft development based on an overall safety approach
o Take into account different root causes which can affect the behaviour of a
system : random failures, events and errors

• Development errors avoidance: confidence that errors have been
sufficiently removed from a product is based on the quality level of the
development process

o Development Assurance Level (DAL) “drives” the Quality of a development

Page 39


Fbruary 2014

Design and development processes: Civil certification – DO254 /
ED80 overview
A full methodology handbook for hardware (electronics) design assurance
Supporting Processes
·
·
·
·

Planning
(Section 4)

S
y
s
t
e
m
P
r
o
c
e
s
s

M
a
n
u
f
a
c
t
u
r
i
n
g

Validation and Verification Process (Section 6)
Configuration Management (Section 7)
Process Assurance
(Section 8)
Certification Liaison
(Section 9)

Hardware
Design
Processes
(Section 5)

Requirements
Capture
Section 5.1 .

(Section
2)

Conceptual
Design

Detailed
Design

Section 5.2 .

Section 5.3 .

Derived Requirements

• No (or few) How
• No guidance about in series production
Page 40

Implementation
Section 5.4

Production
Transition
Section 5.5

.

P
r
o
c
e
s
s


Fbruary 2014

Design and development processes: Civil certification – DO254 /
ED80 overview and content
Chapter 1 : introduction
Chapter 2 : system aspects of HW design assurance

Chapter 3 : HW life cycle
Chapter 4 : planning process
Chapter 5 : HW design process

Scope and complexity considerations
Decision making for HW design assurance strategy
Definition of Transition criteria
Supporting process
Design processes

Chapter 6 : validation and verification process
Chapter 7 : configuration management process
Chapter 8 : process assurance

Supporting processes

Chapter 9 : certification liaison process

Chapter 10 : HW life cycle data
Chapter 11 : additional considerations
Appendix A : modulation of HW life cycle data based on HW design assurance level

Appendix B : design assurance considerations for level A and B functions

Appendix C, D : glossary of terms, acronyms
Page 41

Previously developed HW, COTS, tool qualification

Data vs. Design assurance level, independence definition
Additional Verification activities for DAL A &B


Fbruary 2014

Design and development processes: Complexity mastery and
maturity search
Ensure electronic complexity mastery and product maturity: implementation of
structured development process as a key factor

• Hardware life cycle (V&V process)
o Usually, 2 main cycles : development prototype & industrial prototype

(Note
: development prototype cycle not mandatory according to type / characteristics of the
project)

• Development Prototype
• Validate and firm-up requirements with a physical implementation

• Industrial Prototype
• Verify the requirements with a physical implementation vs. product specification
• Build the industrial dossier

Page 42


Fbruary 2014

Design and development processes: Development life cycle
Development Life cycle : W process example
Delivery Works
Requirements
capture
R

traceability
HW-SW
integration tests

A
Preliminary
Design
R

PR

traceability

Detailed
Design

A
R

T
HW Qualification
R
T
R
HW-HW
Transition to
integration testsproduction

T
HW-HW
integration tests Req capture
R
R
A
T
Test
Detailed
Design
Test
R
R

Prototype
manufacturing

LUAR

T

R

Prototype
manufacturing

Development Prototype

HW-SW
integration tests

CDR

Industrial Prototype

PDR

R
A

DDR
Page 43

T

Review
Analysis
Test


Fbruary 2014

Design and development processes: Detailled development life
cycle

Upper level requirements

HW assembly level
Packaging level
Requirements
Board level
capture
ASIC level

 Activities at different level

HW-HW
integration tests

PLD level
Supporting
processes
HW Quality
Assurance

Requirements
Preliminary
capture

Design
review

Planning &
Development

review

VERIFICATION

Preliminary
Detailed

Transition to
production

analysis

Design Design
Validation &
Verification

review
Detailed Prototype

Modification &
Configuration
Management
Certification
liaison
(airborne HW)

Implementation

Design

review
Prototype


Delivery Works

Test

Implementation

Test

Page 44

HW Qualification
analysis

test
review


Fbruary 2014

Design and development processes: Board development process
example
Preliminary

Detailed

design

Board
Spec

design

Board Architecture Design
Analysis:
- Pre-BoM
- Schematcis
- EMC
- Technology

- Safety
- Func Testability.
- Manuf Testability
- Thermal

Board Pre-Placement
Analysis:
-EMC

-Thermal

V & V Strategy Definition
 Develop Board Verification SW.
 Develop Enabling products
 Develop Programmable component

Review

Schematic Design
Analysis:
- BoM
- Schematics
- EMC
- Technology
- Safety

- Func Testability.
- Documentary
- Manuf Testability
- Thermal
- JTAG

Board Place & Route
Analysis:
-Packaging.
-Thermal

-Test
-Manuf Techno

Design Dossier (design
justification)

Definition and
Manufacturing Dossier

Prototype
Verification
Verification Procedure
Writing

Prototype Integration with
Programmable components
Board Verif SW Integration
Complete Board
Verification
Update Design and
Definition Dossier if
required
Review

Review
Page 45


Fbruary 2014

Design and development processes: Multi-disciplinary
• Many specific jobs around Avionic Equipment and Electronics Development activities
working closely together
Electronic
Components

Quality

Manufacturing
Technologies

Procurement

Design:
• Digital,
• Specific components (FPGA,
ASIC),
• Analog,
• Power Supply,
• PCB layout,
• Packaging

Environment:
• Thermal,
• Mechanical,
• EMC,
• Lightning,
• Radiation
• …

Page 46

Equipment,
Electronics
Development

Certification
Qualification

Integration

Manufacturing
Safety &
Reliability

Maintenability
& Testability


Summary
• Introduction
• Context

• Conclusion

Page 47

Fbruary 2014


Fbruary 2014

Conclusion
Electronics is a major enabler for Aircraft systems
•
•
•
•

Intelligence, performance, smart controls…
Integration / miniaturization (more perf. in same or lower volume & weight)
Flexibility
…

But faced to high levels of constraints & requirements (life time, safety,
reliability, environment, certification…)
Requiring robust design and development processes, multi-diciplinary activities
for assessments, analysis, demonstration leading to safe applications

Page 48

More than Moore: Diversification
Analog/RF

More Moore: Miniaturization

Requiring to survey market & trends, to adapt, to
take advantage of advanced emerging technologies
for proposing opportunities and differentiating
innovations
Requiring to prepare the future

Moore’s Law & More

Baseline CMOS: CPU, Memory, Logic

 Electronics technologies are dominated and ruled
by high volume and low cost oriented
applications characterized by rapid change

HV
Power

Passives

65nm
45nm
32nm

Biochips

Interacting with people
and environment

130nm
90nm

Sensors
Actuators

Co
m
bi

Non-digital content
System-in-package
(SiP)

ni

ng

Information
Processing
Digital content
System-on-chip
(SoC)

22nm
.
.
.
V

Beyond CMOS

So
C

an
d

Si

P:

Hi
g

he
rV

alu

eS

ys
te
m
s


Fbruary 2014

© AIRBUS Operations S.A.S. All rights reserved. Confidential and proprietary document. This document and all information contained herein is the sole property of AIRBUS Operations S.A.S. No intellectual property rights are granted by the delivery of this document
or the disclosure of its content. This document shall not be reproduced or disclosed to a third party without the express written consent of AIRBUS Operations S.A.S. This document and its content shall not be used for any purpose other than that for which it is
supplied. The statements made herein do not constitute an offer. They are based on the mentioned assumptions and are expressed in good faith. Where the supporting grounds for these statements are not shown, AIRBUS Operations S.A.S will be pleased to
explain the basis thereof. AIRBUS, its logo, A300, A310, A318, A319, A320, A321, A330, A340, A350, A380, A400M are registered trademarks.

Page 49

20140211 critical-electronics-for-aircraft

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