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Reliability   Moisture sensitivity level 1(MSL1)    Pass   Ball pull after multi-reflow         Pass   Thermal cycle ...
At present:                                            Wire bond/      Organic       PCB/  MOS                   Metal lay...
Ready for your questions &requirement!
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
Introduction To Princo Pkg Plateform
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Introduction To Princo Pkg Plateform

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FO-WLP, eWLP, Coreless

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Introduction To Princo Pkg Plateform

  1. 1. Reliability Moisture sensitivity level 1(MSL1) Pass Ball pull after multi-reflow Pass Thermal cycle test-IPC-TC3 Pass High temperature/humidity test Pass Biased HTMT Pass
  2. 2. At present: Wire bond/ Organic PCB/ MOS Metal layer Bump/ Substrate/ FPC/ device Princo uBump Assembly Assembly Front-end/Foundry Back-end/OSAT PCB/EMS/ Near future: Module MOS Cu pillar/ Wire bond/ Organic PCB/ TSV Metal layer Si interposer/ Bump/ Substrate/ FPC/ device Si-Si stack Princo uBump Assembly AssemblyFront-end/ Middle-end/Foundry or OSAT Back-end/ PCB/EMS/Foundry OSAT Module Chip owner’s solution Princo’s solution
  3. 3. Ready for your questions &requirement!

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