The document discusses the FlexTiles project, which aims to develop a heterogeneous 3D-stacked chip combining a manycore layer with processors and DSPs, an FPGA layer, and a 3D network-on-chip (NoC). The chip is intended to enable efficient mapping of complex applications to limited hardware budgets in applications requiring adaptability like cognitive radio and drones. The consortium involves nine partners from five countries contributing technologies like virtualization, networking, and compilation tools.