1. 3D PLUS
BENEFITS
QUESTIONS & ANSWERS
BUSINESS UNIT S2
The 3D module maker
A. VAL 11/2009

2. Main Benefits
• Miniaturization
• Jedec compliant
• Extended/Specific temperature range
• Lead free or SnPb solderballs
• Robust to harsh environments
• Selection of customer device reference for product catalogue
• Scalable pitch following customer specification (Enhanced reliability
with a 1,27 mm pitch eutectic tin lead solder ball)
• No MOQ
• Prototype / low mix volume
• Flexible / Short term development
• High reliability technology legacy
A. Val 11-2009

3. Benefits in Details
Standard Products
Memory capacity is multiplied by 2 or 4 compared to the capacity available on the market.
Components footprint fully compliant with Jedec standards. No need to redesign the board to use our components.
Commercial, Industrial or Military temperature range depending on memory types. Possible to extend the
temperature range on request.
Lead free or SnPb solderballs following customer’s request. Same price, same lead time.
Technology withstand very well vibrations, shocks, thermal cycles. Product Qualification Reports available on request
Generic basic components or customer’s Approved Manufacturers List (AML) - Bare dice or packaged devices.
No NRE : The same design and manufacturing process are used for a family of components >> No need to start a new
design for each new product (shorter lead time).
No MOQ : Whatever the quantity, we deliver it.
Low manufacturing costs adapted to prototype / low mix volumes.
Flexible / Short term development : 1W (parts in stock) to 16W (design to do) delivery time
A. Val 11-2009

4. Benefits in Details
Custom Products
Miniaturization : Case to case, generally 2 to 10 times the initial design
Robust to harsh environments. We can perform qualification tests on the product we manufacture (thermal cycles,
high temperature storage,…).
Standard or Specific temperature range.
Scalable pitch and footprint following customer specification. Lead free or SnPb solderballs
Generic basic components or customer’s AML - Bare dice or packaged devices.
Adaptable design / co-design flow.
No MOQ : Whatever the quantity, we deliver it.
Low manufacturing costs adapted to prototype / low mix volumes.
Flexible / Short term development
High reliability technology legacy : Robust technology adapted to harsh environments
A. Val 11-2009

5. Questions & Answers
• [Q] Can the documents be sent to our customers?
• [A] Business Unit Presentation, Flyers and Products Qualification Reports are non-
confidential documents. All of them can be forwarded. Flyers are available on our
website.
• [Q] What is your business model?
• [A] We address low volume (up to 50,000 components per year) and high reliability
markets. Thus we deliver products with standard footprint, industrial temp. range and
competitive price. Main markets are : Defense, Avionics, Transportation, Medical,
Industrial.
• [Q] What is new for a potential customer?
• [A] The main benefits are listed in the previous pages.
The main arguments that differentiate us from the competition (IC, hybrids
manufacturers…) are :
• Capacity / Organization not available from IC manufacturers.
• Industrial / Extended Temperature range not available or with MOQ.
• Form factor similar to original component.
• Decoupling capacitors can be integrated.
A. Val 11-2009

6. Questions & Answers
• [Q] From which country the modules are shipped ?
• [A] The products are shipped by 3D Plus from France.
• [Q] ….
• [A] ….
A. Val 11-2009