3. - COMPANY CONFIDENTIAL -Page 3 May 2011
Agenda
1 THINFAB™
2 Technical Requirements
3 Oerlikon Solar Solution
4 Module Power and Design
5 THINFAB™ Development
6 Cost of Ownership
7 Key Messages
8 Summary
4. - COMPANY CONFIDENTIAL -Page 4 May 2011
Technical Requirements
What is key for a competitive PV Thin Film Silicon Fab?
Optimized End-to-End-Solution
Complete value chain out of one hand: From
module design, manufacturing equipment until
material qualification and module certification.
Reliable industrial production
Highest throughput and yield, production proven
processes and robust tool engineering
Lowest CAPEX
Market-driven Fab size configuration for best
utilization of single equipment and highest
uptime
Lowest CoO
Driving product, material and technology
roadmap to deliver lowest cost of ownership
Fastest time to market
Master certificate enables certified module
production directly after SOP, means from first
module on
5. - COMPANY CONFIDENTIAL -Page 5 May 2011
Inherent differences: Single Equipment versus End-to-End
What do you prefer?
Single
Equipm.
Single
Equipm.
Single
Equipm.
Single
Equipm.
Single
Equipm.
Single Equipm. Approach:
Differentiation
End-to-End Approach:
Standardization
Module Efficency, TüV&UL Certification
Fab Performance Parameter (TP, UT, Yi)
Single
Equipm.
Single
Equipm.
Single
Equipm.
Single
Equipm.
Single
Equipm.
Module Efficency, TüV&UL Certification
Fab Performance Parameter (TP, UT, Yi)
6. - COMPANY CONFIDENTIAL -Page 6 May 2011
KAI 1200TCO 1200 Oerlikon End-to-End
Solution
KAI MT
Awarded leading position
7. - COMPANY CONFIDENTIAL -Page 7 May 2011
Oerlikon Solar Solution: THINFAB™
Technical specification
Module out
Module Efficiency 10 % (143 Wp)
Yield 97 %
Annual Output 120 MWp / ~850‘000 modules
Module size 1.1 x 1.3 m2
Production Area 7500 m2
System Control Manufacturing Execution System
Technology Micromorph®
8. - COMPANY CONFIDENTIAL -Page 9 May 2011
Oerlikon Solar Solution: THINFAB™
Possible plant concept Thin and conclusive
gas farm area
head building
administration and offices
additional
storage area
additional
utility area
additional
utility area
gas farm area
staff
material
10. - COMPANY CONFIDENTIAL -Page 12 May 2011
Fab Development
Integration of single equipment into End-to-End THINFAB™
Layout, Configuration and Civil Construction
Line Automation
Dynamic and Static Simulation
Manufacturing Execution System
Facility Information Management
Interface to facility planer for the integration into customer’s facility
Handling Media & Electric Connections
Summarize Consumption & Requirements
Logistic aspects (storage, material supply)
Fab Engineering & Planning
11. - COMPANY CONFIDENTIAL -Page 13 May 2011
THINFAB™ Optimized Throughput and Utilization
Equipment Utilization
(Considering Downtimes and Stand-by times)
ThinFAB - PM
Revision 6
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
G
lass
Loading
InputC
leaner
ID
Laser-M
arking
AO
I
FrontC
ontactLaser#1H
Q
C
leaner
KAIM
T
Laser#2
Back
C
ontactLaser#3
LaserEdge
IsolationC
ontacting
Edge
Sealing
Backglass
Loading
Backglass
C
leaning
Foil&
Back
G
lass
Placem
entLam
inator
Edge
Trim
m
ing
Junction
Box
Setting
H
igh
Voltage
Test
FlasherELA
Potting
&
C
uring
Labelling
12. - COMPANY CONFIDENTIAL -Page 14 May 2011
Facility is everything around the
production line, facilitating the operation.
THINFAB
Gas Supply
Water
Purification
Power
Waste Water
Treatment
Ventilation
Abatement
Process
Exhaust
Module Supply Module
Distribution
Module Part
Supply
Staff & Safety
CDA Cooling
Logistics Utilities Staff & Safety
SiH4
N2
H2
NF3
DEZ
etc.
contacting material
sealant
lamination foil
junction box
etc
Electricity
~6.0 MWh/h
Water
~20 m3/h
2’300 modules/day58 t/day
THINFAB™ Facility Scheme
Cost saving with harmonised facility
13. - COMPANY CONFIDENTIAL -Page 15 May 2011
Equipment control
Equipment
Data collection
Logistic Execution
WIP, Dispatcher, Business Logic Quality
Control
SPC
Tool
Performance
OEE, Yield
Level 1:Level 1:Level 1:Level 1:
Equipment atEquipment atEquipment atEquipment at
shop floor levelshop floor levelshop floor levelshop floor level
Level 3:Level 3:Level 3:Level 3:
MES / CIM / CAMMES / CIM / CAMMES / CIM / CAMMES / CIM / CAM
ApplicationApplicationApplicationApplication
Level 4:Level 4:Level 4:Level 4:
Business PlanningBusiness PlanningBusiness PlanningBusiness Planning
Level 2:Level 2:Level 2:Level 2:
Process OptimizationProcess OptimizationProcess OptimizationProcess Optimization
Fab wide Reporting and Monitoring
ERPERPERPERP
OerlikonMES
ProductionControlPV
Oerlikon MES Production Control PV
14. - COMPANY CONFIDENTIAL -Page 17 May 2011
Yield Improvement
Uptime Improvement
Tact Time Improvement
Module Power Increase
UpgradeabilityProcess
Integration
Process Updates
Volume
Ramp-Up
Continues Fab
Optimization
Secured Invest
…due to guaranteed fab performance milestones
Equipment
Installation
82
84
86
88
90
92
94
96
98
100
End of
Ramp
Month
-1
Month
-2
Month
-3
Total Line Yield
Customer Data
Average Power Distribution
Customer Data
DistributionPmmpstab[W]
100%
- 2%
+ 2%
Avg.: 97.4%
15. - COMPANY CONFIDENTIAL -Page 18 May 2011
Move-in, Process Integration and Ramp-up
120 MWp
Move-in and
Installation
Process
Integration
Production
Ramp-up
143
130
Minimum stab.
module power
at EOR [Wp]
Average stab.
module power
at EOR [Wp]
Production Capacity
Demonstrated and
measured over one
week, 24h by 7 days
0.000
0.500
1.000
1.500
2.000
2.500
0 4 8 12 16 20 24 28 32 36 40 44 48 52 56
weeks
Output,MW/week
EORSOPRPIMVI
27 MW
16. - COMPANY CONFIDENTIAL -Page 20 May 2011
Enhanced light trapping
front contact enables
thinnest silicon absorber
layer
Thinnest laser dead zone
by most accurate high
speed production
increases efficient area
Thinning the back-end
into a simplex and more
environmental-friendly
fabrication
Thinnest layers and
maximized OEE lead
to lowest cost of
ownership
Cross functional
process optimization
leads to highest
stabilized efficiency
10% eff.
0.5€/Wp
Think Thin with Oerlikon Solar Technology
Driving down costs while gaining power and productivity
17. - COMPANY CONFIDENTIAL -Page 26 May 2011
Oerlikon Solar Micromorph Series
Product Features New Low Voltage Design
Module Type Micromorph Low Voltage
Design Glass / Glass laminate, ALL BLACK front
Panel Size 1100 x 1300 / 6.8 mm
Panel Weight 24kg
Operating Temperature -40°C … +85°C
Mechanical Load 2400 Pa
Maximum System Voltage 1000Vdc
Connectors MC-4 or Compatible
Bypass Diode Yes
Cell Type a-Si / uc-Si
Cell Interconnection1 3 sections with 55 cells each
Module Mounting Interface Silicon glued MMI (optional)
Certification2 IEC61646 / 61730, UL1703, PV Gap
1 subject to change due to further development without prior notice 2 pending
120 125 130 143 Temperature Coefficient
Pmpp [Wp] 120 125 130 143 -0.29 %/K ; γ
Voc [V] 72 73 74 73 -0.33 %/K ; α
Isc [A] 2.64 2.65 2.66 2.90 -0.07 %/K ; β
Vmpp [V] 54 55 57 58 -0.36 %/K
Impp [A] 2.23 2.26 2.30 2.47 -0.07 %/K
18. - COMPANY CONFIDENTIAL -Page 27 May 2011
2009 10 11 12 13 14 201570
90
110
130
150
170
Power(stabilized)/Watt
2009 10 11 12 13 14 2015
Champion cell
Champion module
Today
(mass production in existing fabs)
Structured glass
New Module Design
Thin layers 200/800nm
ThinFab™ process
Advanced bottom cell process 11.9%
4.9%
6.3%
7.7%
9.1%
10.5%
Efficiency
Oerlikon Solar‘s Module Power Roadmap
Key innovations
19. - COMPANY CONFIDENTIAL -Page 28 May 2011
THINFAB™ Development
in production 2012 2015
2012 2013 2014 2015
Module
Efficiency
10 %
(143 Wp)
10 %
(143 Wp)
10.5 % *
(150 Wp) *
10.5 %
(150 Wp)
Yield 97.0 % 97.0 % 97.5 % 98.0 %
Annual
Output
120 MWp 130 MWp 138 MWp 139 MWp
* Efficiency improvement requires additional investment for improved KAI reactors
20. - COMPANY CONFIDENTIAL -Page 29 May 2011
19
21
23
0
5
10
15
20
25
30
35
40
45
50
55
Euro/ Module
2013 201420122011
25
2010
26
2009
36
2008
49
Front glass
Encapsulant
White paint
Back glass
Junction box
Others
achieved
Under
qualification
Consumable Cost of Ownership development
in production 2011 2014 (Central Europe)
>50% material cost
reduction within 3 years
21. - COMPANY CONFIDENTIAL -Page 30 May 2011
181920
0
5
10
15
20
25
30
35
40
45
50
55
Euro/ Module
2014201320122011
21
2010
24
2009
36
2008
49
Back glass
Others
Junction box
White paint
Encapsulant
Front glass
>50% material cost
reduction within 3 years
Consumable Cost of Ownership development
in production 2011 2014 (China)
achieved
Under
qualification
22. - COMPANY CONFIDENTIAL -Page 34 May 2011
THINFAB™Economically Viable Solar Power with
Thin Film Silicon – NOW!
23. - COMPANY CONFIDENTIAL -Page 35 May 2011
Cost of
Ownership
Productivity
Flexibility
Investment per
Watt
Module Power
• optimized processes
• improved utilization
• improved takt times
• optimized processes
• improved module design
• upgradeability to coming
technologies
• value engineering
• less tools needed
• improved throughput
• improved module efficiency
+20 %
+15 %
-25 %
-25 %
+ +
Production Area
• reduced footprint
• minimized production
facility
-25 %
Key Message: Making Solar Power economically viable!
Improvements on THINFAB™
24. - COMPANY CONFIDENTIAL -Page 36 May 2011
Message 1:
Highly efficient modules
10% efficiency 143 Wp
Optimized processes and module design
Highest reliability
Message 2:
Lowest Cost of Ownership
CoO 0.50 EUR/Wp
CAPEX 1.00EUR/Wp
Highest productivity in THINFAB™
Message 3:
Reliable industrial
production
More than 4’000’000 modules produced
Highest equipment utilization and yield
Message 4:
Best in class Fab concept
Proven End to End solution
Minimised production footprint
Highly reliable data collection (TÜV / UL)
Summary
Key Messages THINFAB™
25. - COMPANY CONFIDENTIAL -Page 38 May 2011
Competitive
Clean
Sustainable
Three reasons to invest into THINFAB™
Thank you for your attention !