Product Engineering Company- IoT, Semiconductor & Systems. MosChip is Product Development company with over 16+ years of extensive expertise in semiconductor / systems / IoT engineering from SoC (Systems on Chip), Embedded Systems Design, Cloud and Mobile Software development catering to the Aerospace & Defence, Consumer Electronics, Automotive, Medical, Telecommunications, Mobile industries. With over 400+ Clients in 140 countries, Moschip has also put its footprint in the field of IoT, Cloud and Connected Devices domain. Driven by a positive outlook, Moschip is moving to more flexible, agile models. https://moschip.com

1. Mo schip
DREAM . INSPIRE . INNOVATE

2. Over view
MosChip is a complete Product Development company with deep engineering expertise in Chip
Design, Systems Design, Software development for IOT & Vision solutions. We have 16+ years of
proven track record with unique combination of product engineering skills, domain knowledge and
technology expertise in segments such as aerospace and defense, consumer electronics, networking
and telecommunications, mobile electronics and security etc. We help our customers to reduce
time–to-market of their products with our field proven IP’s.
Our product development experience with SOC, wireless connectivity, software, and systems
engineering allows us to be able to meet even the most complex hardware and software design
challenges. With a large pool of engineers segmented into teams with multiple engineering
disciplines, MosChip can deliver ASIC, firmware, drivers, boards, and platform solutions
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3. Awards & Recognition
Winner of “BEST PRODUCT DESIGN COMPANY IN
A&D” at DEFTRONICS awards 2016
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4. 4
Our Journey
Founded in 2000
Development 20 different
products in Connectivity
from inception
Sold 10m+ chips to
customer such as Toshiba,
Sony, IBM more
Developed SOC MCS8142
in 2010
Listed on BSE in 2001
Acquisition of controlling
stake by Techwave 2016
Key Defense Projects
awarded April 2016
Acquisition of Elite Plus,
Orange, Maven (IoT) &
Next Generation(Board)
Emerged as a strong
players in IoT
Additional $10m funding
by Promoters
YTD MosChip
valuation Growth 15x

5. Locations
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Pune Hyderabad (HQ) IND
Bengaluru
Project and Sales Offices
Design Centre, Project and Sales Office
Singapore
Maidenhead (UK)
Milpitas (USA)

6. Service & Offerings
Turnkey solutions Provider
6
MOSCHIP
“A Solution Company”
Internet of Things
IoT Enablement
Semiconductor
Development
System & FPGA
Platform Solutions
IP Development for
Vision Processing &
Deep Learning
Engineering Service
W / Strategic Customer
Engagement

7. Why MosChip ?
7
With 16+ years of
successful track record
MosChip provides a
unique combination of
product development
expertise ranging from
Chip Design to Systems
Development.
MosChip keeps up to
its clients’ vision by
developing their next
generation flagship
product lines, that are
key and rare in the
industry.
Our customer driven
approach focuses on all
facets of the product
development process,
including not only
technology, but also
time-to-market and
return on investment.
We have a large pool of
engineers segmented
into teams with multiple
engineering disciplines
namely ASIC, firmware,
drivers, boards, &
platform solutions.
Turnkey Solutions Innovation Driven Customer First Multi-Disciplined
Team

8. Product Development Lifecycle
• Design Consulting
• Product Planning
• Product Development
• Post Market Support
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9. • We will provide solution from Specification to GDSII
• Fully equipped to take end-to-end design services activities
SoC Design Expertise
Turnkey solutions Provider
9
Timing
DFT
RTL Coding Layout
Synthesis Synthesis
Specification
Architecture
Verification
Planning
Architecture
IP Verification
Soc Verification
Fabrication Test
Assembly/ Packaging
Post Silicon Services
Evaluation/Board
Testing
DESIGN VERIFICATION With Partners
FABRICATION/PACKAGING
POST
SILICON

10. (Providing services from Concept to Silicon)
SoC Design Service
• 20+ ASIC Tape outs
• First Pass Silicon Achievement
• 100% On-Time Delivery
• FPGA to ASIC Translation
• 40nm TSMCLP Design
• 28nm TSMCLP verification
• 55mn gate density largest design
Experience Summary
• Unique combination of Silicon & Systems
• Product development experience
• Outstanding Processes, templates, structures &
checklist for scaling up
• Robust Internal Design Flows
• Low Power Design Expertise
• In-house developed reusable Cores (USB2.0 & 3.0)
• Early adopters of advanced ASIC Verification methodologies
like VMM, OVM & UVM.
• Developed Scalable, Configurable, & Reusable
Verification test bench
• Large Designs Exposure
• Analog/Mixed Signal Expertise
• Power Optimization Experience
• Yield Enhancement Services
Key Differentiators
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11. (Targeted For TSMC 40nm Low Power )
Case Study : Shikhara Soc
Shikhara SoC Features:
• ARM cortex A9 dual core processor
with NEON VFPU
• Trust Zone Support for ARM.
• ADB400 for Power Management.
• ARC processor based AV417 Video Subsystem
& Bluetooth Subsystem.
• MALI-400 - OPEN GL 2.0 & OPEN VG 1.1 GPU
• Over 250Million Transistors
Firmware Development
• iBoot (Internal Boot Code Development).
• UBoot Boot loader development.
• Development of controller drivers
• Linux BSP development.
• Linux Root file system development
• Development of Test Applications to validate BT,
Video, GPU, Camera and Display subsystem.
• Developed Shikhara architecture, design document
for controller driver, etc.
ASIC Development For Shikhara
SoC
• Specifications to Silicon
• System Integration, Synthesis and Verification.
• Verification environment development using C,
Assembly and VMM/UVM.
• The debug and Trace Capability to cover entire SoC.
• Perform Power aware DFT and ATPG generation.
• Development of FPGA platform for system level verification.
Physical design and verification.
• Development of Load Board and Test Software
(To Test SoC on ATE).
• Wafer Fabrication, packaging, assembly and testing
(Using CMOS 40nm LP).
• Development of Evaluation board and board support package
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12. High Definition Camera SoC Verification
Case Study
12
Customer: US Based Company Verification of H.264 IP High
Definition Camera SoC
Services / Solution: System Verilog & C
Language: Tensilica 233L, Tensilica 330HiFi
Processors: IUS9.2
Tools
Understand IP Specification
& Design Architecture
Documents
Prepare Verification
Environment Documents
Implementation
Execution & Start us Report
DUT (IP & SoC)
H . 264 encoder, RGMII,
SDMMC / SDIO, USB2.0 OTG,
GPIO, SPI, PWM, 12C, 12S, UART
Verification Architecture &
Test plan Documents
Implementation of
Verification Architecture &
Test Cases (in SV & .C)
Fictional Verification
Sign – off on RTL

13. High Definition Camera SoC Verification
Case Study
13
• Adhering strict timelines to ensure time to market.
• Target to achieve 100% functional and code coverage on H.264 IP verification.
Business
Need
Scope
Challenges
Business
Benefits
• H.264 Encoder IP and SoC verification using System
Verilog and C
H.264 Encoder IP Verification
• Verification environment development using System Verilog
• Verification IPs development and test cases implementation in System Verilog
• Coverage-driven and Constrained-Random Verification
• Code and functional coverage analysis
SoC Verification
• Verification environment development for all the peripherals in System Verilog.
• Implementation of test cases in C. Automate the verification environment using
PERL Scripting.
H.264 IP and SoC RTL verification sign off
• Developed reusable verification environment for all the peripherals which
can be ported on IP and SoC
• H.264 IP validated thoroughly at IP level which reduced verification
time at system level.
• Multiple teams working in parallel at different geographical locations to speed up the project
execution and to reduce the cost.

14. System/Board Design Services
• PCB Designs of up-to 24 layers
• 250+ System designs of varied complexity
• High Density Interconnect (HDI) designs
• Handling 0.8mm pitch BGAs
• Design using Buried & Blind vias
• Impedance controlled and high speed designs
• Signal Integrity, Power Integrity & Thermal Analysis
• Dedicated resources for Schematic design, PCB design / Signal Integrity,
Component assembly & Testing
• Full support PCB Manufacturing, components Assembly and equipment
EDA Tools : Cadence & Mentor Graphics For
• Schematic Capture, PCB layout
• Signal Integrity, Power Integrity & Thermal Analysis
• Expertise in Multilayer Complex board designs
• Rich experience in High Speed Mixed signal designs
(Analog, Digital & RF)
• Schematic Capturing & Component Library creation
• Signal & Power Integrity
• Reengineering
• High first time success rate
• Component Assembly
• Board bring up and testing
• System Debug
(Leveraging product development to custom engineering
services)
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Board Design Capabilities System Design

15. System Engineering
• High Density FPGA based design
• Soft Processor Integration
• IP Development & Integration
• Reference Design Development
• RTL Design & Synthesis
• Verification & Validation
• Hardware/Software Partitioning
• Test bench Generation
• Low power designs
• ASIC Prototyping
• Handling of High-end FPGAs
• Xilinx: Virtex-II Pro, Virtex-4/5/6, Virtex-7,
Spartan, ARTIX, ZYNQ
• Altera: Cyclone-II/III, Stratix-III/IV
FPGA Families - Xilinx & Altera Series
• Single and Multi Clock Domain Logic
• Frequencies up to 500MHz
• PLL, DLL an DCM
Soft Processor - ARM, NIOS, MicroBlaze & Power PC
Processor interfaces - AMBA AXI, AHB, APB, VCI, etc.
Bus Interfaces
• USB 2.0/3.0, OTG, PCIe Gen 1/2/3, PCI, ISA,
• Ethernet(10/100/1000), TCP offload Engines
• RGMII, MII SATA, PATA, SDIO, FireWire, IrDA, CAN, I2C,
SPI, …
Audio/Video Interfaces - Codecs AC97, I2S, CSI, LVDS, Video
ADC & DAC, HDMI, LCD, DSI, BT656,
Memory interfaces
• SDRAM, DDR/2/3, LPDDR
• Flash (SPI & Parallel) CFD, SD Card, MMC …
• Wireless - WIFI 802.11 b/g/n, ZigBee, Bluetooth
• Voltage Levels - LVPECL, LVDS, LVCMOS, LVTTL
• Operating voltages
• 1v to 5v
• Storage Security: IEEE-P1619 compliant XTS-AES
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FPGA Design Capabilities Domain Expertise

16. Embedded Software Services...
• OS Porting & Board Support
Package (BSP)
• Device Drivers – Bare metal, OS
• ARM, freeScale, TI, Samsung,
Qualcomm
• Multimedia Middleware
Components
• Display/Video/Audio controllers
• Audio/Video CODECs
• 3rd Party IP, Application
Integration
• System Integration & Validation
• Benchmark, Compliance Testing
• Product Development /
Customization
ASSP SW Development, Board Support Packages
Boot loaders, OS/ Kernel Bring up, Porting
• Linux, VxWorks
• Android, Windows
Device Drivers
• DMA, I2C, I2S, McBSP, UART (HS/FS)
• MMC/SD, SPI, eMMC, SDIO
• Touch Screen, LCD/LVDS
• NAND, NOR
• A/V, HDMI, MIPI DSI/CSI
• USB, WLAN, IrDA
• Ethernet, BT, PCI, PCIe
• Multimedia (Audio, Video)
Power on Diagnostic, Power management
Multi-Media Framework Dev & Porting
Embedded Software
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Platform Development (BSP)

17. Testing Expertise Summary
• Creation of Test Strategy
• Creating Test Plan
• Test Case Design
• Prepare and maintain Test
Coverage/Specification documents
• Test Case Execution
• Defect Identification, Analysis & Fixing
• Communication written/oral
• Defect reporting & tracking
• Detailed Test Summary report creation
• Covering silicon, systems, embedded
software and OS
Types of Testing
• System integration and
validation
• BSP Validation
• Benchmark testing
• Functional Testing
• Performance Testing
• Load/Stress Testing
• Reliability testing
• Compliance Testing
• Compatibility Testing
• Interoperability Testing
• Integration & Regression
Testing
• UI Testing
• Environmental Stress Testing
Automation Framework Development
Test Suite Automation using
• C
• Shell Scripting
• Perl Scripting
• Python Scripting
Areas
• Software Device Drivers Testing
• Embedded Application Testing
Connectivity Testing
• PCI/PCIe, Ethernet/ Serial / Parallel /
USB/I2C /SPI/I2S
Network Testing
• Network Protocols (TCP/IP Suite, Wi-Fi,
ZigBee, Bluetooth),
Storage Testing
• Testing of Storage Controllers like (SATA,
NAND etc.)
• Consumer Network Storage solutions like
NAS, iSCSI, AoE etc.)
• POS, Digital Signage etc.
Areas of Testing ExpertiseTest Automation
Testing Expertise…
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18. (One Virtex – 7 FPGA & One ZYNQ – 7045 SoC)
Shikhara FPGA Platform
Key PCB Information :
• Board Size: 11” x 12”
• Layer Count : 16-Layered
• Component Count: 2388
• Signal Nets Count: 8929
• Virtex-7 FPGA pin Count # 1925
• ZYNQ-7045 SoC pin Count# 900
Operating Frequency:
• Memory @1.067GT per second
• GTX links @6.25Gbps
• USB3.0 PIPE: 16bit@250MHz
Critical Interfaces:
• DDR3 SDRAM, USB3.0
• Gigabit Ethernet, GTX-Serial Link
Interface
• SMC, CSI-DSI, HDMI, AUDIO
• High-Speed SI SAMTEC connectors
Wireless Supported:
• Bluetooth
• GPS/GNSS
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19. (Based on CAM LINK Data - Appliance Processor)
Case Study - Face Recognition System
26-pin Miniature Delta Ribbon connector (MDR-26)
RECONFIGURABLE FACE RECOGNITION PLATFORMKey PCB Information :
• Board Size: 216 x 215 mm
• Layer Count: 16 – Layered
• Component Count: 1706
• Signal Nets Count: 1265
• 2# Virtex - 6 FPGA pin Count: 1156
• 1# Virtex - 5 FPGA Pin Count: 1738
Operating Freq:
• CAMLINK LVDS: 2GHz
• GTX link: 3.125GHz
Critical Interfaces:
• DDR3 SDRAM
• USB2.0 Host
• Gigabit Ethernet
• GTX – Serial Link Interface
• CAMLINK
19

20. (Common Processor Board & Chassis)
Case Study - OCTOPUS
20

21. Vision Related Core Competency and building
more…
Algorithm, Architecture, Camera Domain Expertise
Delivered Multiple Generations of Imaging & Video
Solutions
Tremendous Customer History, Market Engagements
Multiple Generations of Products
Delivered in Previous Companies
• Delivered volume prod to mobile, activity,
surveillance, dental and others
• Developed roadmap for products,
multiple generations outlook
Engaged with Major Customers
From Concept to Production
• Standard products delivered to customers
around the world
• Custom product with strategic partner
Expertise in Camera Domain
• Advanced algorithms implemented
• Silicon & software architecture delivered
• Multiple markets addressed: activity;
surveillance; DSLR/DSMC; embedded
21

22. IoT & Services...
End to End Offering
Hardware Boards
& Modules
From Sensor
Network
Custom Devices &
Systems
Scalable Cloud
Platform
Value Added
Software & Services
Collect & aggregate
data in gateways &
Smartphones
IoT / M2M Platforms
Ready for Connecting
Large Numbers of Nodes
Smartphone apps,
alerts , Data
Analytics
Vertical
Application
Solutions
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23. IoT & Services...
M2M / IoT “ enablers & accelerators”
Real – Time Data Transfer + Storage
Remote
over-the-air
Firmware
Upgrade
Alerting
Alarming
Mechanism
Remote
Configuration
Application
Specific
Reporting &
Data
Analysis
Remote
Diagnostics
& Health Check
WSN
IoT Node WNS = Wireless
Sensor Node
Quickly Customize Solutions
For New Domains Reduced
Time to Market Using the
M2M / IoT Accelerators !
Cloud Connectivity
(Cellular / WiFi / Ethernet
Application Specification
Intelligence
Local Data Handler
& Storage
Sensor/Actuator
Interface
Device Protocol
Interface
M2M Node
Application Specification
Node Intelligence
Local Data Handler
& Storage
Sensor/Actuator
Interface
Device Protocol
Interface
WSN
(Zigbee / WiFi / BT Sub 1GHz
Mesh)
WSN
Application Specification
Intelligence
Local Data Handler
& Storage
DCU / Gateway
Cloud Connectivity
(Cellular / WiFi / Ethernet
WSN (Zigbee / WiFi / BT Sub
1 GHz Mesh)
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24. IoT Solutions Offering
Street lighting Sub metering Solar/wind mills Heavy equipment School buses
Township automation
Residential
metering
Sales force
monitoring
Employee buses
/cabs
Offshore platforms Commercial vehicles Diesel generators
Underground
mining
Commercial lighting
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25. Asset Monitoring
Vehicle
Monitoring
Smart Metering SolutionsSmart Lighting Solutions
Diesel Generator
Monitoring
Wearable Devices
Remote Monitoring Solutions
25

26. Market Verticals Covered
Aerospace &
Defense
IoT, Cloud &
Connected Devices
Security Surveillance &
Access Control
Semiconductor
Medical DevicesHome &
Industrial Automation
Transport & Logistic Retail
Medical CommunicationAutomation Network & Telecom Consumer Electronics
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27. Engineering Team
INDIA : 248
USA : 18
UK / EUROPE : 10
ASIC/FPGA
(83 Engineers)
Design, Verification,
Synthesis & STA
IoT & platform
(60 Engineers)
Design, Software
& Support
Board Design, Layout
Testing (58 Engineers)
Design, Layout
& Testing
SOFTWERE
(48 Engineers)
BSP, Linux, Driver
development & Testing
Total : 276
ENGINEERS
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28. MosChip
EDA & Languages
• Cadence IUS
• Synopsys VCS-MX, MVSIM, MVRC
• Synopsis–DC for synthesis, Prime Time for STA
• Surelint by Verisity for Linting
• Cadence-ICCR – Code coverage
• Cadence simulator – NcVerilog
• Xilinx ISE for FPGA validation
• Synplicity for FPGA Synthesis
• Xilinx Vivado
• Altera Quartus for FPGA synthesis
• ARM tools – DS5, DSTREAM etc.
• Verilog, System Verilog & VHDL
• Shell, PERL, PYTHON & TCL Scripting
EDA Tools Expertise (Development & Testing)
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29. Ecosystem Partners
29

30. • Unique Combination of Silicon and Systems
• Product Development Experience
• Outstanding Process, Structures and checklist for scaling up
• We uniquely combine business dynamics with technology, very few companies have this combination
• Grown up with the methodologies
• Pioneered and deployed several traditional and advanced Digital, MS and LP methodologies.
• Several years of hands on experience in developing modular based traditional and advanced verification environments.
• Developed and Integrated several Verification IPs – elite + engineers know what takes to develop a good VIP, which integrates smoothly into
the Verification environment.
Proven Track Record in..
• Deploying several these methodologies in industry leading companies.
• Claimed several FIRST-PASS verification success.
• Trusted verification eyes to develop your standards, protocols, and test infrastructures,
• whilst product companies focus on their designs and development.
• Cost effective and High Quality Engineering Services.
• Go-to centre of excellence where results really matter.
Why MosChip?
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31. INDIA
Hyderabad (Headquarters)
Plot # 83 & 84
Punnaiah Plaza, 2nd Floor
Banjara Hills
Hyderabad – 500034
Tel: +91-40-6622-9242
Fax: +91-40-6622-9393
Milpitas
840 N. Hillview Drive
Milpitas
California 95035
Tel: 408-737-7141
Fax: (408) 737-7708
MosChip-Semiconductor
www.moschip.com
Moschip Semiconductor Technology Ltd
Bangalore (at HSR Layout)
991 & 992,
2nd floor, 5th main,
7th sector, HSR Layout,
Bangalore – 560 102
Tel: +91 80 25722427
Fax: +91 80 25722427
Bangalore (at Koramangala)
13/36,
3rd cross, Venkatareddy Layout,
80 Feet road, Koramangala,
Bangalore - 560095
Ph: +91 80 41603939
Fax: +91 80 41603939
Pune
"Govind",
7 C Shri Ganesh krupa society
S No 91/1, Kothrud, Off Paud road,
Pune 411038
Ph: +91 20 2539 6775
Fax: + 91 20 2539 6775
USA
Maidenhead
4 Havelock Road
Maidenhead
UK SL65BJ
Tel: +44 (0) 3301137863
Fax: +44 (0) 3301137863
UK
Official Locations
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32. Thank you
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