soc seminar

1. Seminar Report on System on Chips
By
D. Venkatesh(Y09EI017)
B. Vamsi Satwik(Y09Ei007)
V. Santosh(Y09EI055)
Ch. Apparao(Y09EI003)
(IV/IV B.Tech, EIE)
Project Batch No:09
Project Guide: Mr. G. Jalalu
Assoc. Professor

2. Introduction to SoC

3. Introduction
 Technological Advances
 today’s chip can contains 100M transistors .
 transistor gate lengths are now in term of nano meters .
 The number of transistors is based on Moore’s law .
 The Consequences
 components connected on a Printed Circuit Board can now
be integrated onto single chip .
 hence the development of System-On-Chip design .

4. SoC: System on Chip
 System
A collection of all kinds of components and/or subsystems
that are appropriately interconnected to perform the
specified functions for end users.
 A SoC design is a “product creation process”
which
 Starts at identifying the end-user needs (or system)
 Hardware
 Software
 Ends at delivering a product with enough functional
satisfaction to overcome the payment from the end-user

5. What is SoC ?
 The VLSI manufacturing technology
advances has made possible to put
millions of transistors on a single chip.
 It enables designers to put systems-on-a-
chip that move everything from the board
onto the chip eventually.

6.  SoC not only chip, but more on “system”.
 SoC = Chip + Software + Integration
 The SoC chip includes:
 Embedded processor
 ASIC Logics and analog circuitry
 Embedded memory
 The SoC Software includes:

OS, compiler, simulator, firmware, driver, protoco
l stackIntegrated development environment
(debugger, linker, ICE)Application interface

7. What is SoC in your mind?
Definition: integration of a complete system
onto a single IC

8. SoC Evolution
First phase Second phase Third phase

9. Example: Mobile Phone
Yesterday Today
Single Chip
Flash • 5~8
Memory Processors
• Memory
DSP • Graphics
• Bluetooth
Radio • GPS
• Radio
• WLAN
Processor
 Voice only; 2 processors  Voice, data, video, SMS
 4 year product life cycle  <12 month product life cycle
 Short talk time  Lower power; longer talk time

10. Where SoC Goes To?

11. SOC Complexity / Abstraction
Yesterday Today
•Processor-centric (1 or 2) •Many processing units
•Simple I/O •Large amount of I/O
•Manageable Complexity •Overwhelming Complexity!

12. Material Preparation
 First stage.
 Ordinary sand to pure
Si crystals.
 Here the sand with
high silica content is
exposed to high
temperature ,where
the silica is turned
into crystals

13. Silicon rod preparation
 Si crystals collected
in chamber.
 Crystals converted
into perfectly shaped
rods with the help of
moulds.
 This is done at high
temperatures.

14. Wafer Fabrication
 2nd stage.
 Si rod sliced into this
discs with great
accuracy called wafer.
 Each disc is few mm
in thickness.
 Each wafer will grow
100’s of transistors.

15. lithography
 This is the most
important technique.
 Si wafers are coated
with Light sensitive
photo sensitive
material.
 These this disk’s are
then exposed to U.V
rays.

16.  The exposed parts are
soluble.
 This soluble part is
removed by cleaning
with fluid.

17. Etching
 Acids are applied.
 The unprotected
parts are etched away.
 Tiny structures of
billions of small
switches are
generated which acts
as Transistors.

18.  Several billions of
transistors are
generated and
connected forming
several 100’s of chip
on a single wafer.

19. Testing
 Tests each chip for
manufacturing
defects.
 For early identification
and elimination of
defective parts.
 Reduces assembly
cost.

20. Laser cutting
 Wafer then sliced into
several small
individual
components called
chips
 Each part sent to
packaging unit

21. Assembling of chips
 Each chip is
assembled as per
requirement.

22. Major SoC Applications
 Speech Signal Processing .
 Image and Video Signal Processing .
 Information Technologies
 PC interface (USB, PCI,PCI-Express, IDE,..etc)
Computer peripheries (printer control, LCD monitor
controller, DVD controller,.etc) .
 Data Communication
 Wireline Communication: 10/100 Based-T, xDSL, Gigabit
Ethernet,.. Etc
 Wireless communication:
BlueTooth, WLAN, 2G/3G/4G, WiMax, UWB, …,etc

23. The Benefits
• There are several benefits in integrating a large
digital system into a single integrated circuit .
• These include
– Lower cost per gate .
– Lower power consumption .
– Faster circuit operation .
– More reliable implementation .
– Smaller physical size .
– Greater design security .