Se ha denunciado esta presentación.
Utilizamos tu perfil de LinkedIn y tus datos de actividad para personalizar los anuncios y mostrarte publicidad más relevante. Puedes cambiar tus preferencias de publicidad en cualquier momento.

DIGITAL LIGHT PROCESSING (DIP)

2.985 visualizaciones

Publicado el

DIGITAL LIGHT PROCESSING(DIP)

Publicado en: Ingeniería
  • Sé el primero en comentar

DIGITAL LIGHT PROCESSING (DIP)

  1. 1. PRESENTED BY, D.KIRUBASANKAR S.MOHAN
  2. 2. Contents:  Introduction  Basic components in DLP  Working of DLP  Advantages  Applications
  3. 3. Introduction  DLP-Digital Light Processing  Invented by DR.LARRY HORNBECK in 1987  Made by semiconductor material  It consist of One or Three chips methods  It is used in video projector
  4. 4. Basic components of DLP  DMD chip (Digital Micromirror Device)  Light source  They are two methods  One chip system  Three chip system
  5. 5. One chip system  Passes the light to chip(color wheel)
  6. 6. Three chip system  Light passes through prism
  7. 7. DMD chip  It is a semiconductor material  It is core components,miscroscopic mirror  Matrix of micro mirrors 1024 X 768mm  Size of the mirrors: 16 X 16 um
  8. 8. Light source  High power LEDs or LASER source is used  It contain high pressure xenon arc lamp LED based  Ordinary LEDs doesn’t produce intensity LASER based • The first commercially LASER based DLP was introduced in 2008
  9. 9. Working of DLP  3-D printing process  Photopolymer resin.  Compare to stereo lithography DLP have much speed  Withstand the tensions and mechanical movement  High intensity LED’s are used
  10. 10. contd..  Depending on the application DLP system accept either digital or analogue signal.
  11. 11. Advantages  Less maintenance than LCD  Low power consumption  All digital display from DLP chip  It is more reliable
  12. 12. Disadvantages  Some device contain noise  Viewer may have eye strain, headache and migraines.
  13. 13. Applications  DLP projectors  Holographic Data Storage  Printed Circuit Board (PCB) Manufacturing  Print Setting  Telephone lines
  14. 14. Future uses of DLP  High definition image creation  3D visual display

×