SlideShare a Scribd company logo
1 of 39
Download to read offline
Physical Vapor
Deposition
Physical Vapor Deposition
Introduction
 For all devices, there is a need to go from semiconductor to
metal. Thus we need a means to deposit metals.
 Many of these techniques used for metal deposition can be
used to deposit other materials as well.
 Several methods are currently used for deposition of
metal layers.
 One of the method is Physical Vapor Deposition (PVD)
Physical Vapor Deposition
 Physical vapor deposition (PVD) is a variety of vacuum
deposition and is a general term used to describe any of a
variety of methods to deposit thin films by the
condensation of a vaporized form of the material onto
various surfaces (e.g., onto semiconductor wafers).
 The coating method involves purely physical processes
such as high temperature vacuum evaporation or plasma
sputter bombardment rather than involving a chemical
reaction at the surface to be coated as in chemical vapor
deposition
Physical Vapor Deposition
 Physical Vapor Deposition techniques (PVD)
1.) Evaporation
2.) Sputtering
3.) Electron beam physical vapor deposition
4.) Cathodic arc deposition
5.) Pulsed laser deposition
Physical Vapor Deposition
(evaporation & sputtering)
1.) Evaporation:
 Evaporation is based on the concept that there exists
a finite “vapor pressure” above any material.
 The material either sublimes (direct solid to vapor
transition) or evaporates (liquid to vapor transition).
Physical Vapor Deposition
 Evaporation Step Coverage
 The step coverage of evaporated films is poor
due to the directional nature of the evaporated
material (shadowing) (see figure 12-5).
 Heating (resulting in surface diffusion) and rotating
the substrates (minimizing the shadowing) help with
the step coverage problem.
 But evaporation cannot form continuous films for
aspect ratios (AR=step height/step width or diameter)
greater than 1.
 We need a less directional metalization
scheme====> Higher pressures!
Physical Vapor Deposition
Evaporation Step Coverage
Physical Vapor Deposition
Physical Vapor Deposition
• Evaporation:
Advantages:
 highest purity (Good for Schottky contacts)
due to low pressures.
Disadvantages:
 Poor step coverage.
 forming alloys can be difficult.
 lower throughput due to low vacuum.
Physical Vapor Deposition
2. Sputtering
 A plasma at higher pressure is used to “knock”
metal atoms out of a “target”.
 These energetic atoms deposit on a wafer
located near the target.
 The higher pressure produces better step
coverage due to more random angled delivery.
 The excess energy of the ions also aids in
increasing the surface mobility
(movement of atoms on the surface).
Physical Vapor Deposition
• Sputtering
Physical Vapor Deposition
• Film Morphology
• Deposited films can be: (See 12-20).
1.) Porous and/or Amorphous —> Results from poor
surface mobility =low temperature, low ion energy (low
RF power/DC bias or higher pressures=less acceleration
between collisions).
2.) “T-zone”: Small grain polycrystalline, dense, smooth and
high reflectance (the sweet spot for most processes)
Results from higher surface mobility =higher temperature
or ion energy
Sputtering
Physical Vapor Deposition
3. Further increases in surface mobility result in columnar
grains that have rough surfaces. These rough
surfaces lead to poor coverage in later steps.
4. Still further increases in surface mobility result in large
(non-columnar) grains. These grains can be good for
diffusion barriers (less grain boundary diffusion due to
fewer grains) but pose problems for lithography due to
light scatter off of large grains, and tend to be more rigid
leading to more failures in electrical lines.
Sputtering
Physical Vapor Deposition
Sputtering
Film Morphology
Physical Vapor Deposition
Film stress:
Film stress can result in wafer bowing (problems
with lithography), film cracking or peeling.
There is 2 kinds of films stress:
1. Extrinsic Stress
Forces acting on the wafer due to sources external to
the deposited film.
Example: Thermal induced stress:
Sputtering
Physical Vapor Deposition
2.) Intrinsic Stress
 forces acting on the wafer due to sources
internal to the deposited film
 These can be differences in atomic
spacing, variations in grain orientation or
size, grain growth deposition, and even
implanted or trapped gaseous impurities
such as argon.
 These depend strongly on the deposition
conditions.
 Both of these stresses can lead to a
bowed wafer with deflection δ defined in
figure 12-28.
Sputtering
Physical Vapor Deposition
Sputtering
Self Aligned Process Multi-Level Metalization
Physical Vapor Deposition
Sputtering
Advantages:
 Better step coverage.
 less radiation damage than E-beam evaporation.
 easier to deposit alloys.
Disadvantages:
 Some plasma damage including implanted argon.
 Good for ohmics, not Schottky diodes.
Physical Vapor Deposition
Electron beam physical vapor deposition
 Electron Beam Physical Vapor Deposition or EBPVD is
a form of physical vapor deposition in which a target
anode is bombarded with an electron beam given off
by a charged tungsten filament under high vacuum.
 The electron beam causes atoms from the target to
transform into the gaseous phase.
 These atoms then precipitate into solid form, coating
everything in the vacuum chamber with a thin layer
of the anode material
PPT 2.ppt
Physical Vapor Deposition
 In an EBPVD system, the deposition chamber is evacuated
to a pressure of 10-4 Torr.
 The material to be evaporated is in the form of ingots.
There are as many as six electron guns, each having a
power from few tens to hundreds of kW.
 Electron beams can be generated by thermionic emission,
field emission or the anodic arc method. The generated
electron beam is accelerated to a high kinetic energy and
focused towards the ingot.
 When the accelerating voltage is between 20 kV – 25 kV
and the beam current is a few amperes, 85% of the kinetic
energy of the electrons is converted into thermal energy as
the beam bombards the surface of the ingot.
Physical Vapor Deposition
 The surface temperature of the ingot increases resulting in
the formation of a liquid melt. Although some of incident
electron energy is lost in the excitation of X-rays and
secondary emission, the liquid ingot material evaporates
under vacuum.
 The ingot itself is enclosed in a copper crucible, which is
cooled by water circulation. The level of molten liquid pool
on the surface of the ingot is kept constant by vertical
displacement of the ingot. The number of ingot feeders
depends upon the material to be deposited. The
evaporation rate may be of the order of 10-2 g/cm2 sec
Physical Vapor Deposition
Electron beam physical vapor deposition
Advantages :
 The deposition rate in this process can be as low
as 1 nm per minute to as high as few micrometers
per minute.
 The material utilization efficiency is high relative to
other methods and the process offers structural and
morphological control of films.
 Due to the very high deposition rate, this process
has potential industrial application for wear resistant
and thermal barrier coatings in aerospace industries,
hard coatings for cutting and tool industries, and
electronic and optical films for semiconductor
industries
Physical Vapor Deposition
Electron beam physical vapor deposition
Disadvantages
 The translational and rotational motion of the shaft helps
for coating the outer surface of complex geometries, but
this process cannot be used to coat the inner surface of
complex geometries.
 Another potential problem is that filament degradation in
the electron gun results in a non-uniform evaporation rate
 EBPVD is a line-of-sight of deposition process.
Physical Vapor Deposition
Pulsed laser deposition
 Thin film deposition (specifically a physical vapor
deposition, PVD) technique where a high power
pulsed laser beam is focused inside a vacuum
chamber to strike a target of the desired
composition.
 Material is then vaporized from the target and
deposited as a thin film on a substrate, such as a
silicon wafer facing the target.
 This process can occur in ultra high vacuum or in the
presence of a background gas, such as oxygen which
is commonly used when depositing oxides to fully
oxygenate the deposited films.
Physical Vapor Deposition
Pulsed laser deposition
 When the laser pulse is absorbed by the target, energy is
first converted to electronic excitation and then into
thermal, chemical and mechanical energy resulting in
evaporation, ablation, plasma formation and even
exfoliation .
 The ejected species expand into the surrounding vacuum
in the form of a plume containing many energetic species
including atoms, molecules, electrons, ions, clusters,
particulates and molten globules, before depositing on the
typically hot substrate.
Physical Vapor Deposition
Pulsed laser deposition
The process of PLD can generally be divided into four stages:
 Laser ablation of the target material and creation of a
plasma
 Dynamic of the plasma
 Deposition of the ablation material on the substrate
 Nucleation and growth of the film on the substrate surface
Physical Vapor Deposition
Cathodic Arc Deposition
 Cathodic arc deposition is a kind of ion beam deposition
where an electrical arc is created that literally blasts ions
from the cathode.
 It is actively used among the community of the coaters of
thin hard-film coatings to synthesize extremely hard film to
protect the surface of cutting tools and extend their life
significantly.
 A wide variety of thin hard-film and nanocomposite
coatings can be synthesized by this technology: TiN, TiAlN,
CrN, ZrN, TiAlSiN,
Physical Vapor Deposition
Cathodic Arc Deposition
 This is also used quite extensively particularly for carbon
ion deposition to create diamond-like carbon films.
 Because the ions are blasted from the surface ballistically,
it is common for not only single atoms, but larger clusters
of atoms to be ejected.
 Thus, this kind of system requires a filter to remove atom
clusters from the beam before deposition.
 The DLC film from filtered-arc contains extremely high
percentage of sp3 diamond which is known as tetrahedral
amorphous carbon, or ta-C.
Physical Vapor Deposition
EQUIPMENTS
Physical Vapor Deposition
EQUIPMENTS
Physical Vapor Deposition
EQUIPMENTS
Physical Vapor Deposition
EQUIPMENTS
Physical Vapor Deposition
Physical Vapor Deposition
Physical Vapor Deposition
some of applications
Physical Vapor Deposition
some of applications
Physical Vapor Deposition
some of applications
 Conductive Silicone
Rubber dispensed
directly onto housing
 Low cost
 Applications
 Mobile Phone
 PDA
 Portable electronics
 Base Station
Physical Vapor Deposition
some of applications

More Related Content

What's hot

Lithography and Nanolithography
Lithography and NanolithographyLithography and Nanolithography
Lithography and NanolithographySaheem Anwar
 
Electron beam lithography
Electron beam lithographyElectron beam lithography
Electron beam lithographypaneliya sagar
 
Dip coating and ed
Dip coating and edDip coating and ed
Dip coating and edpreet yadav
 
Thin_Film_Technology_introduction[1]
Thin_Film_Technology_introduction[1]Thin_Film_Technology_introduction[1]
Thin_Film_Technology_introduction[1]Milan Van Bree
 
Sol gel coating
Sol gel coatingSol gel coating
Sol gel coatingengrktk
 
Photocatalytic Performance of TiO2 as a Catalyst
Photocatalytic Performance of TiO2 as a CatalystPhotocatalytic Performance of TiO2 as a Catalyst
Photocatalytic Performance of TiO2 as a Catalystmaamirazam
 
Chemical Vapour Deposition
Chemical Vapour DepositionChemical Vapour Deposition
Chemical Vapour Depositionaroosa khan
 
Silicon Manufacturing
Silicon ManufacturingSilicon Manufacturing
Silicon ManufacturingAJAL A J
 
Electroless Nickle Plating Process
Electroless Nickle Plating ProcessElectroless Nickle Plating Process
Electroless Nickle Plating Processgrowelindia1
 
Thin film fabrication using thermal evaporation
Thin film fabrication using thermal evaporationThin film fabrication using thermal evaporation
Thin film fabrication using thermal evaporationUdhayasuriyan V
 
Sol- Gel Technology
Sol- Gel TechnologySol- Gel Technology
Sol- Gel TechnologySruthi R
 
Different types of corrosion
Different types of corrosionDifferent types of corrosion
Different types of corrosionsourabhrana21
 
DLC coatings for tribological applications
DLC coatings for tribological applications DLC coatings for tribological applications
DLC coatings for tribological applications Koushik Kosanam
 

What's hot (20)

Oxidation--ABU SYED KUET
Oxidation--ABU SYED KUETOxidation--ABU SYED KUET
Oxidation--ABU SYED KUET
 
Galvanic corrosion
Galvanic corrosionGalvanic corrosion
Galvanic corrosion
 
Lithography and Nanolithography
Lithography and NanolithographyLithography and Nanolithography
Lithography and Nanolithography
 
Electron beam lithography
Electron beam lithographyElectron beam lithography
Electron beam lithography
 
Dip coating and ed
Dip coating and edDip coating and ed
Dip coating and ed
 
Thin_Film_Technology_introduction[1]
Thin_Film_Technology_introduction[1]Thin_Film_Technology_introduction[1]
Thin_Film_Technology_introduction[1]
 
Sol gel coating
Sol gel coatingSol gel coating
Sol gel coating
 
Refining Slags.pptx
Refining Slags.pptxRefining Slags.pptx
Refining Slags.pptx
 
Physical Vapour Deposition
Physical Vapour DepositionPhysical Vapour Deposition
Physical Vapour Deposition
 
Photocatalytic Performance of TiO2 as a Catalyst
Photocatalytic Performance of TiO2 as a CatalystPhotocatalytic Performance of TiO2 as a Catalyst
Photocatalytic Performance of TiO2 as a Catalyst
 
Chemical Vapour Deposition
Chemical Vapour DepositionChemical Vapour Deposition
Chemical Vapour Deposition
 
Silicon Manufacturing
Silicon ManufacturingSilicon Manufacturing
Silicon Manufacturing
 
Electroless Nickle Plating Process
Electroless Nickle Plating ProcessElectroless Nickle Plating Process
Electroless Nickle Plating Process
 
Physical vapor deposition
Physical vapor depositionPhysical vapor deposition
Physical vapor deposition
 
Thin film fabrication using thermal evaporation
Thin film fabrication using thermal evaporationThin film fabrication using thermal evaporation
Thin film fabrication using thermal evaporation
 
Sol- Gel Technology
Sol- Gel TechnologySol- Gel Technology
Sol- Gel Technology
 
PVD,CVD,AFM.ppt
PVD,CVD,AFM.pptPVD,CVD,AFM.ppt
PVD,CVD,AFM.ppt
 
Different types of corrosion
Different types of corrosionDifferent types of corrosion
Different types of corrosion
 
Chemical vapour deposition
Chemical vapour depositionChemical vapour deposition
Chemical vapour deposition
 
DLC coatings for tribological applications
DLC coatings for tribological applications DLC coatings for tribological applications
DLC coatings for tribological applications
 

Similar to PPT 2.ppt

Advanced_Coating.pptx
Advanced_Coating.pptxAdvanced_Coating.pptx
Advanced_Coating.pptxJiaJunWang17
 
High speed semiconductor devices ppt
High speed semiconductor devices pptHigh speed semiconductor devices ppt
High speed semiconductor devices pptBalajiG107
 
Enmater Final Ppt
Enmater Final PptEnmater Final Ppt
Enmater Final Pptenmaterppt
 
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.Toru Hara
 
Mse phd lecture
Mse phd lectureMse phd lecture
Mse phd lectureToru Hara
 
Pulsed Laser Ablation
Pulsed Laser AblationPulsed Laser Ablation
Pulsed Laser AblationArun Aravind
 
Metallization
Metallization Metallization
Metallization GKGanesh2
 
Thinfilms and nanomaterials_Modified October 2020.pptx
Thinfilms and nanomaterials_Modified October 2020.pptxThinfilms and nanomaterials_Modified October 2020.pptx
Thinfilms and nanomaterials_Modified October 2020.pptxhappycocoman
 
Paper id 21201429
Paper id 21201429Paper id 21201429
Paper id 21201429IJRAT
 
why and how thin films
why and how thin filmswhy and how thin films
why and how thin filmssumit__kumar
 
Lecture12_Various Fabrication Techniques1.pdf
Lecture12_Various Fabrication Techniques1.pdfLecture12_Various Fabrication Techniques1.pdf
Lecture12_Various Fabrication Techniques1.pdfSelvaBabu2
 
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...thinfilmsworkshop
 
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...thinfilmsworkshop
 
Introduction to thin film growth and molecular beam epitaxy
Introduction to thin film growth and molecular beam epitaxyIntroduction to thin film growth and molecular beam epitaxy
Introduction to thin film growth and molecular beam epitaxyOleg Maksimov
 
thin films Engineering Chemistry Year 1.pptx
thin films Engineering Chemistry Year 1.pptxthin films Engineering Chemistry Year 1.pptx
thin films Engineering Chemistry Year 1.pptxhappycocoman
 
Bottom up approaches for nanoparticle synthesis
Bottom up approaches for nanoparticle synthesisBottom up approaches for nanoparticle synthesis
Bottom up approaches for nanoparticle synthesiskusumDabodiya
 

Similar to PPT 2.ppt (20)

Advanced_Coating.pptx
Advanced_Coating.pptxAdvanced_Coating.pptx
Advanced_Coating.pptx
 
By final
By finalBy final
By final
 
PVD.ppt
PVD.pptPVD.ppt
PVD.ppt
 
High speed semiconductor devices ppt
High speed semiconductor devices pptHigh speed semiconductor devices ppt
High speed semiconductor devices ppt
 
Enmater Final Ppt
Enmater Final PptEnmater Final Ppt
Enmater Final Ppt
 
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.
MSE PhD lecture. Adv. Mater. Synthesis. Thin Films. Oct 23, 2014.
 
Mse phd lecture
Mse phd lectureMse phd lecture
Mse phd lecture
 
Pulsed Laser Ablation
Pulsed Laser AblationPulsed Laser Ablation
Pulsed Laser Ablation
 
Metallization
Metallization Metallization
Metallization
 
Thinfilms and nanomaterials_Modified October 2020.pptx
Thinfilms and nanomaterials_Modified October 2020.pptxThinfilms and nanomaterials_Modified October 2020.pptx
Thinfilms and nanomaterials_Modified October 2020.pptx
 
Paper id 21201429
Paper id 21201429Paper id 21201429
Paper id 21201429
 
why and how thin films
why and how thin filmswhy and how thin films
why and how thin films
 
Lecture12_Various Fabrication Techniques1.pdf
Lecture12_Various Fabrication Techniques1.pdfLecture12_Various Fabrication Techniques1.pdf
Lecture12_Various Fabrication Techniques1.pdf
 
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
 
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...Rosa alejandra lukaszew   a review of the thin film techniques potentially ap...
Rosa alejandra lukaszew a review of the thin film techniques potentially ap...
 
Introduction to thin film growth and molecular beam epitaxy
Introduction to thin film growth and molecular beam epitaxyIntroduction to thin film growth and molecular beam epitaxy
Introduction to thin film growth and molecular beam epitaxy
 
Nano materials
Nano materialsNano materials
Nano materials
 
Pvc cmos finale
Pvc cmos finale Pvc cmos finale
Pvc cmos finale
 
thin films Engineering Chemistry Year 1.pptx
thin films Engineering Chemistry Year 1.pptxthin films Engineering Chemistry Year 1.pptx
thin films Engineering Chemistry Year 1.pptx
 
Bottom up approaches for nanoparticle synthesis
Bottom up approaches for nanoparticle synthesisBottom up approaches for nanoparticle synthesis
Bottom up approaches for nanoparticle synthesis
 

Recently uploaded

ChatGPT-and-Generative-AI-Landscape Working of generative ai search
ChatGPT-and-Generative-AI-Landscape Working of generative ai searchChatGPT-and-Generative-AI-Landscape Working of generative ai search
ChatGPT-and-Generative-AI-Landscape Working of generative ai searchrohitcse52
 
How to Write a Good Scientific Paper.pdf
How to Write a Good Scientific Paper.pdfHow to Write a Good Scientific Paper.pdf
How to Write a Good Scientific Paper.pdfRedhwan Qasem Shaddad
 
nvidia AI-gtc 2024 partial slide deck.pptx
nvidia AI-gtc 2024 partial slide deck.pptxnvidia AI-gtc 2024 partial slide deck.pptx
nvidia AI-gtc 2024 partial slide deck.pptxjasonsedano2
 
Graphics Primitives and CG Display Devices
Graphics Primitives and CG Display DevicesGraphics Primitives and CG Display Devices
Graphics Primitives and CG Display DevicesDIPIKA83
 
Gender Bias in Engineer, Honors 203 Project
Gender Bias in Engineer, Honors 203 ProjectGender Bias in Engineer, Honors 203 Project
Gender Bias in Engineer, Honors 203 Projectreemakb03
 
EPE3163_Hydro power stations_Unit2_Lect2.pptx
EPE3163_Hydro power stations_Unit2_Lect2.pptxEPE3163_Hydro power stations_Unit2_Lect2.pptx
EPE3163_Hydro power stations_Unit2_Lect2.pptxJoseeMusabyimana
 
Design of Clutches and Brakes in Design of Machine Elements.pptx
Design of Clutches and Brakes in Design of Machine Elements.pptxDesign of Clutches and Brakes in Design of Machine Elements.pptx
Design of Clutches and Brakes in Design of Machine Elements.pptxYogeshKumarKJMIT
 
Modelling Guide for Timber Structures - FPInnovations
Modelling Guide for Timber Structures - FPInnovationsModelling Guide for Timber Structures - FPInnovations
Modelling Guide for Timber Structures - FPInnovationsYusuf Yıldız
 
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdf
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdfRenewable Energy & Entrepreneurship Workshop_21Feb2024.pdf
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdfodunowoeminence2019
 
Basic Principle of Electrochemical Sensor
Basic Principle of  Electrochemical SensorBasic Principle of  Electrochemical Sensor
Basic Principle of Electrochemical SensorTanvir Moin
 
Mohs Scale of Hardness, Hardness Scale.pptx
Mohs Scale of Hardness, Hardness Scale.pptxMohs Scale of Hardness, Hardness Scale.pptx
Mohs Scale of Hardness, Hardness Scale.pptxKISHAN KUMAR
 
GENERAL CONDITIONS FOR CONTRACTS OF CIVIL ENGINEERING WORKS
GENERAL CONDITIONS  FOR  CONTRACTS OF CIVIL ENGINEERING WORKS GENERAL CONDITIONS  FOR  CONTRACTS OF CIVIL ENGINEERING WORKS
GENERAL CONDITIONS FOR CONTRACTS OF CIVIL ENGINEERING WORKS Bahzad5
 
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdf
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdfSummer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdf
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdfNaveenVerma126
 
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...amrabdallah9
 
Dev.bg DevOps March 2024 Monitoring & Logging
Dev.bg DevOps March 2024 Monitoring & LoggingDev.bg DevOps March 2024 Monitoring & Logging
Dev.bg DevOps March 2024 Monitoring & LoggingMarian Marinov
 
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....santhyamuthu1
 
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...Amil baba
 
solar wireless electric vechicle charging system
solar wireless electric vechicle charging systemsolar wireless electric vechicle charging system
solar wireless electric vechicle charging systemgokuldongala
 

Recently uploaded (20)

ChatGPT-and-Generative-AI-Landscape Working of generative ai search
ChatGPT-and-Generative-AI-Landscape Working of generative ai searchChatGPT-and-Generative-AI-Landscape Working of generative ai search
ChatGPT-and-Generative-AI-Landscape Working of generative ai search
 
How to Write a Good Scientific Paper.pdf
How to Write a Good Scientific Paper.pdfHow to Write a Good Scientific Paper.pdf
How to Write a Good Scientific Paper.pdf
 
nvidia AI-gtc 2024 partial slide deck.pptx
nvidia AI-gtc 2024 partial slide deck.pptxnvidia AI-gtc 2024 partial slide deck.pptx
nvidia AI-gtc 2024 partial slide deck.pptx
 
Graphics Primitives and CG Display Devices
Graphics Primitives and CG Display DevicesGraphics Primitives and CG Display Devices
Graphics Primitives and CG Display Devices
 
Gender Bias in Engineer, Honors 203 Project
Gender Bias in Engineer, Honors 203 ProjectGender Bias in Engineer, Honors 203 Project
Gender Bias in Engineer, Honors 203 Project
 
EPE3163_Hydro power stations_Unit2_Lect2.pptx
EPE3163_Hydro power stations_Unit2_Lect2.pptxEPE3163_Hydro power stations_Unit2_Lect2.pptx
EPE3163_Hydro power stations_Unit2_Lect2.pptx
 
Design of Clutches and Brakes in Design of Machine Elements.pptx
Design of Clutches and Brakes in Design of Machine Elements.pptxDesign of Clutches and Brakes in Design of Machine Elements.pptx
Design of Clutches and Brakes in Design of Machine Elements.pptx
 
Présentation IIRB 2024 Marine Cordonnier.pdf
Présentation IIRB 2024 Marine Cordonnier.pdfPrésentation IIRB 2024 Marine Cordonnier.pdf
Présentation IIRB 2024 Marine Cordonnier.pdf
 
Modelling Guide for Timber Structures - FPInnovations
Modelling Guide for Timber Structures - FPInnovationsModelling Guide for Timber Structures - FPInnovations
Modelling Guide for Timber Structures - FPInnovations
 
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdf
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdfRenewable Energy & Entrepreneurship Workshop_21Feb2024.pdf
Renewable Energy & Entrepreneurship Workshop_21Feb2024.pdf
 
Basic Principle of Electrochemical Sensor
Basic Principle of  Electrochemical SensorBasic Principle of  Electrochemical Sensor
Basic Principle of Electrochemical Sensor
 
Mohs Scale of Hardness, Hardness Scale.pptx
Mohs Scale of Hardness, Hardness Scale.pptxMohs Scale of Hardness, Hardness Scale.pptx
Mohs Scale of Hardness, Hardness Scale.pptx
 
Lecture 2 .pptx
Lecture 2                            .pptxLecture 2                            .pptx
Lecture 2 .pptx
 
GENERAL CONDITIONS FOR CONTRACTS OF CIVIL ENGINEERING WORKS
GENERAL CONDITIONS  FOR  CONTRACTS OF CIVIL ENGINEERING WORKS GENERAL CONDITIONS  FOR  CONTRACTS OF CIVIL ENGINEERING WORKS
GENERAL CONDITIONS FOR CONTRACTS OF CIVIL ENGINEERING WORKS
 
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdf
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdfSummer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdf
Summer training report on BUILDING CONSTRUCTION for DIPLOMA Students.pdf
 
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...
Strategies of Urban Morphologyfor Improving Outdoor Thermal Comfort and Susta...
 
Dev.bg DevOps March 2024 Monitoring & Logging
Dev.bg DevOps March 2024 Monitoring & LoggingDev.bg DevOps March 2024 Monitoring & Logging
Dev.bg DevOps March 2024 Monitoring & Logging
 
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....
SATELITE COMMUNICATION UNIT 1 CEC352 REGULATION 2021 PPT BASICS OF SATELITE ....
 
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...
Popular-NO1 Kala Jadu Expert Specialist In Germany Kala Jadu Expert Specialis...
 
solar wireless electric vechicle charging system
solar wireless electric vechicle charging systemsolar wireless electric vechicle charging system
solar wireless electric vechicle charging system
 

PPT 2.ppt

  • 2. Physical Vapor Deposition Introduction  For all devices, there is a need to go from semiconductor to metal. Thus we need a means to deposit metals.  Many of these techniques used for metal deposition can be used to deposit other materials as well.  Several methods are currently used for deposition of metal layers.  One of the method is Physical Vapor Deposition (PVD)
  • 3. Physical Vapor Deposition  Physical vapor deposition (PVD) is a variety of vacuum deposition and is a general term used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces (e.g., onto semiconductor wafers).  The coating method involves purely physical processes such as high temperature vacuum evaporation or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapor deposition
  • 4. Physical Vapor Deposition  Physical Vapor Deposition techniques (PVD) 1.) Evaporation 2.) Sputtering 3.) Electron beam physical vapor deposition 4.) Cathodic arc deposition 5.) Pulsed laser deposition
  • 5. Physical Vapor Deposition (evaporation & sputtering) 1.) Evaporation:  Evaporation is based on the concept that there exists a finite “vapor pressure” above any material.  The material either sublimes (direct solid to vapor transition) or evaporates (liquid to vapor transition).
  • 6. Physical Vapor Deposition  Evaporation Step Coverage  The step coverage of evaporated films is poor due to the directional nature of the evaporated material (shadowing) (see figure 12-5).  Heating (resulting in surface diffusion) and rotating the substrates (minimizing the shadowing) help with the step coverage problem.  But evaporation cannot form continuous films for aspect ratios (AR=step height/step width or diameter) greater than 1.  We need a less directional metalization scheme====> Higher pressures!
  • 9. Physical Vapor Deposition • Evaporation: Advantages:  highest purity (Good for Schottky contacts) due to low pressures. Disadvantages:  Poor step coverage.  forming alloys can be difficult.  lower throughput due to low vacuum.
  • 10. Physical Vapor Deposition 2. Sputtering  A plasma at higher pressure is used to “knock” metal atoms out of a “target”.  These energetic atoms deposit on a wafer located near the target.  The higher pressure produces better step coverage due to more random angled delivery.  The excess energy of the ions also aids in increasing the surface mobility (movement of atoms on the surface).
  • 12. Physical Vapor Deposition • Film Morphology • Deposited films can be: (See 12-20). 1.) Porous and/or Amorphous —> Results from poor surface mobility =low temperature, low ion energy (low RF power/DC bias or higher pressures=less acceleration between collisions). 2.) “T-zone”: Small grain polycrystalline, dense, smooth and high reflectance (the sweet spot for most processes) Results from higher surface mobility =higher temperature or ion energy Sputtering
  • 13. Physical Vapor Deposition 3. Further increases in surface mobility result in columnar grains that have rough surfaces. These rough surfaces lead to poor coverage in later steps. 4. Still further increases in surface mobility result in large (non-columnar) grains. These grains can be good for diffusion barriers (less grain boundary diffusion due to fewer grains) but pose problems for lithography due to light scatter off of large grains, and tend to be more rigid leading to more failures in electrical lines. Sputtering
  • 15. Physical Vapor Deposition Film stress: Film stress can result in wafer bowing (problems with lithography), film cracking or peeling. There is 2 kinds of films stress: 1. Extrinsic Stress Forces acting on the wafer due to sources external to the deposited film. Example: Thermal induced stress: Sputtering
  • 16. Physical Vapor Deposition 2.) Intrinsic Stress  forces acting on the wafer due to sources internal to the deposited film  These can be differences in atomic spacing, variations in grain orientation or size, grain growth deposition, and even implanted or trapped gaseous impurities such as argon.  These depend strongly on the deposition conditions.  Both of these stresses can lead to a bowed wafer with deflection δ defined in figure 12-28. Sputtering
  • 17. Physical Vapor Deposition Sputtering Self Aligned Process Multi-Level Metalization
  • 18. Physical Vapor Deposition Sputtering Advantages:  Better step coverage.  less radiation damage than E-beam evaporation.  easier to deposit alloys. Disadvantages:  Some plasma damage including implanted argon.  Good for ohmics, not Schottky diodes.
  • 19. Physical Vapor Deposition Electron beam physical vapor deposition  Electron Beam Physical Vapor Deposition or EBPVD is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum.  The electron beam causes atoms from the target to transform into the gaseous phase.  These atoms then precipitate into solid form, coating everything in the vacuum chamber with a thin layer of the anode material
  • 21. Physical Vapor Deposition  In an EBPVD system, the deposition chamber is evacuated to a pressure of 10-4 Torr.  The material to be evaporated is in the form of ingots. There are as many as six electron guns, each having a power from few tens to hundreds of kW.  Electron beams can be generated by thermionic emission, field emission or the anodic arc method. The generated electron beam is accelerated to a high kinetic energy and focused towards the ingot.  When the accelerating voltage is between 20 kV – 25 kV and the beam current is a few amperes, 85% of the kinetic energy of the electrons is converted into thermal energy as the beam bombards the surface of the ingot.
  • 22. Physical Vapor Deposition  The surface temperature of the ingot increases resulting in the formation of a liquid melt. Although some of incident electron energy is lost in the excitation of X-rays and secondary emission, the liquid ingot material evaporates under vacuum.  The ingot itself is enclosed in a copper crucible, which is cooled by water circulation. The level of molten liquid pool on the surface of the ingot is kept constant by vertical displacement of the ingot. The number of ingot feeders depends upon the material to be deposited. The evaporation rate may be of the order of 10-2 g/cm2 sec
  • 23. Physical Vapor Deposition Electron beam physical vapor deposition Advantages :  The deposition rate in this process can be as low as 1 nm per minute to as high as few micrometers per minute.  The material utilization efficiency is high relative to other methods and the process offers structural and morphological control of films.  Due to the very high deposition rate, this process has potential industrial application for wear resistant and thermal barrier coatings in aerospace industries, hard coatings for cutting and tool industries, and electronic and optical films for semiconductor industries
  • 24. Physical Vapor Deposition Electron beam physical vapor deposition Disadvantages  The translational and rotational motion of the shaft helps for coating the outer surface of complex geometries, but this process cannot be used to coat the inner surface of complex geometries.  Another potential problem is that filament degradation in the electron gun results in a non-uniform evaporation rate  EBPVD is a line-of-sight of deposition process.
  • 25. Physical Vapor Deposition Pulsed laser deposition  Thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition.  Material is then vaporized from the target and deposited as a thin film on a substrate, such as a silicon wafer facing the target.  This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
  • 26. Physical Vapor Deposition Pulsed laser deposition  When the laser pulse is absorbed by the target, energy is first converted to electronic excitation and then into thermal, chemical and mechanical energy resulting in evaporation, ablation, plasma formation and even exfoliation .  The ejected species expand into the surrounding vacuum in the form of a plume containing many energetic species including atoms, molecules, electrons, ions, clusters, particulates and molten globules, before depositing on the typically hot substrate.
  • 27. Physical Vapor Deposition Pulsed laser deposition The process of PLD can generally be divided into four stages:  Laser ablation of the target material and creation of a plasma  Dynamic of the plasma  Deposition of the ablation material on the substrate  Nucleation and growth of the film on the substrate surface
  • 28. Physical Vapor Deposition Cathodic Arc Deposition  Cathodic arc deposition is a kind of ion beam deposition where an electrical arc is created that literally blasts ions from the cathode.  It is actively used among the community of the coaters of thin hard-film coatings to synthesize extremely hard film to protect the surface of cutting tools and extend their life significantly.  A wide variety of thin hard-film and nanocomposite coatings can be synthesized by this technology: TiN, TiAlN, CrN, ZrN, TiAlSiN,
  • 29. Physical Vapor Deposition Cathodic Arc Deposition  This is also used quite extensively particularly for carbon ion deposition to create diamond-like carbon films.  Because the ions are blasted from the surface ballistically, it is common for not only single atoms, but larger clusters of atoms to be ejected.  Thus, this kind of system requires a filter to remove atom clusters from the beam before deposition.  The DLC film from filtered-arc contains extremely high percentage of sp3 diamond which is known as tetrahedral amorphous carbon, or ta-C.
  • 38. Physical Vapor Deposition some of applications  Conductive Silicone Rubber dispensed directly onto housing  Low cost  Applications  Mobile Phone  PDA  Portable electronics  Base Station