1. AMD 2014 MOBILITY UPDATE
NOVEMBER 13, 2013

2. IN THIS DECK
MARKET OVERVIEW
AMD’S POSITION & FOCUS
2014 MOBILITY APU ROADMAP ADDITIONS
NEW FEATURES & BENEFITS
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3. THE AMD MISSION
To be the leading designer and integrator of
innovative, tailored technology solutions
that empower people to push the
boundaries of what is possible.
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4. THE EVOLVING CLIENT MARKET
OLD WINDOWS ECOSYSTEM
ANDROID/IOS ECOSYSTEM
THE NEW
 Big screens
 X86 performance focus
 Work devices
CLIENT
ECOSYSTEM
 Small screens
 Good enough performance
 Communication devices
 Productivity
 Content creation
 Best gaming
 Beautiful displays
 App-based consumption
 Browsing/entertainment
 DT towers
 Thick notebooks
 Slow boot, bad battery life
 Thin & light phones/tablets
 Able to go virtually everywhere
 Fast boot times, long battery life
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5. AMD’S MOBILITY FOCUS
BRIDGING THE GAP BETWEEN TABLETS AND NOTEBOOKS
PERFORMANCE TABLETS
Productivity, more
immersive experiences
2-in-1s
CONVERTIBLES
NOTEBOOKS
Tablet & productivity
notebook
Full featured notebook first,
converts to touch tablet
13–15” content creation and
new compute experiences
CONSUMPTION
PRODUCTIVITY
DELIVERING SURROUND COMPUTE EXPERIENCES ACROSS FORM FACTORS
ENHANCED MEDIA
NATURAL USER INTERFACES
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GAMING
CONTENT ANYWHERE

6. AMD’S 2013 MOBILITY LINEUP IN ACTION
SMALL SCREEN TOUCH NOTEBOOKS
TABLETS & 2-in-1s
VIZIO
11.6”
Tablet PC
MSI
W20 3M
Tablet
Toshiba
Satellite®
Click
HP
Pavilion13
x2
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HP
Pavilion11
TouchSmart
MSI
S12T
Notebook
Acer
Aspire
V5-122P
MAINSTREAM & PERFORMANCE NOTEBOOKS
Acer
Aspire
V5-552
HP
ENVY15
TouchSmart
Samsung
ATIV Book
9 Lite

7. AMD 2013-2014 MOBILITY ROADMAP
2013
“Richland” APU
“Kaveri” APU
2-4 “Piledriver” CPU Cores
2nd Generation DX®11 GPU Cores
17W-35W
Performance
Mainstream
2014
2-4 “Steamroller” CPU Cores
GCN Graphics Compute Units
HSA Features
AMD TrueAudio
15W-35W
28nm
32nm
“Kabini” APU
2-4 “Jaguar” CPU Cores
GCN Graphics Compute Units
15W-25W
Low-Power
Essential
28nm
“Beema ” APU
2-4 “Puma” CPU Cores
GCN Graphics Compute Units
AMD Security Processor
10W-25W
28nm
SoC
SoC
“Temash” APU
2-4 “Jaguar” CPU Cores
GCN Graphics Compute Units
3W-4W SDP
Ultra-Low Power
28nm
SoC
“Mullins ” APU
2-4 “Puma”” CPU Cores
GCN Graphics Compute Units
AMD Security Processor
~2W SDP
28nm
SoC
AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended
to represent first year of production shipments.
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8. 2014 AMD MOBILITY ROADMAP ADDITIONS
“MULLINS”
Outstanding performance in an SOC designed
for fanless tablets, 2-in-1s, and notebooks
"Temash" 4C
“BEEMA”
More performance and the latest features for a better
experience in mainstream & entry 2-in-1S AND NOTEBOOKS
"Mullins" 4C
300%
"Kabini" 4C
250%
250%
250%
200%
200%
200%
200%
150%
150%
150%
150%
100%
100%
100%
100%
50%
50%
50%
50%
0%
0%
0%
"Beema" 4C
250%
0%
3DMark11 - Performance
Normalized
PCMark 8 - Home
Normalized
More than 2X the
performance per watt of
the previous generation1
3DMark11 - Performance
Normalized
PCMark 8 - Home
Normalized
 AMD Radeon™ graphics: The world's best graphics technology that is found in all the
latest game consoles AND in PCs that deliver richer more lifelike videos, movies, photos
and the best gaming experience
 AMD DockPort technology support
 Microsoft 8.1 optimizations and Microsoft InstantGo2 for faster wake times and to
ensure data, such as e-mail, actively refreshes in standby
 Platform security processor based on the ARM Cortex™-A5 processor featuring ARM
TrustZone® technology for enhanced data security
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See backup for footnotes

9. AMD DOCKPORT TECHNOLOGY
ONE CONNECTION, VIRTUALLY LIMITLESS POSSIBILITIES
Use AMD DockPort to connect:
 Up to four monitors*
 Mouse/keyboard
 External HDD
DP
HDMI
VGA
 Optical drive
 Printers
 Virtually any other device or peripheral
that supports DP1.2 standard
Up to USB 3.0 speed*
Charging power
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DP
HDMI
VGA
DP
HDMI
VGA
Dock
DP 1.2
USB 3.0
Powers Notebook
HDD
KBD &
Mouse
Smart
Phone
DVD/Blu-ray
* Use of 4 1920x1200 external monitors does not support simultaneous USB 3.0 speed. BPU support required.

10. AMD AND MICROSOFT COLLABORATION – WINDOWS 8.1
AMD Wireless Display
Enabling great experiences for end users with AMD Wireless Display3
built on top of Windows 8.1 support for Miracast technology
Performance
Optimizations in both Windows 8.1 as well as in the AMD driver4 to
streamline performance
Accelerated Experiences
Internet Explorer 11 includes support for WebGL™ to enable
acceleration for better online experiences when using AMD APUs
and GPUs
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11. MICROSOFT INSTANTGO*
WITH INSTANTGO, YOUR WINDOWS DEVICE IS RESPONSIVE AND ALWAYS READY
INSTANTLY AVAILABLE
ALWAYS CURRENT
Your device wakes up the moment
you need it
Your apps and data are already up to
date when your screen lights up
Your experience can last all day with
extended battery life
 Go from standby mode to "on" in
under 500 milliseconds
 Maintains network connectivity*
and syncs automatically while your
device sleeps
 Battery can last all-day while
working or up to 14 days in standby
mode
 Allows Live Tiles, Windows Store
apps, news, and data to refresh
even when device is in standby
 Designed for thin, light, and
connected devices
 Get back to what you were doing in
the blink of an eye
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* Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full
details please contact Microsoft directly.

12. AMD-DESIGNED PLATFORM SECURITY PROCESSOR WITH ARM TRUSTZONE
 Provides a Trusted Execution Environment (TEE)
AMD SOC
‒ Protects against software attack from open/rich OS side of
system
‒ Provides scalable environment for secure applications like user
authentication, anti-malware, content management, online
payments, etc.
 Delivers two separate domains, normal and secure
TrustZone API
Secure OS in TEE
Secure Monitor
Secure Boot
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Trusted
App
Trusted
App
Trusted
App
Secure World
Isolated
Apps
Isolated
Apps
‒ Processing data path
‒ On/off-chip memory
‒ I/O and display
Normal World
Isolated
Apps
‒ Extends across entire system
‒ Beyond simply the processor/SOC
‒ Can deliver secure
PSP (ARM Cortex-A5)

13. IN SUMMARY
THE CHANGING CLIENT MARKET CREATES A HUGE OPPORTUNITY, CENTERED AROUND
CONVERGENCE FORM-FACTORS
And AMD is uniquely
positioned to succeed
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GRAPHICS-INTENSIVE WORKLOADS
SURROUND COMPUTING
New additions to the 2014 Mobility Roadmap
focus on delivering exceptional performance and
important features for this new era

14. Thank You
Find us online:
AMD.COM
TWITTER
FACEBOOK
G+
LINKEDIN
PINTEREST
INSTAGRAM

15. FOOTNOTES
1.
Slide 8: Testing conducted by AMD Performance Labs on optimized AMD reference systems. PC manufacturers may vary configuration yielding different results.
‒
PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Mullins platform (4.5W) scored 1809 while the Temash platform(8W) scored 1343. MUN-3 AMD "Larne" reference platform
system used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production
engineering sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver.
‒
3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Mullins (4.5W) platform scored 570 while the Temash (8W) platform scored 468. MUN-4 AMD "Larne" reference platform system used for
both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Radeon™ HD 8250 Graphics, 2x2GB of DDR3-1333MHz RAM (running at 1066MHz), Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering
sample of “Mullins” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1333MHz RAM, Windows 8.1, and unreleased reference driver.
‒
PCMark 8 - Home score divided by TDP(W) is used to simulate productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3
AMD "Larne" reference
platform system used for both APUs. Kabini-based AMD A6-5200 quad-core APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering
sample of “Beema” quad-core APU with next generation AMD Radeon graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver.
‒
3DMark 11 score divided by TDP(W) is used to simulate graphics performance per watt; the Beema (15W) platform scored 823 while the Kabini (25W) platform scored 685. BMN-4 Home score divided by TDP(W) is used to simulate
productivity performance per watt; the Beema platform (15W) scored 2312 while the Kabini platform(25W) scored 1861. BMN-3 AMD "Larne" reference platform system used for both APUs. Kabini-based AMD A6-5200 quadcore APU with AMD Radeon™ HD 8400 Graphics, 2x2GB of DDR3-1600MHz RAM, Windows 8.1, 13.200.11.0 - 03-Sep-2013 driver. Pre-production engineering sample of “Beema” quad-core APU with next generation AMD Radeon
graphics (model number TBD), 2x2GB DDR3-1600MHz RAM, Windows 8.1, and unreleased reference driver.
2.
Slide 8: Material provided by Microsoft. Microsoft testing not independently verified by AMD. For full details please contact Microsoft directly.
3.
Slide 9: AMD Wireless Display technology provides the ability to wirelessly display local screen content onto a remote screen with low latency and automatic upscaling of video and graphics. AMD Wireless Display technology is enabled
on select systems with AMD APUs and requires Windows 8 and Wi-Fi certified Miracast™ receiver equipment. Confirm capabilities with system manufacturer before purchase.
4.
AMD Catalyst™ 13.11 Beta Driver for Windows® (http://support.amd.com/en-us/kb-articles/Pages/latest-catalyst-windows-beta.aspx).
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16. DISCLAIMER & ATTRIBUTION
The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.
The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap
changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software
changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD
reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of
such revisions or changes.
AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY
INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.
ATTRIBUTION
© 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro
Devices, Inc. in the United States and/or other jurisdictions.
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17. CAUTIONARY STATEMENT
This Presentation contains forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, AMD’s 2014 mobile
Accelerated Processing Unit (APU) product roadmap, AMD’s future products including strategy, the timing , availability, features and functionality of such future products, which are
made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may,"
"expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based
on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially
from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product
introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable
terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to
develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry
suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products
on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to
meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities;
that the Company’s requirements for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the
number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately
estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is
unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the
Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be
unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that
global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or
internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including
but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013.
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