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17
STGB10NC60KD
STGF10NC60KD - STGP10NC60KD
N-channel 600V - 10A - D2
PAK / TO-220 / TO-220FP
Short circuit rated PowerMESH™ IGBT
General features
■ Lower on voltage drop (Vcesat)
■ Lower CRES / CIES ratio (no cross-conduction
susceptibility)
■ Very soft ultra fast recovery antiparallel diode
■ Short circuit withstand time 10µs
Description
Using the latest high voltage technology based on
a patented strip layout, STMicroelectronics has
designed an advaced family of IGBTs, the
PowerMESH™ IGBTs, with outstanding
performances. The suffix “K” identifies a family
optimized for high frequency motor control
applications with short circuit withstand capability.
Applications
■ High frequency motor controls
■ SMPS and PFC in both hard switch and
resonant topologies
■ Motor drivers
Internal schematic diagram
Type VCES
VCE(sat)Max
@25°C
IC
@100°C
STGB10NC60KD
STGP10NC60KD
STGF10NC60KD
600V
600V
600V
<2.5V
<2.5V
<2.5V
10A
10A
6A
1
2
3
TO-220FPTO-220
1
2
3
1
3
D²
PAK
www.st.com
Order codes
Sales Type Marking Package Packaging
STGB10NC60KDT4 GB10NC60KD D²PAK Tape & reel
STGP10NC60KD GP10NC60KD TO-220 Tube
STGF10NC60KD GF10NC60KD TO-220FP Tube
Contents: STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
2/17
Contents:
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical ratings
3/17
1 Electrical ratings
Table 1. Absolute maximum ratings
Symbol Parameter
Value
Unit
D²PAK/TO-220 TO-220FP
VCES Collector-Emitter Voltage (VGS = 0) 600 V
IC
(1)
1. Calculated according to the iterative formula::
Collector Current (continuous) at TC = 25°C 20 9 A
IC
(1) Collector Current (continuous) at TC = 100°C 10 6 A
ICM
(2)
2. Pulse width limited by max junction temperature
Collector Current (pulsed) 30 A
VGE Gate-Emitter Voltage ±20 V
IF Diode RMS Forward Current at Tc=25°C 10 A
PTOT Total Dissipation at TC = 25°C 60 25 W
VISO Insulation Withstand Voltage A.C.(t=1sec;Tc=25°C) -- 2500
Tstg Storage Temperature
– 55 to 150 °C
Tj Operating Junction Temperature
Tscw Short Circuit Withstand Time 10 µs
Tl
Maximum Lead Temperature For Soldering
Purpose (for 10sec. 1.6 mm from case)
300 °C
Table 2. Thermal resistance
Symbol Parameter Value Unit
Rthj-case Thermal Resistance Junction-case Max
TO-220/D²PAK 2.08 °C/W
TO-220FP 5.0 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
I
C
T
C
( )
T
JMAX
T
C
–
R
THJ C–
V
CESAT MAX( )
T
C
I
C
,( )×
---------------------------------------------------------------------------------------------------=
Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
4/17
2 Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3. Static
Symbol Parameter Test Condictions Min. Typ. Max. Unit
VBR(CES)
Collector-Emitter
Breakdown Voltage
IC= 1mA, VGE= 0 600 V
VCE(sat)
Collector-Emitter
Saturation Voltage
VGE= 15V, IC= 5A
VGE= 15V, IC= 5A, Tc= 125°C
2
1.8
2.5 V
V
VGE(th) Gate Threshold Voltage VCE= VGE, IC= 250 µA 4.5 6.5 V
ICES
Collector cut-off Current
(VGE = 0)
VCE= Max Rating,TC= 25°C
VCE=Max Rating,TC= 125°C
150
1
µA
mA
IGES
Gate-Emitter Leakage
Current (VCE = 0)
VGE= ±20V , VCE= 0 ±100 nA
gfs Forward Transconductance VCE = 15V, IC= 5A 15 S
Table 4. Dynamic
Symbol Parameter Test Condictions Min. Typ. Max. Unit
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VCE = 25V, f = 1MHz,
VGE = 0
380
46
8.5
pF
pF
pF
Qg
Qge
Qgc
Total Gate Charge
Gate-Emitter Charge
Gate-Collector Charge
VCE = 390V, IC = 5A,
VGE = 15V,
(see Figure 18)
19
5
9
nC
nC
nC
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics
5/17
Table 5. Switching on/off (inductive load)
Symbol Parameter Test Condictions Min. Typ. Max. Unit
td(on)
tr
(di/dt)on
Turn-on Delay Time
Current Rise Time
Turn-on Current Slope
VCC = 390V, IC = 5A
RG= 10Ω, VGE= 15V, Tj=
25°C
(see Figure 19)
17
6
655
ns
ns
A/µs
td(on)
tr
(di/dt)on
Turn-on Delay Time
Current Rise Time
Turn-on Current Slope
VCC = 390V, IC = 5A
RG= 10Ω, VGE= 15V,
Tj=125°C
(see Figure 19)
16.5
6.5
575
ns
ns
A/µs
tr(Voff)
td(off)
tf
Off Voltage Rise Time
Turn-off Delay Time
Current Fall Time
Vcc = 390V, IC = 5A,
RGE = 10Ω , VGE =
15V,TJ=25°C
(see Figure 19)
33
72
82
ns
ns
ns
tr(Voff)
td(off)
tf
Off Voltage Rise Time
Turn-off Delay Time
Current Fall Time
Vcc = 390V, IC = 5A,
RGE=10Ω , VGE =15V,
Tj=125°C
(see Figure 19)
60
106
136
ns
ns
ns
Table 6. Switching energy (inductive load)
Symbol Parameter Test Condictions Min. Typ. Max. Unit
Eon
(1)
Eoff
(2)
Ets
1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
Turn-on Switching Losses
Turn-off Switching Losses
Total Switching Losses
VCC = 390V, IC = 5A
RG= 10Ω, VGE=15V,
Tj=25°C
(see Figure 19)
55
85
140
µJ
µJ
µJ
Eon
(1)
Eoff
(2)
Ets
Turn-on Switching Losses
Turn-off Switching Losses
Total Switching Losses
VCC = 390V, IC = 5A
RG= 10Ω, VGE= 15V,
Tj= 125°C
(see Figure 19)
87
162
249
µJ
µJ
µJ
Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
6/17
Table 7. Collector-emitter diode
Symbol Parameter Test Condictions Min. Typ. Max. Unit
Vf Forward On-Voltage
If = 2.5A
If = 2.5A, Tj = 125°C
1.6
1.3
2.1 V
V
trr
Qrr
Irrm
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
If = 5A ,VR = 30V,
Tj = 25°C, di/dt = 100 A/µs
(see Figure 20)
23.5
16.5
1.4
ns
nC
A
trr
Qrr
Irrm
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
If = 5A ,VR = 30V,
Tj =125°C, di/dt = 100A/µs
(see Figure 20)
39
39
2
ns
nC
A
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics
7/17
2.1 Electrical characteristics (curves)
Figure 1. Output characterisics Figure 2. Transfer characteristics
Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs
temperature
Figure 5. Gate charge vs gate-source voltage Figure 6. Capacitance variations
Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
8/17
Figure 7. Normalized gate threshold voltage
vs temperature
Figure 8. Collector-emitter on voltage vs
collector current
Figure 9. Normalized breakdown voltage vs
temperature
Figure 10. Switching losses vs temperature
Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector
current
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics
9/17
Figure 13. Thermal Impedance for TO-220/
D²PAK
Figure 14. Turn-off SOA
Figure 15. Emitter-collector diode
characteristics
Figure 16. Thermal Impedance for TO-220FP
Test circuit STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
10/17
3 Test circuit
Figure 17. Test Circuit for Inductive Load
Switching
Figure 18. Gate charge test circuit
Figure 19. Switching Waveform Figure 20. Diode Recovery Time Waveform
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Package mechanical data
11/17
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Package mechanical data STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
12/17
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
TO-220 MECHANICAL DATA
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Package mechanical data
13/17
TO-247 MECHANICAL DATA
1
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R 0.4 0.015
V2 0º 4º
D2
PAK MECHANICAL DATA
3
Package mechanical data STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
14/17
L2
A
B
D
E
H
G
L6
F
L3
G1
1 2 3
F2
F1
L7
L4
L5
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
TO-220FP MECHANICAL DATA
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Packaging mechanical data
15/17
5 Packaging mechanical data
TAPE AND REEL SHIPMENT
D2
PAK FOOTPRINT
* on sales type
DIM.
mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
BASE QTY BULK QTY
1000 1000
REEL MECHANICAL DATA
DIM.
mm inch
MIN. MAX. MIN. MAX.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
TAPE MECHANICAL DATA
Revision history STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
16/17
6 Revision history
Table 8. Revision history
Date Revision Changes
14-Jun-2005 1 New Release
19-Jul-2005 2 Complete version
27-Jan-2006 3 Inserted ecopack indication
01-Mar-2006 4 New template
STGB10NC60KD - STGP10NC60KD - STGF10NC60KD
17/17
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
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Original MOSFET N-Channel STGF10NC60KD GF10NC60KD 10NC60 10N60 10A 600V New

  • 1. March 2006 Rev 4 1/17 17 STGB10NC60KD STGF10NC60KD - STGP10NC60KD N-channel 600V - 10A - D2 PAK / TO-220 / TO-220FP Short circuit rated PowerMESH™ IGBT General features ■ Lower on voltage drop (Vcesat) ■ Lower CRES / CIES ratio (no cross-conduction susceptibility) ■ Very soft ultra fast recovery antiparallel diode ■ Short circuit withstand time 10µs Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advaced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “K” identifies a family optimized for high frequency motor control applications with short circuit withstand capability. Applications ■ High frequency motor controls ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers Internal schematic diagram Type VCES VCE(sat)Max @25°C IC @100°C STGB10NC60KD STGP10NC60KD STGF10NC60KD 600V 600V 600V <2.5V <2.5V <2.5V 10A 10A 6A 1 2 3 TO-220FPTO-220 1 2 3 1 3 D² PAK www.st.com Order codes Sales Type Marking Package Packaging STGB10NC60KDT4 GB10NC60KD D²PAK Tape & reel STGP10NC60KD GP10NC60KD TO-220 Tube STGF10NC60KD GF10NC60KD TO-220FP Tube
  • 2. Contents: STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 2/17 Contents: 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
  • 3. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical ratings 3/17 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit D²PAK/TO-220 TO-220FP VCES Collector-Emitter Voltage (VGS = 0) 600 V IC (1) 1. Calculated according to the iterative formula:: Collector Current (continuous) at TC = 25°C 20 9 A IC (1) Collector Current (continuous) at TC = 100°C 10 6 A ICM (2) 2. Pulse width limited by max junction temperature Collector Current (pulsed) 30 A VGE Gate-Emitter Voltage ±20 V IF Diode RMS Forward Current at Tc=25°C 10 A PTOT Total Dissipation at TC = 25°C 60 25 W VISO Insulation Withstand Voltage A.C.(t=1sec;Tc=25°C) -- 2500 Tstg Storage Temperature – 55 to 150 °C Tj Operating Junction Temperature Tscw Short Circuit Withstand Time 10 µs Tl Maximum Lead Temperature For Soldering Purpose (for 10sec. 1.6 mm from case) 300 °C Table 2. Thermal resistance Symbol Parameter Value Unit Rthj-case Thermal Resistance Junction-case Max TO-220/D²PAK 2.08 °C/W TO-220FP 5.0 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W I C T C ( ) T JMAX T C – R THJ C– V CESAT MAX( ) T C I C ,( )× ---------------------------------------------------------------------------------------------------=
  • 4. Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 4/17 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Static Symbol Parameter Test Condictions Min. Typ. Max. Unit VBR(CES) Collector-Emitter Breakdown Voltage IC= 1mA, VGE= 0 600 V VCE(sat) Collector-Emitter Saturation Voltage VGE= 15V, IC= 5A VGE= 15V, IC= 5A, Tc= 125°C 2 1.8 2.5 V V VGE(th) Gate Threshold Voltage VCE= VGE, IC= 250 µA 4.5 6.5 V ICES Collector cut-off Current (VGE = 0) VCE= Max Rating,TC= 25°C VCE=Max Rating,TC= 125°C 150 1 µA mA IGES Gate-Emitter Leakage Current (VCE = 0) VGE= ±20V , VCE= 0 ±100 nA gfs Forward Transconductance VCE = 15V, IC= 5A 15 S Table 4. Dynamic Symbol Parameter Test Condictions Min. Typ. Max. Unit Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 25V, f = 1MHz, VGE = 0 380 46 8.5 pF pF pF Qg Qge Qgc Total Gate Charge Gate-Emitter Charge Gate-Collector Charge VCE = 390V, IC = 5A, VGE = 15V, (see Figure 18) 19 5 9 nC nC nC
  • 5. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics 5/17 Table 5. Switching on/off (inductive load) Symbol Parameter Test Condictions Min. Typ. Max. Unit td(on) tr (di/dt)on Turn-on Delay Time Current Rise Time Turn-on Current Slope VCC = 390V, IC = 5A RG= 10Ω, VGE= 15V, Tj= 25°C (see Figure 19) 17 6 655 ns ns A/µs td(on) tr (di/dt)on Turn-on Delay Time Current Rise Time Turn-on Current Slope VCC = 390V, IC = 5A RG= 10Ω, VGE= 15V, Tj=125°C (see Figure 19) 16.5 6.5 575 ns ns A/µs tr(Voff) td(off) tf Off Voltage Rise Time Turn-off Delay Time Current Fall Time Vcc = 390V, IC = 5A, RGE = 10Ω , VGE = 15V,TJ=25°C (see Figure 19) 33 72 82 ns ns ns tr(Voff) td(off) tf Off Voltage Rise Time Turn-off Delay Time Current Fall Time Vcc = 390V, IC = 5A, RGE=10Ω , VGE =15V, Tj=125°C (see Figure 19) 60 106 136 ns ns ns Table 6. Switching energy (inductive load) Symbol Parameter Test Condictions Min. Typ. Max. Unit Eon (1) Eoff (2) Ets 1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current Turn-on Switching Losses Turn-off Switching Losses Total Switching Losses VCC = 390V, IC = 5A RG= 10Ω, VGE=15V, Tj=25°C (see Figure 19) 55 85 140 µJ µJ µJ Eon (1) Eoff (2) Ets Turn-on Switching Losses Turn-off Switching Losses Total Switching Losses VCC = 390V, IC = 5A RG= 10Ω, VGE= 15V, Tj= 125°C (see Figure 19) 87 162 249 µJ µJ µJ
  • 6. Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 6/17 Table 7. Collector-emitter diode Symbol Parameter Test Condictions Min. Typ. Max. Unit Vf Forward On-Voltage If = 2.5A If = 2.5A, Tj = 125°C 1.6 1.3 2.1 V V trr Qrr Irrm Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current If = 5A ,VR = 30V, Tj = 25°C, di/dt = 100 A/µs (see Figure 20) 23.5 16.5 1.4 ns nC A trr Qrr Irrm Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current If = 5A ,VR = 30V, Tj =125°C, di/dt = 100A/µs (see Figure 20) 39 39 2 ns nC A
  • 7. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics 7/17 2.1 Electrical characteristics (curves) Figure 1. Output characterisics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs temperature Figure 5. Gate charge vs gate-source voltage Figure 6. Capacitance variations
  • 8. Electrical characteristics STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 8/17 Figure 7. Normalized gate threshold voltage vs temperature Figure 8. Collector-emitter on voltage vs collector current Figure 9. Normalized breakdown voltage vs temperature Figure 10. Switching losses vs temperature Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current
  • 9. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Electrical characteristics 9/17 Figure 13. Thermal Impedance for TO-220/ D²PAK Figure 14. Turn-off SOA Figure 15. Emitter-collector diode characteristics Figure 16. Thermal Impedance for TO-220FP
  • 10. Test circuit STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 10/17 3 Test circuit Figure 17. Test Circuit for Inductive Load Switching Figure 18. Gate charge test circuit Figure 19. Switching Waveform Figure 20. Diode Recovery Time Waveform
  • 11. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Package mechanical data 11/17 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
  • 12. Package mechanical data STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 12/17 DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA
  • 13. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Package mechanical data 13/17 TO-247 MECHANICAL DATA 1 DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0.4 0.015 V2 0º 4º D2 PAK MECHANICAL DATA 3
  • 14. Package mechanical data STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 14/17 L2 A B D E H G L6 F L3 G1 1 2 3 F2 F1 L7 L4 L5 DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 TO-220FP MECHANICAL DATA
  • 15. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD Packaging mechanical data 15/17 5 Packaging mechanical data TAPE AND REEL SHIPMENT D2 PAK FOOTPRINT * on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA
  • 16. Revision history STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 16/17 6 Revision history Table 8. Revision history Date Revision Changes 14-Jun-2005 1 New Release 19-Jul-2005 2 Complete version 27-Jan-2006 3 Inserted ecopack indication 01-Mar-2006 4 New template
  • 17. STGB10NC60KD - STGP10NC60KD - STGF10NC60KD 17/17 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com