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© 2016, Amazon Web Services, Inc. or its Affiliates. All rights reserved.
Martin Kronberg, Intel IoT Evangelist
6/21/2016
Intel SoC
A Platform to Connect Sensor Data to AWS
T H A N K S T O O U R F R I E N D S A T :
Intel Confidential Copyright © 2016, Intel Corporation. All rights reserved.
Other names and brands may be claimed as the property of others.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS AND IS “AS IS.” NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this
document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are
available on request.
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are
target dates, are provided for planning purposes only and are subject to change.
Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and
other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code
names is at the sole risk of the user.
Intel, Intel Inside, Intel Atom and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
Other names and brands may be claimed as the property of others.
Copyright © 2016, Intel Corporation. All rights reserved.
Internet of Things
5
1. IDC
2. MC/EDC: The Digital Universe of
Opportunities
3. Goldman Sachs
4. IMS Research
The Internet of Things is …
Home
Mobile
Network
Industrial
Gateway
DC/Cloud
44ZETABYTES2
3
COST OF
SENSORS 2X
PAST 10
YEARS
COST OF
BANDWIDTH 40X
PAST 10
YEARS
COST OF
PROCESSING 60X
PAST 10
YEARS
50BDEVICES1
85%UNCONNECTED4
21
212BSensors
7
1. Research & Development Roadmap for Emerging HVAC Technologies. U.S. Department of Energy (October 2014).
2. The ‘Internet of Things’ Is Now, Connecting the Real Economy. Morgan Stanley (April 3, 2014).
3. How much electricity is lost in transmission and distribution in the United States? U.S. Energy Information Administration (April 6, 2016).
The Internet of Things (IoT) is fueling
innovation across a range of industries to
optimize processes and increase efficiency.
4. "How Manufacturers Use IoT for Operational Efficiencies." Industry Week (October 21, 2015).
5. Tech Today Video Series Episode 3: Vnomics. Intel (March 4, 2014).
Need for IoT
TRANSPORTATION
Fleet management, freight tracking,
urban congestion management
Enhanced driver coaching can save
nearly 7% on fuel costs.5
RETAIL
Point of sale, vending machines,
supply chain
Supermarket cost-to-sales ratios can be
reduced 2% by automatic checkout.2
SMART BUILDING
Energy use monitoring; sensors in heaters
and chillers to find inefficiencies
Greater efficiency for HVAC systems, which
account for 41% of U.S. building energy use.1
INDUSTRIAL &
MANUFACTURING
Assembly-line equipment reporting,
inventory management; automation
Manufacturers using IoT report 82% increased
efficiency and 49% fewer defects.4
ENERGY
Environmental data logging, substation
monitoring, grid efficiencies
IoT can optimize energy grids, which lose
~6% during transmission and distribution.3
Intel® IoT
THINGS (ENDPOINTS)
CLOUD-BASED ANALYTICS
The Intel® IoT Platform: A blueprint for connecting
devices into the cloud for developers to better
leverage data, customize, and scale
NETWORK
(DATA CENTER)
Copyright © 2016 Intel Corporation. All rights reserved.
Intel® Architecture Powers the Internet of Things
GATEWAY
9
Yocto* Project
Linux* OS
image
Supports Intel® Edison, Intel® Galileo boards
as well as Intel® IoT Gateway
Middleware libraries for IO and sensors /
actuators
IDEs and tools to create, run, debug and
optimize IoT solutions
C/C++, JavaScript*, Python* and Java*
programming language support
Advanced power efficiency/performance
optimization tools
Examples with WindRiver* Helix* Cloud
IoT Cloud and Edge Analytics for data
collection, visualization and analytics
Intel® IoT
Developer Kit OS
Image (Intel®
Edison, Intel®
Galileo boards)
IoT OS
*Other names and brands may be claimed as the property of others.
Intel® IoT Developer Kit Overview
For more details go to https://software.intel.com/iot
Intel Edison
Board
IO Library
(SPI, GPIO, I2C, AIO,
UART)
HardWareOS
Image
CloudEdge
Analytics
Intel Galileo
Board
Intel® IoT Gateway
Middleware
Communication Stack
(Wi-Fi, Bluetooth®
Technology, ZigBee*, etc.)
Manageability, Security,
RealSense SDK, etc.
API Bindings (C/C++, Node.JS*, Python*, Java*)
Sensor & Actuator
Libraries
IDE/Tools
Prototype Evaluate/ Prototype / Product
IBM* BlueMix*, Microsoft* Azure*, Amazon* AWS*, General Electric Predix* and more...
Intel® D2000 Sensors / Actuators
10
Where to Start?
Almost all IoT solutions start with a proof of concept
• Fast and Easy to
develop
• Familiar Tools
• Low cost
• Mature and stable offering
• Reliable and scalable
• Flexible and secure
What is a System On
Module (SOM)?
• Falls between an MCU and Single-
Board Computer
• Includes processor, RAM, I/O
• Lacks standard I/O peripherals
• Commonly requires carrier board
• Offers densely packed, highly
integrated components
• Typically low-energy
• Primary goal: Accelerated time to
market, reduced cost
SOM Strengths and Weaknesses
Strengths:
• Easier to upgrade compute to next
generation by swapping on carrier
• Makes no assumptions about
required I/O, customer can tailor
carrier to their needs
• Faster time to market, especially if
software and tools are provided to
program the core unit
• FCC and global pre-certification
saves time and money
Weaknesses:
• Module must be compatible with
carriers across upgrades for
swappable value proposition to
emerge
• Connection points can be source
of system fragility
• Assumes the need for a carrier,
which can take up more space
than a “board-down”
implementation
Intel® Edison Module
Dual-Core Intel® Atom™ processor
@ 500 MHZ
Wi-Fi*, Bluetooth® 4.0 (LE)
32-bit Intel® Quark™ Microcontroller
@ 100 MHZ
1 GB RAM, 4 GB Flash
40 multiplexed GPIO with multiple
expansion boards for total project
design flexibility
Intel® Edison Module
Key Benefits
• Many supported communication
protocols
• High density 70-pin connector
allows small footprint
• Programmable with C++,
JavaScript, Python, and Java
• Extensive Sensor Library
• High compute power with x86
• Low Power consumption
• FCC Wireless certification for Wi-Fi*
and Bluetooth® worldwide
• Simple integration with cloud
services such as AWS*
Intel® Edison Communication Protocols
• WiFi
• Bluetooth 4.0
• I2C
• I2S
• UART
• SPI
Intel Expansion Boards
Intel® Edison
• 70 pin connector
• Hirose DF40 Series
• Breakout Board
• Arduino* expansion board
• Easy to build your own board
Sparkfun* Expansion Boards
Introducing MRAA and UPM
•
•
•
•
•
•
•
•
Sensor Support and Control Protocols
200+ sensor drivers for maker and industry
Leverages MRAA communication layers
Adds ZigBee, Z-Wave, Bluetooth, Modbus, BACnet,
RS422/485
Industrial Sensors: Aeon Labs*, Bosch*, Comet*, Maxim
Integrated*, Omega*, Veris*, and others
2
Wireless Certification
FCC Certification (United States) is
complex, time consuming and
expensive
Can cost $250,000 and take 6+ months
to certify a wireless module globally
Worldwide certification can take months
and cost hundreds of thousands of
dollars
SOMs allow you to avoid this cost
Intel® Edison Use Cases
Tektyte* Edi-Expand
Raspberry Pi*-like IO for Intel®
Edison
Modulowo* Explore*
Expansion modules to add
GPS and other functionality
via DuoNect
DFRobot*
Starter Kit for
Intel® Edison
Case Study: KINETIC*
Objective: Provide workers with a
solution to reduce lifting-related injuries
by unsafe lifts in the workplace.
Project: Wearable waist and wrist-
based lift trackers
Team Size: ~10
Location: New York, NY
Website: www.wearkinetic.com
KINETIC* Product
Prototyped on Intel® Edison board,
replacing alternate SoC
Used I2C, Bluetooth® Low Energy, Wi-
Fi*, GPIO
Acquired 2,000+ field experience with
Intel Edison
Python* micro-service for code updates
and deployment
1500mAH LiPo battery
Cost: $300
Case Study:
Dronesmith Technologies*
Objective: Enable drone developers
with an Intel® Edison compute module
based prototyping and experimentation
platform “Luci”
Project: Luci flight controller, QK II
drone
Team Size: ~10
Location: Las Vegas, Nevada
Website: www.dronesmith.io
Dronesmith
Technologies* Luci
Dual processor technology (RISC-based
flight core and Intel® Edison compute
module)
10 Degrees-Of-Freedom dual
accelerometers, gyros, magnetometers and
barometer
2xUART, 1xI2C, Spektrum*-IN, PPMS.Bus-
IN, 6xServo Out, 2xmicroSD, 3xUSB
Cost: $400
Case Study:
Robodub, Inc.
Objective: Live-action streaming for
robots and drones, gamification of
robotics
Project: RamBot
Team Size: ~12
Location: Bellevue, Washington
Website: www.robodub.com
Intel® Edison and AWS* :
Rapid Cloud Prototyping
Intel® Edison and Grove* IoT Starter Kit Powered by
AWS*
• Temperature&Humidity Sensor
• Moisture Sensor
• Light Sensor
• UV Sensor
• PIR Motion Sensor
• Encoder
• Button
• LCD RGB Backlight
• Relay
• Servo
• Buzzer
Setup Intel® Edison
• Download & Flash latest
firmware
• Setup SSH
• Connect to WiFi
• ~15 min
Intel® XDK IoT Edition
IDE for JavaScript:
• Push code over WiFi
• Install Packages
• Access SSH terminal
• Install AWS* SDK
• Easily share projects across
XDKs
• ~15 min
Create AWS* IoT Thing
AWS* IoT Console:
• Create Things
• Create Services
• Create Rules
• ~15min
AWS* IoT Device Connection
• Certificate Generation
• Code Snippet
• Link to GitHub
AWS* Repository
Sample code for AWS* SDK to
connect devices
Extensive API documentation
JavaScript, C++, Ruby,
Python, PHP, +others
Intel® Developer Zone
200+ sensors
JavaScript, C++, Python, Java
API description
Code Samples
AWS* MQTT Client
Subscribe to monitor incoming
data
Publish to send data back to
device
AWS* Rules Engine
Redirect data to:
• Database
• SMS service
• AWS* Lambda
• Etc.
DynamoDB
• Dynamic Database
• Sort Data
• See metrics on usage
Out of Box to Cloud
Total Time: ~ 1.5 hour
Total Code: 30 lines
Easy!
Demo!
Thank You!

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Intel SoC as a Platform to Connect Sensor Data to AWS

  • 1. © 2016, Amazon Web Services, Inc. or its Affiliates. All rights reserved. Martin Kronberg, Intel IoT Evangelist 6/21/2016 Intel SoC A Platform to Connect Sensor Data to AWS
  • 2.
  • 3. T H A N K S T O O U R F R I E N D S A T :
  • 4. Intel Confidential Copyright © 2016, Intel Corporation. All rights reserved. Other names and brands may be claimed as the property of others. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS AND IS “AS IS.” NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change. Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user. Intel, Intel Inside, Intel Atom and Intel Core are trademarks of Intel Corporation in the U.S. and other countries. Other names and brands may be claimed as the property of others. Copyright © 2016, Intel Corporation. All rights reserved.
  • 6. 1. IDC 2. MC/EDC: The Digital Universe of Opportunities 3. Goldman Sachs 4. IMS Research The Internet of Things is … Home Mobile Network Industrial Gateway DC/Cloud 44ZETABYTES2 3 COST OF SENSORS 2X PAST 10 YEARS COST OF BANDWIDTH 40X PAST 10 YEARS COST OF PROCESSING 60X PAST 10 YEARS 50BDEVICES1 85%UNCONNECTED4 21 212BSensors
  • 7. 7 1. Research & Development Roadmap for Emerging HVAC Technologies. U.S. Department of Energy (October 2014). 2. The ‘Internet of Things’ Is Now, Connecting the Real Economy. Morgan Stanley (April 3, 2014). 3. How much electricity is lost in transmission and distribution in the United States? U.S. Energy Information Administration (April 6, 2016). The Internet of Things (IoT) is fueling innovation across a range of industries to optimize processes and increase efficiency. 4. "How Manufacturers Use IoT for Operational Efficiencies." Industry Week (October 21, 2015). 5. Tech Today Video Series Episode 3: Vnomics. Intel (March 4, 2014). Need for IoT TRANSPORTATION Fleet management, freight tracking, urban congestion management Enhanced driver coaching can save nearly 7% on fuel costs.5 RETAIL Point of sale, vending machines, supply chain Supermarket cost-to-sales ratios can be reduced 2% by automatic checkout.2 SMART BUILDING Energy use monitoring; sensors in heaters and chillers to find inefficiencies Greater efficiency for HVAC systems, which account for 41% of U.S. building energy use.1 INDUSTRIAL & MANUFACTURING Assembly-line equipment reporting, inventory management; automation Manufacturers using IoT report 82% increased efficiency and 49% fewer defects.4 ENERGY Environmental data logging, substation monitoring, grid efficiencies IoT can optimize energy grids, which lose ~6% during transmission and distribution.3
  • 9. THINGS (ENDPOINTS) CLOUD-BASED ANALYTICS The Intel® IoT Platform: A blueprint for connecting devices into the cloud for developers to better leverage data, customize, and scale NETWORK (DATA CENTER) Copyright © 2016 Intel Corporation. All rights reserved. Intel® Architecture Powers the Internet of Things GATEWAY 9
  • 10. Yocto* Project Linux* OS image Supports Intel® Edison, Intel® Galileo boards as well as Intel® IoT Gateway Middleware libraries for IO and sensors / actuators IDEs and tools to create, run, debug and optimize IoT solutions C/C++, JavaScript*, Python* and Java* programming language support Advanced power efficiency/performance optimization tools Examples with WindRiver* Helix* Cloud IoT Cloud and Edge Analytics for data collection, visualization and analytics Intel® IoT Developer Kit OS Image (Intel® Edison, Intel® Galileo boards) IoT OS *Other names and brands may be claimed as the property of others. Intel® IoT Developer Kit Overview For more details go to https://software.intel.com/iot Intel Edison Board IO Library (SPI, GPIO, I2C, AIO, UART) HardWareOS Image CloudEdge Analytics Intel Galileo Board Intel® IoT Gateway Middleware Communication Stack (Wi-Fi, Bluetooth® Technology, ZigBee*, etc.) Manageability, Security, RealSense SDK, etc. API Bindings (C/C++, Node.JS*, Python*, Java*) Sensor & Actuator Libraries IDE/Tools Prototype Evaluate/ Prototype / Product IBM* BlueMix*, Microsoft* Azure*, Amazon* AWS*, General Electric Predix* and more... Intel® D2000 Sensors / Actuators 10
  • 12. Almost all IoT solutions start with a proof of concept • Fast and Easy to develop • Familiar Tools • Low cost • Mature and stable offering • Reliable and scalable • Flexible and secure
  • 13. What is a System On Module (SOM)? • Falls between an MCU and Single- Board Computer • Includes processor, RAM, I/O • Lacks standard I/O peripherals • Commonly requires carrier board • Offers densely packed, highly integrated components • Typically low-energy • Primary goal: Accelerated time to market, reduced cost
  • 14. SOM Strengths and Weaknesses Strengths: • Easier to upgrade compute to next generation by swapping on carrier • Makes no assumptions about required I/O, customer can tailor carrier to their needs • Faster time to market, especially if software and tools are provided to program the core unit • FCC and global pre-certification saves time and money Weaknesses: • Module must be compatible with carriers across upgrades for swappable value proposition to emerge • Connection points can be source of system fragility • Assumes the need for a carrier, which can take up more space than a “board-down” implementation
  • 15. Intel® Edison Module Dual-Core Intel® Atom™ processor @ 500 MHZ Wi-Fi*, Bluetooth® 4.0 (LE) 32-bit Intel® Quark™ Microcontroller @ 100 MHZ 1 GB RAM, 4 GB Flash 40 multiplexed GPIO with multiple expansion boards for total project design flexibility
  • 16. Intel® Edison Module Key Benefits • Many supported communication protocols • High density 70-pin connector allows small footprint • Programmable with C++, JavaScript, Python, and Java • Extensive Sensor Library • High compute power with x86 • Low Power consumption • FCC Wireless certification for Wi-Fi* and Bluetooth® worldwide • Simple integration with cloud services such as AWS*
  • 17. Intel® Edison Communication Protocols • WiFi • Bluetooth 4.0 • I2C • I2S • UART • SPI
  • 18. Intel Expansion Boards Intel® Edison • 70 pin connector • Hirose DF40 Series • Breakout Board • Arduino* expansion board • Easy to build your own board
  • 20. Introducing MRAA and UPM • • • • • • • •
  • 21. Sensor Support and Control Protocols 200+ sensor drivers for maker and industry Leverages MRAA communication layers Adds ZigBee, Z-Wave, Bluetooth, Modbus, BACnet, RS422/485 Industrial Sensors: Aeon Labs*, Bosch*, Comet*, Maxim Integrated*, Omega*, Veris*, and others 2
  • 22. Wireless Certification FCC Certification (United States) is complex, time consuming and expensive Can cost $250,000 and take 6+ months to certify a wireless module globally Worldwide certification can take months and cost hundreds of thousands of dollars SOMs allow you to avoid this cost
  • 24. Tektyte* Edi-Expand Raspberry Pi*-like IO for Intel® Edison
  • 25. Modulowo* Explore* Expansion modules to add GPS and other functionality via DuoNect
  • 27. Case Study: KINETIC* Objective: Provide workers with a solution to reduce lifting-related injuries by unsafe lifts in the workplace. Project: Wearable waist and wrist- based lift trackers Team Size: ~10 Location: New York, NY Website: www.wearkinetic.com
  • 28. KINETIC* Product Prototyped on Intel® Edison board, replacing alternate SoC Used I2C, Bluetooth® Low Energy, Wi- Fi*, GPIO Acquired 2,000+ field experience with Intel Edison Python* micro-service for code updates and deployment 1500mAH LiPo battery Cost: $300
  • 29. Case Study: Dronesmith Technologies* Objective: Enable drone developers with an Intel® Edison compute module based prototyping and experimentation platform “Luci” Project: Luci flight controller, QK II drone Team Size: ~10 Location: Las Vegas, Nevada Website: www.dronesmith.io
  • 30. Dronesmith Technologies* Luci Dual processor technology (RISC-based flight core and Intel® Edison compute module) 10 Degrees-Of-Freedom dual accelerometers, gyros, magnetometers and barometer 2xUART, 1xI2C, Spektrum*-IN, PPMS.Bus- IN, 6xServo Out, 2xmicroSD, 3xUSB Cost: $400
  • 31. Case Study: Robodub, Inc. Objective: Live-action streaming for robots and drones, gamification of robotics Project: RamBot Team Size: ~12 Location: Bellevue, Washington Website: www.robodub.com
  • 32. Intel® Edison and AWS* : Rapid Cloud Prototyping
  • 33. Intel® Edison and Grove* IoT Starter Kit Powered by AWS* • Temperature&Humidity Sensor • Moisture Sensor • Light Sensor • UV Sensor • PIR Motion Sensor • Encoder • Button • LCD RGB Backlight • Relay • Servo • Buzzer
  • 34. Setup Intel® Edison • Download & Flash latest firmware • Setup SSH • Connect to WiFi • ~15 min
  • 35. Intel® XDK IoT Edition IDE for JavaScript: • Push code over WiFi • Install Packages • Access SSH terminal • Install AWS* SDK • Easily share projects across XDKs • ~15 min
  • 36. Create AWS* IoT Thing AWS* IoT Console: • Create Things • Create Services • Create Rules • ~15min
  • 37. AWS* IoT Device Connection • Certificate Generation • Code Snippet • Link to GitHub
  • 38. AWS* Repository Sample code for AWS* SDK to connect devices Extensive API documentation JavaScript, C++, Ruby, Python, PHP, +others
  • 39. Intel® Developer Zone 200+ sensors JavaScript, C++, Python, Java API description Code Samples
  • 40. AWS* MQTT Client Subscribe to monitor incoming data Publish to send data back to device
  • 41. AWS* Rules Engine Redirect data to: • Database • SMS service • AWS* Lambda • Etc.
  • 42. DynamoDB • Dynamic Database • Sort Data • See metrics on usage
  • 43. Out of Box to Cloud Total Time: ~ 1.5 hour Total Code: 30 lines Easy!
  • 44. Demo!