This guide simplifies application design and accelerates time-to-market by defining basic, system-level Interconnect, Passive and Electromechanical (IP&E)building blocks. In addition, the guide provides a “who’s who” of IP&E technology manufacturers and demonstrates how Avnet can meet a full breadth of product requirements and, in the process, add exceptional value to our customers.
Apidays Singapore 2024 - Building Digital Trust in a Digital Economy by Veron...
Avnet IP&E Technology Guide: Interconnect, Passive and Electromechanical Products
1. IP&E Technology Guide
Interconnect, Passive and Electromechanical Products
Quick Reference
Version 6.0
IP&E Information at Your Fingertips @ www.em.avnet.com/ipezone
2. Table of
Contents
This guide simplifies application design and accelerates
time-to-market by defining basic, system-level Interconnect,
Passive and Electromechanical (IP&E) building blocks.
In addition, the guide provides a “who’s who” of IP&E
technology manufacturers and demonstrates how Avnet
can meet a full breadth of product requirements and, in the
process, add exceptional value to our customers.
IN THIS GUIDE
>> Connectivity,
product, commodity and
vertical market information
>> Functional
connectivity block diagrams, along with
common system blocks, to facilitate association
of IP&E and semiconductor products
>> Product-specific
sections that spotlight suppliers and
technologies and provide valuable information that can
be used throughout the product development lifecycle
1
IP&E Technology Guide 6.0
2
3
4
6
7
8
9
11
12
13
14
15
16
17
18
19
20
21
The Avnet IP&E Story
Connectivity Block Diagram
System Blocks: IP&E Support
Capacitors
Circuit Protection
Filters
High-Reliability and Military
Inductors
Commercial Interconnect
Magnetics
Power Supplies
Relays
Resistors
RF and Wireless
Switches and Sensors
Thermal Management
Timing Solutions
IP&E Physical Value-Add Services
3. THE AVNET IP&E STORY
Avnet Electronics Marketing is committed to successfully supporting
our customers’ Interconnect, Passive and Electromechanical (IP&E)
requirements with best-in-class people, products and services. We
achieve this goal by leveraging the manufacturing and technology
expertise of our industry-leading supplier partners, investing in
dedicated IP&E resources and tools, and creating value for our
customers by providing support throughout the product development
lifecycle. Avnet’s unparalleled strength and scale allow us to deliver
specialized IP&E solutions that integrate differentiated product and
service offerings, supported by world-class design chain and supply
chain expertise.
LINE CARD
VALUE-ADD SERVICES
eCOMMERCE
INVENTORY
DEDICATED RESOURCES
IP&E ECOSYSTEM
Line Card/Technology Coverage
eCommerce − THE POWER OF AVNET AVAILABLE ONLINE
»»68 manufacturers supply products
The power of Avnet is conveniently online at AvnetExpress.com. At
AvnetExpress.com, you can do a parametric search, cross reference parts and
check pricing and availability as well as delivery status. You can also access Web
content, which includes publications, featured products, product news and special
offers that support new product releases from our supplier partners.
across 15 different technologies
»»The top manufacturer in every category
is on the Avnet EMA line card
Commercial, High-Reliability
and Military IP&E Inventory Position
»»$150 to $200 million on-hand and an additional
$150 to $200 million in the pipeline
»»Appropriate inventory mix across commodities: interconnect
(50%), passive (30%) and electromechanical (20%)
Dedicated Customer Resources
»»350+ Sales and Marketing Representatives and Managers
»»350+ Field-deployed Account Managers
»»150+ Field Applications Engineers
»»125+ employees dedicated to providing IP&E materials,
pricing, marketing and technical support
Services
Avnet offers a wide range of IP&E services from any point in the
design cycle from concept to architectural design, to new product
introductions and on through next generation modification or
end-of-life. With offerings that run the gamut from Web seminars
to connector assembly, Avnet offers it all.
Design
»»Parametric search
»»Technical support
»»Development tools & kits
»»New product introduction
Products
»»Over 5 million parts online
»»Over 1.5 million parts in quantities of 1
»»Cut reel program
Search/Sort/Compare
»»Top sellers
»»Alternate parts
»»Prototype quantities
»»In stock only
Order and Delivery
»»No minimum orders
»»No handling charges
»»Global and same day shipping
»»Bill of Material upload
IP&E Technology Guide 6.0
2
4. Connectivity Block Diagram
SOCKETS &
HEAT SINKS
MEMORY OR
OTHER HIGH
VALUE CHIPS
FILTERING/
MAGNETICS
CIRCUIT
PROTECTION
IO
CONNECTORS
“On Board” Interconnect, Passive & Electromechanical Products
CARD EDGE
PCB HEADER
MEZZANINE
CLOCK
DRIVERS
DISCRETE POWER
BEADS, CHOKES,
CAPACITORS, EMI FILTERS
& TRANSFORMERS
SWITCHES &
SENSORS
CAPACITORS,
INDUCTORS &
RESISTORS
MOST OF THESE PRODUCTS HAVE RF & WIRELESS
AND/OR HIGH-RELIABILITY & MILITARY PRODUCT VERSIONS
APPLICATION SPECIFIC/WIDE USAGE
RELAYS
DC POWER
TIMING
OSCILLATORS/
CRYSTALS
HEAT SINKS
MONSTER CHIP:
MCU, MPU, FPGA,
ASIC, ETC.
BACKPLANE
BOARD TO BOARD INTERCONNECT
WIRE TO BOARD CONNECTORS
“Off the Board” Products
FILTERS,
POWER ENTRY MODULES
CABLE ASSEMBLIES
FANS & BLOWERS
AC/DC POWER SUPPLY
3
RELAYS & CIRCUIT
BREAKERS
CONNECTORS
IP&E Technology Guide 6.0
SWITCHES &
SENSORS
5. System Blocks: IP&E Support
Analog Signal Chain
TIMING
DEVICES
SENSOR
OP-AMP
GAIN AMP
FILTER
FILTER
TIMING
DEVICES
ADC
uP/FPGA/ASIC
OPTIONAL BIAS
FILTER
DAC
TIMING
DEVICES
Filters
Sensors
Timing devices
Capacitors
Inductors
Resistors
Flow
Position
Pressure
Proximity
Temperature
Clock Drivers
Crystals
Oscillators
Resonators
Battery/Power Management
VDC1+
AC/DC
MODULE
VDC2+
DC/DC
MODULE
AC LINE
VDC3+
Circuit
Protection
PWM
CONTROLLER
Power
Modules
Power Entry
Modules
MOSFET
DRIVER
Beads
Capacitors
Chokes
Inductors
Relays
Resistors
Transformers
Filters
PFC
Discrete
Power
Circuit Breakers
Fuses
MOVs
Thyristors
Varistors
PLUG
AC/DC
DC/DC
OPTO ISOLATION
VREF AND
SECONDARY
PWM
IP&E Technology Guide 6.0
4
6. System Blocks: IP&E Support
Off the Board
Processing/User Interface
SERIAL PLUG
RJ-11
RJ-45
PUSH BUTTON
MAGNETICS
FILTERS
I/O DEVICES
IDENTIFICATION
ETH PHY
KEYPAD
CABLE ASSEMBLIES
THERMAL MANAGEMENT
SYSTEM IO CONNECTORS
SYSTEM PCB OR CHASSIS
PROCESSOR
MEMORY CONNECTORS
SIM CARD
TIMING
DEVICES
CONNECTORS
ANTENNA
POWER SUPPLIES
CIRCUIT
PROTECTION
SMART CARD
RELAYS
SOCKETS
THERMAL
MANAGEMENT
USB PORT
HDMI
DISPLAY PORT
FIREWIRE
MICRO SD CARD
Cable
Assemblies
Cable/Wire
Identification
Circuit
Protection
Connectors
Filters
Magnetics/
Filters
System IO
Connectors
IO devices
Data IO
Connectors
Memory
Connectors
Board to Board
User Interface
Wire to Board
Labels
Circuit Breakers
Board to Board
Wire to Board
EMI/EFI
Power Entry
Modules
RF/IF
Relays
Thermal
Management
Keypads
Potentiometers
Serial/RJ-11/
RJ-45
Switches and
Sensors
microSD Cards
SD Cards
SIM Cards
SMART Cards
Power
Supplies
Backplanes
Board to Board
Interconnects
Card Edges
Mezzanines
PCB Headers
Dials
DisplayPorts
DVI/HDMI/
FireWire/USB
Antennas
Chokes
Ferrite Beads
Integrated
Modular Jacks
RF/IF Filters
Transformers
Chip
Puck
Stand-Alone
Surface-Mount
Tab
Whip
AC/DC
DC/DC
UPS
Electromechanical
Solid-State
AC Fans
DC Fans
Fan Trays
Timing
Devices
Circuit
Protection
Sockets
thermal
Management
Clock Drivers
Crystals
Oscillators
Resonators
ESD Diodes
Fuses
Thyristors
Varistors
Memory
Sockets
Processor
Sockets
Fans
Heatsinks
Wired and RF Connectivity
TIMING
DEVICE
FILTER
MODULE
FILTER
PA
FILTER
CONNECTOR/CABLE
MODULES
DAC
RF ANTENNA
PROCESSOR
VGA
FILTER
MODULE
LNA
FILTER
CONNECTOR/CABLE
MODULES
ADC
RF ANTENNA
RF/IF AMP
TIMING
DEVICE
5
IPE Technology Guide 6.0
TIMING
DEVICE
Passive
Antennas
Coax Cable
Assemblies
RF Adapters
RF Connectors
RF/IF AMP
TIMING
DEVICES
Interconnect
Couplers
Phase Trimmers
RF Chip Capacitors
RF Chip Inductors
RF Frequency Control
RF Trimmer Capacitors
Splitters/Combiners
Terminations
7. Capacitors
Technology
Component Sourcing Considerations
Capacitors are passive components commonly used in analog and digital
»»Device type or application
electronic systems to separate AC and DC electrical currents. The devices
»»Termination style/package (surface mount, axial leaded, radial leaded,
store energy between two conducting plates separated by an insulator
disk, screw terminal and snap-in)
or dialectric. When capacitors store an electrical charge up to a certain
»»Case size (surface mount)
level, they then releases them. Capacitance, or the amount of current that
»»Lead spacing (leaded)
is stored, is measured in farads. Capacitors permit AC signals to pass
»»Material (ceramic, tantalum, aluminum electrolytic, film and glass)
through them with little opposition but block the passage of DC signals.
»»Capacitors of various types and sizes are used in every electronic circuit.
Anytime a semiconductor is used, a capacitor will also be used. The type
of capacitor used is dependent upon application requirements.
»»Voltage
»»Tolerance
»»Dialectric (ceramics; NPO/COG, X7R, X5R, Z5U and Y5V)
»»Typically, any application that requires a capacitor will also need
»»On board power applications will typically require both ceramic and
aluminum capacitors.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
•
Tusonix
•
•
•
•
TDK (EPCOS)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TAIYO-YUDEN
•
•
Samsung
•
Surge Components
require stability and wide temperature ranges.
•
•
•
•
•
•
•
•
•
•
Stackpole
»»Film capacitors are found in high-frequency applications that typically
CAPACITOR Product/Type
Aluminum Leaded
Aluminum Polymer
Aluminum Screw Terminals
Aluminum Snap In
Aluminum Surface Mount
Ceramic Chip
Ceramic Disk
Ceramic Leaded
Film Chip
Film Leaded
Glass
Super Capacitors
Tantalum Axial
Tantalum Chip
Tantalum Conformal Coated
Tantalum Polymer
Tantalum Radial
Tantalum Wet
Panasonic
devices hold a large amount of energy, making them ideal for use in
high-capacitance applications.
NIC
»»Aluminum capacitors are often found in low-cost applications. These
Murata
other devices with clean DC power.
AVX
»»Tantalum capacitors are mainly used on voltage lines that feed ICs and
KEMET
COG/NPO, X7R, Z5U and are targeted at low capacitance applications.
Cooper Bussmann
additional passive devices such as inductors, resistors and magnetics.
»»Ceramic capacitors feature ceramic dialectrics commonly referred to as
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
IPE Technology Guide 6.0
6
8. »»Applications that require ESD protection always need some type
of circuit protection.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
TE Connectivity
Schurter
Nidec Copal
•
Murata
»»Most boards require some type of circuit protection.
•
•
Bourns
strikes, electrostatic discharge (ESD) and external disruptions.
Bourns
system surges at start up. Common over voltage causes include lightning
Circuit Protection
OVER CURRENT
PRODUCT/type
Circuit Breakers
Line Potection Modules
Resettable Fuses
One-Time Use
Telecom Fuses
AVX
fluctuations, wire or trace shortages, faulty wiring, and lighting and
Bel
are designed to withstand. Common over current causes are AC power
AVX
against current in excess of what the circuit and surrounding components
NIC
Over current and over voltage protection devices provide protection
Cooper Bussmann
Technology
Carling Technologies
Circuit protection
•
•
•
»»Target applications include telecom and networking.
»»Operating current
»»Voltage rating
»»Ambient temperature
»»Accessories (fuse holders, clips, etc.)
»»Tolerance
OVER VOLTAGE CIRCUIT PROTECTION
»»Type
»»AC/DC operating voltage
»»Peak current
»»Temperate range
7
IPE Technology Guide 6.0
•
•
•
•
•
•
•
•
•
Vishay
»»Type (standard or resettable)
Circuit Protection
OVER VOLTAGE
PRODUCT/type
ESD Protection Devices
Gas Discharge Tubes
Thyristors
TVS Diodes
Varistors
TDK (EPCOS)
OVER CURRENT CIRCUIT PROTECTION
Stackpole
Component Sourcing Considerations
Abracon
agnetically actuated and thermally actuated devices.
TE Connectivity
»»Circuit breakers are categorized in two groups:
•
•
•
9. Filters
RF/IF and microwave filters are devices that pass or reject signals by
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TOKO America
Pulse
•
Panasonic
Murata
•
•
•
•
Steward
ensure effective circuit performance.
•
•
•
Schurter
the unwanted noise. Both EMI and RFI filters eliminate disturbances to
CTS
energy (electromagnetic), while RFI refers to the frequency range of
RF/IF FILTER PRODUCT/TYPE
Balun Transformers
IF Band Pass Filters
RF Band Pass Filters
RF Duplexers
RF Low Pass Filters
SAW Resonators
Panasonic
radio frequency interference (RFI). Technically, EMI refers to the type of
AVX
Electromagnetic interference (EMI) is often used interchangeably with
Abracon
from other devices within a system.
TDK (EPCOS)
Filter products are used to regulate or suppress line voltage imperfections
TAIYO-YUDEN
Technology
•
•
•
•
•
•
•
•
frequency. The filter design determines the amount of insertion loss and
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
•
Tusonix
•
TE Connectivity
•
•
TDK (EPCOS)
Murata
UL listing mark, UL recognized component mark, VDE component
mark and Mil Spec.
KEMET
»»Important approvals for EMI and RFI filters include CSA mark,
•
Bourns
»»Target applications include networking and medical equipment.
EMI/RFI Product/type
Chokes
EMI Filters
Ferrite Beads
Ferrite Cores
Power Entry Modules
AVX
electromechanical devices and fans.
»»Typically used in applications that require EMI/RFI protection.
API Delevan
»»Often used with power supplies, power entry modules, power cords,
Abracon
types of RF and microwave filters.
TAIYO-YUDEN
phase shift for signals that pass through the filter. There are several basic
•
•
Component Sourcing Considerations
»»Type
»»Application and agency approval requirements
»»Rated input/output voltage
»»Amount of filtering (in amps)
»»Leakage
»»Package
IPE Technology Guide 6.0
8
10. High-Reliability and Military
Technology
inventory experts, a comprehensive bill of material and drawing database
and the industry’s largest value-add ISO-9002, MIL-I-45208, UL and CSA
certified assembly operation. Avnet also offers a comprehensive portfolio
of space and RadHard products.
Component Sourcing Considerations
»» vnet can meet Mil-Spec and commodity-specific sourcing requirements.
A
»»In many cases, environmental or industry-specific guidelines or
product certification is required.
»»These products can be called out by MIL and/or commercial part numbers.
»»Many products can be sourced with accessories such as end bells,
back shells and covers.
9
IPE Technology Guide 6.0
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Weidmuller
•
•
Tri-Star
•
•
•
TE Connectivity
Glenair
FCI
•
•
•
Molex
Avnet has a full team of dedicated Hi-Rel/Mil-Aero/industrial product and
ITT Interconnect
Solutions
specifically engineered to survive in industrial applications/environments.
Interconnect
Product/type
Arinc 404/600
D-Sub IO
Hi-Rel Circular
MIL-C-21097
MIL-C-22292
MIL-C-26482
MIL-C-26500
MIL-C-28840
MIL-C-39012
MIL-C-39029
MIL-C-5015
MIL-C-55074
MIL-C-55302
MIL-C-81511
MIL-C-81659
MIL-C-83723
MIL-C-85049
MIL-DTL-24308
MIL-DTL-38999
MIL-DTL-83733
MIL-PRF-83513
MIL-T-81714
Power/Industrial
Tubing/Molded Shapes
Conesys
without the testing certifications, or simply ruggedized components
AEP
off the Shelf) products, which are equivalent to Mil-Spec parts but
AVX/ELCO
Government. High-reliability components are either COTS (Commercial
Amphenol
product drawings and testing criteria established by the United States
Amphenol PCD
Military and aerospace products are built to specifications based on
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
11. High-Reliability and Military
electromechanical products. Users can build part numbers from descriptions
and technical attributes and perform side-by-side comparisons of similar
components.
Mil-Spec
Avnet offers the broadest selection of mil-spec products and custom valueadd services available today. These products and services, such as military
connector assembly, can be accessed via our Web site, which is powered
by the industry’s largest online component database. Behind the scenes,
this database is maintained and grown by defense-aerospace product and
inventory experts. This expertise is also evident in the “build your own bill
of materials” functionality embedded in our Web site. Avnet also offers
a comprehensive portfolio of space and RadHard products enhanced by
exclusive space inventory programs with top component manufacturers.
Special programs include data pack management. Avnet can also provide
advice and technical insight into ruggedized products as well as test data to
support specific customer requirements.
COTS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TE Connectivity
•
•
Sensata/Airpax
Schurter
Esterline
Power Systems
Electromechanical Product/type
Circuit Breakers
Fans Blowers
Industrial/COTS Relays
MIL-PRF-28750
MIL-PRF-28776
MIL-PRF-39016
MIL-PRF-6106
MIL-PRF-83536
MIL-PRF-83726
MIL-R-5757
ebm papst
introductions and provide end-to-end supply chain management.
•
•
•
•
•
•
•
•
•
•
products. The key to successfully supporting COTS requirements is a
relationships with manufacturers to the ability to support new product
•
•
Avnet is one of the largest distributors of COTS components and embedded
proper ecosystem — from product and program management to strategic
Vishay
Passive Product/type
Ceramics: MIL-PRF-11015
Ceramics: MIL-PRF-123
Ceramics: MIL-PRF-20
Ceramics: MIL-PRF-39014
Ceramics: MIL-PRF-55681
Inductors: MIL-PRF-15305, 39010, 83446
Magnetics: MIL-PRF-21038/27
Metal Film Resistors: MIL-R-122, 10509,
39017, 55182, 55342 22684
Network Trimmers: MIL-R-22097, 27208,
39015 39035
Network Trimmers: MIL-R-83401
Tantalums: DSCC10004
Tantalums: MIL-PRF-26655
Tantalums: MIL-PRF-39003
Tantalums: MIL-PRF-39006
Tantalums: MIL-PRF-3965
Tantalums: MIL-PRF-49137
Tantalums: MIL-PRF-55365
Tantalums: MIL-PRF-93026
Wire Wound Resistors: MIL-R-26, 93,
18546, 39005/7/9
•
•
•
•
•
•
•
•
•
•
•
IPE Technology Guide 6.0
Teledyne
to complete portfolios of semiconductor, interconnect, passive and
Pulse
resistors to FPGAs. Our online parametric search tool provide easy access
KEMET
manufacturers, which allow us to support entire bills of materials from
AVX
API Delevan
Avnet has strategic global relationships with best-in-class component
Bourns
Differentiated Product Options Commercial Grade
•
•
•
10
12. An inductor is a coil of wire wrapped around a core of air, iron, or ferrite
(a compound made of iron particles mixed in a non-conducting epoxy
cement material). Inductors are not commonly found in digital systems,
but they may be used in volume in certain types of analog systems,
including RF and network interface applications.
Inductors function as filtering or choke components and are mainly used
in tuned circuits to block high-frequency AC signals. They pass DC easily,
but block AC signals. This action is the opposite of what a capacitor does.
Inductors are used to suppress or limit the flow of alternating current
without affecting the flow of direct current.
»»Inductors of various types and sizes are often used in electronic circuits.
»»Typically, any application that requires an inductor will also require
additional passive devices such as capacitors, resistors and magnetics.
»»Inductors have broad application potential. Target markets include
automotive, cellular, computer, consumer, industrial, power and
telecommunications.
Component Sourcing Considerations
»» Package
»»Inductance range
»»Q factor
»»Current
»»DC Resistance
11
IPE Technology Guide 6.0
INDUCTOR
product/type
Chip Inductors
Leaded Inductors
Power Inductors
RF Inductors
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
Technology
Abracon
API Delevan
AVX
Bourns
Cooper Bussmann
KEMET
Murata
NIC
Panasonic
Pulse
Samsung
Stackpole
Sumida
TAIYO-YUDEN
TDK (EPCOS)
TOKO
Inductors
•
•
•
•
13. Technology
Connectors are used to connect two or more electrical circuits and typically
feature a plastic or metal housing and metal contacts/terminals, with the
exception of fiber optics, which use fiber to transmit signals. For general
reference, interconnect products can be divided into six levels of packaging.
»»Many interconnect products conform to industry standards developed by
committees comprised of, among others, representatives from a number
of Avnet’s connector suppliers. Avnet routinely aggregates information
on products that are specifically designed to meet these standards.
»»Look for the connectivity points based on the level of packaging
(i.e., socketing a high value IC, connecting two boards, etc.).
»»In most systems, the main PCB (motherboard, backplane, etc.) will
need to connect to smaller boards, system IO, etc.
»»Avnet also stocks and distributes custom and off-the-shelf cable
assemblies from most of the connector suppliers listed on our line card.
Six Levels of Interconnect Packaging
»»Primary connection (IC chip to package)
»»Components to circuits (device to board)
»»Circuit to circuit (board to board)
COMMERCIAL
INTERCONNECT
product/type
Backplane
Cable
Card Edge
Circular
D-Sub
Electrical
Products
Fiber Optic
IO
PCB
Power
Rack Panel
Rectangular
Power
Sockets
Terminal Blocks
3M
ALPS
Amphenol
Amphenol PCD
Amphenol TCS
AVX/ELCO
Bel
Cooper Bussman
FCI
Glenair
ITT Interconnect Solutions
Molex
Panduit
Samtec
TE Connectivity
Vishay
Weidmuller
Commercial Interconnects
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
»»Sub-assembly to sub-assembly (wire to board)
»»Sub-assembly to IO (panel mount)
»»System to system (box to box, cable assemblies)
Component Sourcing Considerations
»»Type (backplane, card edge, IO, PCB, power, etc.)
»»Configuration (board to board, wire to board (cable to board), wire to wire
(cable to cable), panel mount (IO) and box to box (cable assemblies))
»»Contact count and spacing
»»Gender
»»Contact plating
»»Termination style (crimp, IDC, through hole, surface mount, wire wrap
and press fit)
»»Design options (keying, shielding and accessories)
»»Industry standards (IEEE1394, USB 2.0)
»»Control input and output requirements
IPE Technology Guide 6.0
12
14. »»Ideal for applications that transmit voice, data and/or video.
»»Some applications that use RJ-11 and RJ-45 connectors may also
benefit from integrating magnetics products.
»»There is a one-to-one correlation between communication ICs and
magnetic transformers; the LAN or telecom transformer must be
matched to an IC.
»»Designs requiring fast clock rates and multi-line IO interfaces will often
need magnetics.
Component Sourcing Considerations
»»Type (LAN modules, telecom modules, common mode chokes,
filtered RJ jacks, broadband modules and power modules)
»»Application (T1/E1, 10Base-T, 100Base-T, 1GBase-T, 10GBase-T)
»»Matching IC
»»Ports supported (single, dual, quad and octal)
»»Packaging
»»DC resistance, isolation voltage (chokes)
13
IPE Technology Guide 6.0
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
TDK (EPCOS)
Sumida
Pulse
•
•
•
•
•
•
•
Panasonic
common mode chokes and transformers are used to convert power.
MAGNETIC Product/type
Broadband Modules
Chokes
Integrated RJ Jacks
LAN Modules
Power Magnetics
Telecom Modules
Transformers
Murata
and convert voltage. In power applications, magnetics such as inductors,
Bourns
or down signal levels), suppress unwanted signals, filter noise emissions
Bel
magnetic products are used to isolate circuits, match impedances (step up
API Delevan
LAN, telecom and power applications. In LAN and telecom applications,
Abracon
Magnetic-based components are an integral part of electronic circuitry in
Molex
Technology
CK Components
Magnetics
•
•
•
15. Power supplies
AC to DC) and can also change voltage level values (i.e., 5 to 3.3 V).
»»A large variety of form factors, features and operating specifications are
available to address the unique power requirements of differing applications.
»»Complete power solutions often require several conversion stages
including AC-DC and DC-DC. The architecture used can significantly
influence the performance characteristics of the solution.
»»Power solutions are available as modular solutions or as discrete
component designs. Choosing the best solution for a given application
involves a make versus buy analysis.
DC/DC Power SupplY PRODUCT/TYPE
Isolated Bricks
Isolated Industrial
Point-of-Load (POL), Non-Isolated
Specialty - ATCA
Specialty - POE
Specialty - VRM
Specialty - RF
Specialty - LED
Specialty - Military
DOSA Multi-Source Member
POLA Multi-Source Member
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TDK-Lambda
GE
Critical Power
load. For example, they can convert current from one form to another (i.e.,
SL Power
Emerson
Network Power
characteristics that are acceptable for distribution or consumption by a
Power-One
Bel
•
•
•
•
•
•
Power supplies convert an available power source into voltage and current
Martek Power
Aimtec
Technology
•
•
•
•
•
•
•
•
•
•
•
•
•
•
your Avnet support team early on in the design process)
»»Feature requirements (tracking, load sharing, sequencing, IO interface,
remote ON/OFF, remote sensing, I2C, etc.)
»»Options (PFC, remote sensing, inhibit, enable, voltage adjustability,
current share, hot swap and redundant (N+1))
»»Thermal Environment (Operating temperature, start-up temperature,
airflow and heat sinking)
»»Efficiency (Energy Star, 80 PLUS, etc.)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Power-One
•
•
•
•
•
•
•
•
•
•
Power Source PRODUCT/TYPE
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Mide Technology
»»Agency approvals (UL, CSA, TUV, CE and IEC)
TDK-Lambda
•
Solartech
»»Power architecture and budget (be sure to share this information with
•
Solar-Rigid Crystalline Panels/Modules
•
Solar-Custom Panels/Modules
•
•
Vibration+Solar-Energy Harvesters
•
DC-AC Inverter
PRODUCT/TYPE
Solar
Emerson
Network Power
Vibration-Piezoelectric Energy Harvesters
•
Power Storage PRODUCT/TYPE
House of
Batteries
»»Input voltage, output voltage and output current (Power = V x I)
•
SL Power
Component Sourcing Considerations
AC/DC Power SupplY PRODUCT/TYPE
Board Mount
Compact PCI
DIN Rail
Externals (AC Adapters)
Front Ends Rectifiers
Linear
Modular-Configurable Power
Open, U-Channel, Enclosed
Power Factor Correction (PFC) Modules
Specialty - Medical Rated
Specialty - POE
Specialty - LED Lighting
Specialty - Military
Martek Power
everything in between, require power supplies.
GE
Critical Power
»»Most electronic components, from analog to programmable logic to
Aimtec
modules. The most popular being the Distributed-power Open
Standards Alliance (DOSA) and the Point-Of-Load Alliance (POLA).
Emerson
Network Power
»»Multi-source agreements exist for some DC-DC power supply
Custom Battery Pack Design
•
Standard Batteries (AA,C,D,SLA, etc.)
•
IPE Technology Guide 6.0
14
16. Relays
continues to outpace the overall relay market. This is occurring because
today’s circuit designs require high-reliability, IO isolation, high-speed
switching, logic IC compatibility and noise filtering, all of which can not
be sustained by electromechanical relays. Electromechanical relays,
however, still lead in applications that must switch between AC and DC
and that need very high-voltage and/or high-current ratings with low, offstate leakage, all at the lowest cost.
»»Ideal for applications with power switching and signal
isolation requirements.
»»It’s important to remember that relay types are often applicationspecific (i.e., high-frequency, low-power signal, military, power,
general purpose, etc.).
Component Sourcing Considerations
»»Type
»»Contact switch rating
»»Coil voltage
»»Contact configuration (how many poles and throws?)
»»Mounting style
»»Dimensions
»»Military specification (where applicable)
15
IPE Technology Guide 6.0
RELAY PRODUCT/TYPE
Circuit Breakers
COTS Industrial
General Purpose
IO Modules
Military
Power
Reed
RF
Signal
Solid-State
•
•
•
•
•
•
•
•
•
•
•
*TE Connectivity relay brands: Agastat, Axicom, CII, Kilovac, OEG, PB and Schrack.
•
•
•
•
•
•
•
•
•
•
Teledyne
or mechanically (electromechanical relay). Solid-state relay growth
TE Connectivity
as a switch, except they are powered either electrically (solid-state relay)
Schurter
or close electrical contacts. These devices serve the same basic function
OMRON
Relays are electrically controlled devices that use a control signal to open
Esterline Power
Systems
Technology
•
•
•
•
•
•
•
17. Resistors
of resistivity. The materials are processed and shaped into packages with
metal leads or pads connected to the ends of the material. Some form of
marking identifies the resistance and tolerance of the resistor and is then
printed on the package.
»»Resistors of various types and sizes are used in every electronic circuit
so every application will need these devices.
»»It’s important to determine application-specific requirements. Anytime
a semiconductor is used, a resistor will also be used so information is
needed to narrow product selection.
»»Typically, any application that requires a resistor will also require
additional passive devices such as capacitors, resistors and magnetics.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vishay
Stackpole
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Samsung
•
Panasonic
•
NIC
•
Murata
RESISTOR PRODUCT/type
Carbon Film
Chip Resistor Arrays
Current Sense Resistors
Film Resistors Leaded
MELF Resistors
Thick Film Chip Resistors
Thick Film Networks Leaded
Thick Film Networks SMD
Thin Film Chip Resistors
Trimmer Pots Leaded
Trimmer Pots SMD
Wirewound Leaded
Wirewound Surface Mount
CTS
resistors are made by using materials that have known characteristics
Bourns
components, contain a specific amount of electrical resistance. All
ALPS
ohms. Resistors, which are one of the most commonly used passive
AVX
Resistance is opposition to electrical flow and is specified in units called
Nidec Copal
Technology
•
•
•
•
•
•
•
•
•
•
•
•
Component Sourcing Considerations
»»Termination style (surface mount or leaded)
»»Case size/package
»»Material (carbon film, carbon composition, cermet,
metal film, wirewound, etc.)
»»Wattage (1/4, 1/2, 3/4, 1, 2, etc.)
»»Resistance (ohms)
»»Tolerance
»»Type (concave, convex - chip arrays)
»»Circuit type (bussed, isolated - chip arrays and networks)
»»Number of terminals/pins (chip arrays and networks)
»»Number of turns (trim pots)
»»Sealed or unsealed (trim pots)
IPE Technology Guide 6.0
16
18. RF and Wireless
•
•
•
•
•
•
•
•
•
•
•
TE Connectivity
•
•
•
RF Connectors
•
TAIYO-YUDEN
•
•
Samtec
RF Adapters
•
Radiall/AEP
Coax Cable Assemblies
wireless solutions.
Pulse
products and other highly integrated designs comprise our RF and
•
Murata
Antennas
FCI
FETs, RF ICs, MMICs, ASICs, modules, RF interconnect and passive
•
RF Interconnect
PRODUCT/TYPE
3M
over 18 GHz, and from 1 mW to over 80 W. Discrete diodes, transistors,
Molex
and millimeter wave markets. Avnet’s solutions range from under 1 MHz to
ITT Interconnect
Solutions
create leading-edge standard and custom products for the RF, microwave
Emerson
Network Power
Avnet’s RF and wireless solutions combine complementary technologies to
Amphenol RF
Technology
•
•
•
•
•
•
•
Component Sourcing Considerations
»»Application type
»»Power output requirement
»»System voltage and current requirements
»»Special issues
»»Technology preferences (bipolar, MOSFET, LDMOS, GaAs, etc.)
»»Device packaging (surface mount, through hole, ceramic, plastic, etc.)
»»Temperature rating
»»Special testing or selection
17
IPE Technology Guide 6.0
RF Passive
PRODUCT/TYPE
Couplers
Phase Trimmers
RF Chip Capacitors
RF Chip Inductors
RF Frequency Control
RF Trimmer Capacitors
Splitters/Combiners
Terminations
Amphenol RF
API Delevan
AVX
CTS
FOX
KEMET
Murata
NIC
Pulse
Radiall/AEP
TAIYO-YUDEN
TDK (EPCOS)
TOKO
Tusonix
Vishay
»»Product and commodity specifics
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
19. »»Ideal for any application that needs to be turned on or off.
»»Switches can be board or panel/box-mounted depending on
the application.
»»Generally, board mount switches, especially DIP and tactile, are
high volume items with low ASPs.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TE Connectivity
•
Schurter
•
Panasonic
OMRON
•
•
•
•
•
•
TDK (EPCOS)
functions. Generally, the switch actuator differentiates the product type.
•
TAIYO-YUDEN
an extremely cost-effective and simple means of performing switching
SWITCH PRODUCT/TYPE
Dip
Keypad Keyswitch
Keylock
Rocker
Rotary
Slide
Snap-Action
Tactile/Push-button
Thumb-wheel
Toggle
Nidec Copal
or more metal contacts to make or break circuits. This technology is
Grayhill
These devices mechanically bring together or separate the surfaces of two
Bourns
The majority of products being sold are electromechanical devices.
ALPS
electric device. There are literally thousands of different switch configurations.
CTS
Switches are devices that make, break or change the connections in an
Carling
Technologies
Technology
CK Components
Switches and Sensors
•
•
•
•
»»Panel mount switches, especially in industrial applications, have
»»Contact configuration (SPST, SPDT, DPST, DPDT, 3PST, 4PST, etc.)
»»Packaging (size and mounting style)
Vishay
•
•
PUI Audio
Panasonic
OMRON
»»Coil voltage
•
•
Murata
»»Contact switch rating (in amps)
SENSOR PRODUCT/TYPE
Audio Indicators and Alerts
Flow Sensors
Magnetoresistive Sensors
Microphones
Pressure Sensors
Proximity Sensors
Speakers
Temperature Sensors
Thermistors
Bourns
tactile, thumb-wheel, toggle, trigger, keylock, Hall effect, keypads,
keyswitch, keyboard, etc.)
AVX
»»Type (dip, push-button, rocker, rotary, slide, snap-action,
ALPS
Component Sourcing Considerations
CK Components
higher resales.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Note: These are IPE sensor products. There are additional types and numerous
semiconductor options for sensor products. A complete listing can be found on
AvnetExpress.com under Sensors Transducers.
IPE Technology Guide 6.0
18
20. Thermal Management
Technology
heat sinks
Thermal management solutions include products and services that
»»Natural or forced air
solve problems associated with the dissipation of unwanted heat in
»»Flow velocity
electronic and electrical components and systems. Forced convection
»»Available sink volume
cooling and heat transfer are two of the more popular methods of thermal
»»Maximum allowable case temperature
management. Avnet offers several products that use these methods for
»»Device area in contact with sink
heat dissipation:
»»Fans (convection cooling) move and displace air and are categorized
by the amount of air they can produce.
»»Number of devices to be cooled
»»Power to be dissipated per device
»»Just about any application that calls for a monster chip (i.e.,
microprocessor, microcontroller, FPGA, DSP, etc.) will require
thermal management products.
»»In addition, many larger watt power supplies will also require some
type of device to dissipate heat.
»»There are a wide range of applications that require a fan or fan
tray (i.e., servers, routers, telecom equipment). These are all good
candidates for a factory-assembled fan tray or a custom fan tray sold
and assembled by Avnet.
Component Sourcing Considerations
fans
»»Type (AC, DC, fan or blower)
»»Square size (inches or mm)
»»Width size (inches or mm)
»»Supply voltage
»»CFM required
19
IPE Technology Guide 6.0
•
•
•
•
•
•
•
•
•
•
TE Connectivity
•
Sunon
THERMAL MANAGEMENT product/type
AC Fans
Active/Passive Heat Sinks
Blowers
DC Fans
Fan Trays
Fanless Cooler
Guards/Hardware
Microscale Thermal Management
MIL/Industrial Fans
Molex
interface materials and molded, stamped or extruded metal sinks that
pull heat away from its sources and into the ambient air. Heat sinks can
be passive or active (includes a fan).
ebm papst
»»Heat sinks (heat transfer) provide heat transfer through heat-conducting
CTS
stream focusing air movement to a defined area of the system.
Aavid Thermalloy
»»Blowers (convection cooling) move and displace air in a controlled
•
•
•
•
21. a combination of a quartz crystal and other electronic components enclosed
in a single package. Oscillators provide greater stability and tighter
tolerance than crystals, without additional electronics. Oscillators are
frequently used in devices that require greater reliability or in high-end
•
•
•
•
•
•
•
•
•
Vishay
•
•
•
Murata
TIMING Product/type
Crystals
Oscillators
Resonators
FOX
regulate the timing or system speed (clock rate) of a circuit. Oscillators are
CTS
at a specific frequency when voltage is applied. This vibration is used to
AVX
Crystals are naturally occurring pieces of quartz that vibrate (oscillate)
Abracon
Technology
Panasonic
Timing Solutions
•
•
•
Note: These are IPE Timing Solutions. There are additional types and numerous
semiconductor options for timing devices. A complete listing can be found on
AvnetExpress.com under Logic Timing.
applications. Typically constructed from ceramic materials, resonators are
a low-cost alternative to crystals and are used in applications that do not
require tight control of tolerance and stability.
»»It is important to determine if the timing device will be used to control
a microprocessor or a microcontroller.
»»Be sure to tie crystals and oscillators to chipsets.
»»Remember that fast clock devices may require magnetics for
signal filtering.
»»Target applications include LAN and data communications as well as
RF and wireless applications, to name a few.
Component Sourcing Considerations
»»Oscillators (frequency, stability (PPM), CMOS or
TTL, package size, voltage, filtering)
»»Crystals (frequency, load, capacitance, package size,
tolerance, temperature range)
»»Resonators (frequency, tolerance, package)
IPE Technology Guide 6.0
20
22. IPE Physical Value-Add Services
All of Avnet’s core value-add services are performed in the Avnet Logistics Solution Center (LSC) in Nogales, Mexico. The LSC is sustained by a diverse group
of employees with varied skill sets and work experiences cultivated through employment at Avnet and other globally-recognized companies.
Certification and Compliance Credentials
FCI
Manufacturers Services
Discrete Multi- Conductor
Flat Flex/Flex
Flat Ribbon IDC
IDC Termination – .100/.156
IDC Termination – High-Density
RF Coax
Ties, Labels Accessories
Amphenol
•
•
Manufacturers Services
Contacts
Cylindrical
D-Sub
Headers
•
•
•
•
•
•
FCI
Commercial interconnect value-add products are built and
inventoried based on manufacturer listed part numbers
and part specifications. Avnet has invested in robotic
automation for part identification, adhesive application,
contact insertion and insulator insertion, which is
deployed to minimize human error, increase productivity
and maintain cost efficiencies. As a result, Avnet
maintains an industry-leading low defect rate.
3M
Commercial Interconnect
Amphenol
Avnet has a dedicated production cell that provides
first article cable assemblies of varying sophistication
levels based on customer specifications. Once the first
article is approved, Avnet documents and electronically
stores the manufacturing process, which includes
detailed step-by-step assembly instructions that can be
recalled for future use.
3M
Custom Cable Assembly
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
21
IPE Technology Guide 6.0
Manufacturers Services
MIL-C-26482
MIL-C-24308
MIL-C-38999
MIL-C-5015
MIL-C-81659
MIL-C-83723
MIL-C-83733
MIL-C-83513
MIL-C-26500
MIL-C-39029
D-Sub/ IO
Hi-Rel Circular
Power/Industrial
Amphenol
Conesys
FCI
Glenair
High-Reliability/Military Interconnect
The Avnet LSC is MIL-I-45208 certified to assemble
close to 60 different military specification products
in accordance with the Qualified Parts List (QPL) and
is fully authorized to stock and assemble products to
manufacturer drawings and specifications. Avnet currently
offers 24-hour delivery on over 250 of the most popular
high-reliability and military-aerospace products. In
addition, Avnet has achieved delivery cycle times of less
than three days on normal-sized orders for many other
high-reliability and military-aerospace connectors.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
TE Connectivity
»»ISO-13485
•
•
•
•
•
•
•
•
TE Connectivity
WHMA-A-620
Institute (BSI)
Molex
»»C-TPAT
»»IPC J-STD-001 and IPC/
»»UL and CSA
»»British Standards
Molex
»»Staffed by more than 300 employees
Regulations (ITAR)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Molex
TE Connectivity
»»125,000 square foot assembly center
»»International Traffic in Arms
ITT Interconnect
Solutions
»»ISO-9001-2000
»»ISO-14001 (Green)
»»AS9100C
»»MIL-I-45208
ITT Interconnect
Solutions
»»Located in Nogales, Mexico
ITT Interconnect
Solutions
About the Avnet Logistics Solution Center
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
23. TDK-Lambda
•
•
SL Power Electronics
•
•
•
•
•
•
Power-One
•
•
•
•
•
•
•
•
•
Murata
•
•
•
•
•
•
•
•
•
Martek Power
GE Critical Power
•
•
•
•
•
•
•
•
•
Manufacturers Services
Add Electro
Add Sheet Metal Enclosures
Burn-in Load Testing
Cable/Harness Assembly
High-Current Interconnect
High Level Assembly
Modular Power Supplies
Racks
Thermal Management
Emerson
Network Power
Working with a dedicated team of product and material
specialists, Avnet’s business development managers,
field application engineers (FAEs) and regional power
specialists help customers source power supplies
quickly and efficiently. Avnet is a certified value-add
reseller (VAR) for Emerson Network Power, TDKLambda, Power-One and modular power supplies.
Using off-the-shelf modules, Avnet can quickly
assemble modular power supplies to meet custom
output specifications from 200 to 4,920 watts.
Aimtec
Power Supply Solutions
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
ebm-papst
Sunon
•
•
•
•
•
•
•
•
•
Manufacturers Services
Connectorized Cables
Fan Trays
Hardware Guards
Sheet Metal Enclosures
TE Connectivity
Many sophisticated silicon components cannot function
properly without effective heat dissipation. Avnet offers
custom assembly and modification for cooling fans and
heat sinks. In fact, Avnet is one of the world’s largest
distributors of thermal management products, shipping
millions of cooling fans, blowers and heat sinks each year
through the Logistics Solution Center.
Tri-Star Electronics
Thermal Management
•
•
•
•
•
•
•
•
•
•
•
•
TDK-Lambda
Sunon
SL Power
Samtec
Power-One
Murata
Molex
•
•
•
Martek Powerx
GE Critical Power
FCI
Emerson Network Power
ebm-papst
Conesys
•
•
•
•
ITT Interconnect Solutions
•
•
•
Glenair
•
•
Amphenol
Aimtec
Manufacturers Services
Cable Assembly
Commercial Interconnect
Hi-Rel Mil-Aero Interconnect
Power Supply Modification
Thermal Management
3M
Physical Value-Add Service Overview
•
•
•
•
•
•
IPE Technology Guide 6.0
22