HIgh Speed Design Services and Solutions Company

1. Agenda
Background
Design Capabilities
Value Proposition
Technology Paradigm Shift
Win-Win Partnership
© 2008 Bayside Design, Inc. Confidential 1

2. Vision
Leader in providing High
Speed Design Services &
Solutions
© 2008 Bayside Design, Inc. Confidential 2

3. Executive Summary
Started in Dec 2002, and self funded
We have over 100 customers, profitable
and growing
Advanced design, modeling, analysis,
verification and measurement services
Over 200 projects with first pass success
We offer excellent ROI and risk mitigation
We allow you to focus on your core
competencies
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4. Experienced Team
Combined experience of 160+ years
− IBM, DEC, Bell Labs, AMD, National, Sun,
Xaqti, Velio Communications
Founding Engineers@
− Xaqti, Velio Communications Inc
Moderately successful exits
− Xaqti sold to Vitesse
− Velio sold to RAMBUS & LSI Logic Inc
US locations (Silicon Valley & Boston)
− And now India
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5. Comprehensive Services
Verification
Design Package
Kits Design
Measurement
& Compliance
Characterization
Channel Board
LEGEND
Analysis Design
SYSTEMS
IP, FABLESS
Signal/Power &
& SYSTEMS Timing
All Customers Analysis 5
© 2008 Bayside Design, Inc. Confidential

6. Value Proposition
We offer a lot of different services
− Package planning, feasibility, modeling and analysis
− Protocol compliance analysis
− Board design, modeling, analysis, fab, assembly
− Design kit for customer distribution
− Measurement and characterization
− Signal, Power Integrity analysis and Timing
We design in the context of a system
− Use Silicon IP (data sheet, Hspice, IBIS….)
− Analyze each interface, including core supply
− Include board level topology
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7. Value Proposition
Work on a project basis
Work with your supply chain
− IP vendors, Package and Board vendors
Maximize yield, reliability and margins
Get paid when we deliver
Deliver as fast as possible
First pass success
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8. Technology Paradigm Shift
Process geometries shrinking
Total power consumption trend
Rapid adoption of Serial technology
Application specific standards
DDR ->DDR1->DDR2->DDR3
Package technology
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9. Process Geometry Trends
Source: TSMC 90nm Seminar
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10. Process, Design & Package
Are Intertwined @90nm
Source: TSMC 90nm Seminar
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11. Chip Level Power Consumption Trend
Source: TSMC 90nm Seminar
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12. Distribution of SerDes Speeds
(% of OEM Designs using SerDes I/O)
Data Rate (Gb/s)
Source: EE Times
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13. XAUI Leads Today’s Users
But 10 Gb/s triples to dominate in 2-3 years
Source: EE Times
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14. Percentage of Engineers Designing SerDes
Systems
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15. Simulation and Analysis Solutions
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16. Signal Integrity is Top Concern for
SerDes Designs
Source: EE Times
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17. SerDes Sources
% of Respondents
Source: EE Times
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18. SerDes Foundry Processes
% of Respondents
Source: EE Times
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19. Number of Channels Used
% of Respondents
Source: EE Times
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20. Multi-Gb Terrain Map
SATA2
3.0
PCIEG2
2.5
5.0
HDMI
1.66
20
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21. Application Specific Standards
Protocol Data Rate Standard Application
3G-Serial Data I/F 1.485, 2.9Gbps SMPTE HDMI, multimedia
Infiniband 2.5Gbps IB Trade Server connection
Association & IO
1394 FW, I.Link 3.2Gbps IEEE Consumer,
multimedia, digital
video
Sonet/SDH 51.84, 155.52, ITU WAN, MAN
622.08 Mbps, 2.488,
9.953, 39.812 Gbps
Rapid IO 1, 2, 2.5, 4, 8, Rapid IO Trade System
10Gbps Association interconnect fabric
Serial Attached 1.5, 3 and 6 Gbps SCSI Trade
SCSI (SAS) Association
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22. Application Specific Standards
Protocol Data Rate Standard Application
Ethernet 1,10, 100Gbps IEEE802.3 LAN,MAN,WAN
Fibre Channel 1.035, 2.125, 4.25, FC Industry Ass, SAN
8.5Gbps INCITS, T11
HDMI Up to 10.2 Gbps HDMI Licensing Consumer,
LLC multimedia, HDTV
& audio
HT 2.6 Gbps HT Consortium PC, server,
memory, Micro
interconnect
PCI Express gen 1 2.5 to 5 Gbps PCI SIG Computer busses
&2
XAUI 3.125 Gbps IEEE802.3ae C2C & BP
SATA 1.5 & 3 Gbps Serial ATA HD and Optical
International Org Drive I/F
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23. Design Challenge
I/O speeds deep into microwave bands.
Propagating error-free signals through multi-domain
channels becoming a serious challenge
PCI-E PCI-E II
Fundamental Fundamental
23
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24. Chain is as strong as the
weakest link
CHIP PACKAGE BOARD
Power Integrity Technology Selection Noise
RC Power Integrity Thermal
EM Signal Integrity EMI
Substrate Noise RLC/Transmission Timing
Timing S- Parameters Jitter
Signal Integrity Loop Inductance BER
…….. Return Paths & Skew Skew
…………. ………
Challenge: Optimize Chip/Package/Board
Signal and Power Integrity
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25. Supply Chain Partners
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26. Partial Customer List
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27. Partial Customer List
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28. Partial Customer List
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29. Customer Sectors
IP
Vendors
Testers FPGA
Companies
TCAM &
Memories BDI Storage &
Data Center
Wireless & Computers
Consumers
Routers &
Switches
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30. Sample
Customer Quotes
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31. “We have worked with Bayside on multiple
projects in the area of high-speed SERDES
package and PCB designs. We are very
pleased with their timely delivery, service
quality, customer commitment, and most
importantly, first time design success.”
Tony Pialis, Director of Business Development
Snowbush IP, A Division of Gennum
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32. quot;Bayside Design, Inc. has been a strong
technical complement to our team and
consistently makes an extra effort to meet our
needs. Their expertise in high performance
board design has been invaluable in bringing
our products to production.”
Dimitrios Dimitrelis, VP Engineering,
NetLogic Microsystems,Inc.
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33. quot;Bayside design inc is an important partner to
3Leaf for high speed package, board design
and signal integrity analysis. They are
competent, responsive and a pleasure to work
with. They provided excellent support
throughout every project with 3Leaf.quot;
Chee Hu, Director of Engineering
3Leaf Networks
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34. “Bayside Design, Inc's expertise in high
speed/high performance Substrate and board
design is world class. They are very
professional in their interaction with the
customers and a pleasure to work with. I’d
highly recommend them to anyone who is
considering state of the art package and
board design services.”
Nagaraj Murthy, VP of Operations and
systems engineering, Tilera
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35. “Bayside Design has been instrumental in the
successful market deployment of our accelerated
10Gb Ethernet adapters. They provide outstanding
services for signal and power integrity as well as
package and board design. Their commitment to
their customers, level of expertise, and willingness
to collaborate on innovative new solutions makes
them an invaluable resource for meeting the
demands of the data center market. In fact, we
frequently refer our own business partners to
Bayside.”
Steve Majors, Director of Engineering,
NetEffect, Inc.
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36. quot;Bayside Design has been the vendor of choice for designing
packages for our high speed processors since 2003. Our
partnership with them has benefited by their vast domain
knowledge in signal integrity, their professional attitude when
accommodating the inevitable last minute changes that occur,
the short schedules they commit to and then drive themselves
to meet with almost maniacal intensity, and their passion for
excellence demonstrated by the focus they apply to each
minute routing detail. The result of working with this
professional and responsive design team has been first pass
success on all of the design work Bayside Design has done
for us.quot;
Bruce Kauffmann, Sr Director of Engineering,
Raza Microelectronics, Inc.
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37. Win-Win Partnership
We offer excellent ROI & risk management
Flexible business model – one stop shop
Designed over 150 packages and boards
Every single project first pass success
Allow you to focus on your core expertise
WE CAN make you successful
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38. THANK YOU
© 2008 Bayside Design, Inc. Confidential 38