2. EPON™ and EPI-REZ™ Epoxy Resins
Introduction Qualifying a resin system that offers the best balance of performance and processability
can be a significant task. You not only need quality products from a reliable supplier; you
need a company that is willing to share its technical expertise and who will provide services
that help satisfy your unique requirements. That's where we come in.
We're the Epoxy Business of Hexion Specialty Chemicals, one of the world’s leading
suppliers of epoxy resins, curing agents, modifiers and epoxy systems. We offer a diverse
line of epoxy resins that vary in chemical structure, molecular weight, viscosity and
functionality - providing the formulator with a multitude of options. What's more, our
products have over sixty years of innovation and success in a variety of markets and end-
use applications.
At our world-class technology centers in the U.S. and Europe, we pursue advanced
processing technologies while creating new resin products and systems with broad
performance ranges. By continually working on technical challenges in our application
laboratories, we are able to translate real application requirements into high quality,
production-oriented materials.
The EPON™ and EPI-REZ™ families of resins were developed to provide superior overall
performance in a variety of end-use applications. These products enable manufacturers to
achieve practically any desired performance level, while optimizing processability and
strength retention at elevated temperatures.
EPON resins, in thermoset systems with our curing agents and modifiers, offer advantages
such as:
• Low room temperature viscosity
• Very long working life
• Low moisture absorption
• Good epoxy performance characteristics
• Flexibility
• Reactivity
• High elongation
• Adjustable cure times
• Good chemical and corrosion resistance
• Heat resistance
• Fire retardance
• MIL-R-9300B specifications (in some resin systems)
3. Page
At A Glance EPON™ - Liquid Epoxy Resins and Blends 4 – 5
This segment of our product line represents the most widely used products in a
number of industries. The most commonly used EPON Resin/Heloxy™ Modifier
blends are available in several types and viscosity grades.
EPON - Epoxy Resin Solutions 5 – 6
These products are higher molecular weight standard or modified epoxies
which are cut in solvent to allow easier handling and formulation via lower
viscosity.
EPON - Solid and Powder Grade Resins 7
These epoxy resins are in the molecular weight range most suitable for use in
epoxy solutions, powder coating and electronic applications. These products
have a good balance of properties, including appropriate epoxy functionality for
proper curing, good physical stability (sintering resistance), and good melt flow
(low melt viscosity).
EPON - Epoxy Novolac Resins 8
These products are specifically designed to provide increased levels of thermal
stability and chemical resistance, and are used in composites, structural
adhesives, electronics / electrical and coating applications.
EPON - Epoxy Polyacrylates 9
These are very low viscosity resins possessing excellent wetting characteristics
and rapid reaction rates with amine curatives over a broad temperature range.
EPON - Elastomer Modified Epoxy Resins 9
These products offer improved adhesive properties, thermal shock resistance
and toughness, with good fatigue resistant properties.
EPONEX™ – Cycloaliphatic Resin 9
This segment offers a low viscosity liquid epoxy based on hydrogenated
Bisphenol A for applications requiring UV resistance.
EPON and EPONOL™ - Electrical Laminating Resins 10
These products can be used to obtain fire retardance in a base epoxy resin
formulation. The ultra-high molecular weight resin can be used to improve
flexibility and modify the flow properties of the system
EPON and EPIKOTE™ - Epoxy Resins for Composites 10
Epoxy resins that provide the property retention, toughness and corrosion
protection required in composite applications.
EPI-REZ™ - Epoxy Waterborne Resins 11
These non-ionic aqueous dispersions of our epoxy resins provide benefits such
a low or zero VOCs, extended potlife, high crosslink density, high temperature
performance, very good chemical resistance, B-stage capability, low color, and
complete water-reducibility. Many of the Hexion EPIKURE™ Curing Agents can
be used with these epoxy dispersions. In addition, since dicyandiamide is water
soluble, it may be used to provide extended potlife formulations.
4. The
Formulator’s
Choice
All of our products are manufactured to high standards of quality and have very specific
property ranges. To help you assess the many production and performance advantages
of Hexion’s complete line of resins, we’ve summarized typical properties and resin
characteristics in the technical charts below. The data in this brochure are intended to
give only basic product information for quick reference – individual product technical data
sheets with additional information are available for many of the products listed in the
following pages. For additional information about any or all of these products, or to
contact us, visit the Epoxy, Curing Agents and Modifiers section of the Hexion website at:
www.hexion.com/epoxy
Resin Solution
Coding
System
Epoxy resins employ a simple three-part coding system for designating the composition
of resin solutions. The coding system consists of a number indicating the epoxy resin
used in the particular solution, followed by one or more letters that describe the solvent or
combination of solvents used to make up the solution. The last two numbers indicate the
percent solids (by weight) of the composition. For example:
EPON™ Resin 1001-H-75
In this example, the base resin used to make this solution is the EPON Resin 1001F type.
The solvent used is Propylene Glycol Monomethyl Ether (PM), as noted from the list
below, and the solids content is 75% by weight.
The coding system that is used to designate the solvents in resin solutions is as follows:
Letter Code Solvent Name Abbr Non HAPS
VOC
Exempt
A Acetone Yes Yes
B Methyl Ethyl Ketone MEK Yes
C Methyl Isobutyl Ketone MIBK
D Diacetone Alcohol DAA Yes
E Isopropyl Alcohol IPA Yes
F n-Butyl Alcohol (Converting to Code "N") NBA Yes
G n-Butyl Acetate NBAC Yes
H Propylene Glycol Monomethyl Ether PGMME / PM Yes
I iso-Butyl Alcohol Yes
J Ethyl 3-Ethoxy Propionate EEP
K t-Butyl Acetate TBAC Yes Yes
L Propylene Glycol Mono n-Butyl Ether PGMnBE / PnB Yes
M Ethylene Glycol Monobutyl Ether EGMBE / EB Yes
N n-Butyl Alcohol NBA Yes
O Methyl n-Amyl Ketone MNAK Yes
P n-Propyl Alcohol NPA Yes
Q Propylene Glycol Monomethyl Ether Acetate PGMMEA / PMA Yes
R Dimethyl Formamide DMF
S Cyclohexanone Yes
T Toluene
U Aromatic 100 A 100 < 5% HAPS
V Dipropylene Glycol Monomethyl Ether DPGME Yes
W Water Yes Yes
X Xylene
Y Ethylene Glycol Monopropyl Ether EGMPE / EP
5. Page 4
Table 1 / Typical Properties of EPON™ Unmodified Liquid Epoxy Resins
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 825 DGEBPA 50 – 65 175 – 180 < 50 9.7 Ultra high purity, low viscosity liquid epoxy used for high solids
coatings and specialty composites.
EPON 826 DGEBPA 65 – 95 178 – 186 < 50 9.7 Low viscosity liquid epoxy used in coatings and composite
applications.
EPON 827 DGEBPA 80 - 100 179 – 184 < 100 9.7 Medium viscosity liquid epoxy resin that falls between EPON 826
and EPON 828. It is used mainly in composite applications.
EPON 828 DGEBPA 110 – 150 185 – 192 < 50 9.7 Predominant liquid epoxy product, widely used in multiple
applications.
EPON 830 DGEBPA 170 – 225 190 – 198 < 50 9.7 Higher molecular weight liquid epoxy.
EPON 834 DGEBPA 3.5 – 9 2
230 – 280 < 50 9.7 Highest molecular weight liquid epoxy used in adhesives and as a
modifier of liquid epoxy systems.
EPON 862 DEGBPF 25 – 45 165 – 173 < 50 9.8 Low viscosity Bisphenol F liquid epoxy used alone or in blends
with other resins. Allows high solids formulations with good
chemical resistance. A high performance alternative to diluted
EPON 828 resins.
EPON 863 DEGBPF 25 – 45 165 – 174 < 50 9.9 Comparable performance to EPON 862 with improved
crystallization resistance.
1
Platinum-Cobalt Color Scale
2
70% by weight solution in Diethylene Glycol Monobutyl Ether
Table 2 / Typical Properties of EPON Modified Liquid Epoxy Resins
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 824 Modified
DGEBPA
40 – 70 192 – 204 < 200 9.6 Liquid epoxy modified for low viscosity and may be used as an
alternative to diluted EPON 828 resins.
EPON 829 Modified
DGEBPA
30 – 70 193 – 203 < 200 9.6 Liquid epoxy resin pre-catalyzed for subsequent up-staging.
EPON 8280 Modified
DGEBPA
110 – 150 185 – 195 < 50 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for
systems with fillers and pigments.
EPON 8281 Modified
DGEBPA
110 – 140 182 – 195 < 50 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for silica
filled systems.
EPON 872 Modified
DGEBPA
15 – 38 3
625 – 725 < 6 2
9.0 Liquid epoxy modified for flexibility and toughness. Used in
applications where thermal shock or impact resistance is
important.
1
Platinum-Cobalt Color Scale
2
Gardner Color Scale
3
75% by weight solution in Xylene
6. Page 5
Table 3 / Typical Properties of EPON™ Epoxy Resin Blends
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 235 DGEBPA/
DGEBPF
60 – 80 177 – 182 < 50 9.8 Blend of BPA and BPF liquid epoxy resins. It provides
lower viscosity than standard LER as well as
crystallization resistance.
EPON 813 Diluted
DGEBPA
5 – 7 180 – 195 < 50 9.5 Liquid epoxy diluted with HELOXY 62 – Cresyl Glycidyl
Ether, for good chemical and crystallization resistance.
EPON 815C Diluted
DGEBPA
5 – 7 180 – 195 < 50 9.4 Liquid epoxy diluted with HELOXY 61 – Butyl Glycidyl
Ether, providing superior wetting characteristics.
EPON 8112 Diluted
DGEBPA
7 – 10 182 – 190 < 50 9.4 Similar to EPON 815C with slightly higher viscosity.
EPON 8131 Diluted
DGEBPA
11 – 16 245 – 275 < 50 9.2 Liquid epoxy diluted with HELOXY 505 – Castor Oil
Glycidyl Ether, for flexibility in flooring and adhesive
applications.
EPON 8132 Diluted
DGEBPA
5 – 7 195 – 215 < 50 9.2 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl
Ether, utilized in a broad range of applications.
EPON CS 241 Diluted
DGEBPA
22.5 – 27.5 190 – 200 < 50 9.6 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl
Ether. A higher viscosity version of EPON 8132.
EPON CS 242 Diluted
DGEBPA
13.5 – 18.5 195 – 205 < 50 9.4 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl
Ether. A medium viscosity version of EPON 8132 most
often used in flooring systems.
EPON CS 243 Modified
DGEBPA
Solution
52 – 58 187-195 < 1 9.6 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl Ether
that provides easier handling with good overall
performance.
EPON 8201 Diluted
DGEBPA
50 – 65 180 – 195 < 50 9.7 Liquid epoxy diluted with HELOXY 62 – Cresyl Glycidyl
Ether and modified for anti-settling and anti-foaming,
primarily used in highly filled systems.
1
Platinum-Cobalt Color Scale
Table 4 / Typical Properties of EPON Liquid Epoxy Solutions
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 828-X-95 DGEBPA
Solution
15 – 45 193 – 204 < 1 9.5 Resin solution, 95% solids in Xylene.
EPON 834-F-90 DGEBPA
Solution
46 – 148 225 – 265 < 1 9.3 Resin solution, 90% solids in n-Butanol.
EPON 834-X-80 DGEBPA
Solution
4.5 – 18 230 – 280 < 1 9.2 Resin solution, 80% solids in Xylene.
EPON 834-X-90 DGEBPA
Solution
63 – 590 230 – 280 < 1 9.5 Resin solution, 90% solids in Xylene.
EPON 836-C-75 DGEBPA
Solution
3 – 6.5 280 – 335 < 1 8.9 Resin solution, 75% solids in MIBK.
EPON 8521-MX-60 Mod
DGEBPA
Solution
17.5 – 36 750 – 850 < 1 8.8 Modified resin solution, 60% solids in Ethylene Glycol
Monobutyl Ether / Xylene, for improved surface tension
characteristics.
EPON 872-X-75 Mod
DGEBPA
Solution
20 – 28 625 – 700 < 6 8.4 Modified resin solution, 75% solids in Xylene, for
applications needing flexibility and toughness.
EPON 873-CX-80 Mod
DGEBPA
Solution
4.5 – 23 380 – 420 < 5 8.6 Modified resin solution, 80% solids in MIBK / Xylene, for
applications needing flexibility, toughness, and reduced
VOC levels.
EPON 874-B-90 Mod
DGEBPA
Solution
550 – 1290 245 – 275 < 6 9.1 Modified resin solution, 80% solids in MEK, for
applications needing flexibility, toughness, and reduced
VOC levels.
EPON 874-CX-90 Mod
DGEBPA
Solution
13 – 27 245 – 275 < 4 9.1 Modified resin solution, 90% solids in MIBK / Xylene, for
applications needing flexibility, toughness, and reduced
VOC levels.
1
Gardner Color Scale
8. Page 7
Table 7 / Typical Properties of EPON™ Solid Epoxy Resins – Fusion Grades
Product
Chemical
Type
Solution
Viscosity 1
@ 25°C (cP)
Weight
per
Epoxide Color 1,2
Softening
Point (°C)
Melt
Viscosity
@ 150°C (P) Comments
EPON 1001F DGEBPA 7.0 – 9.6 525 – 550 < 200 79 4 – 5 Lowest molecular weight solid epoxy with
used to provide improved toughness,
flexibility, flow control and tack. Basic resin
for coatings and pre-preg. Susceptible to
sintering. Density 1.20 g/ml.
EPON 1002F DGEBPA 9.2 – 13.6 600 – 700 < 200 85 12 – 25 Slightly higher molecular weight than EPON
1001F. Better sinter resistance.
Density 1.20 g/ml
EPON 1004F DGEBPA 15 – 25 800 – 950 < 200 96 16 – 20 Medium molecular weight solid epoxy resin
containing hydroxyl groups. Often reacted
with vegetable oil acids to produce epoxy
ester resins. Can also add toughness,
flexibility and rheology control.
Density 1.20 g/ml.
EPON 1007F DGEBPA 50 – 100 1700-2300 < 200 125 ≈ 500 Moderately high molecular weight solid
epoxy resin used for industrial coatings
cured with urea-formaldehyde and phenol-
formaldehyde resins. Density 1.19. g/ml.
EPON 1009F DGEBPA 100 – 250 2300-3800 < 200 135 > 500 High molecular weight solid epoxy resin for
baked industrial coatings cured with urea-
formaldehyde and phenol-formaldehyde
resins. Density 1.19 g/ml.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
9. Page 8
Table 8 / Typical Properties of EPON™ Solid Epoxy Resins – Powder Coating & Molding
Grades
Product
Chemical
Type
Solution
Viscosity 1
@ 25°C (cP)
Weight per
Epoxide Color 1,2
Softening
Point (°C)
Melt
Viscosity
@ 150°C (P) Comments
EPON 2002 DGEBPA 10 – 17 675 – 760 < 50 80 – 90 20 – 40 Medium low molecular weight solid epoxy
resin containing hydroxyl groups used
primarily for thin film epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2003 DGEBPA 13.5 – 18 725 – 825 < 50 90 – 95 30 – 50 Medium molecular weight solid epoxy resin
containing hydroxyl groups used primarily
for thin or thick epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2004 DGEBPA 18 – 27 875 – 975 < 50 95 -105 70 – 120 Medium molecular weight solid epoxy resin
used primarily for thin or thick epoxy
powder coating applications. Density 1.19
g/ml.
EPON 2005 DGEBPA 25 – 55 1200-1400 < 50 110 – 120 > 300 Moderately high molecular weight solid
epoxy resin used primarily for intermediate
and thick film epoxy powder coating
applications. Density 1.19 g/ml.
EPON 2014 Modified
DGEBPA
35 – 75 750 – 850 < 50 100 – 120 200 – 600 Moderately high molecular weight solid
epoxy resin modified with epoxy phenol
novolac used primarily in high performance
powder coating applications to provide
superior chemical and corrosion
resistance. Density 1.19 g/ml.
EPON 2024 Modified
DGEBPA
17 – 26 850 – 950 < 50 95 – 105 60 – 120 Medium molecular weight solid epoxy resin
modified with a flow control agent.
Density 1.18 g/ml.
EPON 2041 Modified
DGEBPA
8 – 12 625 – 675 < 50 --- --- Medium low molecular weight solid epoxy
resin modified for improved flow.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
Table 9 / Typical Properties of EPON™ Solid Epoxy Resins – Electrical Grade
Product
Chemical
Type
Solution
Viscosity 1
@ 25°C (cP)
Weight per
Epoxide Color 1,2
Softening
Point (°C)
Melt
Viscosity
@ 150°C (P) Comments
EPON 3002 Modified
DGEBPA
7.4 – 9.5 520 – 590 < 200 75 – 80 6 – 8 Solid epoxy resin flake, modified for low
melt viscosity and high reactivity. Primarily
used for electrical encapsulation.
1
40% by weight solution in MEK
2
Platinum-Cobalt Color Scale
10. Page 9
Table 10 / Typical Properties of EPON & EPIKOTE™ Epoxy Novolac Resins
Product Chemical Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 1031 TGETPE
Flake
39 2
195 – 230 > 18 10.4 Tetraglycidyl Ether of Tetraphenol Ethane with a
functionality of 3.5. Used in applications requiring
high temperatures and chemical resistance.
EPON
1031-A-70
TGETPE Solution 0.5 – 2.2 195 – 230 > 18 9.1 EPON 1031 solution, 70% solids in Acetone.
EPON HPT
1050
Epoxy Phenolic
Novolac
310 – 400 3
176 – 181 < 1 10.3 Epoxy phenolic novolac resin with a functionality of
3.6. Produces high strength cured systems with
good chemical resistance and elevated temperature
stability.
EPON HPT
1050-A-85
Epoxy Ph
Novolac Solution
5 – 12 176 – 181 < 1 9.0 EPON 1050 solution, 85% solids in Acetone.
EPON 154 Epoxy Phenolic
Novolac
310 – 400 3
176 – 181 < 1 10.3 Epoxy phenolic novolac resin with a functionality of
3.6, providing high chemical and temperature
resistance, and dimensional stability.
EPON SU-2.5 Epoxy BPA
Novolac
20 – 60 3
180 – 200 < 2 9.8 Epoxy Bisphenol A novolac with a functionality of
2.5, providing good thermal stability and chemical
resistance. Used in electrical, adhesive and
composite applications.
EPON SU-8 Epoxy BPA
Novolac
Flake
10 – 60 4
195 – 230 < 5 10.0 Epoxy Bisphenol A novolac with a functionality of 8,
providing rapid development of green strength, with
good high temperature performance. Used in
electrical, adhesive and composite applications.
EPON 160 Epoxy BPF
Novolac
345 – 485 168 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.6 – a low
viscosity version of EPON 154. High functionality
with easy processing, good thermal stability and
chemical resistance.
EPON 161 Epoxy BPF
Novolac
180 – 280 169 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.5 – a
lower viscosity version of EPON 160. High
functionality with easy processing, good thermal
stability and chemical resistance.
EPON 162 Epoxy BPF
Novolac
60 – 78 166 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.2 – the
lowest viscosity version of EPON 160. Adequate
functionality with easiest processing, yet with good
thermal stability and chemical resistance.
EPON 164 Epoxy Cresol
Novolac Flake
35 – 50 5
200 – 240 < 2 10.0 Solid epoxy cresol novolac resin with a functionality
of 4.1 and is used in high performance laminates,
molding compounds, aerospace composites, special
adhesives, and tooling systems.
EPON 165 Epoxy Cresol
Novolac Flake
100 – 200 4
200 – 230 < 6 10.0 Solid epoxy cresol novolac resin with a functionality
of 5.5 and is used in very high performance
laminates, molding compounds, special adhesives,
aerospace composites, and tooling systems.
EPIKOTE 496 Glycidyl Amine 30 – 60 6
111 – 117 ≤ 6 9.7 Low viscosity tetra-functional amine based epoxy
resin. Exhibits high glass transition temperatures and
excellent retention of mechanical properties at
elevated temperatures when cured with suitable
curing agents. Primarily used in high performance
composites, adhesives and laminates. (TGMDA)
EPIKOTE 498 Glycidyl Amine 5.5 – 8.5 95 – 106 ≤ 3 10.1 High purity, low viscosity tri-functional amine based
epoxy resin. Exhibits rapid cure rates and high glass
transition temperatures when cured with suitable
curing agents. Primarily used in rapid cure adhesives
and laminates, and as a viscosity modifier for high
temperature, high functionality composite and
adhesive systems. (TGPAP)
1
Gardner Color Scale
2
@ 120°C
3
@ 52°C
4
@ 130°C
5
60% by weight solution in MEK
6
@ 50°C
11. Page 10
Table 11 / Typical Properties of EPON™ Epoxy Polyacrylates
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Equivalent
Weight Color 1
Density
(lb/gal) Comments
EPON 8021 Epoxy
Polyacrylat
e
85 – 115 150 < 1 9.2 Very low viscosity epoxy diacrylate resin that
imparts high reactivity and superior wetting
characteristics. 13 minute gel time with TETA.
EPON 8111 Epoxy
Polyacrylat
e
800 – 1100 140 < 1 9.5 Low viscosity epoxy triacrylate resin that
provides rapid reaction rates. Uses include high-
build sealers, wear-resistant surfacing and low
temperature cure applications. 2.5 minute gel
time with TETA.
EPON 8161 Epoxy
Polyacrylat
e
1800 – 2400 177 < 1 9.6 Moderate viscosity epoxy diacrylate resin with
performance similar to EPON 828. Applications
include flooring, grouts, adhesives, casting and
encapsulation systems. 27 minute gel time with
TETA.
1
Gardner Color Scale
Table 12 / Typical Properties of EPON™ Elastomer Modified Epoxy Resins
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 58005 CTBN
Modified
DGEBPA
3000-8000 325 – 375 < 9 9.0 CTBN modified BPA epoxy resin with an
elastomer content of 40%. Utilized in high
performance adhesives for peel strength,
thermal shock resistance, toughness and fatigue
resistance.
EPON 58006 CTBN
Modified
DGEBPA
1500-3000 330 – 360 < 9 8.9 CTBN modified BPA epoxy resin with an
elastomer content of 40%, but a slightly lower
acrylonitrile level than EPON 58005. For
flexibility and fatigue resistance in adhesives and
composites.
EPON 58034 CTBN
Modified
DGENPG
40 – 80 275 – 305 < 7 8.4 CTBN modified HELOXY 68 with an elastomer
content of 50%. Provides a low viscosity and
high toughness modifier for adhesives and
sealants.
EPON 58042 CTBN
Modified
DGECHDM
150 – 300 325 – 375 < 6 8.5 CTBN modified HELOXY 107 with an elastomer
content of 50%. Used as a modifier in many
epoxy systems for adhesive and flexibility
characteristics in adhesives and composites.
EPON 58120 CTBN
Modified
DGEBPA
50 – 200 2
850 –
1050
Straw --- CTBN modified solid epoxy resin with an
elastomer content of 20%. Straw color. Used for
adhesion, thermal shock, fatigue and impact
resistance in functional pipe and thick film
powder coatings as well as for electrical
powders.
EPON 58901 CTBN
Modified
DGEBPA
1000-5000 195 – 210 < 5 9.6 CTBN modified BPA epoxy resin with an
elastomer content of 5%. Provides flexibility and
tack for early green strength, and also provides
flow control for adhesives, prepregs and
sealants.
1
Gardner Color Scale
2
@ 150°C
Table 13 / Typical Properties of EPONEX™ Cycloaliphatic Resin
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPONEX 1510 Hydrogenated
DGEBPA
1800-2500 210-220 < 80 9.1 Low viscosity Cycloaliphatic Glycidyl Ether.
Used to obtain epoxy performance in coatings,
electronics and specialty composites where UV
resistance is a requirement.
1
Platinum-Cobalt Color Scale
12. Page 11
Table 14 / Typical Properties of EPON™ Electrical Laminating Resins
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 1124-A-80 DGETBBPA 1200 – 2000 425 – 445 < 2 10.2 Acetone solution of brominated resin for flame
retardant electrical laminates. Bromine
Content – 19.5% by weight. Slightly higher
molecular weight than EPON 1123-A-80.
EPON 1163 DGETBBPA 100 – 1200 2
380 – 410 < 100 4
15.4 Low melting solid epoxy with 48% by weight
bromine. Softening point at 64°C. Imparts fire
retardancy in laminating, casting and molding
applications.
EPON 1183 DGETBBPA 1000-3000 3
625 – 725 < 200 4
14.4 Higher melting solid epoxy with 42% by
weight bromine. Softening point at 95°C.
Designed for sintering resistance and
moderate flammability resistance.
EPON CS 373 Modified
Brominated
Epoxy
100 – 600 350 – 400 < 12 10.0 One-pack, DICY-free, brominated epoxy resin
and curing agent solution supplied as 70% by
weight solids in a blend of Methyl Ethyl
Ketone (MEK) and Propylene Glycol
Monomethyl Ether (PGME). Used for high Tg
applications at 180°C. Bromine Content –
13.5% by weight.
1
Gardner Color Scale
2
@ 120°C
3
@ 150°C
4
Platinum-Cobalt Color Scale
Table 15 / Typical Properties of EPONOL™ Ultra High Molecular Weight Resin
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Viscosity
@ 25°C (Gardner) Color 1
Density
(lb/gal) Comments
EPONOL 53-BH-35 DGEBPA 600-3600 U – Z2 < 2 7.8 Ultra high-molecular-weight epoxy resin used
for adhesives and prepreg laminates to impart
flexibility and to modify flow properties of the
system.
1
Gardner Color Scale
Table 16 / Typical Properties of EPON & EPIKOTE™ Epoxy Resins for Composites
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPON 9504 DGEBPA 1300 – 2000 169 – 177 < 1 9.5 For VARTM and SCRIMP processes needing
low system viscosity with low temperature
curing capability.
EPON 9215 DGEBPA 3000 – 5000 187 – 207 < 1 9.6 For CIPP (Cured In Place Pipe) applications
where long term physical integrity, durability
and resistance to chemical attack is needed.
Typically used with EPIKURE 9270.
1
Gardner Color Scale
13. Page 12
Table 17 / Typical Properties of EPI-REZ™ Waterborne Epoxy Resin Dispersions
Product
Chemical
Type
Viscosity
@ 25°C (cP)
Weight per
Epoxide pH
Density
(lb/gal) Comments
EPI-REZ 3510-W-60 DGEBPA
Dispersion
500-5000 185-215 4-7 9.0 Waterborne dispersion of a low molecular weight
liquid Bisphenol A epoxy resin (EPON Resin 828
type).
EPI-REZ 3515-W-60 DGEBPA
Dispersion
4000-15000 225-275 4-7 9.2 Waterborne dispersion of a semi-solid Bisphenol
A epoxy resin.
EPI-REZ 3520-WY-55 DGEBPA
Dispersion
7000-17000 485-555 7-9 9.1 Waterborne dispersion of a semi-solid Bisphenol
A epoxy resin (EPON 1001 type) with an organic
co-solvent. Primarily used in coatings systems.
EPI-REZ 3522-W-60 DGEBPA
Dispersion
8000-18000 615-715 7-9 9.2 Waterborne dispersion of a solid Bisphenol A
epoxy resin (EPON 1002 type). Typically used in
film and fiber adhesives and finishes, FRP, and
electrical dip coatings.
EPI-REZ 3540-WY-55 DGEBPA
Dispersion
7000-17000 1600-2000 7-10 9.0 Waterborne dispersion of a solid Bisphenol A
epoxy resin (EPON 1007 type) with an organic co-
solvent. Generally used in baked industrial
finishes, fiber finishes/binders, and as a modifier
for ambient cure systems.
EPI-REZ 3546-WH-53 DGEBPA
Dispersion
1000-15000 1900-2200 7-10 9.0 Waterborne dispersion of a solid Bisphenol A
epoxy resin (EPON 1007 type) similar to EPI-REZ
3540-WY-55 with a non HAPS co-solvent.
EPI-REZ 5003-W-55 BPA Novolac
Dispersion
2000-15000 195-215 3-5 9.2 Waterborne dispersion of an epoxidized
Bisphenol A novolac modified epoxy resin with an
average functionality of 3 (EPON SU-3 type).
Promotes wetting and adhesion to a variety of
fibers and enhances chemical resistance in
coatings.
EPI-REZ 5520-W-60 DGEBPA
Dispersion
2000-15000 480-560 3-5 9.2 Waterborne dispersion of a urethane-modified
Bisphenol A epoxy resin. Provides improved
chemical resistance and thermal performance for
fiber finishes and industrial textile applications.
EPI-REZ 5522-WY-55 DGEBPA
Dispersion
8000-19000 550-700 7-9 9.0 Waterborne dispersion of a novolac modified
Bisphenol A epoxy resin (EPON 1002 type) with
an organic co-solvent. Used for high performance
coatings where higher chemical resistance and
corrosion protection are required.
EPI-REZ 6006-W-68 OCN Novolac
Dispersion
500-2000 230-270 8.5-9.5 9.0 Waterborne dispersion of an epoxidized o-
cresylic novolac resin with an average
functionality of 6. It provides high temperature
stability, abrasion and chemical resistance in
coatings, composites, adhesive and electronic
applications.
EPI-REZ 6520-WH-53 DGEBPA
Dispersion
1000-6000 500-600 7.5-9.5 8.9 NewGenTM
Waterborne dispersion of a solid
Bisphenol A epoxy resin (EPON 1001 type) with a
non HAPS co-solvent. Provides exceptional
corrosion protection for metal substrates as
primers, DTM and topcoats.
Table 18 / Typical Properties of EPI-REZ Water Reducible Epoxy Resins
Product
Chemical
Type
Viscosity
@ 25°C (P)
Weight per
Epoxide Color 1
Density
(lb/gal) Comments
EPI-REZ WD 510 Water Red.
DGEBPA
80-120 190-205 < 1 9.6 Water dispersible Bisphenol A epoxy resin.
EPI-REZ WD 512 Water Red.
DGEBPA
150-600 195-210 < 1 9.7 Water dispersible Bisphenol A epoxy resin.
1
Gardner Color Scale
