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IEEE EMCS Distinguished Lectures
    “ Why Does My Product
          Fail EMC ?”
       And How To Fix it.

         Jerry Meyerhoff
          JDM LABS LLC
         jerrymeyerhoff@ieee.org
        http://rfjock.wordpress.com/
             All Rights Reserved 2012
Outline / Overview
 ●   Thanks For The Invitation !
 ●   EMC Process Overview & Fundamentals <brief>
 ●   Illustrate the 4 Quadrants Through Case Studies
 ●   Problem Solving Methods: Technical & Humanistic
 ●   Measurements, Experiments, Theory Formation, Modeling,
     Solution Generation & Maintaining Progress
 ●   Lessons-learned




IEEE-EMCS-DL-1             jerrymeyerhoff@ieee.org        2
EMC Tech Overview
                    EMC Definition
     The Beneficial Property of a Device / System :
 ●   Not to Create Excessive E-M Energy
 ●   Not to be Disturbed by Expected E-M Energy

 ●   Practical Design Goals & Regulatory Limits
 ●   & Within Constraints

IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org         3
EMC Tech Overview
                  The 3 Players
 ●   Source
 ●   Path / Coupling Mechanism
 ●   Affected Device or System / Receptor
     -Choose the “Best” One(s) to Attack-

 ●   Consider Constraints :
     Performance, $, Time
IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org   4
EMC Tech Overview
SOURCE           PATH                        RECEPTOR
Radio/TV/Cell      wires                    Radio:AM/FM/TV
GPS Satellites     cables                   Cell Hand-set
BlueTooth         earth                     GPS -TomTom
High Voltage Lines metal                    BluetoothHeadset
Car               building                       Car
iPOD               person                    Pace-maker
Cell Hand-set           air                   Hearing Aid
 …
IEEE-EMCS-DL-1      jerrymeyerhoff@ieee.org                    5
EMC Tech Overview
                   The EMC Matrix


    Conducted                                    Conducted
    Immunity                                     Emissions


    Radiated                                     Radiated
    Immunity                                     Emissions


IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org               6
EMC Tech Overview
                 4 Mechanisms + Plus One
           Rank-order... Depends On Situation
 ●   Conducted (mutual inductance)
 ●   Magnetic Field
 ●   Electric Field
 ●   Electro-Magnetic Field (radio)
     + Path of Least Impedance
     Re: Dr Tom VanDoren

IEEE-EMCS-DL-1             jerrymeyerhoff@ieee.org   7
EMC Case Studies
 ●   Narrative Illustrations of ..
 ●   Physical Principles
 ●   Analysis Approaches
 ●   Problem Solving
 ●   Making Progress
 ●   Working Well With Others
 ●   “Best Solutions” Within Constraints

IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org   8
Process Words of Wisdom
                 Henry Ott's Big 4
 1. Divide & Conquer : Structures, Freq's & Modes
 2. Find The Dominant Mechanism : Pile On Fixes
 3. Kill It Dead : Optimize Later
 4. Implement Fixes : Best Possible Fashion




IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org   9
CE Case 1 Scanner                    1

 ●   The “Story”
 ●   Large Table-top
     Commercial
     Document Scanner
 ●   Goal : CE Mark
 ●   Design Approach:
     PC-AT Supply
     CE-Marked

IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       10
CE Case 1 Scanner                2
●    Verification Test :
     Fails CE @ Low MHz
●    Fix : Add “Can” Filter
     Pi+X/Y Caps
●    So We're Done, Right ?
     Uh-Oh, Not so Fast !




    IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       11
RE Case 2 Scanner Reprised                   1
 ●   Large Table-top
     Commercial
     Document Scanner
 ●   The Plot Thickens
     Way Beyond CE
 ●   Boards & Lotsa Wires
 ●   Sources, Paths &
     Radiators
 ●   Where 2 start ?

IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       12
RE Case 2 Scanner Reprised                  2

 ●   Purist Find the Source
     & Stop It There
 ●   Close-field Probe
     The “PC-104 Brains”
 ●   Choke it Off 5X
 ●   Not Enough !
 ●   Keep Moving !


IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       13
RE Case 2 Scanner Reprised                3
●   I see 3 Antennas:
    USB, FootSwitch, AC
●   Measure Currents as
    Lee Hill Advises




IEEE-EMCS-DL-1      jerrymeyerhoff@ieee.org       14
RE Case 2 Scanner Reprised                  4

 ●   Currents on 3
     “Antennas”
 ●   Same but different !




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       15
RE Case 2 Scanner Reprised                    5

     What to do ? All Three !
      “Kill It Dead” H.Ott
 ●   Move AC Filter. Isolate
     & decouple wires
 ●
     Got a “Free” 2nd Use for
     Filter = TriZ principle
 ●   Sounds easy now, but then?




IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       16
RE Case 2 Scanner Reprised                  6
 ●   USB Gnd Floats in
     Plastic
 ●   USB GND bond demo
 ●   Crude R/C filter in
     Foot Switch




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       17
RE Case 2 Scanner Reprised            7




IEEE-EMCS-DL-1   jerrymeyerhoff@ieee.org       18
RE Case 2 Scanner Lessons                   8

 ●   Do not have to always contain it @ Source
     PC104 cards: Just too many I/O & wires
 ●   Thankfully found Dominant Effect (H-Ott)
     Cables = Antennas & K-I-D @ low $
 ●   Did not have to “predict” Pre-Compliance levels
     Relative improvement @ Current Probe Enough
 ●   Problems were Frequency & Source
     independent / separable – Allowed independent
     fixes applied w/o interactions , whew :)
IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org        19
CI Case 3 Load-Dump                   1

 ●   Vehicle Power Socket
     Charger
 ●   24 V “Design”
 ●   600 Watt 39 V TVS
 ●   Passed 12 Volt
     “Load Dump”
 ●   Verify 24 V Dump
     110 ~ 170 Volts
     200mS , 2~ 4 Ohm
IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       20
CI Case 3 Load-Dump                  2

 ●   Monitor I & V
 ●   Ramp Up Stress Volts
 ●   1.6 A slo-blow I2t=6.4




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       21
CI Case 3 Load-Dump                 3

 ●   600 Watt TVS
 ●   Clamps “soft”
 ●   TVS Overheats to
     SHORT
 ●   Blows Fuse
 ●   NOT Acceptable



IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org       22
CI Case 3 Load-Dump                 4
 ●   SPICE for Insights – kW , I^^2*t




IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org       23
CI Case 3 Load-Dump                 5

 ●   5 kW TVS
 ●   Clamps at Voltage
 ●   Holds Voltage
 ●   Clears Fuse, Slow I2t
 ●   TVS Survives
 ●   Change the Fuse OK



IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org       24
CI Case 3 Load-Dump Lessons                   6

 ●   Go / No-Go Testing Insufficient
 ●   Gather “Real” Data While Verifying
 ●   Understand the Physics .. Fuse I2t
 ●   Simulate to Communicate
 ●   Knowledge Makes it Easier to Sell Solutions
 ●   Do Not Fear Going For The Max : 5kW



IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org         25
RI Case 4 - Big PCB               1
 ●   So I Get an e-mail
 ●   Commercial Vehicle
     Control System
 ●   Fails 3V/m @ 3 Labs
     Copper Tape the Box
 ●   Can I Fix It ?
 ●   Client Visit - Overload
 ●   Just Say Yes

IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       26
RI Case 4 - Big PCB               2

                      Assessment
 ●   ~15 cables (antennas)
 ●   Plastic Box
 ●   Huge PCB : Area & Thickness
 ●   Multiple uP's & Analogue - Loosely Populated
 ●   Minimal Failure Data – Something Resets
 ●   “I'm the Expert” – Make Recommendations

IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       27
RI Case 4 - Big PCB                3

                    How To Approach ?
 ●   Study Schematic & Layout
 ●   List of Best Design Practices & Why
 ●   Pictures of PCB modifications
 ●   Alternate PCB Stackups & Why: H Ott's Book
 ●   Expectations Set : 3 Iterations
 ●   Constraints : “If it took a little more $ to solve it
     for The Holidays I'd be good with that ”
IEEE-EMCS-DL-1            jerrymeyerhoff@ieee.org            28
RI Case 4 - Big PCB               4

 ●   PCB Stackup 4 layers
 ●   0.125” thick
 ●   Signals Outers
 ●   Power/Gnd Inners
 ●   No Gnd Fills
 ●   The Opportunity !



IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       29
RI Case 4 - Big PCB                5
                  Marked-up PCB changes




IEEE-EMCS-DL-1            jerrymeyerhoff@ieee.org       30
RI Case 4 - Big PCB               6

●   Found Allies : PCB Design Engineer & Ott Book
●   Chapter 16 “The Rosetta Stone” of Stackups
●   Bury Signals In Between Ground Planes
●   Back-fill / Gnd-pour Open Signal Layer Areas
●   Via-Stitch all Gnds Together Densely
●   Bypass / Choke Every Cable (Antenna) Wire



IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       31
RI Case 4 - Big PCB LESSONS                               7
 ●   Being There & Establishing Trust
 ●   Just Say Yes .. Someone Else Would Too
 ●   Find The Ally Within
 ●   Use Common Language / Framework
 ●   Ask For Everything & Early
 ●   Communicate Frequently (Over Distance)
 ●   Set Expectations & Limitations – Best Efforts
 ●   Best Practices in Circuit & PCB, Work ...It Depends...


IEEE-EMCS-DL-1              jerrymeyerhoff@ieee.org           32
CE Case 5 – Hall Sensor               1
 ●   Good IC RePackaged
 ●   2 terminals – simple !
 ●   500 Hz Pulses
     Wheel Speed




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       33
CE Case 5 – Hall Sensor                2

 ●   Just Measure CE in
     AM Radio Band
 ●   What The %#@&!
     Over the Line ?
 ●   OK 10nF Shunt
     Cap Can Fix This
 ●   & Need Cap for
     ESD “2 for 1 Sale”

IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       34
CE Case 5 – Hall Sensor                 3

 ●   Almost Better ...
 ●   What's That Peak ?
 ●   Find the Hidden
     Resonant Circuit




IEEE-EMCS-DL-1           jerrymeyerhoff@ieee.org       35
CE Case 5 – Hall Sensor                4

                 SPICE Model For Insights




IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org       36
CE Case 5 – Hall Sensor            5

 ●   LISN Gets Pulsed & Rung Out By SPICE




IEEE-EMCS-DL-1      jerrymeyerhoff@ieee.org       37
CE Case 5 – Hall Sensor               6

●   FFT Peak ~500 kHz
●   L-IS-N
●   Impedance Stabilization?
●   LISN Coils Resonance !
●   10nF & 10uH do the math
●   ~500 kHz




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org       38
CE Case 5 – Hall Sensor              7
●   A Better Idea ? Use IC Application Circuit
●   Do AC Analysis This Time




IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org       39
CE Case 5 – Hall Sensor              8

 ●   Now 10 nF & 5 uH = 700 kHz By SPICE AC
 ●   Do The Math, It Will Not Be Better




IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org       40
CE Case 5 – Hall Sensor LESSONS 9
 ●   Beware of Fix's Unintended Interactions
 ●   Industry Standard Fixtures Have Limitations
 ●   Model All the Important Parts in SPICE
 ●   As Simple As Possible But No Simpler (Einstein)
 ●   Analyze By Inspection & Insight (resonance)
 ●   Seek Corroboration : Analysis & Measures
     “3's A Charm”
 ●   Model When You Cannot Get In the Lab
IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org         41
RE Case 6 – Data RF Transmitter                   1

 ●   433 MHz ISM Band
 ●   Battery Op'
 ●   1 Chip Tx (PLL)
 ●   uP : Tx Control, Data
 ●   -20 dBc @1 MHz BW
 ●   Official Measure
     “Strange”
     Non-compliant

IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org   42
RE Case 6 – Data RF Transmitter                  2

 ●   Measure Real-Time
 ●   Late 1900's Tech ;-)
 ●   Key-on Clicks & Pops
     a'la HAM Radio




IEEE-EMCS-DL-1         jerrymeyerhoff@ieee.org   43
RE Case 6 – Data RF Transmitter                 3

●   Suspect Tx Enable
    Time Delay < 1 mS
●   Force Tx On Always
●   Crude But Effective




IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org   44
RE Case 6 – Data Tx LESSONS                    4

 ●   Official Data Often Hides Causal Evidence
 ●   Use Real-time Detection Equipment
 ●   Read Component Spec's
 ●   List Many Ideas & Dispatch Rapidly
 ●   Do Quick 'n Dirty / Is-IsNot Experiments
 ●   Software Was the Fix, For Once
 ●   Experience Can Make It Look Easy

IEEE-EMCS-DL-1        jerrymeyerhoff@ieee.org        45
Summary of Summaries
 ●   Just 3 Things: Source, Path, Affected
 ●   4 Problem classes RE, RI, CE, CI
 ●   4 Coupling modes - Tom V'
 ●   4 Tactics: Divide, Dominant,Dead,Impliment- Ott
 ●   Understand Limitations
 ●   Model Appropriately
 ●   Best Practices Work – Up To a Point
 ●   Human Factors as Important As Tech
IEEE-EMCS-DL-1          jerrymeyerhoff@ieee.org    46
Summary of Summaries , more
 ●   Observe in Real-Time & Parametric Sweeps
 ●   Look For Interactions & Independences
 ●   Precompliance Relative Measures Work
 ●   See The Antennas
 ●   Make / Take Time to Organize & Communicate
 ●   Just One More Thing ? (Colombo)
 ●   Keep On Learning

IEEE-EMCS-DL-1       jerrymeyerhoff@ieee.org      47
Thanks For Giving Me
                                A Hand !


 ●   Mentor: Yale Saffro, Bill Schilb, Gary Fierstein, Dick Bell
 ●   Trainer: Ralph Mitchell, Michel Mardiguian, Henry Ott,Tom VanDoren,
     Lee Hill
 ●   Modeler: Nick Buris, Colin Brench, David Johns, Roy Leventhal
 ●   Consultant: Nick Feagler, Daryl Gerke, Ken Wyatt, Patrick Andre'
 ●   Business: Neil Hagglund, Jack Black, Tom Braxton
 ●   Tech-Colleagues: Keith Hardin, Doug Smith
 ●   EMCS: Bruce Archambeault, Kimball Williams

IEEE-EMCS-DL-1                  jerrymeyerhoff@ieee.org                 48

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IEEE_EMCS_DL JDM LABS LLC 1i Pdf

  • 1. IEEE EMCS Distinguished Lectures “ Why Does My Product Fail EMC ?” And How To Fix it. Jerry Meyerhoff JDM LABS LLC jerrymeyerhoff@ieee.org http://rfjock.wordpress.com/ All Rights Reserved 2012
  • 2. Outline / Overview ● Thanks For The Invitation ! ● EMC Process Overview & Fundamentals <brief> ● Illustrate the 4 Quadrants Through Case Studies ● Problem Solving Methods: Technical & Humanistic ● Measurements, Experiments, Theory Formation, Modeling, Solution Generation & Maintaining Progress ● Lessons-learned IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 2
  • 3. EMC Tech Overview EMC Definition The Beneficial Property of a Device / System : ● Not to Create Excessive E-M Energy ● Not to be Disturbed by Expected E-M Energy ● Practical Design Goals & Regulatory Limits ● & Within Constraints IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 3
  • 4. EMC Tech Overview The 3 Players ● Source ● Path / Coupling Mechanism ● Affected Device or System / Receptor -Choose the “Best” One(s) to Attack- ● Consider Constraints : Performance, $, Time IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 4
  • 5. EMC Tech Overview SOURCE PATH RECEPTOR Radio/TV/Cell wires Radio:AM/FM/TV GPS Satellites cables Cell Hand-set BlueTooth earth GPS -TomTom High Voltage Lines metal BluetoothHeadset Car building Car iPOD person Pace-maker Cell Hand-set air Hearing Aid … IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 5
  • 6. EMC Tech Overview The EMC Matrix Conducted Conducted Immunity Emissions Radiated Radiated Immunity Emissions IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 6
  • 7. EMC Tech Overview 4 Mechanisms + Plus One Rank-order... Depends On Situation ● Conducted (mutual inductance) ● Magnetic Field ● Electric Field ● Electro-Magnetic Field (radio) + Path of Least Impedance Re: Dr Tom VanDoren IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 7
  • 8. EMC Case Studies ● Narrative Illustrations of .. ● Physical Principles ● Analysis Approaches ● Problem Solving ● Making Progress ● Working Well With Others ● “Best Solutions” Within Constraints IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 8
  • 9. Process Words of Wisdom Henry Ott's Big 4 1. Divide & Conquer : Structures, Freq's & Modes 2. Find The Dominant Mechanism : Pile On Fixes 3. Kill It Dead : Optimize Later 4. Implement Fixes : Best Possible Fashion IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 9
  • 10. CE Case 1 Scanner 1 ● The “Story” ● Large Table-top Commercial Document Scanner ● Goal : CE Mark ● Design Approach: PC-AT Supply CE-Marked IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 10
  • 11. CE Case 1 Scanner 2 ● Verification Test : Fails CE @ Low MHz ● Fix : Add “Can” Filter Pi+X/Y Caps ● So We're Done, Right ? Uh-Oh, Not so Fast ! IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 11
  • 12. RE Case 2 Scanner Reprised 1 ● Large Table-top Commercial Document Scanner ● The Plot Thickens Way Beyond CE ● Boards & Lotsa Wires ● Sources, Paths & Radiators ● Where 2 start ? IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 12
  • 13. RE Case 2 Scanner Reprised 2 ● Purist Find the Source & Stop It There ● Close-field Probe The “PC-104 Brains” ● Choke it Off 5X ● Not Enough ! ● Keep Moving ! IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 13
  • 14. RE Case 2 Scanner Reprised 3 ● I see 3 Antennas: USB, FootSwitch, AC ● Measure Currents as Lee Hill Advises IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 14
  • 15. RE Case 2 Scanner Reprised 4 ● Currents on 3 “Antennas” ● Same but different ! IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 15
  • 16. RE Case 2 Scanner Reprised 5 What to do ? All Three ! “Kill It Dead” H.Ott ● Move AC Filter. Isolate & decouple wires ● Got a “Free” 2nd Use for Filter = TriZ principle ● Sounds easy now, but then? IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 16
  • 17. RE Case 2 Scanner Reprised 6 ● USB Gnd Floats in Plastic ● USB GND bond demo ● Crude R/C filter in Foot Switch IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 17
  • 18. RE Case 2 Scanner Reprised 7 IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 18
  • 19. RE Case 2 Scanner Lessons 8 ● Do not have to always contain it @ Source PC104 cards: Just too many I/O & wires ● Thankfully found Dominant Effect (H-Ott) Cables = Antennas & K-I-D @ low $ ● Did not have to “predict” Pre-Compliance levels Relative improvement @ Current Probe Enough ● Problems were Frequency & Source independent / separable – Allowed independent fixes applied w/o interactions , whew :) IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 19
  • 20. CI Case 3 Load-Dump 1 ● Vehicle Power Socket Charger ● 24 V “Design” ● 600 Watt 39 V TVS ● Passed 12 Volt “Load Dump” ● Verify 24 V Dump 110 ~ 170 Volts 200mS , 2~ 4 Ohm IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 20
  • 21. CI Case 3 Load-Dump 2 ● Monitor I & V ● Ramp Up Stress Volts ● 1.6 A slo-blow I2t=6.4 IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 21
  • 22. CI Case 3 Load-Dump 3 ● 600 Watt TVS ● Clamps “soft” ● TVS Overheats to SHORT ● Blows Fuse ● NOT Acceptable IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 22
  • 23. CI Case 3 Load-Dump 4 ● SPICE for Insights – kW , I^^2*t IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 23
  • 24. CI Case 3 Load-Dump 5 ● 5 kW TVS ● Clamps at Voltage ● Holds Voltage ● Clears Fuse, Slow I2t ● TVS Survives ● Change the Fuse OK IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 24
  • 25. CI Case 3 Load-Dump Lessons 6 ● Go / No-Go Testing Insufficient ● Gather “Real” Data While Verifying ● Understand the Physics .. Fuse I2t ● Simulate to Communicate ● Knowledge Makes it Easier to Sell Solutions ● Do Not Fear Going For The Max : 5kW IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 25
  • 26. RI Case 4 - Big PCB 1 ● So I Get an e-mail ● Commercial Vehicle Control System ● Fails 3V/m @ 3 Labs Copper Tape the Box ● Can I Fix It ? ● Client Visit - Overload ● Just Say Yes IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 26
  • 27. RI Case 4 - Big PCB 2 Assessment ● ~15 cables (antennas) ● Plastic Box ● Huge PCB : Area & Thickness ● Multiple uP's & Analogue - Loosely Populated ● Minimal Failure Data – Something Resets ● “I'm the Expert” – Make Recommendations IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 27
  • 28. RI Case 4 - Big PCB 3 How To Approach ? ● Study Schematic & Layout ● List of Best Design Practices & Why ● Pictures of PCB modifications ● Alternate PCB Stackups & Why: H Ott's Book ● Expectations Set : 3 Iterations ● Constraints : “If it took a little more $ to solve it for The Holidays I'd be good with that ” IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 28
  • 29. RI Case 4 - Big PCB 4 ● PCB Stackup 4 layers ● 0.125” thick ● Signals Outers ● Power/Gnd Inners ● No Gnd Fills ● The Opportunity ! IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 29
  • 30. RI Case 4 - Big PCB 5 Marked-up PCB changes IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 30
  • 31. RI Case 4 - Big PCB 6 ● Found Allies : PCB Design Engineer & Ott Book ● Chapter 16 “The Rosetta Stone” of Stackups ● Bury Signals In Between Ground Planes ● Back-fill / Gnd-pour Open Signal Layer Areas ● Via-Stitch all Gnds Together Densely ● Bypass / Choke Every Cable (Antenna) Wire IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 31
  • 32. RI Case 4 - Big PCB LESSONS 7 ● Being There & Establishing Trust ● Just Say Yes .. Someone Else Would Too ● Find The Ally Within ● Use Common Language / Framework ● Ask For Everything & Early ● Communicate Frequently (Over Distance) ● Set Expectations & Limitations – Best Efforts ● Best Practices in Circuit & PCB, Work ...It Depends... IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 32
  • 33. CE Case 5 – Hall Sensor 1 ● Good IC RePackaged ● 2 terminals – simple ! ● 500 Hz Pulses Wheel Speed IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 33
  • 34. CE Case 5 – Hall Sensor 2 ● Just Measure CE in AM Radio Band ● What The %#@&! Over the Line ? ● OK 10nF Shunt Cap Can Fix This ● & Need Cap for ESD “2 for 1 Sale” IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 34
  • 35. CE Case 5 – Hall Sensor 3 ● Almost Better ... ● What's That Peak ? ● Find the Hidden Resonant Circuit IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 35
  • 36. CE Case 5 – Hall Sensor 4 SPICE Model For Insights IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 36
  • 37. CE Case 5 – Hall Sensor 5 ● LISN Gets Pulsed & Rung Out By SPICE IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 37
  • 38. CE Case 5 – Hall Sensor 6 ● FFT Peak ~500 kHz ● L-IS-N ● Impedance Stabilization? ● LISN Coils Resonance ! ● 10nF & 10uH do the math ● ~500 kHz IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 38
  • 39. CE Case 5 – Hall Sensor 7 ● A Better Idea ? Use IC Application Circuit ● Do AC Analysis This Time IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 39
  • 40. CE Case 5 – Hall Sensor 8 ● Now 10 nF & 5 uH = 700 kHz By SPICE AC ● Do The Math, It Will Not Be Better IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 40
  • 41. CE Case 5 – Hall Sensor LESSONS 9 ● Beware of Fix's Unintended Interactions ● Industry Standard Fixtures Have Limitations ● Model All the Important Parts in SPICE ● As Simple As Possible But No Simpler (Einstein) ● Analyze By Inspection & Insight (resonance) ● Seek Corroboration : Analysis & Measures “3's A Charm” ● Model When You Cannot Get In the Lab IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 41
  • 42. RE Case 6 – Data RF Transmitter 1 ● 433 MHz ISM Band ● Battery Op' ● 1 Chip Tx (PLL) ● uP : Tx Control, Data ● -20 dBc @1 MHz BW ● Official Measure “Strange” Non-compliant IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 42
  • 43. RE Case 6 – Data RF Transmitter 2 ● Measure Real-Time ● Late 1900's Tech ;-) ● Key-on Clicks & Pops a'la HAM Radio IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 43
  • 44. RE Case 6 – Data RF Transmitter 3 ● Suspect Tx Enable Time Delay < 1 mS ● Force Tx On Always ● Crude But Effective IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 44
  • 45. RE Case 6 – Data Tx LESSONS 4 ● Official Data Often Hides Causal Evidence ● Use Real-time Detection Equipment ● Read Component Spec's ● List Many Ideas & Dispatch Rapidly ● Do Quick 'n Dirty / Is-IsNot Experiments ● Software Was the Fix, For Once ● Experience Can Make It Look Easy IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 45
  • 46. Summary of Summaries ● Just 3 Things: Source, Path, Affected ● 4 Problem classes RE, RI, CE, CI ● 4 Coupling modes - Tom V' ● 4 Tactics: Divide, Dominant,Dead,Impliment- Ott ● Understand Limitations ● Model Appropriately ● Best Practices Work – Up To a Point ● Human Factors as Important As Tech IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 46
  • 47. Summary of Summaries , more ● Observe in Real-Time & Parametric Sweeps ● Look For Interactions & Independences ● Precompliance Relative Measures Work ● See The Antennas ● Make / Take Time to Organize & Communicate ● Just One More Thing ? (Colombo) ● Keep On Learning IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 47
  • 48. Thanks For Giving Me A Hand ! ● Mentor: Yale Saffro, Bill Schilb, Gary Fierstein, Dick Bell ● Trainer: Ralph Mitchell, Michel Mardiguian, Henry Ott,Tom VanDoren, Lee Hill ● Modeler: Nick Buris, Colin Brench, David Johns, Roy Leventhal ● Consultant: Nick Feagler, Daryl Gerke, Ken Wyatt, Patrick Andre' ● Business: Neil Hagglund, Jack Black, Tom Braxton ● Tech-Colleagues: Keith Hardin, Doug Smith ● EMCS: Bruce Archambeault, Kimball Williams IEEE-EMCS-DL-1 jerrymeyerhoff@ieee.org 48