Sputtering deposition semiconductor equipment

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Used Semiconductor Equipment Source
Chemical Deposition(CVD,PECVD)
ADVANCED CRYSTAL SCIENCES LPCVD SYSTEM
AIXTRON AIX200 LP-MOCVD Chemical Vapor Deposition
AMP-3300 Plasma II PECVD Deposition System
NOVELLUS Deposition Tool CONCEPT 2 Altus DLCM
Oxford PlasmaLab 80 Plus DLC Deposition System
Plasma-Therm 730 SLR PECVD Load-Locked System
Plasma-Therm 790 Dual Chamber PECVD & RIE System
Plasma-Therm 790™ Series Platform
Plasma-Therm LAPECVD™
Plasma-Therm Productivity Enhancements
Plasmafab PF310 (STS 310) PECVD
Plasmatherm 790 PECVD
Plasmatherm Dual Chamber PVD-RIE
Plasmatherm SLR 730 PECVD Plasma Shuttle-Lock
Plasmatherm SLR 730 PECVD Shuttle lock PECVD hysical sputtering is driven by momentum
PlasmaTherm Versalock 700 PECVD exchange between the ions and atoms in the
ROTH & RAU AK 800 materials, due to collisions.
Solid State Equipment SSEC 3308 Cassette to Cassette The incident ions set off collision cascades in the
Technics PEIIA PECVD / RIE System target. When such cascades recoil and reach the
TEMESCAL BJD-1800 target surface with an energy greater the surface
Used CHA SEC 1000 RAP 4 pocket E-Beam evaporator binding energy, an atom would be ejected, known
Used CVC Old Style Shutter Assembly as sputtering. If the target is thin on an atomic
Used CVD Semicoductor Equipment List scale the collision cascade can reach the back
Used Plasmatherm 700 VLR (Versalock ) PECVD System side of the target and atoms can escape the
Used Plasmatherm 790 PECVD Stand alone deposition surface binding energy `in transmission'. The average number of atoms
Used Plasmatherm 790 PECVD/RIE Dual Chamber 790 ejected from the target per incident ion is called the sputter yield and

https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system 12/14/2012


Used Plasmatherm PT530 PECVD Deposition System depends on the ion incident angle, the energy of the ion, the masses of the
Veeco RF350 C2 IBE (Ion Beam Deposition) ion and target atoms, and the surface binding energy of atoms in the target.
Watkins Johnson (WJ) 1000 For a crystalline target the orientation of the crystal axes with respect to the
Watkins Johnson (WJ) 1500 target surface is relevant.
Watkins Johnson (WJ) 999R APCVD The primary particles for the sputtering process can be supplied in a number
Coater and Developer of ways, for example by a plasma, an ion source, an accelerator or by a
Karl Suss ACS200 Cassette to Cassette Coat-Develop radioactive material emitting alpha particles.
Suss Microtec Delta 20T2/150VPO A model for describing sputtering in the cascade regime for amorphous flat
Used SVG Coater and Developer Equipment targets is Thompson's analytical model.[4] An algorithm that simulates
Contact Us sputtering based on a quantum mechanical treatment including electrons
Dicing Saws stripping at high energy is implemented in the program TRIM.[5]
Thermocarbon Dicing Saw 8003
A different mechanism of physical sputtering is heat spike sputtering. This
E-Testers may occur when the solid is dense enough, and the incoming ion heavy
Agilent HP 4062UX Semiconductor Process Control System enough, that the collisions occur very close to each other. Then the binary
Evaporation Equipment collision approximation is no longer valid, but rather the collisional process
Balzers Evaporator should be understood as a many-body process. The dense collisions induce
CHA Industries Mark 40 Source Evaporator a heat spike (also called thermal spike), which essentially melts the crystal
CHA Industries Mark 50 Source Evaporator locally. If the molten zone is close enough to a surface, large numbers of
CHA Industries SE 1000 E-Beam Evaporation System atoms may sputter due to flow of liquid to the surface and/or
CHA Industries SE 600 E-Beam Evaporator microexplosions.[6] Heat spike sputtering is most important for heavy ions
CHA Mark 50 system for sale (real CHA) (say Xe or Au or cluster ions) with energies in the keV–MeV range
CHA SE 600 EBEAM SYSTEM bombarding dense but soft metals with a low melting point (Ag, Au, Pb, etc.).
CHA SE 600 EVAPORATOR The heat spike sputtering often increases nonlinearly with energy, and can
CHA SE 600 RAP CHA for small cluster ions lead to dramatic sputtering yields per cluster of the
Cooke Filament Evaporator order of 10000.[7] For animations of such a process see here.
CTI 8 CRYOPUMP CTI Physical sputtering has a well-defined minimum energy threshold which is
Denton 502 Denton equal to or larger than the ion energy at which the maximum energy transfer
Edwards Auto 500 of the ion to a sample atom equals the binding energy of a surface atom.
NRC / Varian 3117 Thermal Evaporator This threshold typically is somewhere in the range 10–100 eV.
NRC / Varian 3125 E-Beam Evaporator Preferential sputtering can occur at the start when a multicomponent solid
Temescal BJD 1800 6 Pocket E-Beam Evaporator target is bombarded and there is no solid state diffusion. If the energy
Temescal FC 1800 E-Beam Evaporator transfer is more efficient to one of the target components, and/or it is less



Temescal VES 2550 Four Pocket E-Beam Evaporator strongly bound to the solid, it will sputter more efficiently than the other. If in
Used CHA 1000 E-Beam Evaporator an AB alloy the component A is sputtered preferentially, the surface of the
Used CHA 600 Gold Evaporator solid will, during prolonged bombardment, become enriched in the B
Used Semiconductor Equipment component thereby increasing the probability that B is sputtered such that
Used Temescal FCE 3200 Six Pocket E - Beam Evaporator the composition of the sputtered material will be AB.
VARIAN 3117 FILIMENT EVAPORATOR
Varian 3118 Thermal Filament Evaporator Electronic sputtering
Varian 3180 Sputtering System
The term electronic sputtering can mean either sputtering induced by
Veeco RF350 C2 IBD Ion Beam Deposition
energetic electrons (for example in a transmission electron microscope), or
VEECO/SLOAN ELECTRON BEAM EVAPORATOR
sputtering due to very high-energy or highly charged heavy ions which lose
Furnace and Oven energy to the solid mostly by electronic stopping power, where the electronic
Lab-Line Squaroid DUO-VAC OVEN excitations cause sputtering.[8] Electronic sputtering produces high sputtering
LINDBERG TUBE FURNACE yields from insulators, as the electronic excitations that cause sputtering are
MRL Cyclone C430 LH Nitride/Oxidation Furnance not immediately quenched, as they would be in a conductor. One example of
Vacuum Furnace for Hard Bake special parts this is Jupiter's ice-covered moon Europa, where a MeV sulfur ion from
Inductively coupled plasma-ICP Jupiter's magnetosphere can eject up to 10,000 H2O molecules.[9]
STS (Surface Tech Sys) MultiplexInductively-Coupled Plasma (ICP)
Advanced Silicon Etch (ASE) System Potential sputtering
STS Inductively Coupled Plasma High Density Plasma Etch
STS Multiplex ASE AOE ICP CLUSTER TOOL In the case of multiply charged projectile ions a particular form of
STS MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon
electronic sputtering can take place which has been termed potential
Etch (ASE) System sputtering. In these cases the potential energy stored in multiply charged
Lithography & Photoresist ions (i.e., the energy necessary to produce an ion of this charge state from its
Metrology Systems neutral atom) is liberated when the ions recombine during impact on a solid
surface (formation of hollow atoms). This sputtering process is characterized
Clean Room Partice Count Meter model 100
by a strong dependence of the observed sputtering yields on the charge
ESD RING Automatic Cold Resistance Meter of Sliders
state of the impinging ion and can already take place at ion impact energies
Hitachi CD-SEM S-8820 Used Semiconductor Equipment
well below the physical sputtering threshold . Potential sputtering has only
HItachi CD-SEM S-8840 Used Semiconductor Equipment
been observed for certain target species and requires a minimum potential
HITACHI Field Emission SEM (FE-SEM) S-5000
energy.
Hitachi S-800 SEM Scanning Electron Microscope
JWS-7555S Wafer Inspection
Etching and chemical sputtering
Kla-Tencor OmniMap Auto RS55 / tc USED



PEGASUS 2000 Flying Height Test System Model FHT Removing atoms by sputtering with an inert gas is called `ion milling' or 'ion
Tencor TF-1 Thin films monitor etching'.
Used Hitachi CD-SEM Equipment
Sputtering can also play a role in reactive ion etching (RIE), a plasma
Used Hitachi FE-SEM/SEM Equipment process carried out with chemically active ions and radicals, for which the
Used KLA-Tencor Metrology Equipment sputtering yield may be enhanced significantly compared to pure physical
Zeiss/Leo DSM 982 FE SEM sputtering. Reactive ions are frequently used in Secondary Ion Mass
Plasma Asher Descum Systems Spectrometry (SIMS) equipment to enhance the sputter rates. The
Plasma Etcher mechanisms causing the sputtering enhancement are not always well
Technics PEIIB Planar Etch Plasma System understood, but for instance the case of fluorine etching of Si has been
Two Used Matrix 10 Plasma Asher Machine for 8 inch Wafe modeled well theoretically.
Used Hydrogen Chloride (HCl) Etching System
Sputtering which is observed to occur below the threshold energy of physical
Rapid Thermal Process sputtering, is also often called chemical sputtering. The mechanisms behind
A.G. Associates 410 Table such sputtering are not always well understood, and may be hard to
AG ASSOCIATES 2146 distinguish from chemical etching. At elevated temperatures, chemical
AG Associates 4100 Heatpulse Rapid Thermal Processor sputtering of carbon can be understood to be due to the incoming ions
AG Associates Heatpulse 210 Rapid Thermal Process weakening bonds in the sample, which then desorb by thermal
AG ASSOCIATES HEATPULSE 210 RAPID THERMAL activation. The hydrogen-induced sputtering of carbon-based materials
PROCESSOR observed at low temperatures has been explained by H ions entering
AG Associates Heatpulse 410 Rapid Thermal Anneal between C-C bonds and thus breaking them, a mechanism dubbed swift
AG ASSOCIATES HEATPULSE 410 RAPID THERMAL chemical sputtering.
PROCESSOR
AG Associates Heatpulse 610 I Rapid Thermal Processor Applications and phenomena
AG Associates Heatpulse 610 Rapid Thermal Anneal
AG Associates Heatpulse 610 Rapid Thermal Process Film deposition
AG ASSOCIATES HEATPULSE 610 RAPID THERMAL
PROCESSOR Main article: Sputter deposition
AG Associates Heatpulse RTP Sputter deposition is a method of depositing thin films by sputtering which
AG Associates Heatpulse Services involves eroding material from a "target" source onto a "substrate" e.g. a
AG Associates Heatpulse210 silicon wafer. Resputtering, in contrast, involves re-emission of the deposited
AG Associates Heatpulse410 Rapid Thermal Processor material, e.g. SiO2 during the deposition also by ion bombardment.
AG Associates Heatpulse610 Rapid Thermal Processor Sputtered atoms ejected into the gas phase are not in their thermodynamic
AG ASSOCIATES MINIPULSE 310 RAPID THERMAL equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.
PROCESSOR



AG Associates Minipulse310 Rapid Thermal Processor A substrate (such as a wafer) placed in the chamber will be coated with a
APPLIED MATERIALS 0010-22033 Rapid Thermal Process thin film. Sputtering usually uses an argon plasma.
APPLIED MATERIALS Centura 5200
APPLIED MATERIALS Centura 5200 TPCC Etching
APPLIED MATERIALS Centura ACP 2X Radiance ISSG In semiconductor industry sputtering is used to etch the target. Sputter
APPLIED MATERIALS Centura RTP TPCC XE+ etching is chosen in cases where a high degree of etching anisotropy is
APPLIED MATERIALS Centura TPCC Rapid Thermal Anneal needed and selectivity is not a concern. One major drawback of this
BOC EDWARDS Helios technique is wafer damage.
BOC EDWARDS Helios S Rapid Thermal Processing
BOC EDWARDS IGRC For analysis
CEE/Brewer Science UV-Thermal Processing System Another application of sputtering is to etch away the target material. One
DAINIPPON LA-3000-F such example occurs in Secondary Ion Mass Spectrometry (SIMS), where
EATON NOVA / AXCELIS 808 the target sample is sputtered at a constant rate. As the target is sputtered,
EATON NOVA / AXCELIS Reliance 850 the concentration and identity of sputtered atoms are measured using Mass
INSTRON RHS 1533A Spectrometry. In this way the composition of the target material can be
Koyo Thermo Systems RTP and RTA Systems:RLA3100 series determined and even extremely low concentrations (20 µg/kg) of impurities
RLA1200 series detected. Furthermore, because the sputtering continually etches deeper into
LPT TM 100 / 300 FC RTA RTP RTO RTN Systems the sample, concentration profiles as a function of depth can be measured.
Mattson AST2800
Mattson AST2900 RTP In space
Mattson AST3000 Sputtering is one of the forms of space weathering, a process that changes
Mattson SHS-2900 RTA RTP System for 200 mm Wafer the physical and chemical properties of airless bodies, such as asteroids and
METRON / AG ASSOCIATES 4108 Rapid Thermal Annealing RTA our moon. It is also one of the possible ways that Mars has lost most of
RTP RTO RTN Systems its atmosphere and that Mercury continually replenishes its tenuous surface-
METRON / AG ASSOCIATES Heatpulse 8108 Rapid Thermal bounded exosphere.
Process RTA RTP RTN RTO Systems
METRON / AG ASSOCIATES Heatpulse 8800 Rapid Thermal
Anneal RTA RTP RTN RTO
METRON / AG ASSOCIATES Heatpulse 8800 RTA RTP RTN RTO
Rapid Thermal Anneal
Modular Pro RTP-600S
MPT Used UV-600 UV-OZONE CLEANING SYSTEM



MPTC RTP-600XP Rapid Thermal Annealing Systems RTP RTA
RTN RTO Systems
MPTC RTP-600XP Rapid Thermal Processors Systems RTA RTP
RTO RTN Systems
NEWYOUNG RTA 200HRapid Thermal Processing Systems RTO
RTN RTA RTP Systems
PEAK ALP 5000 Flash Rapid Thermal Annealing Systems RTN
RTO RTP RTA Systems
PPC 2016 BT Rapid Thermal Process Systems RTA RTP RTO
RTN Equipment
Rapid Thermal Processing: AG ASSOCIATES 8800
Rapid Thermal Processors: AET RX-V4
Rapid Thermal Processors: AG ASSOCIATES 210
Rapid Thermal Processors: AG ASSOCIATES 210M
Rapid Thermal Processors: AG ASSOCIATES 410 C23
Rapid Thermal Processors: AG ASSOCIATES Heatplus 2146
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 2101-01
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 210T
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4100
Rapid Thermal Processors: AG ASSOCIATES Mini-Pulse 310
Rapid Thermal Processors: APPLIED MATERIALS Centura
Rapid Thermal Processors: APPLIED MATERIALS Centura 5200
Rapid Thermal Processors: APPLIED MATERIALS Centura 5200
TPCC
Rapid Thermal Processors: APPLIED MATERIALS Centura ACP



Rapid Thermal Processors: APPLIED MATERIALS Centura RTP
XE+
Rapid Thermal Processors: BOC EDWARDS TCS 1
Rapid Thermal Processors: BOC EDWARDS TCS-S
Rapid Thermal Processors: DAINIPPON LA-820
Rapid Thermal Processors: JIPELEC JetFirst 300
Rapid Thermal Processors: MATTSON 3000
Rapid Thermal Processors: METRON / AG ASSOCIATES 4100
Rapid Thermal Processors: METRON / AG ASSOCIATES
Heatpulse 8108
Rapid Thermal Processors: STEAG / MATTSON / AST 2800
Rapid Thermal Processors: STEAG / MATTSON / AST 2800e
Rapid Thermal Processors: STEAG / MATTSON / AST SHS 2800
Rapid Thermal Processors: STEAG / MATTSON / AST SHS 3000
RAYTEK Marathon MR Series Pyrometer
RTP 2 INCH 115V RAPID THERMAL PROCESSOR, RAPID
THERMAL ANEALER
RTP Matton SHS 2900 AST 2900 Rapid Thermal Process
Spare Parts for AG Associates Product Lines
SSI Solaris 150 Rapid Thermal Annealing System
TEL / WAFERMASTERS SA0150LP Rapid Thermal Processing
Systems
TEL / WAFERMASTERS SRTF200-LP Rapid Thermal Processor
RTA RTP RTN RTO System
Used ANNEALSYS Products RTP & RTCVD AS-Master
Used ANNEALSYS Products RTP & RTCVD AS-One
Used Annealsys Rapid Thermal Annealing furnaces AS-Micro
Used CEE/Brewer Science 2100 UV-Thermal processing
Used CVD RTA RTP Systems
Used Jipelec JetClip -200-mm RTP & RTCVD Cluster Tool
Used Jipelec JetClip sg
Used Jipelec JetFirst RTA-Low cost bench top RTP processor - Up
to 12"



Used Jipelec JetStar -Versatile RTP processor to transfer your
process from development to production.
Used Koreavac KVR-2000 Series RTP(Rapid Thermal Process)
Used Modular Process Technology Rapid Thermal Processing
System: RTP-3000
System: RTP-800S (200 mm)
Production System: MODULAR One
Used Rapid Thermal Annealing System AO 500
Used Rapid Thermal Annealing System: RTP-600S (150 mm)
Modular Process Technology
Used SSI Inc Solaris 100 Rapid Thermal Processor
Used SSI INC Solaris Eclipse Vacuum RTP
Used SSI Solaris 150UV
Used Summit XT RAPID THERMAL PROCESSING
Used ULVAC Technologies MILA-5000-P-F Mini Lamp Annealer
Used ULVAC Technologies MILA-5000-P-N Mini Lamp Annealer
Used ULVAC Technologies MILA-5000-UHV Mini Lamp Annealer
Used UniTemp GmbH RTP-1000-150 Front loading
Used UniTemp GmbH RTP-1200-100 Front loading
Used UniTemp GmbH VPO-1000-300 Top loading
WAFERMASTERS 5BAO-200 Rapid Thermal Anneal Equipment
RTA RTP RTN RTO
Reactive ion etching-RIE
Alcatel 601E DRIE
Plasma-Therm Reactive Ion Etching System Model 70 Serie
Plasmatherm SLR 720 RIE,700 series
STS RIE system



Used Plasmatherm 790 RIE Stand alone 790 RIE
Sciber Breaker
Dynatex DX-III wafer sciber breaker
Dynatex GST-150 wafer sciber breaker
Sputter Deposition System
2400 series single piece product line
2KVA Evaporator From CVC system 2KVA transformer
AIRCO TEMESCAL FDC-8000 Sputtering Systems:
Airco Temescal HRS 2550 Sputtering System
AIRCO TEMESCAL HRS 2550 Sputtering Systems:
AIRCO TEMESCAL VES 2550 Sputtering Systems:
AKT 1600 Sputtering Systems:
ALCATEL / MEIVAC / COMPTECH 2480 Sputter Deposition
Systems:
ALCATEL PUMA 500 Sputtering Systems:
AMAT Endura® 5500 SIP EnCoRe™ System
ANATECH / TECHNICS HUMMER V
ANATECH / TECHNICS Hummer V-A Sputter Coater System
ANATECH / TECHNICS HUMMER X
ANATECH / TECHNICS RF-2C
ANATECH / TECHNICS: HUMMER 6.2
ANATECH / TECHNICS: HUMMER IV Sputter Deposition System
PECVD
ANATECH / TECHNICS: HUMMER V
ANATECH / TECHNICS: Hummer V-A Sputter
ANATECH / TECHNICS: HUMMER VI
ANATECH / TECHNICS: HUMMER VI Sputter Systems
ANATECH / TECHNICS: HUMMER VII
Anelva ILC-3935S Sputter
APPLIED MATERIALS CENTURA 300MM
APPLIED MATERIALS ENDURA 5500 SIP ENCORE
APPLIED MATERIALS HDP
APPLIED MATERIALS: Endura



APPLIED MATERIALS: Endura 5500
APPLIED MATERIALS: Endura 5500 Sputter Deposition
APPLIED MATERIALS: Endura 5500 Sputter Systems PECVD
APPLIED MATERIALS: Endura 5500P Sputtering Coating
Equipment
APPLIED MATERIALS: Endura PECVD Semiconductor Equipment
APPLIED MATERIALS: Endura Sputter Deposition Systems
APPLIED MATERIALS: Endura Sputter Systems
AURION Custom Sputter Systems
Aurion Sputter
AVIZA AL203 Process Module for Nano-ALD System
AVIZA NANO-ALD Brooks Automation Gemini Express
BALZERS: LLS 801
Bellopressor Technologies Four Stage Compressor
Blank off Flange for CVC 2800/611 8" target P/N 288536
Blank off Flange for CVC 601 8" target
Buy Perkin-Elmer Sputter
CANON / ANELVA: C-7100
CANON / ANELVA: ECR 300E
CANON / ANELVA: I-1012
CANON / ANELVA: I-1012 Sputter Coater
CANON / ANELVA: I-1060 SVII Plus 1
CANON / ANELVA: ILC 1012 MK II
CANON / ANELVA: ILC 1013
CANON / ANELVA: ILC 1060SV
CANON / ANELVA: ILD 4100
CANON / ANELVA: MIG 430
CANON / ANELVA: SPF-540H



CHA 600 Evaporator
CHA Industries Mark 50 Source Evaporator
CHA INDUSTRIES SPUTTERING SYSTEM
CHA SE 600 EBEAM SYSTEM
CHA WEB/ROLL SPUTTER COATER
CHESSEN Sputter Systems
CPA V2000 Five Target RF and DC Magnetron In Line
CPA V2000 Five Target RF and DC Magnetron Inline Sputtering
System
CVC 601 Four Target RF Sputtering System
CVC 601 LL Load Lock with RF Etch
CVC 601 sputter systems
CVC parts
CVC SPUTTERING SYSTEM, ION ETCH AST-304
Denton Desktop Pro Sputtering System
Denton Explorer Thin Film Deposition Platform
Denton Integrity Precision Optics Coating Platform
DENTON KSE 2AA Denton
DENTON VACUUM DESK II
EDWARDS 306 FILAMENT EVAPORATOR
Edwards 306 Sputtering System
Edwards AUTO 306 Sputtering System
Edwards Auto 500
ELECTRON MICROSCOPY SCIENCES EMS575XD
Fulintec FSE-ANE-IBS - 6”/ 8” wafer UBM sputter for sale
GENCOA PLANAR MAGNETRON CATHODE
INNO VAC KVTS-T0138
ION BEAM SPUTTER TARGET
KDF 654ix Wafer Processing System
KURT J. LESKER Vacuum System



L / VARIAN MB2-830
L91510 Perkin Elmer PE-2400 Sputtering System parts/repair
w/Accessories
Leybold Balzers Z660, Used, Oerlikon Complete System
LEYBOLD HERAEUS A 1350 BM sputtering Systems
LEYBOLD HERAEUS: A 1350 BM sputter
LEYBOLD HERAEUS: Z650
LGA Thin Films
Magnetron Sputter Source - High Vacuum DC/RF Magnetron
Magnetron Sputtering
Magnetron Sputtering Cathode Services
Manufacturer: MAGNETRON Sputter
Manufacturer: MAGNETRON Sputter coater
MEIVAC / ALCATEL / COMPTECH VQ 200-ISO-U-SM
Mfr of Sputter Systems
MILL LANE DUAL CHAMBER RESEARCH SPUTTERING
SYSTEM
MILL LANE ENGINEERING REEL COATER 4123
MKS 250/B
MKS 252A
MRC / TEL Eclipse Mark II
MRC / TEL Eclipse Mark II Pre-Star
MRC / TEL Eclipse Mark IV
MRC / TEL Eclipse Star
MRC / TEL: Eclipse Mark II sputtering
MRC / TEL: Eclipse Star
MRC / TEL: Eclipse Star sputter coater
MRC 600 Series Sputtering Tool
MRC 603 II
MRC 603 Sputter System
MRC 603-III MRC INLINE SPUTTERING SYSTEM, CRYO
PUMPED Used
MRC 643 Sputtering System (643)



MRC 902 sputter
MRC 903M MRC MRC 903M 3 TARGET SPUTTERING
DEPOSITION SYSTEM
MRC 943 Down Sputter System
MRC 943 Down sputter system.
MRC IN-LINE SPUTTER ETCH SYSTEM MRC 902
MRC Planar
MRC THREE TARGET INLINE SPUTTERING SYSTEM MRC
903M
NORDIKO: 2550 sputter deposition
NORDIKO: 8550
NORDIKO: 8550 sputtering deposition
NOVELLUS SYSTEM: CONCEPT 3 INOVA-xT sputter
NOVELLUS SYSTEM: CONCEPT 3 sputter
NOVELLUS: CONCEPT 2 sputter system
NOVELLUS: MB2 sputter deposition
NOVELLUS: MB2 used sputter coater
NOVELLUS: MBB 830 sputtering systems
NOVELLUS: XM 90 Used
NRC / Varian 3117 Thermal Evaporator
NRC / Varian 3125 E-Beam Evaporator
Nu Vacuum Systems Ultrahigh Vacuum Box Coater
OERLIKON / BALZERS Sprinter-9
OPAL: 3 Pro sputter despostion
PELCO: 3 sputter deposition
Perkin Elmer 2400 Sputter Tool: New Water Interlock Switch Details
Perkin Elmer 2400 Sputtering System with RF
Perkin Elmer 2400 Sputtering System with RF Generator
Perkin Elmer 2400-SSA Physical Vapor Deposition
Perkin Elmer 4400 Sputtering System
Perkin Elmer 4410
PERKIN ELMER 4410 (WITH LOAD LOCK)
Perkin Elmer 4410 Sputtering System



Perkin Elmer 4450 Sputtering
PERKIN ELMER 5 kV
Perkin Elmer 6J Sputtering System
Perkin Elmer 8L Sputtering System
Perkin Elmer PE-2400 Sputtering System parts/repair
w/Accessories
Perkin Elmer PVD System Available Parts
Perkin Elmer Sputter
Perkin-Elmer 2400-6J RF Sputter System, 3 target
Perkin-Elmer 2400-8L Sputtering Deposition Systems Service
Perkin-ELmer 2400-8SA Sputtering System Technical Service
Perkin-Elmer 2400-8SA Sputtering Systems
Perkin-elmer 4400 series batch product line
Perkin-Elmer 4400 Sputtering Deposition Systems Service
PERKIN-ELMER 4450 SPUTTERING DEPOSITION SYSTEM
PERKIN-ELMER PE 2400-8L Sputtering System Spare Parts
Perkin-Elmer PE 2400-8L Sputtering Systems
Perkin-Elmer PE 4400 Sputtering Systems
PERKIN-ELMER PE2400-8SA Sputtering System Spare Parts
PERKIN-ELMER PE4400 Sputtering System Spare Parts
PERKIN-ELMER SPUTTERING DEPOSITION SYSTEM For Sale
Perkin-Elmer Sputtering Deposition Systems



PERKIN-ELMER SPUTTERING SYSTEM START-UP
PROCEDURE
Physical Vapor Deposition (PVD) Suppliers
PLASMA SCIENCES: Arc
PLASMA SCIENCES: HRC 150
PLASMA SCIENCES: HRC 200 sputter
Plasma-Therm Versalock™ Cluster Based Platform
PLATECH: 3
Pre-Owned Sputtering Systems
PROCESS INTEGRATION: 944 used
QUORUM TECH / BIO-RAD / POLARON: E-5100
QUORUM TECH / BIO-RAD / POLARON: E-5100 sputter
QUORUM TECH / BIO-RAD / POLARON: ISI PS-2
SANYU: SC-701C sputter
SEMICORE: SC 1500 sputter
SFI Endeavor 8600 Cluster Sputtering
SHARON VACUUM SPUTTERING SYSTEM
SHIBAURA BM-1400PC
SHIBAURA: CFS-12P-100H
SHOWA SHINKU SBC-08C
SHOWA SHINKU SBC-08CX
SHOWA SHINKU SBC-10DXC
SHOWA SHINKU SPH-2016
SHRADER sputter deposition used
SIGMA INSTRUMENTS SID-142
SIGMA Sputtering System
SLOAN SL 1800-S
SONOTEK Ultrasonicator Flexicoat FC
SPI 11425 SPI 11430 sputter
SPI 11425/11430 Tabletop Sputter Coater for SEM



SPI-Module Sputter/Carbon Coater System
Sputter Deposition Equipment Accessories
Sputter Deposition Key Words-A
Sputter Deposition Key Words-B ,C
Sputter Deposition Key Words-D,E,F,G,H
Sputter Deposition Key Words-I,J,K,L,M,N,O
Sputter Deposition Key Words-P,Q,R
Sputter Deposition Key Words-S,T,U,V,W,X,Y,Z
sputter Varian 3180 3280 3190 3290 3290 STQ thin film sputtering
sputter Varian 3180 3280 3190 3290 thin film sputtering
SPUTTERED FILMS INC / SFI Endeavor 8600
SPUTTERED FILMS INC / SFI Shamrock 6
Sputtering and Evaporation Service
Sputtering Deposit System Spare Parts
Sputtering system about by Second Source, Inc.
Sputtering system reliability ..... for the last 25 years
Sputtering System, Perkin Elmer-4400
Sputtering Systems Emitech / Emcore K650
Sputtering Systems Emitech / Emcore K950 sputter
Sputtering Systems Comtech
Sputtering Systems Cvc 2800
Sputtering Systems Cvc 2800LL
Sputtering Systems Cvc 601
Sputtering Systems Cvc 601LL
Sputtering Systems Cvc AST 400
Sputtering Systems Cvc AST 601
Sputtering Systems Cvc ICS 660
Sputtering Systems Cvc PSE 403
Sputtering Systems Denton DESK I
Sputtering Systems Denton DESK I Sputter
Sputtering Systems Denton DESK II
Sputtering Systems Denton DESK II coater



Sputtering Systems Denton DESKTOP I
Sputtering Systems Denton DESKTOP II
Sputtering Systems Edwards 306 sputter
Sputtering Systems Edwards E09602000
Sputtering Systems Edwards E09602000 sputter
Sputtering Systems Emscope SC-650 sputter
Sputtering Systems Emscope SM-300 sputter
Sputtering Systems Enercon LM3214-09
Sputtering Systems Evatec Process System Radiance Sputter
Sputtering Systems Fulintec FSE FU-16PEB
Sputtering Systems Fulintec FSE-CLS-UBM-200
Sputtering Systems Fulintec FSE-UBM-200
Sputtering Systems Fulintec UBM Sputter
Sputtering Systems Glow Research Sputterglow
Sputtering Systems Indel 3 RF GUN
Sputtering Systems Inficon XMS-1
Sputtering Systems Inficon XMS-3
Sputtering Systems Innotec DS 24
Sputtering Systems Innotec Sputter
Sputtering Systems Innotec VS 24C
Sputtering Systems VARIAN 3190
Sputtering Systems VARIAN 3280
Sputtering Systems Various sputtering target
Sputtering Systems, Cpa / Kurdex
Sputtering Systems: AMCI GT777
Sputtering Systems: AMCI GT7777
Sputtering Systems: AURION
Sputtering Systems: BALZERS 450
Sputtering Systems: BALZERS BA 810
Sputtering Systems: BALZERS LLS 900
Sputtering Systems: BALZERS SCD 040
Sputtering Systems: BOC EDWARDS 306



Sputtering Systems: BOC EDWARDS AR
Sputtering Systems: CANON / ANELVA SBH 2306DE
Sputtering Systems: CPA / KURDEX 9900
Sputtering Systems: CPA V2000
Sputtering Systems: ISI PS 2 Sputter Coater
Sputtering Systems: JM IOTA
Sputtering Systems: KDF 945
Sputtering Systems: KRAUSS MAFFEI Triathlon
Sputtering Systems: KURT J. LESKER Torus 10l
Sputtering Systems: LEYBOLD / BALZERS ZH 620
Sputtering Systems: LEYBOLD / BPS Z 600
Sputtering Systems: LEYBOLD HERAEUS 240
Sputtering Systems: LEYBOLD HERAEUS A550 VZK
Sputtering Systems: LEYBOLD HERAEUS APS 1104
Sputtering Systems: LEYBOLD HERAEUS LH 550
Sputtering Systems: LEYBOLD HERAEUS V1500 V-7
Sputtering Systems: LEYBOLD HERAEUS Z400
Sputtering Systems: LEYBOLD HERAEUS Z550 used
Sputtering Systems: LEYBOLD HERAEUS Z550MS
Sputtering Systems: LEYBOLD HERAEUS Z700
Sputtering Systems: LEYBOLD HERAEUS ZV 1200 used
Sputtering Systems: LEYBOLD HERAEUS ZV 6000
Sputtering Systems: LEYBOLD Univex 450C
Sputtering Systems: LEYBOLD Univex 500
Sputtering Systems: LK TECHNOLOGIES NGI 3000
Sputtering Systems: MAGNETRON Sputtering
Sputtering Systems: MAT-VAC MVT-60X/3T
Sputtering Systems: MEIVAC 2252
Sputtering Systems: MRC / KDF 943
Sputtering Systems: MRC / TEL Eclipse Mark II / UHV
Sputtering Systems: MRC 600 Series
Sputtering Systems: MRC 603



Sputtering Systems: MRC 902A
Sputtering Systems: MRC 902M
Sputtering Systems: MRC 903A
Sputtering Systems: MRC 903M
Sputtering Systems: MRC SS-8633
Sputtering Systems: NORDIKO 2050
Sputtering Systems: PERKIN ELMER 2400
Sputtering Systems: PERKIN ELMER 2400 6J
Sputtering Systems: PERKIN ELMER 2400 8J
Sputtering Systems: PERKIN ELMER 2400 Series
Sputtering Systems: PERKIN ELMER 2400-8L
Sputtering Systems: PERKIN ELMER 2400-SSA
Sputtertech Perkin-Elmer, TFE, and STI sputter systems
SST 2200 Vacuum Furnace
Suss Micro Tec 2004 Delta 20T/150 VPO Manual Coat
Sustaining Engineering - sustainingengineering
Tabletop Sputter Coater for SEM Samples
TED PELLA INC SC650
TEL / VARIAN MB2 sputter
TEL / VARIAN MB2-730
TEL / VARIAN MB2-730 coater
TEL / VARIAN MB2-730 HT
TEL / VARIAN MB2-730 HT-HT
TEL / VARIAN MB2-730W
TEMESCAL BJD-1800



Temescal BJD-1800 E-Beam Sputter System
Temescal FC-3200
Temescal FCE 3200 Six-Pocket E-Beam Evaporator
tescal.com
TITAN SpraySafe
TORR CRC-150
TORR CRC-150 sputter
Torr International Model CRC 150 Sputtering System
TOUSIMIS Samsputter IIA
TOUSIMIS Samsputter IIA sputter coater
TRIKON ELECTROTECH 6310
TRIKON / ELECTROTECH 308
TRIKON / ELECTROTECH MS 6200
TRIKON / ELECTROTECH MS 6210
TRIKON / ELECTROTECH MS 6210 sputter
TRIKON / ELECTROTECH ND 6200
ULVAC Ceraus thin film sputter
ULVAC Ceraus Z-1000 thin film coater
ULVAC Ceraus Zi-1000 thin film sputtering
ULVAC Ceraus Zi-1000N sputtering thin film
ULVAC Ceraus ZX-1000 sputtering thin film coater
ULVAC Ceraus ZX-1000 thin film deposition
Ulvac Entron W-200T6 PVD System
ULVAC MCH-4500 thin film deposition
ULVAC MLX-3000N thin film sputtering
UNAXIS / BALZERS LLS 502
Used Anatech Hummer VI SEM Sputter Coater
Used Cryco Automated Dual Stack loader for Mini-brute
Used CVC 601 Physical Vapor Deposition system
Used ESC ELAS Large Area Sputtering System
Used MRC 643 Horizontal PVD Sputtering System
Used or Refurbished Perkin Elmer 2400 Series Sputtering Systems



Used Perkin Elmer 2400-SSA Physical Vapor Deposition
Used Perkin-Elmer Sputtering Deposition System
Used Polaron Instruments Sputtering System
Used Sputter Deposition Semiconductor Equipment
Used Sputtering Systems
Used Technics Hummer VI Sputtering System
Used Vacuum Bell Jars
VAGATHERM 550 thin film sputtering deposition
VARIAN NOVELLUS M 2000/8
VARIAN NOVELLUS M2i M2000 sputtering
VARIAN / NOVELLUS M2000 thin film sputtering
VARIAN / NOVELLUS M2i sputtering thin film
Varian 3118 E-Beam Evaporator
VARIAN 3180 sputtering deposition thin film
Varian 3190 Metal Sputtering System, 5"
VARIAN 3190 SPUTTER SYSTEM
VARIAN 3290STQ sputtering deposition thin film
VARIAN HIGH PERFORMANCE VACUUM COATER SYSTEM
3118
VARIAN NOVELLUS M2i M2000 sputtering deposition thin film
used semiconductor equipment
VARIAN NOVELLUS M2i / M2000
VARIAN Varian 7 CFM D/D
VARIAN XM 90 thin film deposition sputtering
VEECO / CVC CX 6 thin film
Veeco 400 E-Beam System
Veeco 775 Veeco
VEECO EBEAM Veeco
VERGASON TECHNOLOGY RAPID CYCLE METALIZING
SYSTEM Press-Side 2000
VST | Thin Film Deposition | Equipment Upgrade | Perkin-Elmer



WELCH 1397 Welch
XYTEC COATINGS (a BOC EDWARDS design) ML-8
Wafer Handling & Robotics
Brooks Automation Wafer Aligner USED, 4 inch to 8 inch
Wafer Probes
ELECTROGLAS EG 1034 wafer probe or prober
ELECTROGLAS EG 2001X wafer probe or prober
ELECTROGLAS EG 4085X wafer probe or prober
ELECTROGLAS EG 4085X wafer prober for parts
Signatone Probe station S-250
Wet Processing
Semitool SDC-400 photo mask etch spinner
SH-801 Spin Rinse Dryer
SV-702 Spin Rinse Dryer
Wire & Die Bonding
KTC Wire Bond Test machine Model: BT-30 W/TD
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