1. SCM partner for quality products

2. About us :
SISTECHCON is a cost effective solutions provider having ECOSYSTEM with a
group of Companies for electronic designer products. A business model of
connecting our network of Electronic & Electro-Mechanical Components
Distributors, Sheet Metal Fabricators, Plastic Molders with our EMS and Wire
harness facility for manufacturing of quality products under a single unit.
The company caters to a variety of services ranging from PCBA to Product
manufacturing (End to End solution). We also offer various turnkey services that
involve material procurement to product manufacturing. Through our various
services and customer interfaces across engineering to program, we help ensure that
we not only deliver working PCBAs/product but also become an integral part of
your product life cycle management.
The ERP (Enterprise resource planning) developed by SISTECHON is customised
to suit the requirement of the Design & product based Organisations, with Features
that include Product development , Product testing and tracking.

3. Vision & Mission :
To position as a best business organization with focus to provide a sole window
approach to our customers for their end-to-end solutions through our Design
Engineering, System Integration and EMS / Contract Manufacturing capabilities
and support the customer for their prototype, pilot & mass production of the
products.
Trusted supply chain & engineering partner for OEMs/Design Houses in key sectors
in India/globally with focus on High complex Mid/Low Volume Production,
Create niche for our customers in technology intensive high mix volume
manufacturing with focus on product quality to make he product more competitive
in the market.
Adding value to our partners with a commitment to form a robust supply chain
system, driven by customer focus, cutting edge manufacturing technologies and
ethical practices and support our customers during their R&D phases with intent to
reduce product design life cycle and engineering costs.
Quality policy:
To provide a quality product to meet our customer requirement at competitive price
on as per the committed scheduled and strive for continual improvement in the
process.
We ensure to set up process and Validation at each level of Operations as per the
customer work instructions for providing a seamless integration of the assembled
PCB with the harnessing, Box building and testing at various levels that leads to
final quality products.

4. Product Management
Design : Our strong hardware design team can support the customers with
Designing of schematics , cad design , BOM preparation Convert Design Files to
Testable proto types & complete hardware life cycle .
We can also support your technical team with providing the alternative
components to B Class & C class parts , EOL Parts etc.
Manage ECN for the product and generate the revised BOM as per the
Manufacturing requirement.
MRP : Our planning team will work on the forecast based MRP of the
customer comparing the demands (order book and/or forecasts) to the current
stock and suggesting reordering the components / parts for replenishment of
works orders for the appropriate dates and quantities to cover any shortfalls. The
MRP systems in place enable us to plan procurement and production based on your
varying demands and forecasts.
Procurement : Our supply chain teams are well versed with sourcing and
procurement of , Electronics , Sheet Metal , Plastics and Cables Harness and also
Hard to get components.
Sourcing of all electronic components through authorized distributors /
Manufacturers there by reducing the risk of getting wrong components
The parts in the BOM are segregated and kitted to ensure shortages free
production without any line stoppages.
Logistics: The components are kitted & consolidated at our freight forwarders
there by reducing the freight cost and additional Overheads.
Sheet Metal: We have an inhouse sheet metal works to support us with the
Enclosures and other mechanicals using Various process such as welding (Arc /
XRay), Bending, Laser cutting, CNC, Powder coating, drilling and punching.
Plastic Components : Plastic supplies including tool design, tooling and
tool maintenance are inhouse there by ensuring that all the parts are available
under a single unit

5. Process Capabilities
RoHS and Non RoHS process.
0.25mm pitch components / smallest component 0201.
Flexible, Rigid-Flex, Thin PCB Assemblies.
Package on Package (PoP) assemblies.
Assemblies based on FCBGAs, VFBGAs, uBGAs, CSPs, LGAs, and other lead less
devices including back to back BGAs.
40000 cph – Chip shooter / 6500 cph – IC Placer – SMT Pick and Place.
6 σ Vision & Print Deposit using 3 mil to 6 mil stencils.
7 zone reflow oven with RoHS capability.
Thermal profiling using predictive profiling methods.
Statistical based sampling quality processes in Material Incoming Quality Control,
First Article Approval, Final Quality Control and Out of Box Audits.
Best FIFO and JIT practices in the stores.
Dual wave pot for RoHS and non RoHS processes.
Regular preventive maintenance schedules.
Best practices in product manufacturing
Process flows, Control Plans, Failure Mode Effective Analysis (Product /Process),
Production Parts Approval Process.
Traceability from Incoming Material to Outgoing Finished Goods

6. PCB fabrication
LAYER : 2 - 36 layers
MATERIAL : FR4, Halogen free, AL base, High Frequence
BOARD THICKNESS 0.2 mm - 6 mm
COPPER THICKNESS 4oz (inner max.) 6oz (outer max.)
HOLE SIZE > 0.1mm
ASPECT RATIO 12 : 1 (max.)
MIN. TRACK WIDTH 3 mil
MIN. TRACK SPACING 3 mil
SOLDER MASK DAM 0.09 mm
HOLE PLUGGING SIZE 0.3mm~0.55mm
Blind & Buried Microvia’s as per DFM.
Press fit
IMPEDANCE CONTROL +/- 10%
SOLDER MASK COLOR green, white, black, red, orange,yellow,blue, purple
SURFACE FINISH TYPE OSP, HAL Lead-Free, HASL, ENIG, Hard Gold,
Flash Gold,
Immersion : Silver, ImmersionTin

7. EMS – printed board assembly
State of the Art manufacturing facility, PCB stuffing lines, component forming
with ESD protected shop floor , Testing & rework Line and stores area.
Fully sophisticated SMD Pick & place machine –CM245P advanced with Screen
Printer and Reflow oven
TH line with wave soldering. Auto Insertion line for both radial and axial lead
Electro-Mechanical Assembly , Box Building to meet safety & IPC Standards.
SMT Pick & place machine
.
Reflow Owen

8. Wave soldering Machine – Dual Wave
Standard specifications
Material
Type :
FR-4 (Tg-135)[Layer <= 2]
FR-4(Tg 180)[Layer > 2]
Material
Thickness :
0.062”/0.031"/0.
039"
Final Finish : Lead free HASL Cu Finish : Up to 2 oz.
Solder Mask
Side :
Both
Solder Mask
LPI Color :
Green (semi gloss)
Silk Screen
Side :
One side
Silk Screen
Color :
White
Trace/Space
Width :
6 mils or greater
Slots : Min. 0.062" slot
width
Max. # of
holes / sq :
25 per sq. inch
Min. Hole Size :
10 mils or greater
CNC route
points :
up to 14 points, Panel form
available
ET :
No
File Type : 274X Max. # of tools :10
Gold : No Reports : C of C, IPC class II
Cutouts : Max 3 Allowed

9. Mechanicals
1. Lazer Cutting & Engraving Machine
Maximum working Area : 4ft*3ftt ,
Maximum Cutting and Engraving Thickness : 15 to 20 in mm
Materials : Non - Metals like Acrylic , Plastic, Rubber etc

10. 2. Sheet Metal Fabrication
Capabilities Envelope
Sl.
No
Parame
ter
Machine
Capacity
Max Size
mm
Max.
thicknes
s- mm
Accuracy
mm
1) Cutting 5 Ton to 50
Ton
500x
200mm
MS- 5.0
Al- 8.0
SS- 2.0
MS ±0.03
Al ±0.05
SS ±0.05
2) Bending 2 Ton to 50
Ton
500x
200mm
MS- 5.0
Al- 8.0
SS- 2.0
MS ±0.2
Al ±0.2
SS ±0.2
3) Welding 20 KVA No
limitation
1.5+1.5m
m
±0.3mm
Precision Bending
Machines
Pipe Bending Machines

11. Arc Welding Machines Sheet Rolling
Machines
Hydraulic PressesSpot Welding Machines

12. Plastic Moulding
Machineries & Products
Capabilities Envelope
Sl
.
N
o
Parameter Machine
Capacity
Make
1) Injection moulding
machine
130 TN Yuan Chan
2) Injection moulding
machine
40 GR Texair
3) Injection moulding
machine
60GR Texair
4) Moulding capacity 0.0001GR TO
0.200GR

14. ERP Implementation
Sistechcon have designed and developed an ERP that is customised to suit the
requirement of the Design & product based Organisations
It has a unique feature having the combination of
Inventory Module
Planning Module
Purchase Module
Manufacturing Module
Quality Modules &
Customer order handling & Sales Modules , Which are interfaced with the
Product development Module.
Product Cost Module
Sales return and rework
Product testing modules As a single package.
This ERP Package helps the organisation in having control on the current status of
the product that is under development , and there by ensuring the Minutes of
Meeting are tabulated after every review.
Information on the Preliminary & Final Bill Of Material's . Electronic BOM’s ,
Mechanical BOM & Assembly BOM of the products with the schematics , PCB
board file ,X-Y data & Gerber etc along with the revisions can be documented
based on date finalised in the ERP.
The Testing Module has been provided with the test process of each of the products
, there by ensuring that the product goes thru the entire Test cycle Process
without which the Sl No of the Product cannot be generated, The Sl No is
mandatory for the preparation of the invoice to the customer.
The process in this ERP also helps the management in tracking the Finished
product , starting from the work order, Indent , RFQ , Purchase order , GRN ,
Production issue , Date of Production till shipment details of the product.
The unique date code concept for the components helps the inventory person to get
the life of the components , There by ensuring that the components with old
dated code or EOL are not used for production.
From the finance planning prospective It provides the Payment status of the
customers & Vendors.

15. Thanking you
Prasad B Sistla
Co-Founder
No 280, 4th cross LRDE Layout,
Karthiknagar , Doddanekundi,
Marathahalli post ,
Bangalore 560037
Email: Sistechcon@gmail.com ;
pbs@sistechcon.com
Ph: 9900056418 / 7259637053