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Active Thermography for 
Nondestructive Testing 
presented by 
Vetorix Engineering S.r.l. 
1 www.vetorixgroup.com
Increased Acceptance of Thermographic NDI 
2 www.vetorixgroup.com 
Used for NDI of metals, 
composites, polymers 
and ceramics. 
Applications 
• Delamination 
• Adhesive disbond 
• Impact damage 
• Corrosion 
• Water entrapment 
• Thickness measurement 
• Porosity 
• TBC coating measurement
Published Sept 2007 
3 www.vetorixgroup.com
4 www.vetorixgroup.com 
Examples 
Delamination in CFRP 
Voids in CFRP 
Water inclusion in honeycomb 
Hybrid junction
NDT Requires Active Thermography 
5 www.vetorixgroup.com 
IR Camera 
Excitation 
energy (input) 
Emitted 
IR energy 
Sample 
Internal 
flaw 
Excite sample 
View thermal 
response via IR 
surface 
temperature 
Some stimulus must be applied to the sample in order 
to obtain subsurface information from the IR camera.
Active Thermography Basics 
6 www.vetorixgroup.com 
Light 
Hot air 
Direct 
contact 
Heat (or cool) the sample 
surface and observe the 
response with an IR camera. 
IR camera 
possible 
heat 
sources
Typical Thermography Results 
cooler warmer cooler warmer 
7 www.vetorixgroup.com 
Delaminations obstruct the 
flow of heat and cause the 
surface to appear warmer. 
Trapped water absorbs 
incident heat and causes the 
surface to appear cooler.
Excitation / Detection Schemes 
Pulse Step Modulated 
response 
excitation 
response 
8 www.vetorixgroup.com 
temperature 
excitation 
response 
time 
temperature 
excitation 
time 
temperature 
time 
Analyze cooling Analyze heating or cooling Analyze both 
The fundamental mechanism for detection of subsurface structure is the 
same regardless of how the heat is applied or when it is detected.
Pulse Response is Easiest to Interpret 
9 www.vetorixgroup.com 
excitation 
response 
Surface temperature 
falls as 1/√t for an 
infinitely thick sample 
Tsurf 
time 
ln(Tsurf) 
response 
ln (time) 
Log-log plot of temperature vs. time 
is a straight line with slope -0.5
Flash Thermography: Basic Technology 
• Most widely implemented 
• Fastest 
• Non-contact 
• Most repeatable 
• Provides quantitative measurement 
10 www.vetorixgroup.com 
Flashlamp 
IR camera 
defect 
PC 
IR Image
Pulsed Thermography Basics 
Heat conduction 
11 www.vetorixgroup.com 
Probe Internal 
Structure 
Measure 
Surface ΔT 
Lamps 
IR camera 
Excite Surface 
Layer 
Light 
IR radiation 
to PC 
Process 
PC 
Blackbody 
radiation
Cool air IR radiation 
12 www.vetorixgroup.com 
Heat Transfer Basics 
Conduction: Diffusion into 
material from higher energy 
state (hotter) to lower 
(cooler). 
Convection: Heat is carried 
away from surface by 
moving particles (e.g. air 
current). 
Radiation: Heat is carried 
away from surface by 
electromagnetic radiation 
(light, IR) 
How does a sample heated 
at one face cool? 
Conduction provides the most information about internal structure. 
Convection and radiation depend solely on surface properties of the sample.
1 
defect 
T 
13 www.vetorixgroup.com 
Defect Model 
surface 
3 
2 
Heat from the inbound pulse is blocked by the defect. 
Trapped heat energy will diffuse out through the sides of the “trap”. 
Area above insulating defect appears hotter than defect-free areas. 
Temperature profile above defect is not flat 
1 
2 
3 
4 
4
Log Plot of Temperature vs. Time 
6.5 
6 
5.5 
5 
4.5 
4 
3.5 
Back 
wall 
14 www.vetorixgroup.com 
5000 
4500 
4000 
3500 
3000 
2500 
2000 
1500 
1000 
500 
0 
0 1 2 3 4 5 6 
time (sec) 
T 
bkgd 
defect 
3 
0 1 2 3 4 5 6 
ln(time) 
ln(T) 
bkgd 
defect 
In the log plot, the defect-free background follows a straight 
line until heat flow is obstructed by the back wall of the sample.
Break time 
15 www.vetorixgroup.com 
Interpreting the Log Plot 
ln (time) 
ln (temperature) 
normal diffusion 
(no defect) 
Back wall or 
defect slope = - 0.5 
The log-log plot is a powerful diagnostic tool that allows analysis without 
comparison to a reference or other pixels.
diffusion 
blocked by 
back wall 
16 www.vetorixgroup.com 
Log Plot: Ideal Slab 
ln(t*) ln(t) 
ln(Tinit) 1-d diffusion 
slope = -0.5 
ln(T – T0) 
ideal 
Thermally isolated: assume 
1-d conduction is the only 
cooling mechanism.
17 www.vetorixgroup.com 
1.5 
1.0 
0.5 
0.0 
-0.5 
-1.0 
-1.5 
-4.5 -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 
ln(time) 
ln(T- T0) 
25 mm Plate 
1.2 mm FBH 
3.3 mm FBH 
5.3 mm FBH 
Flaw Depth and the Log Plot 
Steel Plate with Flat Bottom Holes
Case studies 
• Water inclusion in honeycomb sandwich panel, 
18 www.vetorixgroup.com 
rivet junction – helicopter tail 
• Impact damage–fusolage 
• Flaws – wing leading edge

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Vetorix: Active Thermography for Nondestructive Testing

  • 1. Active Thermography for Nondestructive Testing presented by Vetorix Engineering S.r.l. 1 www.vetorixgroup.com
  • 2. Increased Acceptance of Thermographic NDI 2 www.vetorixgroup.com Used for NDI of metals, composites, polymers and ceramics. Applications • Delamination • Adhesive disbond • Impact damage • Corrosion • Water entrapment • Thickness measurement • Porosity • TBC coating measurement
  • 3. Published Sept 2007 3 www.vetorixgroup.com
  • 4. 4 www.vetorixgroup.com Examples Delamination in CFRP Voids in CFRP Water inclusion in honeycomb Hybrid junction
  • 5. NDT Requires Active Thermography 5 www.vetorixgroup.com IR Camera Excitation energy (input) Emitted IR energy Sample Internal flaw Excite sample View thermal response via IR surface temperature Some stimulus must be applied to the sample in order to obtain subsurface information from the IR camera.
  • 6. Active Thermography Basics 6 www.vetorixgroup.com Light Hot air Direct contact Heat (or cool) the sample surface and observe the response with an IR camera. IR camera possible heat sources
  • 7. Typical Thermography Results cooler warmer cooler warmer 7 www.vetorixgroup.com Delaminations obstruct the flow of heat and cause the surface to appear warmer. Trapped water absorbs incident heat and causes the surface to appear cooler.
  • 8. Excitation / Detection Schemes Pulse Step Modulated response excitation response 8 www.vetorixgroup.com temperature excitation response time temperature excitation time temperature time Analyze cooling Analyze heating or cooling Analyze both The fundamental mechanism for detection of subsurface structure is the same regardless of how the heat is applied or when it is detected.
  • 9. Pulse Response is Easiest to Interpret 9 www.vetorixgroup.com excitation response Surface temperature falls as 1/√t for an infinitely thick sample Tsurf time ln(Tsurf) response ln (time) Log-log plot of temperature vs. time is a straight line with slope -0.5
  • 10. Flash Thermography: Basic Technology • Most widely implemented • Fastest • Non-contact • Most repeatable • Provides quantitative measurement 10 www.vetorixgroup.com Flashlamp IR camera defect PC IR Image
  • 11. Pulsed Thermography Basics Heat conduction 11 www.vetorixgroup.com Probe Internal Structure Measure Surface ΔT Lamps IR camera Excite Surface Layer Light IR radiation to PC Process PC Blackbody radiation
  • 12. Cool air IR radiation 12 www.vetorixgroup.com Heat Transfer Basics Conduction: Diffusion into material from higher energy state (hotter) to lower (cooler). Convection: Heat is carried away from surface by moving particles (e.g. air current). Radiation: Heat is carried away from surface by electromagnetic radiation (light, IR) How does a sample heated at one face cool? Conduction provides the most information about internal structure. Convection and radiation depend solely on surface properties of the sample.
  • 13. 1 defect T 13 www.vetorixgroup.com Defect Model surface 3 2 Heat from the inbound pulse is blocked by the defect. Trapped heat energy will diffuse out through the sides of the “trap”. Area above insulating defect appears hotter than defect-free areas. Temperature profile above defect is not flat 1 2 3 4 4
  • 14. Log Plot of Temperature vs. Time 6.5 6 5.5 5 4.5 4 3.5 Back wall 14 www.vetorixgroup.com 5000 4500 4000 3500 3000 2500 2000 1500 1000 500 0 0 1 2 3 4 5 6 time (sec) T bkgd defect 3 0 1 2 3 4 5 6 ln(time) ln(T) bkgd defect In the log plot, the defect-free background follows a straight line until heat flow is obstructed by the back wall of the sample.
  • 15. Break time 15 www.vetorixgroup.com Interpreting the Log Plot ln (time) ln (temperature) normal diffusion (no defect) Back wall or defect slope = - 0.5 The log-log plot is a powerful diagnostic tool that allows analysis without comparison to a reference or other pixels.
  • 16. diffusion blocked by back wall 16 www.vetorixgroup.com Log Plot: Ideal Slab ln(t*) ln(t) ln(Tinit) 1-d diffusion slope = -0.5 ln(T – T0) ideal Thermally isolated: assume 1-d conduction is the only cooling mechanism.
  • 17. 17 www.vetorixgroup.com 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -4.5 -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 3.5 ln(time) ln(T- T0) 25 mm Plate 1.2 mm FBH 3.3 mm FBH 5.3 mm FBH Flaw Depth and the Log Plot Steel Plate with Flat Bottom Holes
  • 18. Case studies • Water inclusion in honeycomb sandwich panel, 18 www.vetorixgroup.com rivet junction – helicopter tail • Impact damage–fusolage • Flaws – wing leading edge