1. INSPECTION – TESTING - SOLDERING & ASSEMBLY EXPERIENCE
I have been employed as a QA Technician (Computer Product Eng. Dept. & Plastics at EPSON - ‘90’s Navy contractor of computers),
Lab Technician (PCB coupon testing & solder-ability inspection with scope), IAOI Inspector, Clean-Print-Room Printer and IAOI-Print-
Inspector, Circuit and dielectric Integrity Inspector, Computerized Optical Comparator Inspector (minimal GDT exp.), Lab Assistant
(Computer Eng. R&D Dept.), Assembly Inspector, and Hand-Solder-Specialist (Microscope [component, coils, etc.], SMT & Thru-hole -
not currently IPC certified).
Extensive use of Environmental Chambers, Vibration Tables, A/C Line noise Meters, dielectric testers (Inrush & layer), Minimal EMI
Testing Experience (including OATS Lab).
This experience includes the collection of test data (image documentation and upload), and generation of reports, with experience
in TrueChem software and data input and tracking. Also, Included is use of digital microscopes, standard scopes, computerized
optical comparators, multi-meters, oscilloscopes, multiple soldering tools, calipers, micrometers. At SolarWorld, I also used Robotic
interfacing – for in process sample deliveries.
Soldering skills (somewhat not current)
MERIX: Solder-ability & Shock Test/Inspect, 100% Product QA AOI, 100% testing & Clean- Print-Room.
EPSON (EAI): R&D Lab Assist. PCB Visual Trouble Shooter, wiring mod., and de-soldering/soldering (multi-pin).
Performed Fine-pitch, Thru-hole, plus Line Assembly (2 years +) with Inspection (1 year), wire routing, etc.
NEC: (Olsten/Adecco 12-1-‘88) - Fine-pitch SMT (with recertification), insp., PCB pin-test Trouble Shooter.
OECO: (Barrett ’88, 4 mo.) – Fine-pitch SMT, microscope (coils), Thru-hole, PCB stuffing, crimp, routing.
Multi-Comp (Barrett ’88): Flow-solder-pot, Thru-hole, fine pitch SMT, Coil bobbin machine, PCB Stuffing.
Tektronix: (’74-’75) – Thru-hole, PCB stuffing, Air-driver component assembly, harnessing, Freon clean processes, and / etc. . .