5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Yole Développement

FromTechnologies to Market
5G impact on RF
Front End Modules
& Connectivity for
Cellphones
2018 report
June 2018
Sample

2
Biography & contact
Technology & MarketAnalyst, RF Devices &Technologies
Division Director, Power &Wireless
Claire Troadec is Director, Power and Wireless, at Yole Développement (Yole) where she has been a member of the MEMS
manufacturing team since 2013. Claire graduated from INSA Rennes in France with an engineering degree in microelectronics
and material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer at
the IMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devices
from 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in the
semiconductor field.Claire also managed her own distribution company before joiningYoleDéveloppement.
As a Technology & Market Analyst, specialized in RF devices & technologies iwithin the Power & Wireless division at Yole
Développement (Yole), Cédric Malaquin is involved in the development of technology & market reports as well as the
production of custom consulting projects. Prior his mission at Yole, Cédric first served Soitec as a process integration engineer
during 9 years, then as an electrical characterization engineer during 6 years. He deeply contributed to FDSOI and RFSOI
products characterization. He has also authored or co-authored three patents and five international publications in the
semiconductor field.Cédric graduated from Polytech Lille in France with an engineering degree in microelectronics and material
sciences.
5G impact on RF Front End module and connectivity for cell phones | Sample | www.yole.fr | ©2018

3
TABLE OF CONTENTS
REPORT OBJECTIVES 6
METHODOLOGY 8
EXECUTIVE SUMMARY 14
1 – INTRODUCTION TO 5G 36
2 – GLOBAL MOBILE ECOSYSTEM 55
Smartphones facts and figures 56
RF spectrum 74
RF front-end industry 92
Innovation in RF front-ends 101
Wi-Fi technology landscape 117
3 – MARKET FORECASTS 127
Radio frequency power amplifiers (RF PAs) 130
Radio frequency low-noise amplifiers (RF LNAs) 134
Switches 138
Filters 142
Antenna tuners 146
Millimeter wave FEM 150
All components 153
RFFE module 159
Wafer projections 168
4 – EVOLUTION TRENDS 177
Network performance and technologies 178
Future architecture 187
New RF front-end 204
5 – INDUSTRIAL PLAYERSAND MARKET STRATEGIES 210
RF front-end ecosystem 211
Front-end players capability and plants 214
RF front-end players strategy 219
New entrants 229
CONCLUSIONS AND OUTLOOK 235
RELATED REPORTS 241
APPENDIX – BACK TO BASICS: DESCRIPTION OF THE RF
COMPONENTS IN RFFE MODULES 242
Power amplifiers 246
Low noise amplifiers 261
Filters 267
Switches 285
Antenna tuning 301
Carrier aggregation 305
OFDM 318

4
COMPANIES CITED IN THE REPORT
AIROHA,Akoustis,Alcatel,Alcatel-Lucent,Analog Devices Inc. (Hittite),Amazon,Amkor,Apple,ASE Group,ASUS,AT&T,BLU,
Broadcom Ltd. (AvagoTechnologies,Javelin Semiconductor), Brocade,Cavendish Kinetics, Cisco, China Mobile, China Telecom,
China Unicom, Coolpad, DelfMEMS, Ericsson,Fujitsu, GLOBALFOUNDRIES, Gartner, Gionee, Google, Facebook,HTC, Huawei
(HiSilicon), Infineon, Intel, IPDIA, JCET/STATS ChipPAC, KDDI, KT, Kyocera,Lava,Lenovo,LG, LG U+, MACOM, Marvell,Maxim
Integrated,Mediatek,Microsoft,Mitsubishi Electric, Motorola,Murata Manufacturing Company, Nokia,NEC, NTT Docomo, NXP
Semiconductors (Freescale),OMMIC, OnePlus, OPPO, Orange,Panasonic, Peregrine Semiconductor/Murata, Primatec,Qorvo
(RFMD,Triquint), Qualcomm (RF360), Quantenna,RDA, Realtek,Resonant,Samsung,SKT, Skyworks Solutions Inc (RFaxis),
SoftBank,Soitec, Sony Semiconductor, Sprint, ST-Microelectronics,TaiyoYuden Company Ltd.,TDK-EPC (EPCOS),TCL,Telefonica,
Telia,Telstra,Towerjazz,TPSCO,TSMC,T-Mobile, USI, UMC,Verizon,Verykool,Vivo,Vodafone,Win Semiconductors Corp., Wilocity,
WIPAM,Wisol,WiSpry, Xiaomi, ZTE, and more

5
OBJECTIVES OF THIS REPORT
• Ecosystem identification and analysis:
o Determine market dynamics
o Technical market description
o Economic requirements,bysegment
o Key players,by market and analysis
o Market size and market forecast in $M and Munits
• Analysis and description of market and technologies involved:
o Major players worldwide
o Technology identification for different devices and processes
o Competing technologies
o Main technical challenges
o Future direction

6
SCOPE OFTHE REPORT
RF andWi-Fi
Bluetooth
components
and Front-End
modules are
considered in
this report.
Modem,
transceivers,
antennas, IPDs,
… are not
covered.
RF components (PA, LNA, filters,switches,antenna tuners)
4G and 5G technologies
Wi-Fi & Bluetooth modules…
Modems,transceivers,baseband processors
Antennas,IPDs, …
Topics NOT included in the report
Focus of the report

7
AIR INTERFACE STANDARD PENETRATION RATE
In 2017,GSM and
HSPA together
represent54% of
cellular
technology in
mobile handsets.
LTE continuous
progression along
with the upcoming
5G offeringwill
lead to an
inflexion point in
between 2018 and
2019.
• HSPA record the strongest decrease
enabling LTE penetration
• Among LTE standards, LTE-A and
LTE-A Pro are those that better
penetrate the mobile market. LTE
start to phase out by 2020
• 5G sub 6 GHz will take off on
luxury phone from 2019 with
significant volume and will then be
extended in some of the high end
phones explaining fastest adoption
than those of LTE-A Pro
• 5G millimeter wave phase in should
start in 2021 and could come for
mid tier phone OEM looking for
disruption

88
SMARTPHONE MARKET SHARE INVALUE
Top 5 handset
OEM together
capture 74% of
the market
value.Among
the other
numerous
brand, Xiaomi
is the most
likely to change
this ranking.
• Apple remain the champion of market
value with 31% of smartphone market
value, it achieved a record of 141 $B of
net sales in 2017 for the mobile
segment
• Samsung consolidate its 2nd position
with 22% of global smartphone market,
almost 100 $B generated
• Huawei rank 3rd with 37 $B of revenue
generated in the mobile segment
• Oppo andVivo complete the top 5,
however Xiaomi competition is even
more intense and Xiaomi is expected
to enter the top 5 in 2018
• Among the other brand, ZTE is under
pressure with the recent ban decided
by US government.Commercial war is
engaged with Chinese government still
blocking NXP acquisition by
Qualcomm

99
CELLULAR MODEM CAPABILITYVS TECHNOLOGY
Gigabit LTE linear
evolution with
Carrier
Aggregation
technology scaling
in handset
augmentedby 4x4
MIMO technology.
mmW technology
could be a
disruptive
technology for the
very next
generation of
handset.
• Carrier Aggregation (CA) is the driving
technology employed by chip maker for
data rate improvement
• Today downlink speed reached a record
of 1.2 Gbps thanks to the use of 5
component carriers (CC).
Uplink speed reach 300 Mbps (3CC)
• Next generation phone could
theoretically reach 2 Gbps for the
downlink with 5CC
• MIMO 4x4 is now supported by all chip
vendors allowing spectral efficiency
improvement.It is extended through
more supported CC increasing the
possible number of spatial stream (up to
12 today)
• All chip vendors support 256QAM since
the 3rd modem generation
• mmW technology come as a disruptive
technology to traditional CA scaling and
is developed by main modem vendors
for future handset generation

1010
EVOLUTIONTO DUAL CONNECTIVITY
Sub 6 NR UHB
(ex N78) to be
aggregated on
LTE bands (ex
1, 3, 7). Mm-
Wave bands
provide extra
capacity for
real time
upload and
download
Control Extra upLink
with 5G mmW
• Sub 6 NR UHB are likely to be impacted by harmonics because
of the wide bandwidth. It could lead to receiver desensing
while LTE transmit.For instance,2nd harmonic LTE band 3 fall
into NR band N71. It is thus important to design high Q filters. Rx
Tx
N71
B3
B3 2nd harmonic

1111
REGIONAL ALLOCATION FOCUS ON ULTRA HIGH BAND
Ultra high fat
band adoption
is largely
expected
worldwide
through band
N77,N78,
N79
Source Qorvo modified by Yole
• Korea and Japan are the
main user of UHB LTE
spectrum.Both countries
consider UHB spectrum
extension through 5G NR
• UHB 5G spectrum
expansion is also expected
in Europe,China, Russia and
India
• FCC have not yet decided
to expand UHB spectrum
in the US

1212
RF FRONT END SEGMENTATION
Module
integration and
multiplication,
plus RF signal
multiplexing
were the main
evolution in RF
front end
market in 2017
• More OEM are moving for integration this
year with OEM such as Xiaomi starting to
use PA Module while it used to be on a
discrete architecture 1 year ago.
• Fully integrated PA module (PAMiD) still
only are affordable in high end segment.
HoweverHuawei opened up a path with
its P10 using Skyworks PAMiD
• Rx diversity module also made a huge
penetration in the front end with
implementationof more carrier
aggregation (up to 5-6 CC) and MIMO 4x4
• Multiplexer now have entered the market
with quad and quint-plexer also following
carrier aggregationand MIMO 4x4
0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
Apple - iPhone X - A1902
Apple - iPhone X - A1901
Apple - Watch Series 3
Samsung Galaxy S8 - SM950F
Samsung Galaxy S8 - SM95U1
Huawei P10
Sony Xperia XZs
Asus ZenFone 4 Pro
Xiaomi Mi6
Area Distributionper Function
PAMiD FEMiD RxDM PAM Multiplexer Total

1313
MARKET FORECASTS

1414
ECOSYSTEM ANALYSIS

15
RELATED REPORTS

5G will totally redefine how the radio frequency
(RF) front-end interacts in-between the network
and the modem. Indeed, new radio frequency
bands, sub-6 GHz, and mm-wave (as defined
in 3GPP release 15) pose big challenges for the
industry. However, with these challenges comes
opportunity to disrupt the market’s leadership.
On the sub-6 GHz side, the current front-end
leaders (Broadcom, Qorvo, Skyworks, and Murata)
have already begun adapting to these changes.
Broadcom prepared for the arrival of 5G ultra-high
band by integrating mid and high bands together.
And with its FBAR BAW filter technology,
Broadcom also owns the main critical building
block for the high and ultra-high frequency bands.
Skyworks is positioned on the 5G ultra-high band
market with its newly announced Sky5TM platform.
Moreover, the company has already earned some
design wins in the high-end segment with its
SkyOneR LiTE platform, in addition to the low-end
segment with its leading position among Chinese
OEMs (Huawei, Oppo, Vivo, Xiaomi).
Qorvo has a similar approach, with a broad
product portfolio covering the high-end and
low-end segments with its RF FusionTM and RF
FlexTM platforms, respectively. Another Qorvo
strength is its internal test and packaging capability,
which enable quick reaction time and continuous
improvement. Notably, Qorvo was the first player
to unveil a front-end module for ultra-high band
coverage.
Murata mostly covers the low band, but is very
well positioned for the growing, diversity module
market.
Qualcomm is the new entrant that brings with it
an end-to-end solution from modem to antenna.
Also, strategic investment in TDK Epcos’ filtering
technology has become profitable. The first revenue
was generated in the RF front-end segment during
2017. We can expect further revenue to come in the
near future. A first mobile phone (i.e. Sony’s XZ2)
already adopted Qualcomm’s complete solution.
Along with sub-6 GHz, the mm-wave front-end
module will completely disrupt the front-end
industry, representing a completely different
technology mindset that could create a new path
to high data-rate access. While Qualcomm is one
of the new entrants clearly positioned for mm-
wave technology, all of the top platform providers
(i.e. Intel, Samsung, HiSilicon, and Mediatek) are
exploring this new business opportunity.
The sub-6 GHz radio band will always be required
for radio coverage and link integrity, but complexity
could drop in the sub-6 GHz regime with mm-wave
technology’s arrival, especially in dense urban areas
when the mm-wave network is deployed. The mud
fight has already begun.
5G’S IMPACT ON RF FRONT-END MODULE AND
CONNECTIVITY FOR CELL PHONES 2018
Market & Technology report - July 2018
5G - WHO HAS THE MOST TO WIN (AND LOSE)?
How is 5G enabling new business opportunities despite flat mobile growth?
KEY FEATURES
• Market forecast 2017 - 2023,
including revenue, players, and
volumes
• Current 5G characteristics
and future outlook, including
carrier aggregation, MIMO, dual
connectivity, and new wave form
• Roadmap for technology evolution
and future developments
• RF front-end - industry strategy
• Back to basics - a detailed
description of RF device
functions and their challenges/key
characteristics
WHAT’S NEW
• Wi-Fi connectivity market forecast
2017 - 2023
• Mm-wave front-end module
market forecast 2017 - 2023
OBJECTIVES OF THE REPORT
• Ecosystem identification and
analysis:
Determine market dynamics
Technical market description
Economic requirements, by
segment
Key players, by market and
analysis
Market size and market forecast
in $M and Munits
• Analysis and description of market
and technologies involved:
Major players worldwide
Technology identification for
different devices and processes
Competing technologies
Main technical challenges
Future direction
(Yole Développement, July 2018)
11
mm-WAVE
SUB 6 GHZ
Carrier Aggregation
4x4 MIMO
256 QAM
Ma-MIMOBeam formingUHF spectrum
Non exhaustive list of companies 2018 – 2020+
From the lte race to the 5G mud fight

5G’S IMPACT ON RF FRONT-END MODULE AND CONNECTIVITY FOR CELL PHONES 2018
5G OFFERS A BIGGER MARKET OPPORTUNITY TO THE RF FRONT-END INDUSTRY…
The mobile handset RF front-end market, along with
the WiFi connectivity sector, is expected to reach
$35.2B in 2023 at a CAGR of 14%. LTE evolution clearly
is the first growth wave (as we stated in our 2017
report), but most of the market opportunities in the
mid-term will come from 5G non-stand-alone (NSA)
radio, which became prevalent in late December 2017
(as defined in 3GPP during release 15). The need for
dual connectivity (i.e. the 5G new radio (NR) band
attachment to the LTE) implies evolution on RF front-
end architecture and additional components.
Not all components will exhibit equal market
growth. Filters, which represent the RF front-end
industry’s biggest market segment, will almost
triple from 2017 - 2023. This growth will come
mainly from the significant penetration rate of
high-quality BAW filters, which will be required for
the ultra-high frequency range defined by 5G NR.
Another example is co-existence filters for diversity
antenna-sharing with Wi-Fi, since rejection band
will be critical.
The LNA market is expected to grow at a 16%
CAGR with the implementation of the diversity
module, along with integration in power amplifier
modules for handsets. The switch market will enjoy
the same growth due to the addition of a new RF
path with 4x4 MIMO implementation, which will
lead to more diversity switch needs.
The antenna tuner market is also expected to record
significant growth with 4X4 MIMO technology’s
penetration. It is worth noting that 4x4 MIMO will
be mandatory for 5G.
Power amplifier (PA) will be the sole market to
remain almost flat over this period. High-end LTE
PA market growth, especially in high and ultra-
high band, will compensate for the 2G/3G market’s
shrinkage (currently, this market is handled by
multi-mode multi band (MMMB) PA).
2017-2023 market outlook
Total RF components FEM/PAMiD module manufacturers
Filters
Antenna tuners
Switches
PAs
LNAs
mmW FEM
$22,5B
CAGR +19%
$7B
CAGR +7%
$1B
CAGR +15%
$3B
CAGR +15%
$35B
$8B
$5B
$463M
$1B
$15B
2017
2023
$423M
mm-Wave
$246M
$602M
CAGR +16%
CAGR +14%
…BUT COMPLEXITY FOR THE RF FRONT-END SHOULD BE EXPECTED TOO
LTEevolutionhasledtocomplexarchitectureintoday’s
mobile phones, mostly due to carrier aggregation.
Meanwhile, RF’s board area and available antenna
space have been reduced, leading to a densification
trend with more handset OEMs adopting power
amplifier modules and implementing new technics, i.e.
antenna-sharing between LTE and WiFi. In the low-
frequency band, the inclusion of the 600 MHz band
(for which T-Mobile recently acquired licenses) will
pose new challenges for low-band antenna design and
antenna tuners.
5G will add even more complexity, with new radio
bands released in ultra-high frequencies (N77, N78,
N79). This first field is being addressed by Skyworks
and Qorvo via a new product release, as explained in
this flyer’s first section. Band re-farming (early bands
are N41, N71, N28, N66, with more to come) with
dual connectivity will also contribute to increasing
constraint for the front-end. More densification in
front-end modules will be required to enable new
band integration, which is the approach followed by
Broadcom with its innovative mid/high band module.
Another new 5G requirement will be 4x4 MIMO
implementation, which will turn from a “nice to have”
luxury on LTE high-end mobile phones to a “must-have”
for every 5G handset. This will add a significant amount
of RF streams in the handset, and combined with carrier
aggregation requirements will lead to more complex
specifications for antenna tuners and multiplexers.
Last but not least is the implementation of the mm-
wave module into the handset - a topic that poses many
challenges, ranging from antenna array integration
(taking into account radiating efficiency and hand-
blockage effects) to power amplifier efficiency, since
antenna gain cannot be too high given the low number
of antenna array elements allowable in the handset
format. While still at the RD level, great progress
RF front-end evolution from 2017 to 2020+
HB module
MB module
LB module
UHB module
HB+MB module
LB module
3 GHz
2 GHz
1.5 GHz
UHB module
HB+MB module
LB module
2017 2018 2019
6GHz
700 MHz
NR band dual
connectivity
600 MHz
inclusion
More CA
Band refarming
Densification
2020
UHB module
HB+MB module
LB module
mmW
mmW module
Band refarming

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
AIROHA, Akoustis, Alcatel, Alcatel-Lucent, Analog Devices Inc. (Hittite), Amazon, Amkor, Apple,
ASE Group, ASUS, ATT, BLU, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Brocade,
Cavendish Kinetics, Cisco, China Mobile, China Telecom, China Unicom, Coolpad, DelfMEMS,
Ericsson, Fujitsu, GLOBALFOUNDRIES, Gartner, Gionee, Google, Facebook, HTC, Huawei
(HiSilicon), Infineon, Intel, IPDIA, JCET/STATS ChipPAC, KDDI, KT, Kyocera, Lava, Lenovo, LG,
LG U+, MACOM, Marvell, Maxim Integrated, Mediatek, Microsoft, Mitsubishi Electric, Motorola,
Murata Manufacturing Company, Nokia, NEC, NTT Docomo, NXP Semiconductors (Freescale),
OMMIC, OnePlus, OPPO, Orange, Panasonic, Peregrine Semiconductor/Murata, Primatec, Qorvo
(RFMD, Triquint), Qualcomm (RF360), Quantenna, RDA, Realtek, Resonant, Samsung, SKT, Skyworks
Solutions Inc. (RFaxis), SoftBank, Soitec, Sony Semiconductor, Sprint, STMicroelectronics, Taiyo
Yuden Company Ltd., TDK-EPC (EPCOS), TCL, Telefonica, Telia, Telstra, Towerjazz, TPSCO, TSMC,
T-Mobile, USI, UMC, Verizon, Verykool, Vivo, Vodafone, Win Semiconductors Corp., Wilocity,
WIPAM, Wisol, WiSpry, Xiaomi, ZTE, and more

Report objectives 6
Methodology 8
Executive summary 14
Introduction to 5G 36
Global mobile ecosystem 55
Smartphones - facts and figures
RF spectrum
RF front-end industry
Innovation in RF front-end
WiFi technology
Market forecasts 127
Radio frequency power amplifiers (RF PAs)
Radio frequency low-noise amplifiers (RF LNAs)
Switches
Filters
Antenna tuners
Millimeter wave FEM
All components
RFFE module
Wafer projections
Evolution trends 177
Network performance and technologies
Future architectures
New RF front-end
Industrial players and market strategies 210
RF front-end - ecosystem
Front-end players - capabilities and plants
RF front-end players - strategy
New entrants
Conclusion and outlook 235
Related reports 241
Appendix - Back to basics: description of RF
componenets in RFFE modules 242
Power amplifiers
Low-noise amplifiers
Filters
Switches
Antenna tuning
Carrier aggregation
OFDM
TABLE OF CONTENTS (complete content on i-Micronews.com)
AUTHORS
AsaTechnologyMarket
Analyst, specialized in RF
devices technologies
iwithin the Power Wireless division at Yole
Développement(Yole),Cédric Malaquin
is involved in the development of technology
market reports as well as the production
of custom consulting projects. Prior his
mission at Yole, Cédric served Soitec. He
deeply contributed to FDSOI and RFSOI
products characterization. He has also
authored or co-authored three patents
and five international publications in the
semiconductor field. Cédric graduated from
Polytech Lille (France) with an engineering
degree in microelectronics and material
sciences.
Find more
details about
this report here:
RELATED REPORTS
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Find all our reports on www.i-micronews.com
Claire Troadec is
Director of the Power
Wireless Division at Yole
Développement (Yole), part of Yole Group
of Companies. These activities are covering
power electronics, batteries energy
management, compound semiconductors
and emerging materials and RF electronics.
Daily interactions with leading companies
allow these analysts to collect a large
amount of data and cross their vision of
market segments’ evolution and technology
breakthroughs. Prior Yole, she joined NXP
Semiconductors and worked for 7 years
at the IMEC RD facility. Claire Troadec
holds a Master’s degree in Applied Physics
specializing in Microelectronics from INSA
(Rennes, France).
has been made on these mm-wave front-end
silicon-based platforms, demonstrating record
power efficiency and noise level improvement.
Bulk CMOS is preferred by Qualcomm, with
TSMC’s 28nm platform. Other possible platforms
include SiGe and RFSOI, for example with
GLOBALFOUNDRIES’ capability.
With this new mm-wave connectivity for cell
phones, we are entering an exciting new era
of technology competition and breakthrough
performance. This will seriously impact RF
front-end’s bill of materials, and could be useful
for reducing overall connectivity cost. Who
then will be the first OEM to implement this
technology when it’s ready? Could it be Chinese
OEMs like Huawei and Vivo, with their strong
market dynamics and appetite for differentiation/
competition with market leaders like Apple and
Samsung? Or will it be the current leaders, who
are always first to innovate?
For this latest chapter, let’s not forget that Samsung
has always been very keen to utilize innovative
connectivity solutions: for example, they were the
first to implement 4x4 MIMO solutions (on the S7
in 2016).
Get ready to place your bets!
LINKED REPORT
RF Front-End Module
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Process and Cost Report by
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Extensive overview of 40 RF Front-
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in 10 flagship products, including the
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X, Samsung Galaxy S8, Huawei P10,
Asus Zenfone4 Pro, Sony XZs and
Xiaomi Mi6.
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• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)

© 2018
Yole Développement
From Technologies to Market
Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o BioTechnologies
Power
Wireless
o RF DevicesTechnology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o SemiconductorManufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS,Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

3 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
MA with our partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays,forums,…
www.i-Micronews.com

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market,technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVINGTHE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators,end-
users and software
developpers
Device manufacturers
Suppliers:material,equipment,
OSAT,foundries…
Financial investors,RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
FromA to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting andKnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die andInterconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications– Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip– Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent LandscapeAnalysis
− RF Acoustic Wave Filters Patent LandscapeAnalysis
− NMC Lithium-Ion Batteries Patent LandscapeAnalysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L IN E ON SITE IN PERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility,networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly,and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person.Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful,dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier (veyrier@yole.fr),Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTINGANDSPECIFICANALYSIS,REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: MavisWang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez,EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy,CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwithWoodside
CapitalPartners)
• Jean-Christophe Eloy,CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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