New applications are transforming the market and technology playing field for CMOS image sensors It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies. The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity. Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.

1. © 2017 - SAMPLE
From
Technologies
to Market
Status of the
CMOS Image Sensor
Industry 2017

2. © 2017
Executive summary

3. 3
REPORT OBJECTIVES
Provide a clear understanding of applications and related technologies.
Ecosystem identification and analysis:
• Determine applications range
• Technical market segmentation
• Economic requirements by segment
• Key players by market and analysis
• Market size and market forecast in $M and Munits
Analysis and description of market and technologies involved:
• Major actors on a global basis
• Detailed applications per market segment
• Technology identification for different products and processes
• Competing technologies
• Main technical challenges
Ecosystem
Market
Techno
©2017 | www.yole.fr | Status of the CMOS image sensor industry

4. 4
METHODOLOGIES & DEFINITIONS
Yole’s market forecast model is based on the following elementary structured blocks:
Yole’s
analysis
framework
©2017 | www.yole.fr | Status of the CMOS image sensor industry

5. 5
WHAT IS TAKEN INTO ACCOUNT BY THE ANALYSIS ?
From wafer to first packaged sensor
Analysis at the
component
level
Courtesy of Omnivision
Courtesy of Valeo
Courtesy of Sony
Courtesy of Tesla
Camera
Modules
SystemsImage
Sensors
Courtesy of Xiaomi
CIS
Die
Courtesy of Sony
CIS
Wafer
Courtesy of Apple
Market report focus Market analysis only
©2017 | www.yole.fr | Status of the CMOS image sensor industry

6. 6
TABLE OF CONTENTS (1/2)
o GLOSSARY 2
o TABLE OF CONTENTS 3
o REPORT OBJECTIVES 6
o METHODOLOGY 8
o COMPANIES CITED 13
o EXECUTIVE SUMMARY 14
1. INTRODUCTION 31
• Market segmentation
• Historical perspective
• CMOS image sensor landscape by player
• CMOS image sensor landscape by application
• CMOS image sensor technology shift CMOS vs CCD
• CMOS image sensor technology shift BSI vs FSI
• CMOS image sensor technology shift 300mm vs 200mm
2. MARKET FORECAST 47
• 2016 CIS revenue breakdown by market
• CIS volume shipment forecast 2010-2022
• CIS revenue forecast 2010-2022
• CIS average selling price forecast 2010-2022
• CIS wafer production forecast 2010-2022
3. ECOSYSTEM 61
• 2016 M&A activity in CIS
• CMOS image sensor ecosystem
• CMOS image sensor competitive landscape
• CMOS image sensor ecosystem
• Geographic mapping of CIS players
• Geographic mapping of CIS foundries
4. PLAYERS & RANKINGS 71
• 2016 CIS revenue ranking by player
• 2016 CIS production ranking by foundry
• 2016 CIS player activity breakdown
• 2016 CIS revenue mobile market breakdown by player
• 2016 CIS revenue photography market breakdown by player
• 2016 CIS revenue tablet market breakdown by player
• 2016 CIS revenue laptop PC market breakdown by player
• 2016 CIS revenue medical X-ray market breakdown by
player
• 2016 CIS revenue security & surveillance market
breakdown by player
• 2016 CIS revenue machine vision market breakdown by
player
©2017 | www.yole.fr | Status of the CMOS image sensor industry

7. 7
TABLE OF CONTENTS (2/2)
5.1. MOBILE MARKET TRENDS 88
• Consumer electronics volume forecast
• Consumer electronics revenue forecast
• Who can afford a smartphone?
• Revenue comparison
• Mobile market volume forecast by phone type
• Mobile market volume forecast by player
• Market drivers
• Mobile resolution mix forecast
• Dual camera rollout scenario
• 3D camera applications
• Mobile market trends
5.2 OTHER CONSUMER MARKETTRENDS 111
• Consumer photography volume forecast
• Action camera & drone volume forecast
• 360° camera trend
• AR/VR headset volume forecast
• AR/VR headset trend
• Wearable volume forecast
• Consumer drone volume forecast
• Consumer robotics volume forecast
• Computing volume forecast
5.3. OTHER MARKET TRENDS 132
• Light vehicle volume forecast
• Automotive imaging trend
• Automotive camera volume forecast
• Robotic vehicle trend
• Medical CIS volume forecast
• Medical CIS trend
• Security & surveillance volume forecast
• Machine vision volume forecast
6.TECHNOLOGY TRENDS 155
• Pixel / Resolution / Optical Format
• From FSI to BSI to stacked BSI
• Hybrid stack / Multi-stack
• 3D imaging & sensing
• Technology by players
7. CONCLUSION 193
8. COMPANY PROFILE 197
©2017 | www.yole.fr | Status of the CMOS image sensor industry

8. 8
Almalence, Ambarella, Apple, Agilent, ams, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, CMOSIS,
Cognex, Continental, Core Photonics, CSEM, Dongbu HiTek, DXO, Dynamax, ESPROS Photonics, Evg, Excelitas Technologies,
Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace
Valley, Hamamatsu, Hasselblad, Heliotis, Himax Imaging, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage,
InvenSense, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Magna, Mantis Vision,
Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging Technologies, Nikon, NXP,
Nvidia, Odos Imaging, Omnivision, Omron, ON Semiconductor, Panasonic, PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD
Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, Sharp, SiliconFile, Sirona, SK Hynix, SMIC,
Siemens, Socionext, Softkinetics, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne e2v, Teledyne DALSA, Teradyne,
Tessera, Toshiba, Trixell, TSMC, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab,
Xintec, ZTE and more …
COMPANIES CITED IN THE REPORT
©2017 | www.yole.fr | Status of the CMOS image sensor industry

9. 9
WHAT WE GOT RIGHT, WHAT WE GOT WRONG
Technology & market forecast challenge
What we got right
o Steady growth of CIS
o Stacked BSI introduction and impact
o Dual camera introduction and impact
o Increasing role of consumer drones & robots
o No specific “IoT” segment
What we got wrong
o Bigger than expected size of dual camera sensors
o Impact of Mobileye – Tesla issue for automotive CIS
o Lower than expected computing market
o Higher than expected security market
o Emergence of theVR segment
©2017 | www.yole.fr | Status of the CMOS image sensor industry

10. 10
ABOUT THE AUTORS OF THIS REPORT
Biography & contact
Pierre Cambou
From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions atThomsonTCS which became
Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up calledVence Innovation (now Irlynx) in
order to bring to market a disruptive Man to Machine interaction technology. He has an Engineering degree from Université de
Technologie de Compiègne and a Master of Science fromVirginiaTech. More recently he graduated with an MBA from Grenoble
Ecole de Management. He joinedYole Développement as Imaging Activity Leader in 2014.
Contact: cambou@yole.fr
Jean-Luc Jaffard
From 1966 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and
growth of this business. At STMicroelectronics Imaging Division he was successively appointed as Research Development and
Innovation Director managing a large multidisciplinary and multicultural team and later on promoted to Deputy General
Manager and Advanced Technology Director in charge of identifying and developing breakthrough Imaging Technologies and to
transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property
Business Unit Director. In January 2014 he created the Technology and Innovation branch of Red Belt Conseil.
©2017 | www.yole.fr | Status of the CMOS image sensor industry

11. © 2017
Body sample

12. 12
0
5 000
10 000
15 000
20 000
25 000
2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022
Revenue($M)
Historical CIS revenue forecast (in $M)
2010 Fcst 2012 Fcst 2014 Fcst 2015 Fcst 2016 Fcst 2017 Fcst
WHAT WE GOT RIGHT,WHAT WE GOT WRONG
CIS Forecast over the years
We are raising again
our forecast for CMOS
Image Sensors.
Mostly driven by dual
camera approaches and
the introduction of new
sensors in smartphones,
the 2017 CIS forecast is
above previous forecast
releases.
Our goal is to
predict the
market +/-10% in
5 years time
©2017 | www.yole.fr | Status of the CMOS image sensor industry

13. 13
6TH CMOS IMAGE SENSOR REPORT
• The CMOS Image Sensor market has reached $11.5B in 2016 and Yole is maintaining a 10.5% CAGR forecast for the
2016-2022 period mainly due to the penetration of additional cameras in smartphone supporting functionalities such
as optical zoom, biometry and 3D interactions.
• Concerning the ecosystem CIS is now heavily dominated by 3 Asian heavyweights, Sony, Samsung and Omnivision,
this last company adopting Chinese nationality beginning of 2016.The US has maintained a presence in the high end
sector with On Semi for Machine vision and Automotive, and Teledyne for Machine vision and Medical. In Europe the
rise of AMS and STM in the consumer sensing space is a notable development still in the making.
• Market wise Mobile is dominating the revenues and the technology developments. New approaches such as hybrid
stack and triple stack are driving new applications such as super slow motion and 3D sensing. The growth story in
Automotive encountered a big hiccup involving Tesla and Mobileye, eventually solved into the $15B Intel purchase of
Mobileye. Security is the nice story of the year boosted by the end of CCD and the new capabilities of IP cameras,
probably the only significant IoT story so far.
• Technology wise the domain is increasingly innovative, being at the forefront of 3D semiconductor technologies,
quantum energy detection, artificial intelligence and more. It is a key part of much general trends including
autonomous vehicles and the robotic revolution in general.
CIS is a key
market and a
key technology

14. 14
Sony
Samsung
Omnivision
On Semi
Canon
Panasonic
SK Hynix
STMicro
Galaxycore
Hamamatsu
Pixelplus
AMS
Sharp
Teledyne Dalsa
Toshiba
Teledyne e2v
Himax
Brigates
Melexis
Gpixel
Excelitas
0
1
10
100
1 000
-100 100 300 500 700 900 1 100 1 300 1 500 1 700 1 900
AverageSellingPrice($)
Volume Shipment (M units)
2016 - CIS market landscape
by player
CMOS IMAGE SENSOR LANDSCAPE
2016 CIS market landscape by player
Sony maintains its
market leadership
leveraging its
technology rooted in
digital photography
and applied to mobile
It benefited from
increased resolution
of mobile cameras
and demand for high
quality pictures from
the consumers.
Sony is now
twice bigger than
its next
competitor
$4.8B
$1,9B
$0.3B
Key Players
High-End
Players
2nd Tier Players
Yole Développement © 2017
©2017 | www.yole.fr | Status of the CMOS image sensor industry

15. 15
2016 CIS REVENUE BREAKDOWN
2016
CIS Revenue
breakdown
By market (in $M)
Mobile $6,666 $8,015 20%
Consumer $1,430 $1,263 -12%
Computing $869 $775 -11%
Automotive $541 $585 8%
Medical $34 $39 16%
Security $427 $624 46%
Industrial/Space/Defense $281 $297 5%
TOTAL $10,248 $11,598 13.2%
2015 2016 YoY(%)
©2017 | www.yole.fr | Status of the CMOS image sensor industry

16. 16
Rank
(Previous)
Company 2015 2016 YoY (%)
1 (1) Sony $3960 $4,858 23%
2 (2) Samsung $1,850 $2,126 15%
3 (3) Omnivision $1,250 $1,437 15%
4 (5) ON Semi $747 $717 -4%
5 (4) Panasonic $336 $387 15%
6 (7) Canon $404 $360 -11%
7 (8) SK Hynix $325 $310 -5%
8 (10) ST Micro $200 $290 45%
9 (9) Galaxycore $275 $286 4%
10 (11) Pixart $170 $181 6%
11 - Hamamatsu $96 $132 38%
12 (12) Pixelplus $93 $85 -9%
13 Other $542 $429 -21%
$10,248 $11,598
2016 CIS REVENUE RANKING
2016
CIS Revenue
ranking
By player (in $M)
©2017 | www.yole.fr | Status of the CMOS image Sensor Industry

17. 17
Foundry 2015 2016 YoY (%)
Sony 774 813 5.0%
Samsung 634 676 6.6%
Tsmc 444 459 3.4%
Smic 200 195 -2.5%
Sk Hynix 75 79 5.3%
Tpsco 50 51 3.2%
Dongbu 22 23 5.4%
Canon 5 4 -8.5%
Stm 1.7 1.7 -1.0%
Hamamatsu 1.0 1.1 4.6%
Umc 0.4 0.4 -16.3%
Other 75 64 -14.9%
TOTAL 2,281 2,367 3.8%
2016 CIS PRODUCTION RANKING
2016
CIS production
ranking
By foundry (in kWPY 12”eq.)
©2017 | www.yole.fr | Status of the CMOS image Sensor Industry

18. 18
CIS WAFER PRODUCTION FORECAST 2010–2022
By technology
CIS is
predominantly
produced
using “3D”
stacked
technology
Since 2010 BSI
technology took
increasing market
share.
Since 2014 the stacked
and BSI approach has
become dominant.
Production stagnated
due to transfer to logic
wafers (DIG).
Hybrid stack technique
will be predominantly
used for specific
sensors such as 3D
imagers.

19. 19
WAFER PRODUCTION FORECAST 2010–2022
Silicon content assumption for mobile cameras
Cameras are
using more
silicon
Only the upper
die is using CIS
process
0
10
20
30
40
50
60
70
80
90
100
2010 2011 2012 2013 2014 2015 2016 2017e 2018e 2019e 2020e 2021e 2022e
AverageDieSurface(mm²)
Total silicon surface - Smartphone cameras (in mm²)
Smartphones Rear (incl dual) Smartphones Front (incl dual) Smartphones Rear Smartphones Front
Transition to stacked
BSI technology allowed
for more silicon
content with the same
camera module
footprint (roughly
10mm x 10mm x
5mm).
The dual camera
approach allows for
more silicon per
smartphone while
silicon per camera
start stagnating.
Stacked BSI allowed
for more silicon
within the same
footprint
Dual cameras
maintains growth
of silicon content
Die size typically
6.3mm x 4.7mm
30mm² x2 (stacked)
Die size typically
5.0mm x 3.8mm
19mm² x2 (stacked)
©2017 | www.yole.fr | Status of the CMOS image sensor industry

20. 20
MOBILE TECHNOLOGY TREND
3D Stacked BSI can be performed usingTSV or hybrid bonding
The choice for
interconnection
depends on
interconnection
density required
 Backside
illumination
will
enable ~
100% fill-
factor!
Stack
BSI – 1st Gen
Silicon
Bulk
TSVTSV
Interco upper
to lower wafer  Backside
illumination
will
enable ~
100% fill-
factor!
Stack
BSI – 2nd Gen
Silicon
Bulk
TSV
 Backside
illumination
will
enable ~
100% fill-
factor!
Hybrid Stack
BSI
Silicon Bulk
Interco
upper to
lower wafer
Connection within
pixels become
possible
©2017 | www.yole.fr | Status of the CMOS image sensor industry

21. 21
MOBILE MARKET TREND
3D cameras are at the fifth phase in the evolution of smartphone cameras.
The majority
of demand is
for 10mm x
10mm x 5mm
modules.
Rear
smartphone
camera
modules
10mm x 10mm
1mm x 1mm
5mm x 5mm
© March 2017
$10
$5
$1
2000 2005 2010 2015 2020 2025
Smartphones:
The size of main camera
stops shrinking and a
front facing camera is
added.
Module size
and cost
Camera phones:
Innovation from
Sharp in June
2000.
3D sensing
module
2030
$20
20mm x 10mm
$20B
$10B
Event #1
Event #2
Event #3
Event #4
Selfies:
The size of front facing
camera increases.
Dual rear cameras:
Improved photography
thanks to a dual
camera approach.
Event #5 $5B
Front
smartphone
camera
module
3D sensing module:
The front camera
becomes a user interface.
Market size
$20B
Market
$10B
Market
$5B
Market
$1B
©2017 | www.yole.fr | Status of the CMOS image sensor industry

22. 22
STATUS OF THE CIS INDUSTRY
2016 Conclusions
• CMOS image sensor industry is maintaining its healthy growth pattern at 10.5% CAGR from 2016 to
2022.
• Sony is the undisputed leader due to its role in Mobile, but competition is still open in many other
dynamic markets such as Security and Automotive
• Photography application is still at the centre of the mobile growth engine essentially due to dual camera
approaches. The industry is on the verge of a massive transformation due to Augmented Reality
applications involving 3D perception.
• Technology innovation is taking no rest, after a period of stacked BSI introduction which is now the new
normal, new techniques such as multi-stack and hybrid stack are enabling new features such full PDAF
and super slow motion.
• The key trend to use computing power to manipulate, enhance, and extract metrics from an image has
resulted into the mega purchase of Mobileye by Intel for $15B. Stakes are indeed very high for the
downstream usage of images.
Healthy
growth
ahead
©2017 | www.yole.fr | Status of the CMOS image sensor industry

23. 23
IMAGE SENSORS APPLICATION: WHAT IS NEXT
A roadmap for the next 10 years
Technology
shift of 2020
will be related
to AI
Technology x Market
penetration
20242016 2018 2020 2022 2026
©2017 | www.yole.fr | Status of the CMOS image sensor industry
Computational
photography
Interaction
capability
ADAS Level 2
assistance
ADAS Level 3
autonomy
ADAS Level 4
& Robotic vehicles
IP cameras
Analytics
Behavioral analysis
Augmented
reality
Ambiant
intelligence
Augmentation
capability
Sensing & Computing era
Artificial Intelligence era
Cognition era
Robotic
Buttler
Drones
2014 2028

24. 24
IMAGE SENSOR TECHNOLOGIE : WHAT IS NEXT
A roadmap for the next 20 years
From
“vision for
imaging”
to
“vision for
sensing”
1900 1980 2020 2030 2040 2045
Technology x Market Penetration
Acceleration :The speed in technology change doubles every technology shift
Era of
Photography
5 years10 years20 years40 years80 years
Era of Machine
Sensing
Main
Players
could
change
Proximity
Sensor
Autofocus
Single
Photon
Imagers
Multi
Wavelength
Imagers
Next Era
Sensor
Fusion ?
Human Vision
Enhancement ?
3D Time
of Flight
By 2030 new
technologies serving
machine sensing could
become dominant
Event based
imagers
Holographic
imagers?
©2017 | www.yole.fr | Status of the CMOS image sensor industry

25. 25
RELATED REPORTS
Discover more related reports within our bundles here.
©2017 | www.yole.fr | Status of the CMOS image sensor industry

26. It’s ten years down the line from the initial
Apple iPhone that started the smartphone era.
Since then, CMOS imaging has benefited from
huge market demand and a technology-driven
environment, resulting in an $11.6B industry
in 2016. Photography and video is the main
application, which has been totally transformed by
new use cases, new devices and new technologies.
The mobile market is key for the CMOS image
sensor (CIS) industry. Despite saturation in the
number of handsets, the CIS market is able to
maintain a 10.5% compound annual growth rate
(CAGR) for the 2016-2022 period due to the
introduction of dual and 3D cameras. These
additional cameras are changing the industry’s
drivers from form factor and image quality to
interactivity.
Penetration into higher added value markets
such as automotive, security and medical shows
that CIS products are transforming use cases
across the board. CIS technology adoption allows
greater automation levels at low cost, while using
newly available computing architectures such as
deep learning. The CMOS image sensor industry
is currently in a virtuous circle where a new
technology is providing true customer value.
Besides the transformation of current applications,
new applications such as drone photography,
biometric identification, and augmented reality
are relying on CIS innovation. All these new
applications are part of the story told in the ‘2017
Status of the CIS Industry’ report.
STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017
Market & Technology report - June 2017
NEW APPLICATIONS ARE TRANSFORMING THE MARKET AND TECHNOLOGY
PLAYING FIELD FOR CMOS IMAGE SENSORS
New use cases and applications are transforming the CMOS Image Sensor (CIS) landscape
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• 2016 CIS revenue breakdown
by market
• 2016 CIS revenue ranking by player
• 2016 CIS production ranking
by foundry
• CIS volume shipment forecast
by application 2010-2022
• CIS revenue forecast by application
2010-2022
• CIS average selling price forecast
by application 2010-2022
• CIS wafer production forecast by
application 2010-2022
WHAT’S NEW
• 2016-2022 forecast
• 2016 MA activity
• Ecosystem update
• Dual and 3D camera trends for
mobile
• Automotive camera adoption
curve
• Security camera trend
• 3D stacking technology update
REPORT OBJECTIVES
Ecosystem identification and analysis:
• Determination of the range of
applications
• Technical market segmentation
• Market trends and forecasts
• Key players by market, and analysis
Analysis and description of markets
and technologies involved:
• Detailed applications for each
market segment
• Major players worldwide
• Technology trends
• Main technical challenges (Yole Développement, June 2017)
Image sensor application: what is next
BEYOND $11.6B IN 2016, THE CIS ECOSYSTEM HAS NOT BECOME
THE OLIGOPOLY WE WOULD HAVE EXPECTED
Sony has established itself as industry leader,
market and technology wise. However, the 2016
earthquake in Japan slowed down its operation
and helped maintain the growth of its close
competitors. Indeed, despite Toshiba’s exit from
the market, two thirds of players have seen
growth in the last year. Samsung, Omnivision
and Panasonic have delivered 15% year-on-year
growth. Those large players are increasing the
weight Asia carries in the CIS industry.
In the US, On Semi has suffered from the public
relations mess that followed a fatal crash involving
Tesla’s semi-autonomous driving system, which
included a Mobileye sensor. Automotive cameras
Technology x market
penetration
20242016 2018 2020 2022 2026
Computational
photography
Interaction
capability
ADAS Level 2
assistance
ADAS level 3
autonomy
ADAS level 4
Robotic vehicles
IP cameras
Analytics
Behavioral analysis
Augmented
reality
Ambiant
intelligence
Augmentation
capability
Sensing computing era
Artificial intelligence era
Cognition era
Robotic
buttler
Drones

27. STATUS OF THE CMOS IMAGE SENSOR INDUSTRY 2017
(Yole Développement, June 2017)
2016 CIS revenue breakdown
SPEED OF TECHNOLOGY ADOPTION MIRRORS THE APPLICATION DEVELOPMENT
FRENZY
(Yole Développement, June 2017)
Image sensor technology: what is next
A CMOS image sensor is an analog device using a
digital process. Therefore, the industry has been
following a key principle of “one application, one pixel,
one process”. This probably explains the dynamism of
the ecosystem and the ability of different players to
coexist in different markets. On Semi, Teledyne, ams
and STMicroelectronics all provide perfect examples
of successful differentiating strategies.
The impact of 3D semiconductors is currently a key
element of the competition. Samsung has finally joined
Sony as a provider of stacked back-side illuminated
(BSI) sensors. Omnivision and SK Hynix will also
soon launch this technology. Meanwhile, SMIC and
STMicroelectronics will probably be the next players
to unveil their versions of stacked technology.
Increases in CIS production capacity have
momentarily stopped due to this stacked trend. This
is currently mainly due to Sony, which can source
its logic wafers from TSMC. In coming years Sony,
Samsung, STMicroelectronics, HLMC and SK Hynix
will all announce extra CIS capacity in order to meet
market demand, despite stacked BSI adoption.
Imagesensorshavebecomeasignificantsemiconductor
segment alongside processors and memories. They
still provide a technology-driven environment that
is profit-friendly despite fierce competition. The
outcome of the competition depends on a combination
of application pull and technology fit. To help judge
that, this report is aimed at giving the best possible
snapshot of the current status of the CIS industry.
Purchasers can therefore use it in order to proactively
benefit from the next wave of innovations.
are safety-critical and therefore the reaction is strong
if performance does not match expectations. Tesla
being cleared by the US National Highway Traffic
Safety Administration and Intel’s $15B purchase
of Mobileye should quickly put this application and
affiliated players back on the growth track.
Moving along the technology ladder proved to be
difficult for SK Hynix, which was not able to switch
quickly enough toward 8MP image sensors requiring
300mm wafer diameter operations.
Another noticeable activity has been STMicroelectronics’
revival of its CIS business through the development of
3D ‘Time of Flight’ (ToF) devices. These devices have
had the ability to move from proximity to distance
rangers and then fully fledged 3D cameras. They will
probably be the biggest event of the end of 2017, if
they materialize in the Apple iPhone 8 as is rumored.
Sony
42%
Samsung
18%
Omnivision
12%
On Semi
6%
Panasonic
3%
Canon
3%
SK Hynix
3%
STMicro
3%
Galaxycore
2%
Pixart
2%
Hamamatsu
1%
Pixelplus
1%
Other
4%
2015
$10.3B
2016
$11.6B
1900 1980 2020 2030 2040 2045
Technology x Market Penetration
Acceleration :The speed in technology change doubles every technology shift
Era of
Photography
5 years10 years20 years40 years80 years
Era of Machine
Sensing
Main
Players
could
change
Proximity
Sensor
Autofocus
Single
Photon
Imagers
Multi
Wavelength
Imagers
Next Era
Sensor
Fusion ?
Human Vision
Enhancement ?
3D Time
of Flight
By 2030 new
technologies serving
machine sensing could
become dominant
Event based
imagers
Holographic
imagers?

28. Find more
details about
this report here:
MARKET TECHNOLOGY REPORT
Glossary 2
Table of contents 3
Report objectives 6
Methodology 8
Companies cited 13
Executive summary 14
Introduction 31
Market segmentation
Historical perspective
CMOS image sensor landscape by player
CMOS image sensor landscape by application
CMOS image sensor technology shift CMOS vs CCD
CMOS image sensor technology shift BSI vs FSI
CMOS image sensor technology shift 300mm
vs 200mm
Market forecast 47
2016 CIS revenue breakdown by market
CIS volume shipment forecast 2010-2022
CIS revenue forecast 2010-2022
CIS average selling price forecast 2010-2022
CIS wafer production forecast 2010-2022
Ecosystem 61
2016 MA activity in CIS
CMOS image sensor ecosystem
CMOS image sensor competitive landscape
Geographic mapping of CIS players
Geographic mapping of CIS foundries
Players and rankings 71
2016 CIS revenue ranking by player
2016 CIS production ranking by foundry
2016 CIS player activity breakdown
2016 CIS revenue mobile market breakdown by
player
2016 CIS revenue photography market breakdown
by player
2016 CIS revenue tablet market breakdown by
player
2016 CIS revenue laptop PC market breakdown
by player
2016 CIS revenue medical X-ray market
breakdown by player
2016 CIS revenue security and surveillance
market breakdown by player
2016 CIS revenue machine vision market
breakdown by player
Mobile market trends 88
Consumer electronics volume forecast
Consumer electronics revenue forecast
Who can afford a smartphone?
Revenue comparison
Mobile market volume forecast by phone type
Mobile market volume forecast by player
Market drivers
Mobile resolution mix forecast
Dual camera rollout scenario
3D camera applications
Mobile market trends
Other consumer market trends 111
Consumer photography volume forecast
Action camera and drone volume forecast
360° camera trend
AR/VR headset volume forecast
AR/VR headset trend
Wearable volume forecast
Consumer drone volume forecast
Consumer robotics volume forecast
Computing volume forecast
Other market trends 132
Light vehicle volume forecast
Automotive imaging trend
Automotive camera volume forecast
Robotic vehicle trend
Medical CIS volume forecast
Medical CIS trend
Security and surveillance volume forecast
Machine vision volume forecast
Technology trends 155
Pixel/Resolution/Optical Format
From FSI to BSI to stacked BSI
Hybrid stack/Multi-stack
3D imaging and sensing
Technology by players
Conclusion 193
Yole Développement presentation 197
TABLE OF CONTENTS (complete content on i-Micronews.com)
COMPANIES CITED IN THE REPORT (non exhaustive list)
Almalence, Ambarella, Apple, Agilent, Arm, Axis, ams Basler, Bosch, Brigates, BYD, Caeleste, Canon,
Clairpixel, CMOSIS, Cognex, Continental, Core Photonics, CSEM, Dongbu HiTek, DXO, Dynamax,
ESPROS Photonics, Evg, Excelitas Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn,
Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu, Hasselblad,
Heliotis,HimaxImaging,Honeywell,Hoya,HTC,Huawei,ImageLab,IMEC,Infineon,Invisage,InvenSense,
Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Magna, Mantis
Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging
Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semiconductor, Panasonic,
PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix,
Rosnes, Samsung, Sanei Hytech, Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens,
Socionext, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne e2v, Teledyne DALSA, Teradyne,
Tessera, Toshiba, Trixell, TSMC, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis, Viimagic,
WLCSP, Xiaomi, X-Fab, Xintec, ZTE and more…
• Imaging Technologies for Automotive 2016
• STMicroelectronics Time of Flight Proximity
Sensor in the Apple iPhone 7 Plus
• 3D TSV and 2.5D Business Update - Market
and Technology Trends 2017
• Solid-State Medical Imaging 2017
• Mobileye EyeQ3®
Automotive Vision-Based
SoC
Find all our reports on www.i-micronews.com
RELATED REPORTS
Benefit from our Bundle Annual Subscription offers and access our analyses at the best
available price and with great advantages
AUTHORS
From 1999, Pierre Cambou has been
part of the imaging industry. Pierre took
several positions at Thomson TCS which
became Atmel Grenoble in 2001 and
e2v Semiconductors in 2006. In 2012 he
founded a start-up called Vence Innovation
(now Irlynx) in order to bring to market a
disruptive infrared interaction technology.
He has an Engineering degree from
Université de Technologie de Compiègne
Tech. More recently he graduated from
Grenoble Ecole de Management’s MBA.
He joined Yole Développement as Imaging
Activity Leader in 2014.
From 1996 to 1999 Jean-Luc Jaffard
paved the way of imaging activity at
STMicroelectronics being at the forefront
of the emergence and growth of this
business. At STMicroelectronics Imaging
division he has been appointed Research
Development and Innovation Director
managing a large multidisciplinary and
multicultural team and was later on
promoted Deputy General Manager and
Advanced Technology Director in charge
of identifying, sourcing or developing
the breakthrough Imaging Technologies
and Applications to transform them into
innovative and profitable products. In 2010
he was appointed STMicroelectronics
Intellectual Property Business Unit Director.
In 2014 he created the Technology and
Innovation branch of Red Belt Conseil, to
support High Tech actors like SME, Research
Institutes, Start-ups, Analysts, Investors
and public authorities. Jean-Luc Jaffard
owns multiple patents in semiconductor
and Imaging domains and has been invited
speaker in many conferences worldwide.
He studied Electronic and Microelectronic
and has been graduated from Ecole
Supérieure d’Electricité of Paris in 1979.

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31. © 2017
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons

32. 27©2017 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE
Yole Développement’s 35+ analysts operate in the following areas
MEMS Sensors
Compound
Semi.
Imaging
Photonics
MedTech
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RF
Devices
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Substrates
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Lighting
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33. 28©2017 | www.yole.fr | About Yole Développement
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34. 29©2017 | www.yole.fr | About Yole Développement
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35. 30©2017 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Yole Inc.
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
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36. 31©2017 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Multi-
Customers
Action
Technology
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Report
Leadership
Meeting
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Service
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Meet the
Analyst
Custom
Analysis
High
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37. 32©2017 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plan along
the entire
supply chain
Integrators and
end-users
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makers
Suppliers: material,
equipment, OSAT,
foundries…
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RD centers

38. 33©2017 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We are
working
across
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the impact of
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Moore
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from device
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From A to Z…
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makers
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and consumer
electronics
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Medical
systems
Industrial and
defense
Energy

39. 34©2017 | www.yole.fr | About Yole Développement
o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in:
• MEMS Sensors
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In the past 19 years, we worked on more than 2 000 projects, interacting with technology professional and high level opinion makers from the main players of the
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o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com

40. 35©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS byYole Développement
o MEMS SENSORS
− Acoustic MEMS and Audio Solutions 2017
− 3D Imaging Sensing 2017
− Microspectrometers Markets and Applications 2017
− Status of the MEMS Industry 2017*
− MEMS Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market Technology Trends 2017*
− 3D Business Update: Market Technology Trends 2017*
− Advanced QFN: Market Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING OPTOELECTRONICS
− 3D Imaging Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology Market Trends 2017*
− Solid State Medical Imaging 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
*2016 version still available / **To be confirmed

41. 36©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017*
− Silicon Power Mosfet: Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017**
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− Quantum Dots for Display Applications 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Automotive Lighting 2017 - Technology, Industry and Market Trends
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and Lasers - Technology Applications and Industry Trends 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management for LED and Power 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation
− Risk and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Micropumps: Patent Landscape Analysis 2017
− GaN Technology: Top-100 IP Profiles 2017
− MicroLEDs: Patent Landscape Analysis 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.*2016 version still available / **To be confirmed

42. 37©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016

43. 38©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).

44. 39©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
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Benefit from the i-Micronews.com
traffic generated by the 8,500+
monthly visitors, the 11,500+
weekly readers of @Micronews
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Seven main events planned for
2017 on different topics to
attract 140 attendees on average
Gain new leads for your business
from an average of 300
registrants per webcast
Contacts: CamilleVeyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing Communication Project Managers.

45. 40©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan Asia: Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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